JP2001195556A - Label, label producing method, card and card producing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a label, into which much more information can be integrated, and a producing method thereof. SOLUTION: Concerning this label, an adhesive agent 3 is formed at the upper part of a separator 2, the upper part of the adhesive agent 3 is formed by successively laminating a tack paper 4, an adhesive agent 5 and a cover paper 6 and an IC chip 7 is integrated into the adhesive agent 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a label incorporating an IC chip with an antenna coil.

[0002]

2. Description of the Related Art Conventionally, various labels are known, and labels displaying data identification means such as bar codes are known.

[0003]

However, since the information amount of the barcode is extremely small and the barcode itself is used in various ways, the barcode identification function is being limited.

[0004] It is an object of the present invention to provide a label which can incorporate a larger amount of information and a method for manufacturing the same.

[0005]

In order to achieve the above object, a label according to claim 1 of the present invention comprises a tack paper, which is a paper or a film, and a tack paper, which serves as a base paper, is vertically adhered to the adhesive face of the tack paper. An IC chip that has an antenna coil for transmitting and receiving radio waves between the upper and lower tack papers, and that incorporates an IC chip capable of transmitting and receiving data from the antenna coil by operating with the induced power of the received radio waves. And

The label according to claim 2 of the present invention is attached with an adhesive so that a non-adhesive portion is partially formed between an upper paper made of paper or a film and a tack paper serving as a lower paper, and The non-adhesive portion has an antenna coil for transmitting and receiving radio waves, and an IC chip capable of transmitting and receiving data from the antenna coil by operating with the induced power of the received radio waves.

A label according to a third aspect of the present invention is a label in which a tack paper serving as a base paper is vertically adhered to an adhesive surface of a tack paper made of paper or a film, and a part of the adhesive of the top paper is used. An ink coil portion is formed, and an antenna coil for transmitting and receiving radio waves is provided between the ink film portion and the tack paper serving as the base paper. The antenna coil operates by induced electric power of the received radio wave to transfer data. An IC chip capable of transmitting and receiving from the antenna coil is incorporated.

According to a fourth aspect of the present invention, there is provided a label having an antenna coil for transmitting and receiving a radio wave to an adhesive of tack paper obtained by applying an adhesive to a lower surface of an upper paper made of paper or film. Attaching an IC chip capable of transmitting and receiving data from the antenna coil by operating with the induction power of the radio wave received by the coil, and attaching at least one of base paper or release paper to the adhesive,
An opening for exposing the IC chip is provided in at least one of the attached base paper or release paper. .

According to a fifth aspect of the present invention, there is provided a method of manufacturing a label.
Mounting an IC chip having an antenna coil on the tack paper on the top surface of the tack paper, supplying a label on the tack paper on which the IC chip is mounted and attaching the label to the tack paper, and sealing the IC chip A step of die-cutting the tack paper thus formed into a label shape while leaving a separator; and a step of peeling the die-cut tack paper from the separator.

A card according to a sixth aspect of the present invention is made of either paper or film, and a tack paper serving as an upper paper and a lower paper are stuck up and down, and a radio wave is provided between the upper paper and the lower paper. And an IC chip capable of transmitting and receiving data from the antenna coil by operating with the induction power of the radio wave received by the antenna coil.

The card according to claim 7 of the present invention is made of either paper or film, and the tack paper as the upper paper and the lower paper are vertically moved so that a non-adhesive part is partially formed therebetween. An IC chip that has an antenna coil for transmitting and receiving radio waves to the non-adhesive portion and that operates by the induction power of the received radio waves to transmit and receive data from the antenna coil. Features.

The card according to claim 8 of the present invention is the card according to claim 6, wherein the IC chip is concealed by an ink coating portion formed on at least one of tack paper or base paper as the upper paper. It is characterized by being.

According to a ninth aspect of the present invention, there is provided a card manufacturing method comprising:
An antenna coil for transmitting and receiving radio waves, a step of mounting an IC chip capable of transmitting and receiving data from the antenna coil by operating with the induction power of the received radio wave on the backing paper, and mounting the IC chip The method includes a step of bonding a tack sheet on a base sheet, and a step of cutting or perforating the tack sheet and the base sheet sandwiching the IC chip into a card shape.

In the labels of the first to fourth aspects and the cards of the sixth to eighth aspects, a fixing adhesive layer may be provided on the lower side of the IC chip. In the method for producing a label and the method for producing a card according to the ninth aspect, a step of applying a fixing pressure-sensitive adhesive layer may be provided on the base paper side.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a label and a method of manufacturing the label according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 shows a layer structure of a label according to the first embodiment of the present invention. In the label 1, an adhesive 3 is formed on an upper part of a separator 2. An adhesive 5 and an upper paper 6 are sequentially laminated and formed, and an IC chip 7 is incorporated in the adhesive 5.

The IC chip 7 has an antenna coil for transmitting and receiving radio waves, and the antenna coil operates by the induced power of the received radio waves so that data can be transmitted and received from the antenna coil. The IC chip 7 includes a microcomputer, a memory, and a power supply circuit. The microcomputer, the power supply circuit, and the memory derive power from radio waves received by the antenna, activate a transmission / reception program, and read and write data. As the memory, a memory capable of erasing data according to a specific instruction and storing data even without power is used.

According to the label 1, a large amount of data and programs can be stored inside the IC chip 7, and the object (for example, containers such as cardboard boxes, bottles, return boxes, product tags, etc.) to which the label 1 is attached can be stored. Information can be read and written.

When the upper and lower tack papers 4 and 6 are adhered to each other with an adhesive, a non-adhesive portion indicated by reference numeral 24 in FIG. The IC chip 7 may be incorporated in the portion to form a label.

Further, when the tack papers 4 and 6 are stuck together with an adhesive, an ink coating portion indicated by reference numeral 34 in FIG. 4 is formed in the adhesive 5 of the tack paper 6, and this ink coating portion is formed. The IC chip 7 may be incorporated into the IC card to form a label.

FIG. 2 shows a layer structure of the card according to the first embodiment of the present invention. The card 8 in FIG. 2 is obtained by laminating an upper paper 9 and a lower paper 10 with an adhesive 11, and an IC chip 7 with an antenna is sealed in a region where the adhesive 11 is applied. . According to the card 8 shown in FIG. 2, a large amount of data can be read and written like the label 1.

FIG. 3 shows a layer structure of a card according to another embodiment of the present invention. In a card 20, a lower paper 22 is pasted on an upper paper 23, and an adhesive 21 is put on the upper paper 23. The space portion 24 is formed in the upper paper 23. In this space 24, an IC chip 25 with an antenna is sealed.

According to the card 20 shown in FIG. 3, a large amount of data can be read and written like the label 1 shown in FIG. 1, and the IC chip 25 can be taken out and reused after use.

FIG. 4 shows a card 30 according to still another embodiment of the present invention.
An adhesive portion 33 is formed between the base material 1 and the base paper 32, and an ink coating portion 34 is provided in a region where the adhesive portion 33 is applied. An IC chip 35 having an antenna coil for transmitting and receiving radio waves between the ink film portion 34 and the base paper 32 and operating by the induction power of the received radio waves to transmit and receive data from the antenna coil. Is incorporated.

According to the card 30, after the card 30 is used, the backing paper 32 is peeled off to easily remove the IC chip 35, and since the ink coating portion 34 covers the adhesive 33, the IC chip 35 can be removed. In addition, it has an excellent effect of not damaging the antenna.

Although FIGS. 3 and 4 have described the cards 20 and 30, the labels may be formed by using tack paper having separators instead of the base papers 22 and 32 of the cards 20 and 30.

FIG. 5 shows steps of a method for manufacturing the label 1 of FIG. The method of manufacturing the label 1 includes a tack paper 3
A first step of applying an adhesive on the upper surface of the IC chip, a second step of mounting an IC chip 7 having an antenna coil on the adhesive, and supplying a label paper 48 on the adhesive having the IC chip 7 mounted thereon. A third step of bonding the tack paper 3 to the tack paper 3 by pressing, a fourth step of stamping the tack paper 3 incorporating the IC chip 7 into a label shape, and a separator 2 from the stamped tack paper 3.
And a fifth step of peeling off.

In the first step, the tack paper 3 is separated from the roll 40 of the tack paper 3 on which the separator 2 is bonded.
And a UV (ultraviolet) curable adhesive is applied to the tack paper 40 with the rolls 41, 41, and the UV lamp 42
To dry the UV curable adhesive.

In the second step, the tray 4 serving as a feeder
3 is taken out by a robot arm 45 provided with a suction pad 44, and the IC chip 7 is placed at a predetermined position on the tack paper 3 at a position read by an arrangement position detection sensor 46 (optical sensor such as a reflective interrupter). To place.

In the third step, the label paper 4 with the separator 47 removed is placed on the tack paper 3 on which the IC chip 7 is mounted.
8 and rolls 49, 49 with soft surfaces
The label paper 48 and the tack paper 3 are stuck together.

In the fourth step, the tack paper 3 incorporating the IC chip is die-cut by a half-cut roll 50 into a label shape.

In the fifth step, the punched tack paper 3 is separated from the separator 2, the tack paper 3 perforated in a label shape is lifted up and wound around a roll 51, and the separator 2 is sized by a cutter 53 to a predetermined size. And laminate the label with separator.

In the above-mentioned label, a fixing adhesive layer may be provided on the lower paper side of the IC chip 7. In the above-mentioned label manufacturing method, the fixing adhesive layer is coated on the lower paper side. A construction process may be provided.

It should be noted that the label may be removed from the laminate in the fourth step without using a die.

When the card of FIG. 2 is manufactured, in the step of FIG. 5, the tack paper 3 with the separator 2 is replaced with the base paper 10 without the separator 2, and the adhesive is not coated and dried. The IC chip 7 is mounted on the lower sheet 10, and a tack sheet 48 as the upper sheet 9 is attached to the lower sheet 10. Sheet 10
After the lamination with the tack paper 48, the paper is cut out in a card shape together with the tack paper 48, or a perforation for separation is made.

In the above card, the IC chip 7
A fixing pressure-sensitive adhesive layer may be provided on the lower paper side, and in the method for manufacturing a card, a coating step of the fixing pressure-sensitive adhesive layer may be provided on the lower paper side.

When the space 24 is provided as in the card 20 shown in FIG. 3, a tack sheet 48 is used as the upper sheet 23. This tack paper 48 does not apply an adhesive to a portion where the IC chip 25 is stored. After the lower paper 22 is bonded to the tack paper 48, the lower paper 22 is cut into a card shape together with the tack paper 48, or a perforation for separation is provided.

When the card 30 shown in FIG. 4 is manufactured, tack paper 48 is used as the upper paper 31. This tack paper 48
Prints or pastes a seal on the ink coating portion 34 at the portion where the IC chip 25 is to be stored. After the lower paper 32 is attached to the tack paper 48, the lower paper 32 is cut into a card shape together with the tack paper 48, or a perforation for separation is provided.

FIG. 6 shows a layer structure of a label according to a fourth embodiment of the present invention. In FIG. 6, an ink layer is formed on the upper surface of the tack paper 60 serving as the upper paper by a printer or the like. An adhesive layer 61 is formed on the lower surface of the tack paper 60, and the adhesive layer 61 has an IC similar to that shown in FIGS.
Chip 7 is incorporated. The peripheral portion of the IC chip 7 has an I
A fixing adhesive 62 for fixing the C chip 7 is formed, and the IC chip 7 is supported by the fixing adhesive layer 62. As a result, the IC chip 7 is incorporated between the tack paper 60 and the tack paper 63. An adhesive layer 64 is formed on the tack paper 63 serving as a base paper.
4, a release paper 65 is attached. Tack paper 63
An opening 66 for exposing the IC chip 7 is formed in the adhesive layer 64 and the release paper 65.
When printing is performed on a label made of the release paper 65 by a printer, printout is prevented from occurring due to the protrusion of the IC chip 7.

FIG. 7 shows a layer structure of a label according to a fifth embodiment of the present invention. In the label of this embodiment, the opening 6 is formed in the release paper 65 of the label shown in FIG.
6 is not provided, the tack paper 63 and the adhesive layer 64
Is closed by a release paper 67. According to this label, since the opening 68 is closed by the release paper 67, dust and dirt can be prevented, and the tack paper 63 can be easily processed because drilling of the release paper 67 is unnecessary. Also, when printing with a printer, the IC chip 7 is used.
Since the thickness can be absorbed, problems such as missing prints can be prevented. The other configuration is the same as that of the label in FIG. 6, and the description thereof will be used.

FIG. 8 shows a layer structure of a label according to the sixth embodiment of the present invention. The label according to this embodiment is such that the IC chip 7 is attached to the adhesive layer 61 of the upper tack paper 60 without using the tack paper 63 serving as the lower paper as in the labels of FIGS. A fixing pressure-sensitive adhesive layer 62 is formed around the chip 7, and the fixing pressure-sensitive adhesive layer 62
To which a release paper 69 is attached. This release paper 69
Is made of a relatively thick material capable of absorbing the thickness of the IC chip 7. An opening 70 for exposing the IC chip 7 is formed in the release paper 69 to prevent the occurrence of printing failure by the printer.

In the labels of the fourth to sixth embodiments, the IC chip 7 is attached to the adhesive layer 61 of the upper paper, and the adhesive layer 61 appears around the IC chip 7, so that the IC chip 7 is fixed. The pressure-sensitive adhesive layer 62 is not always necessary.

FIG. 9 is a diagram showing the label I in FIGS.
This figure shows the planar shape of the openings 66, 68, 70 for absorbing the thickness of the C chip 7, and when the IC chip 7 is incorporated in the corner of the label 71, the openings 66, 68, 70 around the IC chip 7. 70 is formed as shown by the dotted line.
In FIG. 9, reference numeral 72 denotes a tack paper 63 or a release paper 69 serving as a base paper.

[0044]

According to the present invention, there is provided a method for producing a label according to any one of claims 1 to 4 and a label according to claim 5, and a method according to claim 6 of the present invention.
According to the card manufacturing method of claim 8 and the card manufacturing method of claim 9, various and large amounts of information can be read and written without contact, and the amount of readable and writable information such as a bar code can be significantly increased.

In particular, according to the labels of the second and third aspects and the cards of the seventh and eighth aspects, the IC chip with the antenna coil can be taken out and reused, and the label and the claim of the third aspect can be reused. According to the card of No. 7, the presence of the IC chip can be kept secret by covering the IC chip portion with the ink coating portion.

Further, according to the label of the present invention, when printing is performed on the surface of the upper paper by a printer, the amount of protrusion of the bonded portion of the IC chip is reduced, and problems such as missing of the printer can be solved. .

[Brief description of the drawings]

FIG. 1 is a sectional view showing a layer structure of a label according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing a layer structure of the card according to the first embodiment of the present invention.

FIG. 3 is a sectional view showing a layer structure of a card according to a second embodiment of the present invention;

FIG. 4 is a sectional view showing a layer structure of a card according to a third embodiment of the present invention.

FIG. 5 is a process diagram of a label manufacturing method according to the first embodiment of the present invention.

FIG. 6 is a sectional view showing a layer structure of a label according to a second embodiment of the present invention.

FIG. 7 is a sectional view showing a layer structure of a label according to a third embodiment of the present invention.

FIG. 8 is a sectional view showing a layer structure of a label according to a fourth embodiment of the present invention.

FIG. 9 is a plan view showing an arrangement position and an opening of an IC chip provided on the label of FIGS. 6 to 8;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Label 2 Separator 3 Adhesive 4 Underpaper 5 Adhesive 6 Top paper 7 IC chip

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2C005 MA40 MB10 3E075 BA83 CA02 DA03 DA04 DA05 DA23 DA32 DB02 DB11 DB14 DB16 DB32 DD02 DD09 DD31 DD33 DE01 FA06 FA13 GA02 GA04 GA05 5B035 AA01 BA05 BA07 BB09 BC00 CA23

Claims (9)

[Claims] 1. A tack paper as a base paper is vertically adhered to an adhesive surface of a tack paper made of paper or film, and an antenna coil for transmitting / receiving a radio wave is provided between the upper and lower tack papers. A label, comprising: an IC chip capable of transmitting and receiving data from the antenna coil by operating with the induction power of a received radio wave. 2. A non-adhesive portion is bonded to an upper paper made of paper or film and a tack paper used as a base paper so that a non-adhesive portion is partially formed, and a radio wave is transmitted to and received from the non-adhesive portion. A label, comprising: an IC chip that has an antenna coil that operates and is capable of transmitting and receiving data from the antenna coil by operating with the induction power of a radio wave received by the antenna coil. 3. A label in which a tack paper serving as a base paper is vertically adhered to an adhesive surface of a tack paper made of paper or a film, and an ink coating portion is formed on a part of the adhesive of the top paper,
Between this ink film part and the tack paper as the base paper,
An IC chip that has an antenna coil for transmitting and receiving radio waves, and operates by the induction power of the radio wave received by the antenna coil to transmit and receive data from the antenna coil.
A label characterized by being incorporated. 4. An adhesive for tack paper obtained by coating an adhesive on the lower surface of an upper paper made of paper or film, the antenna having an antenna coil for transmitting and receiving a radio wave, and an induction power of the radio wave received by the antenna coil. An IC chip capable of transmitting and receiving data from the antenna coil by operating according to the above method is attached, and at least one of tack paper or release paper serving as a base paper is bonded to the adhesive, and the base paper or the peeled base is bonded. At least one of the paper and the IC
A label having an opening for exposing a chip. 5. A step of mounting an IC chip having an antenna coil on the tacky paper or on the tacky paper on an upper surface of the tacky paper, and supplying a label on the tacky paper on which the IC chip is mounted to supply the label to the tacky paper. Bonding process,
A method for producing a label, comprising: a step of die-cutting the tack paper sealing the IC chip into a label shape while leaving a separator; and a step of peeling the die-cut tack paper from the separator. 6. An antenna coil for transmitting and receiving a radio wave between the upper paper and the lower paper, wherein a tack paper serving as an upper paper made of either paper or film and a lower paper are vertically bonded to each other. A card incorporating an IC chip capable of transmitting and receiving data from the antenna coil by operating with the induction power of the radio wave received by the antenna coil. 7. A tack paper, which is an upper paper made of either paper or a film, and a lower paper are stuck up and down so that a non-adhesive part is partially formed therebetween, A card having an antenna coil for transmitting and receiving radio waves, and incorporating an IC chip capable of transmitting and receiving data from the antenna coil by operating with induction power of the received radio waves. 8. The card according to claim 6, wherein said IC chip is concealed by an ink coating portion formed on at least one of said tack paper and base paper. 9. An antenna coil for transmitting and receiving radio waves,
The antenna coil operates by the induction power of the received radio wave to transmit and receive data from the antenna coil.
A step of mounting a C chip on a sheet of paper, a step of bonding tack paper on the sheet of paper on which the IC chip is mounted, and a step of cutting or perforating the tack sheet and the sheet of paper sandwiching the IC chip into a card shape And a method for producing a card.