JP2002063556A - Ic tag structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC tag structure which makes it easy to peel a released paper off adhesion layer on both the surfaces of an IC tag and enables the released paper to be peeled off with a labeler. SOLUTION: The IC tag structure is composed of a surface film part which has at least one IC tag module part composed of at least an antenna part and an IC chip and covers the module part, both-surface adhesion layers which are adhered opposite to the surface film part, and the released paper which protects the both-surface adhesion layer; and the released paper is bent to the both-surface adhesion layers in the opposite direction from the surface film, so that the released paper can easily be peeled off the both-surface adhesion layers.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention has an IC chip storing tag information and an antenna as main internal parts, is attached to a non-body (article, etc.), and is capable of contacting information with an external device in a non-contact manner. The present invention relates to an IC tag structure for performing the above communication.

[0002]

2. Description of the Related Art A bar code is used as a system for automatically reading and identifying tag information attached to an article or the like, but can handle a larger amount of information, is excellent in environmental resistance, and is remote. An electronic tag identification system called a readable data carrier system has begun to be used.

The electronic tag identification system is composed of a transponder called an electronic tag attached to an article or the like, and an interrogator connected to the host. Magnetic and dielectric electromagnetic waves are interposed between the transponder and the interrogator. It is characterized in that communication is performed in a non-contact manner through a transmission medium such as a field or a microwave.

[0004] Although there are various information transmission systems of the electronic tag identification system, the present invention relates to a microwave system, and energy of a transmission signal from an interrogator can be used as driving power of a transponder. Therefore, unlike a case where a battery is used as a drive source, there is an advantage that there is no fear that the response capability is deteriorated due to the approaching end of the battery life or the use limit is not reached.

The transponder in the electronic tag type identification system includes an antenna unit for transmitting and receiving a signal to and from the interrogator and a circuit unit. By using an IC constituted by one chip in the circuit section, an electronic tag having a small number of components, that is, an IC tag is realized.

FIG. 3 shows a state in which an antenna part 2 and an IC part (circuit part) 1 constituting an IC tag according to the prior art are connected and sandwiched between a surface film 3 and a double-sided adhesive layer 4. 5 is a perspective view showing a state in which the peeling force is removed (arrows 7 and 8 indicate directions of a peeling force). Here, according to the prior art, when peeling the release paper 5 from the double-sided adhesive layer 4, the surface film 3 side and the release paper 5 side are respectively held, and a force is applied in opposite directions to each other.

For example, the double-sided adhesive layer is formed of an acrylic adhesive to a thickness of 50 μm, and is adhered to a release paper having a surface treated with silicone. A film having a thickness of 50 μm, such as polyethylene, is stuck to form a surface film in such a manner as to sandwich the module. Depending on the operation method, various forms are selected, such as a form in which the release paper is formed into a belt shape and aligned here, or a form in which the release paper is also cut for each single product.

[0008]

As described above, when attaching an IC tag to an article, the release paper is peeled off from the double-sided adhesive layer.
This is the operation of attaching the adherable surface of the double-sided adhesive layer to the article. Here, it is necessary to peel off the release paper from the double-sided adhesive layer for each IC tag, and the double-sided adhesive layer side and the release paper side are peeled off as described above, which increases the workability due to manual work. Decline, high cost,
In addition, contact with the surface of the adhesive layer, dirt, and the like adversely affect quality such as a decrease in adhesive strength after the IC tag is attached.

Accordingly, an object of the present invention is to provide a structure in which the double-sided adhesive layer of the IC tag and the release paper can be easily peeled off, and the release paper can be peeled off by a labeler.

[0010]

According to the present invention, there is provided at least one IC tag module section comprising at least an antenna section and an IC chip, and a surface film section covering the module section is bonded to and opposed to the surface film section. In an IC tag structure comprising a double-sided adhesive layer and a release paper for protecting the double-sided adhesive layer, the release paper is easily bonded to the double-sided adhesive layer by bending the release paper in a direction opposite to the surface film. It can be peeled from the layer.

The adhesive strength between the double-sided adhesive layer and the release paper is selected to be smaller than the planar bending strength (rigidity) of the surface film.

When the release paper is peeled off and an IC tag is used, the adhesive strength between the double-sided adhesive layer capable of peeling off the release paper with a labeler and the release paper.

[0013]

FIG. 1 shows a first embodiment of the present invention.
FIG. 4 is a schematic cross-sectional view for explaining a C tag, further showing a state of peeling. IC chip 1 (circuit part) and coil 2
The (antenna portion) is connected by a copper wire of a coil (not shown), and a double-sided adhesive layer 4 for bonding such an internal component to a surface film 3 serving as a surface portion and a non-adhesive (article or the like). Thus, it is in the form of being sandwiched. Here, it is placed on the release paper 5 to protect the attaching surface of the double-sided adhesive layer until it is attached and adhered to a non-adhesive (article or the like).

When the release paper 5 is to be attached to the stripped article, the release paper is folded back on the opposite surface (the side opposite to the double-sided adhesive layer and the surface film), and the release paper is peeled off. Here, the release paper is folded back to the opposite surface by configuring the bonding strength of the double-sided adhesive layer to the release paper to be weaker than the planar bending strength (rigidity) of the surface film and the double-sided adhesive layer. Then, the double-sided adhesive layer is peeled off to form the release paper bent portion 6 and easily peeled off.

FIG. 2 is a schematic perspective view for explaining an IC tag and a labeler according to a second embodiment of the present invention. In general, the labeler is provided with a cut-out portion such as a knife edge in advance so as to bend the portion of the release paper 5, and the double-sided adhesive layer and the surface film 3 correspond to the label to be peeled. Here, if the adhesive strength between the double-sided adhesive layer and the release paper is stronger than the planar bending strength (rigidity) of the surface film and the double-sided adhesive layer, the surface film and the double-sided adhesive layer are peeled off without being released from the release paper. While being adhered to the paper, it cannot be peeled off in the same way as the release paper is folded. Conversely, the same applies to the case where the planar bending strength (rigidity) of the surface film and the double-sided adhesive layer is weak. Therefore, as described in the first embodiment, the planar bending strength (rigidity) of the surface film and the double-sided adhesive layer and the adhesive strength of the double-sided adhesive layer to the release paper are selected, and the strength of the adhesive force is provided. This allows the labeler to work.

For example, in the present embodiment, a PET film having a rigidity higher than that of polyethylene is used even if the surface film has the same thickness of 50 μm. The thickness is changed from the conventional 50 μm to 100 μm from the conventional thickness of 50 μm because the thickness of the double-sided adhesive layer facilitates peeling. Furthermore, by forming a strip of release paper and mounting the IC tags at regular intervals to complete the operation, efficient work by a labeler is realized.

[0017]

According to the present invention, when attaching an IC tag to an article, the release paper is peeled off from the double-sided adhesive layer, and the release paper is peeled off in the operation of attaching the double-sided adhesive layer to the article. This makes it easier to improve the work efficiency, reduce the cost, and reduce the possibility of adversely affecting the quality, such as a decrease in the adhesive strength after attaching the IC tag, due to contact with the adhesive layer surface and dirt.

[Brief description of the drawings]

FIG. 1 is a schematic view of a cross section of a part of an IC tag according to the present invention and a state diagram of peeling.

FIG. 2 is a perspective view of an IC tag according to the present invention in a peeled state.

FIG. 3 is a perspective view showing a state in which an IC tag is peeled off according to a conventional technique.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC chip 2 Antenna part (coil part) 3 Surface film 4 Double-sided adhesive layer 5 Release paper 6 Release paper peeling part 7 Direction of peeling force of surface film 8 Direction of peeling force of release paper

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2C005 MB10 5B035 AA00 BA05 BA07 BB09 BC00 CA23

Claims (3)

[Claims] At least one IC tag module unit comprising at least an antenna unit and an IC chip,
An IC tag structure comprising a surface film portion covering the module portion, a double-sided adhesive layer bonded to the surface film portion, and a release paper for protecting the double-sided adhesive layer,
An IC tag structure wherein the release paper can be easily peeled off from the double-sided adhesive layer by bending the release paper against the double-sided adhesive layer in a direction opposite to the surface film. 2. The IC tag structure according to claim 1, wherein the adhesive strength between the double-sided adhesive layer and the release paper is selected to be weaker than the planar bending strength (rigidity) of the surface film. 3. The adhesive strength between the double-sided adhesive layer and the release paper, and the planar bending strength of the surface film, when the release paper is peeled off and the IC tag is used, so that the labeler can peel off the release paper. 3. An IC tag structure according to claim 1, wherein the IC tag structure is selected from the following.