JP4095741B2 - IC tag structure - Google Patents

IC tag structure Download PDF

Info

Publication number
JP4095741B2
JP4095741B2 JP18312499A JP18312499A JP4095741B2 JP 4095741 B2 JP4095741 B2 JP 4095741B2 JP 18312499 A JP18312499 A JP 18312499A JP 18312499 A JP18312499 A JP 18312499A JP 4095741 B2 JP4095741 B2 JP 4095741B2
Authority
JP
Japan
Prior art keywords
chip
substrate
resin
tag
release layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP18312499A
Other languages
Japanese (ja)
Other versions
JP2001014442A (en
Inventor
康夫 清水
蕃 山本
Original Assignee
シチズンミヨタ株式会社
サクサ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シチズンミヨタ株式会社, サクサ株式会社 filed Critical シチズンミヨタ株式会社
Priority to JP18312499A priority Critical patent/JP4095741B2/en
Publication of JP2001014442A publication Critical patent/JP2001014442A/en
Application granted granted Critical
Publication of JP4095741B2 publication Critical patent/JP4095741B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
    • G06K19/07381—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering
    • G06K19/0739—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering the incapacitated circuit being part of an antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、タグ情報を記憶したＩＣチップとアンテナを主な内部部品として持ち、物品等に付与され、非接触で外部装置との間で情報等の交信を行うＩＣタグ構造に関するものである。
【０００２】
【従来の技術】
物品等に付与されているタグ情報を自動的に読み取って識別するためのシステムとして、バーコード方式によるものがあるが、より大量の情報を扱え、遠隔読み出しが可能となるデータキャリアシステムと呼ばれるＩＣタグシステムの開発が進んでいる。
【０００３】
このＩＣタグシステムは物品等に取り付けられるＩＣタグと呼ばれる応答器と、質問器で構成され、これら応答器と質問器との間で、磁気、誘導電磁界、マイクロ波（電波）等の伝送媒体を介して非接触で交信を行うものである。
【０００４】
図１は従来のＩＣタグ構造を示す分解斜示図である。図２は図１のＡ−Ａ断面図である。１はタグ情報を記憶したＩＣチップであり、基板２に搭載されている。基板２にはパターン部２ａ、２ｂが形成されており、前記ＩＣチップ１はワイヤー１ａ、１ｂを介して前記基板２のパターン部２ａ、２ｂと接続されている。さらに、バリア枠２ｄ内にＩＣチップ保護用のポッティング樹脂１ｃが塗布されてＩＣモジュール部３を構成している。４はアンテナとなるコイル状に巻かれた銅線である。コイル状銅線４の巻きはじめの接続端部４ａと巻き終わりの接続端部４ｂは前記基板２のパターン部２ａ、２ｂにハンダ２ｃにより接続されている。
【０００５】
前記コイル状銅線４の接続端部４ａ、４ｂを前記ＩＣモジュール部３に接続した後、フィルム５、フィルム６を用い、上下から挟んで接着してＩＣタグを完成する。前記フィルムはポリエチレン等の樹脂をシート状に形成したものを用い、熱溶着による方法で接着したり、粘着剤を有するフィルムにて接着されている。また、ＩＣタグを直接物品等に貼り付けて用いる場合、物品に貼り付ける面をあらかじめ粘着剤を有するフィルムで構成しておき、粘着剤を介して物品に貼り付けてタグ情報の自動認識システムに用いている。
【０００６】
ところで、物品に貼り付けられたＩＣタグは貼り付けた物品そのもののタグ情報を記憶しているものなので、一度貼り付けたＩＣタグが、他の物品に貼り替えられるようなことがあると、誤ったタグ情報が認識されてしまい物品の取扱に悪影響を与えてしまう。そこで、物品に一度貼ったＩＣタグは、再度利用できないようなＩＣタグ構造にする必要がある。
ＩＣタグの再利用を不可能にする構造としては、例えば特願平１０−３７３２７３号などが提案されている。これは、物品に貼り付けたフィルム状のＩＣタグを剥がそうとした場合、コイル状銅線は一方のフィルム側に接着されたままの状態で剥がれ、ＩＣモジュール部は他方のフィルム側に接着されたままの状態で剥がれるようにそれぞれが分離し易い構造にしておき、コイル状銅線をＩＣモジュール部の接続部から切断してしまうものである。
【０００７】
【発明が解決しようとする課題】
しかし、前記した従来の構造では、コイル状銅線が切断されるのみであるので、コイル状銅線をＩＣモジュール部の接続部に接続し直すことにより、再利用が可能になってしまう。
そこで、本発明は一度物品に貼付したＩＣタグを剥がすことによって確実に破壊され、その再利用を完全にできなくするＩＣタグ構造を提供しようとするものである。
【０００８】
【課題を解決するための手段】
パターン部を有する基板にＩＣチップを搭載し、該ＩＣチップと前記基板のパターン部がワイヤーボンディングにより接続され、前記ＩＣチップとワイヤー部が封止樹脂にて封止されて成るＩＣモジュール部と、アンテナとなるコイル状銅線を有し、前記ＩＣモジュール部と前記コイル状銅線を、粘着剤を有するフィルム材で挟んで構成するＩＣタグ構造において、前記ＩＣチップを封止する封止樹脂と前記基板の間に剥離層を設ける。
【０００９】
前記封止樹脂側に接着される前記フィルム材の粘着強度は、前記封止樹脂と前記剥離層の固着力及び前記ＩＣチップと前記基板の固着力よりも強い構成とし、前記フィルム材を前記ＩＣモジュールと前記コイル状銅線を挟み込む方向とは逆方向に引っ張りの力を掛けた場合、前記封止樹脂と前記剥離層が分離し、前記ＩＣチップと前記基板を分離し、さらに前記ＩＣチップと前記基板のパターン部とを接続するワイヤーを破壊するＩＣタグ構造とする。
【００１０】
前記封止樹脂はエポキシ系樹脂であり、前記剥離層はシリコン系樹脂で構成する。
【００１１】
【発明の実施の形態】
図３は本発明のＩＣタグのＩＣモジュール部の断面図である。
ＩＣチップ７は基板８に接着剤で固定され、ワイヤー（金線）９を介してパターン部１０と接続される。１１は第１の樹脂層で、剥離層となるものである。１２は第２の樹脂層で、ＩＣチップ７、ワイヤー９を保護するためのポッティング樹脂である。１３はバリア枠で、ポッティング樹脂１２の樹脂流れを防止するためのものである。上記構成によりＩＣモジュール部１４を成している。
前記第１の樹脂層（剥離層）１１はシリコン系の樹脂で構成し、第２の樹脂層（ポッティング樹脂）１２はエポキシ系の樹脂で構成し、それぞれを分離し易い状態にしている。シリコン系の樹脂とエポキシ系の樹脂は、両者のなじみが悪いため、それぞれの固着力を弱く構成できる。
【００１２】
図４は本発明のＩＣタグのＩＣモジュール部の平面図であり、ポッティング樹脂を塗布する前の図である。
剥離層１１は基板８上のＩＣチップ７の搭載部と、パターン部１０のワイヤー接続部１０ａとコイル状銅線接続部１０ｂを除く部分に形成される。前記剥離層１１の形成はスクリーン印刷法により容易に行うことができる。剥離層１１の形成後、ＩＣチップ７を所定の位置に接着固定し、ワイヤー９を介してＩＣチップ７とパターン部１０が接続される。次にバリア枠１３を形成し、バリア枠１３内にポッティング樹脂１２を塗布し、硬化させてＩＣモジュール部が完成する。
【００１３】
図５は本発明のＩＣタグの断面図である。
コイル状銅線１５はその銅線端部（不図示）がＩＣモジュールの基板のパターン部（不図示）に接続される。前記ＩＣモジュール部１４とコイル状銅線１５は粘着剤（不図示）を有するフィルム１６、１７で挟み込み、接着して構成する。フィルム１７は両面に粘着剤を有する構成とし、フィルム１７の外側の面（ＩＣモジュール部、コイル状銅線を挟んでいない面）の粘着剤を介して物品１８等に貼り付けて自動認識システムに用いる。図示しないがフィルム１６の外形状はフィルム１７の外形状よりも大きく形成されている。
【００１４】
図６は、一度物品等に貼り付けられたＩＣタグを剥がそうとした状態を示す断面図である。
図６に示す断面図のように、外形状の大きいフィルム１６の端部から剥がされることとなる。この場合フィルム１７は物品側に貼り付いたまま残り、ポッティング樹脂１２の位置までくると、ポッティング樹脂１２にはＩＣチップ７の搭載された基板とは逆方向へ引っ張る力が加わる。この力が加わると、ポッティング樹脂１２と剥離層１１が分離する。この時ＩＣチップ７はポッティング樹脂１２に強固に接着されているので、ポッティング樹脂１２ごと剥がされ、ワイヤー９は切断され、ＩＣタグを破壊する。ＩＣチップ７と基板８との接着力と、ポッティング樹脂１２と剥離層１１の接着力は、フィルム１６とポッティング樹脂１２との接着力よりも弱く設定しているため、簡単に剥離崩壊する。
【００１５】
破壊の状態については、剥離層１１の層自体が崩壊するか、剥離層１１とポッティング樹脂１２との間で剥離するか、基板８と剥離層１１との間で剥離するかのいずれかの状態で剥離される。いずれの場合でもＩＣチップ７はポッティング樹脂１２に強固に接着されているため、ポッティング樹脂ごと剥離され、ＩＣタグが破壊される。
【００１６】
【発明の効果】
ＩＣチップを封止するポッティング樹脂と基板の間に剥離層を設けることにより、ＩＣタグを剥がそうとした場合に、ポッティング樹脂と剥離層が分離してＩＣチップと基板を分離することによりＩＣチップと基板を接続するワイヤーが切断されＩＣタグを破壊できる。よって、再利用が不可能なＩＣタグを提供できる。
【００１７】
ＩＣチップを封止する際、シリコン系樹脂とエポキシ系樹脂のなじみの悪い樹脂同士で構成することにより、それぞれを分離し易い構造にできる。
【図面の簡単な説明】
【図１】従来のＩＣタグ構造を示す分解斜示図
【図２】図１のＡ−Ａ断面図
【図３】本発明のＩＣタグのＩＣモジュール部の断面図
【図４】本発明のＩＣタグのＩＣモジュール部の平面図
【図５】本発明のＩＣタグの断面図
【図６】物品等に貼り付けられたＩＣタグを剥がそうとした状態を示す断面図
【符号の説明】
１ ＩＣチップ
２ 基板
２ａ パターン部
２ｂ パターン部
２ｃ ハンダ
３ ＩＣモジュール部
４ コイル状銅線
５ フィルム
６ フィルム
７ ＩＣチップ
８ 基板
９ ワイヤー（金線）
１０ パターン部
１０ａ ワイヤー接続部
１０ｂ コイル状銅線接続部
１１ 第１層の樹脂（剥離層）
１２ 第２層の樹脂（ポッティング樹脂）
１３ バリア枠
１４ ＩＣモジュール部
１５ コイル状銅線
１６ フィルム
１７ フィルム[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an IC tag structure that has an IC chip and an antenna that store tag information as main internal parts, is attached to an article, etc., and communicates information and the like with an external device in a non-contact manner.
[0002]
[Prior art]
As a system for automatically reading and identifying tag information attached to articles, etc., there is a system using a bar code system, but an IC called a data carrier system that can handle a larger amount of information and can be read out remotely. Tag system development is progressing.
[0003]
This IC tag system is composed of a transponder called an IC tag attached to an article or the like and an interrogator. Between these transponders and the interrogator, a transmission medium such as magnetism, induction electromagnetic field, microwave (radio wave), etc. It communicates without contact via
[0004]
FIG. 1 is an exploded perspective view showing a conventional IC tag structure. 2 is a cross-sectional view taken along the line AA in FIG. Reference numeral 1 denotes an IC chip that stores tag information, which is mounted on the substrate 2. Pattern portions 2a and 2b are formed on the substrate 2, and the IC chip 1 is connected to the pattern portions 2a and 2b of the substrate 2 through wires 1a and 1b. Further, a potting resin 1c for protecting an IC chip is applied in the barrier frame 2d to constitute the IC module unit 3. Reference numeral 4 denotes a copper wire wound in a coil shape serving as an antenna. The connection end 4a at the beginning of winding and the connection end 4b at the end of winding of the coiled copper wire 4 are connected to the pattern portions 2a, 2b of the substrate 2 by solder 2c.
[0005]
After connecting the connection end portions 4a and 4b of the coiled copper wire 4 to the IC module portion 3, the IC tag is completed by using the films 5 and 6 and sandwiching them from above and below. The film is made of a resin such as polyethylene formed into a sheet shape, and is adhered by a method by heat welding or by a film having an adhesive. In addition, when the IC tag is directly attached to an article or the like, the surface to be attached to the article is configured with a film having an adhesive in advance, and is attached to the article via the adhesive to be used as an automatic tag information recognition system. Used.
[0006]
By the way, since the IC tag attached to the article stores the tag information of the attached article itself, the IC tag once attached may be erroneously replaced with another article. The tag information is recognized and adversely affects the handling of the article. Therefore, the IC tag once attached to the article needs to have an IC tag structure that cannot be used again.
For example, Japanese Patent Application No. 10-373273 has been proposed as a structure that makes it impossible to reuse an IC tag. This is because when a film-like IC tag attached to an article is to be peeled off, the coiled copper wire is peeled off while being adhered to one film side, and the IC module part is adhered to the other film side. The structure is such that each can be easily separated so as to be peeled off as it is, and the coiled copper wire is cut off from the connection portion of the IC module portion.
[0007]
[Problems to be solved by the invention]
However, in the above-described conventional structure, only the coiled copper wire is cut, so that it can be reused by reconnecting the coiled copper wire to the connection part of the IC module part.
Therefore, the present invention intends to provide an IC tag structure that is surely destroyed by peeling off an IC tag once attached to an article and cannot be completely reused.
[0008]
[Means for Solving the Problems]
An IC module mounted on a substrate having a pattern portion, the IC chip and the pattern portion of the substrate are connected by wire bonding, and the IC chip and the wire portion are sealed with a sealing resin; In an IC tag structure having a coiled copper wire serving as an antenna and sandwiching the IC module part and the coiled copper wire with a film material having an adhesive, a sealing resin for sealing the IC chip; A release layer is provided between the substrates.
[0009]
The adhesive strength of the film material bonded to the sealing resin side is configured to be stronger than the adhesive strength between the sealing resin and the release layer and the adhesive strength between the IC chip and the substrate, and the film material is the IC When a tensile force is applied in a direction opposite to the direction in which the module and the coiled copper wire are sandwiched, the sealing resin and the release layer are separated, the IC chip and the substrate are separated, and the IC chip and An IC tag structure that breaks a wire connecting the pattern portion of the substrate.
[0010]
The sealing resin is an epoxy resin, and the release layer is made of a silicon resin.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 3 is a cross-sectional view of the IC module portion of the IC tag of the present invention.
The IC chip 7 is fixed to the substrate 8 with an adhesive, and is connected to the pattern unit 10 via a wire (gold wire) 9. Reference numeral 11 denotes a first resin layer, which becomes a release layer. A second resin layer 12 is a potting resin for protecting the IC chip 7 and the wire 9. Reference numeral 13 denotes a barrier frame for preventing the resin flow of the potting resin 12. The IC module unit 14 is configured as described above.
The first resin layer (peeling layer) 11 is made of a silicon-based resin, and the second resin layer (potting resin) 12 is made of an epoxy-based resin so that they can be easily separated from each other. Silicon-based resin and epoxy-based resin are poorly compatible with each other, and thus can be configured to have a weak fixing force.
[0012]
FIG. 4 is a plan view of the IC module portion of the IC tag of the present invention, and is a view before applying potting resin.
The release layer 11 is formed on a portion of the substrate 8 excluding the mounting portion of the IC chip 7 and the wire connecting portion 10a and the coiled copper wire connecting portion 10b of the pattern portion 10. The release layer 11 can be easily formed by screen printing. After the release layer 11 is formed, the IC chip 7 is bonded and fixed at a predetermined position, and the IC chip 7 and the pattern portion 10 are connected via the wire 9. Next, the barrier frame 13 is formed, and the potting resin 12 is applied and cured in the barrier frame 13 to complete the IC module portion.
[0013]
FIG. 5 is a cross-sectional view of the IC tag of the present invention.
The coiled copper wire 15 has an end portion (not shown) of the copper wire connected to a pattern portion (not shown) of the substrate of the IC module. The IC module part 14 and the coiled copper wire 15 are sandwiched between films 16 and 17 having an adhesive (not shown) and bonded together. The film 17 is configured to have an adhesive on both sides, and is attached to the article 18 or the like via an adhesive on the outer surface of the film 17 (the surface on which the IC module part and the coiled copper wire are not sandwiched). Use. Although not shown, the outer shape of the film 16 is larger than the outer shape of the film 17.
[0014]
FIG. 6 is a cross-sectional view showing a state in which an IC tag once attached to an article or the like is about to be peeled off.
As shown in the cross-sectional view of FIG. 6, the film 16 is peeled off from the end of the film 16 having a large outer shape. In this case, the film 17 remains attached to the article side, and when it reaches the position of the potting resin 12, a force is applied to the potting resin 12 in a direction opposite to that of the substrate on which the IC chip 7 is mounted. When this force is applied, the potting resin 12 and the release layer 11 are separated. At this time, since the IC chip 7 is firmly bonded to the potting resin 12, the potting resin 12 is peeled off, the wire 9 is cut, and the IC tag is destroyed. Since the adhesive force between the IC chip 7 and the substrate 8 and the adhesive force between the potting resin 12 and the peeling layer 11 are set to be weaker than the adhesive force between the film 16 and the potting resin 12, the peeling and collapse are easily performed.
[0015]
Regarding the state of destruction, either the layer itself of the release layer 11 collapses, the release layer 11 and the potting resin 12 peel off, or the substrate 8 and the release layer 11 peel off. Is peeled off. In any case, since the IC chip 7 is firmly adhered to the potting resin 12, the entire potting resin is peeled off and the IC tag is destroyed.
[0016]
【The invention's effect】
By providing a release layer between the potting resin that seals the IC chip and the substrate, when the IC tag is to be peeled off, the potting resin and the release layer are separated to separate the IC chip and the substrate. And the wire connecting the board can be cut and the IC tag can be destroyed. Therefore, an IC tag that cannot be reused can be provided.
[0017]
When sealing the IC chip, it is possible to make the structure easy to separate from each other by forming the silicon resin and the epoxy resin with poor compatibility.
[Brief description of the drawings]
1 is an exploded perspective view showing a conventional IC tag structure. FIG. 2 is a cross-sectional view taken along the line AA in FIG. 1. FIG. 3 is a cross-sectional view of an IC module portion of the IC tag according to the present invention. FIG. 5 is a cross-sectional view of an IC tag according to the present invention. FIG. 6 is a cross-sectional view illustrating a state where an IC tag attached to an article or the like is to be peeled off.
DESCRIPTION OF SYMBOLS 1 IC chip 2 Board | substrate 2a Pattern part 2b Pattern part 2c Solder 3 IC module part 4 Coiled copper wire 5 Film 6 Film 7 IC chip 8 Substrate 9 Wire (gold wire)
DESCRIPTION OF SYMBOLS 10 Pattern part 10a Wire connection part 10b Coiled copper wire connection part 11 Resin of 1st layer (peeling layer)
12 Second layer resin (potting resin)
13 Barrier frame 14 IC module 15 Coiled copper wire 16 Film 17 Film

Claims (3)

パターン部を有する基板にＩＣチップを搭載し、該ＩＣチップと前記基板のパターン部がワイヤーボンディングにより接続され、前記ＩＣチップとワイヤー部が樹脂封止されて成るＩＣモジュール部と、アンテナとなるコイル状銅線を有し、前記ＩＣモジュール部と前記コイル状銅線を、粘着剤を有するフィルム材で挟んで構成するＩＣタグ構造において、前記ＩＣチップを封止する封止樹脂と前記基板の間に剥離層を設けたことを特徴とするＩＣタグ構造。An IC chip is mounted on a substrate having a pattern portion, the IC chip and the pattern portion of the substrate are connected by wire bonding, and the IC chip and the wire portion are resin-sealed, and an antenna coil In an IC tag structure having a copper wire and sandwiching the IC module part and the coiled copper wire with a film material having an adhesive, between the sealing resin for sealing the IC chip and the substrate An IC tag structure, wherein a release layer is provided on the substrate. 前記封止樹脂側に接着される前記フィルム材の粘着強度は、前記封止樹脂と前記剥離層の固着力及び前記ＩＣチップと前記基板の固着力よりも強い構成とし、前記フィルム材を前記ＩＣモジュールと前記コイル状銅線を挟み込む方向とは逆方向に引っ張りの力を掛けた場合、前記封止樹脂と前記剥離層が分離し、前記ＩＣチップと前記基板を分離し、さらに前記ＩＣチップと前記基板のパターン部とを接続するワイヤーを破壊することを特徴とする請求項１記載のＩＣタグ構造。The adhesive strength of the film material bonded to the sealing resin side is configured to be stronger than the adhesive strength between the sealing resin and the release layer and the adhesive strength between the IC chip and the substrate, and the film material is the IC When a tensile force is applied in a direction opposite to the direction in which the module and the coiled copper wire are sandwiched, the sealing resin and the release layer are separated, the IC chip and the substrate are separated, and the IC chip and 2. The IC tag structure according to claim 1, wherein a wire connecting the pattern portion of the substrate is broken. 前記封止樹脂はエポキシ系樹脂であり、前記剥離層はシリコン系樹脂であることを特徴とする請求項１または２記載のＩＣタグ構造。3. The IC tag structure according to claim 1, wherein the sealing resin is an epoxy resin and the release layer is a silicon resin.
JP18312499A 1999-06-29 1999-06-29 IC tag structure Expired - Fee Related JP4095741B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18312499A JP4095741B2 (en) 1999-06-29 1999-06-29 IC tag structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18312499A JP4095741B2 (en) 1999-06-29 1999-06-29 IC tag structure

Publications (2)

Publication Number Publication Date
JP2001014442A JP2001014442A (en) 2001-01-19
JP4095741B2 true JP4095741B2 (en) 2008-06-04

Family

ID=16130225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18312499A Expired - Fee Related JP4095741B2 (en) 1999-06-29 1999-06-29 IC tag structure

Country Status (1)

Country Link
JP (1) JP4095741B2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2833801B1 (en) * 2001-12-19 2005-07-01 Oberthur Card Syst Sa METHOD FOR PRODUCING A MICROCIRCUIT CARD
JP4342771B2 (en) * 2002-05-15 2009-10-14 リンテック株式会社 IC tag
TWI257332B (en) 2003-01-22 2006-07-01 Mitsubishi Heavy Ind Ltd Method for removing and retrieving IC tags adhered to papersheet, and system and apparatus for the same
CN1910596B (en) * 2004-01-16 2011-03-09 株式会社半导体能源研究所 Semiconductor device
KR100719973B1 (en) 2005-12-22 2007-05-18 주식회사 알에프링크 Radio frequency idemtification tag with connector protecter
WO2008117383A1 (en) * 2007-03-23 2008-10-02 Fujitsu Limited Electronic device, electronic apparatus mounting electronic device, article mounting electronic device, and method for manufacturing electronic device
EP2131392A4 (en) * 2007-03-23 2011-08-24 Fujitsu Ltd Electronic device, electronic apparatus mounting electronic device, article mounting electronic device, and method for manufacturing electronic device
EP2420960A1 (en) * 2010-08-17 2012-02-22 Gemalto SA Method for manufacturing an electronic device comprising an irremovable module and device thus obtained
CN105472480A (en) * 2015-11-18 2016-04-06 佳律通信设备(上海)有限公司 Repeater radio frequency module screw-less fixing device
FR3106425B1 (en) * 2020-01-20 2023-03-24 Safran Aircraft Engines Radiofrequency tag comprising a means of destruction and associated method

Also Published As

Publication number Publication date
JP2001014442A (en) 2001-01-19

Similar Documents

Publication Publication Date Title
JP3636202B2 (en) Information carrier, information recording medium, sensor, article management method
US7843341B2 (en) Label with electronic components and method of making same
EP0821406B1 (en) An integrated circuit on an ultra-flexible substrate and a method of wire bonding an integrated circuit to an ultra-flexible substrate
JP3557990B2 (en) Information recording tag
US6572022B2 (en) Information recording tag
US20110011939A1 (en) Contact-less and dual interface inlays and methods for producing the same
US20080180255A1 (en) RFID tag
WO1996009175A1 (en) Non-contact type ic card and method of manufacturing same
JP4095741B2 (en) IC tag structure
JP2000105807A (en) Label type noncontact data carrier
JP2002528908A (en) Self-adhesive electronic circuit
JP2000105806A (en) Label type noncontact data carrier
JPH1111060A (en) Module for ic card, ic card with it and manufacture of the module for the card
JP4117989B2 (en) IC tag
JP4117958B2 (en) IC tag structure
JP4132333B2 (en) IC tag structure
JP2002297040A (en) Ic chip tag
JP3241993B2 (en) Electronic tag and its manufacturing method
JPH1111062A (en) Manufacture of ic card
JP2000251041A (en) Ic card
JP2000036023A (en) Inlet for radio card and radio card
JP2002063556A (en) Ic tag structure

Legal Events

Date Code Title Description
A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20040506

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20051129

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080205

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080226

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080310

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110314

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110314

Year of fee payment: 3

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110314

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120314

Year of fee payment: 4

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313117

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130314

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140314

Year of fee payment: 6

LAPS Cancellation because of no payment of annual fees