JP2000036023A - Inlet for radio card and radio card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a radio card of high convenience by improving the strength of an IC mounting part holding an IC chip and giving flexibility to an antenna part. SOLUTION: The radio card 1 is provided with an IC module substrate 11 where an IC chip and a connection conductor are installed, a coil substrate 13 where a conductor 17a being coil for antenna is formed on a base material whose rigidity is lower than that of a base material used for the IC module substrate 11, a connection part 12 which electrically connects the IC module substrate 11 and the coil substrate 13, a core sheet 2 in which an area corresponding to the IC module substrate 11 in an inlet 10 where the IC module substrate 11 and the coil substrate 13 are connected by the connection part 12 is formed on an opening 4, and which is constituted of material that melts by heat from outside and can flow around the IC module substrate 11 and surface sheets 3a and 3b stuck to the surfaces of the core sheet 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is applied to an automatic ticket gate used for transportation, a credit card used for payment of a price or fee in a sales business such as a department store or a retail store, a hotel, and the like. The present invention relates to a wireless card (contactless IC card).

[0002]

2. Description of the Related Art Today, regular tickets used in transportation, cards prepaid for a fixed fee (magnetic cards), and credit cards used for payment in department stores, retail stores, hotels, etc. Various cards capable of holding and writing data, such as magnetic cards) and electronic money cards (contact IC cards), are widely used. Some credit cards are moving to contact IC cards in view of an increase in data to be held and ease of security. On the other hand, non-contact IC cards (wireless cards) that excel in convenience
Are becoming increasingly popular.

[0003] The structure of a wireless card (non-contact IC card) will be described below. A wireless card that holds a large amount of data, processes data received from an external device, and transmits data to the external device;
An antenna used for receiving power and data from the external device and transmitting data to the external device.

[0004] The IC chip is fixed to an IC mounting portion of a wiring board used as a structure of a card. Also,
The coil part of the antenna is formed on a common wiring board with the IC mounting part on which the IC chip is mounted. When fixing the antenna to the IC mounting portion, an example using a special thin substrate typified by, for example, a metal lead frame has been proposed.

[0005]

In a wireless card, a relatively strong material is used for an IC mounting portion to protect an IC chip. On the other hand, by using an elastic material for the coil portion of the antenna, convenience in use is improved.

However, if a wireless card is formed by using a common wiring board for the IC mounting portion and the coil portion, the strength of the IC mounting portion becomes insufficient and the IC chip may be damaged. There is a problem that the rigidity of the portion is too high and the card exterior material is cracked. Also, if a metal lead frame is used for the IC mounting part,
Although the thickness of the lead frame can be made relatively thin, it is difficult to maintain strength because there is no reinforcing material connecting the conductors,
Further, a special device is also required for connecting the coil portion to the substrate, and there is a problem that the cost increases. An object of the present invention is to provide:

[0007]

SUMMARY OF THE INVENTION The present invention has been made on the basis of the above-described problems, and has an IC module substrate on which an IC chip is mounted, a material having an antenna coil formed therein, and a material having a lower rigidity than the IC module substrate. And a connection portion for connecting the connection area of the IC module board and the connection area of the coil board, thereby providing an inlet for a wireless card.

Further, the present invention provides an IC module substrate on which an IC chip is mounted, and a substrate made of a thin elastic body on which a coil conductor for an antenna is formed. A wireless card inlet comprising: a coil substrate having an opening in which an IC module substrate can be arranged on the same plane; and a plurality of connection regions for connecting the IC module substrate and the coil substrate. To provide.

Further, the present invention provides an IC module substrate in which an IC chip and a connecting conductor are sealed on a base material having a first rigidity, and a rigidity as compared with the base material used for the IC module substrate. A coil substrate on which a conductor for providing a coil for an antenna is formed on a base material having a low second rigidity; a connection member for electrically connecting the IC module substrate to the coil substrate; At least a region corresponding to the IC module substrate in an inlet where the IC module substrate and the coil substrate are connected by a member is formed in an opening, and is melted by heat from the outside and flows around the IC module substrate. A radio sheet comprising: a core sheet made of a possible material; and a top sheet adhered to each of the surfaces of the core sheet. It is intended to provide a de.

[0010]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a schematic diagram illustrating an example of a wireless card. As shown in FIG. 1, the wireless card 1 includes a core sheet 2 for holding a wireless card IC inlet 10 shown in a later stage using FIG. 2 or FIG. 3, a top sheet 3a covering both sides of the core sheet 2, 3
b. In addition, the core sheet 2 may be
It is composed of three or three layers. Also, the core sheet 2 includes
IC sealing part of inlet 10 (IC chip, see FIG. 2)
An opening 4 for accommodating the IC sealing portion is provided at a position corresponding to the above.

FIG. 2 is a schematic diagram showing an example of an IC inlet suitable for the wireless card shown in FIG. As shown in FIG. 2, the wireless card IC inlet 10 includes an IC module substrate 11 and a coil substrate 13 connected to the IC module substrate 11 by a connection unit 12.

The IC module substrate 11 has a substrate 11a
And a conductor 14 disposed on one side thereof.
The IC chip 15 is held thereon. As a material of the base material 11a, a material having high rigidity such as a glass epoxy resin is used. As the conductor 14, a copper foil having a predetermined thickness and high bending rigidity is used. The thickness of the conductor 14 is, for example, 18 μm.

The IC chip 15 and the conductor 14 are connected by a bonding wire 16. The IC chip 15 and the bonding wires 16 are sealed with a sealing resin 17a to form an IC sealing portion 17.

The coil substrate 13 comprises a base material 13a and conductors (antenna coil members) 18a, 1
8b. The coil substrate 13 is configured to have lower rigidity than the IC module substrate 11,
As a material of the base material 13a, for example, a polyethylene terephthalate (PET) film or vinyl chloride having high elasticity (flexibility) is used. As the material of the conductors 18a and 18b, aluminum foil, copper foil, or the like is used, and is formed by, for example, a printed wiring method by etching or pasting using a tape-shaped conductor.

The connection portion 12 is formed by projecting a part of the conductor 14 of the IC module substrate 11. The conductor 18 b of the coil substrate 13 is provided with a solder, a conductive adhesive, an anisotropic conductive film or an electric conductor. They are connected by welding or the like.

In such a configuration, after positioning the IC inlet 10 at a predetermined position of the core sheet 2,
By setting the topsheets 3a and 3b on both sides of the core sheet 2 and hot-pressing the whole from the front and back, the core sheet 2 and the topsheet 3a around the IC module substrate 11 of the IC inlet 10 The wireless card 1 which flows along the shape and has a flat front surface of the top sheets 3a and 3b is formed. In addition, instead of hot pressing, after attaching one surface sheet to the core sheet,
A predetermined amount of adhesive may be poured around the inlet 10 and the remaining topsheet may be attached and cured.

In this case, the portion of the IC sealing portion 17 that is thicker than the others in the IC inlet 10 is released from the excessive pressure during hot pressing by the opening 4 of the core sheet 2. This reduces damage to the IC chip 15 and cracks in the connection portion 12 and the conductor 14.

In the wireless card 1 thus formed, the base material 11a of the IC module substrate 11 and the IC sealing portion 17 are thick and highly rigid, while the base material 13a of the coil substrate 13 is thick. Is thinner than the thickness of the base material 11a of the IC module substrate 11, and the rigidity thereof is low. Therefore, even when an undesired external force is applied to the card 1, the IC module substrate 11 and the IC seal are not sealed. The stop portion 17 is hardly affected by an external force (bending by the external force), and can prevent the IC chip 15 from being broken. On the other hand, the base material 13a of the coil substrate 13 can be freely deformed following the top sheet 3a, and the top sheet 3a is prevented from being damaged by the influence of external force (bending by external force).

FIG. 3 is a schematic diagram for explaining another embodiment of the wireless card inlet shown in FIG. As shown in FIG. 3, the wireless card IC inlet 20 is
An IC module substrate 21, a coil substrate 22 disposed around the IC module substrate 21 so as to surround the substrate 21, and a plurality of fixing connection portions 23 connecting the two substrates.
And a connecting portion 26 for connecting the conductor 24b of the coil substrate 22 and the conductor 25 of the IC module substrate 21. It should be noted that no signal is supplied to the fixing connection portion 23 or the same signal as the connection portion 26 is supplied.

In the coil substrate 22, an opening 22 a from which the substrate 22 is removed is formed in a region where the IC module substrate 21 overlaps in a plane, in accordance with the size of the IC module substrate 21. A conductor 24a functioning as an antenna is provided on the front surface of the coil substrate.

In this configuration, the conductors 24 of the coil substrate 22
a, that is, the area of functioning as an antenna is increased, so that transmission and reception of data in non-contact, ie, wireless communication, is stabilized, and the flight distance of radio waves can be increased. Further, since there is no area where the IC module substrate 21 and the coil substrate 22 overlap, when the wireless card 1 is assembled, the card can be finished more flat.

Since the IC module substrate 21 and the coil substrate 22 are connected by the fixing connecting portion 23 and the connecting portion 26, they are not bent by an external force, and are assembled in the assembling process or as the wireless card 1. After that, sufficient strength can be provided.

FIG. 4 is a schematic diagram showing another embodiment of an inlet suitable for the wireless card shown in FIG. FIG.
As shown in FIG.
The IC module substrate 31 and the coil substrate 32 are overlapped with each other, and the conductor 33 of the IC module substrate 31 and the conductor 34 of the coil substrate 32 facing each other are soldered.
The connection portion 35 is formed by being connected by a conductive adhesive, an anisotropic conductive film, or the like.

In this configuration, the connection section 35 is an IC
Since the wireless card 1 is defined on the module substrate 31,
Even if external force is applied after assembly,
5 is hardly affected by an undesired external force, and high connection reliability is obtained.

FIG. 5 is a schematic view showing still another embodiment of the inlet suitable for the wireless card shown in FIG. As shown in FIG. 5, the IC inlet 40 for a wireless card has an IC module
A chip 43 and a conductor 44 are arranged on the same side, and an IC
On the same side as the sealing resin 45 at the end of the module substrate 41,
The connection portion 46 has a configuration in which the coil substrates 47 are stacked.

According to this configuration, it is possible to prevent the thickness of the inlet 40 from being increased due to the overlapping of the sealing resin 45 and the coil substrate 47, and it is possible to reduce the connection as compared with the example already described with reference to FIG. The configuration of the unit is simplified. Since the connecting portion 46 is provided on the base 42 of the highly rigid IC module substrate 41, even if the connecting portion 46 receives an external force after being assembled as the wireless card 1, the connecting portion 46 may be affected by an undesired external force. Is less likely to occur, and high connection reliability can be obtained.

As described above, the IC inlet for a wireless card according to the present invention is suitable for a substrate substrate having high rigidity such as glass epoxy and a coil substrate for an antenna, in contrast to the lead frame method using a conductor alone as a module substrate. The thickness of the wireless card is increased by properly arranging the thin elastic resin material in the core sheet constituting the wireless card and by taking into account the connection between the substrate and the resin material. In addition, the strength of the IC module substrate can be increased (the antenna portion has elasticity) as compared with the strength of the coil substrate.

In the above-described structure of the wireless card inlet, an example in which a wire bonding method is used as a method for connecting an IC chip and an IC module substrate has been described. For example, a flip chip method or the like can be used. .

[0029]

As described above, according to the present invention, the IC module substrate and the coil substrate constituting the wireless card can be constituted by independent substrates, whereby the rigidity of the IC module substrate can be reduced. Can be increased in comparison. Therefore, even when an undesired external force is applied, it is possible to reduce the possibility that the IC chip of the IC mounting portion (IC module substrate) is damaged or the card outer material is cracked.

In the connection portion, the area where the IC module substrate and the coil substrate overlap can be reduced, and the thickness of the overlapping portion can be reduced, so that the thickness of the card increases due to the thickness of the connection portion. Is prevented.

On the other hand, when assembling the wireless card IC inlet as a wireless card, the IC
Since the opening for the IC sealing portion corresponding to the C sealing portion is provided in the core sheet, the connection portion between the IC chip and the sealing portion or the coil substrate is damaged by the pressure applied in the lamination process of the top sheet. Is prevented. In addition, since the wireless card was configured such that the topsheet was attached to the two surfaces of the heat-meltable core sheet, the core sheet was integrated with the IC sealing portion in the topsheet laminating step, and the wireless card was flattened. Can be finished.

[Brief description of the drawings]

FIG. 1 is an exemplary diagram showing an example of a wireless card to which an embodiment of the present invention is applied;

FIG. 2 is an exemplary diagram showing an example of a wireless card IC inlet incorporated in the wireless card shown in FIG. 1;

FIG. 3 is a schematic diagram showing another embodiment of the wireless card IC inlet shown in FIG. 2;

FIG. 4 is a schematic view showing another embodiment of the wireless card IC inlet shown in FIG. 2;

FIG. 5 is a schematic view showing another embodiment of the wireless card IC inlet shown in FIG. 2;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Wireless card, 2 ... Core sheet, 3a ... Top sheet, 3b ... Top sheet, 4 ... Opening of core sheet, 10 ... IC inlet for wireless cards, 11 ..IC module substrate, 11a base material, 12 connection part, 13 coil substrate, 13a base material, 14 conductor, 15 IC chip, 16 -Bonding wire, 17 ... IC sealing part, 17a ... sealing resin, 18a ... conductor (coil), 18b ... conductor (for coil connection).

Claims (9)

[Claims] An IC module board on which an IC chip is mounted, an antenna coil formed thereon, a coil board formed of a material having lower rigidity than the IC module board, a connection area of the IC module board, A connection part for connecting the connection area of the coil substrate to the connection area of the coil board. 2. The wireless card inlet according to claim 1, wherein the connection portion is defined at a predetermined position on the IC module substrate. 3. The connecting portion is capable of connecting a conductor protruding from the base of the IC module substrate and a conductor exposed on the base of the coil substrate in a state of being superposed on each other. 2. The wireless card inlet according to claim 1, wherein: 4. The connection part connects a conductor protruding from the base of the IC module substrate and a conductor protruding from the base of the coil substrate. The described wireless card inlet. 5. An IC module substrate on which an IC chip is mounted, and a substrate made of a thin elastic body on which a coil conductor for an antenna is formed, wherein the IC module substrate is mounted on a portion corresponding to the IC module substrate. An inlet for a wireless card, comprising: a coil substrate having openings that can be arranged on the same plane; and a plurality of connection regions for connecting the IC module substrate and the coil substrate. 6. The wireless IC card inlet according to claim 5, wherein the connection area is formed integrally with a base material of the IC module substrate. 7. The wireless IC card inlet according to claim 5, wherein the connection area is formed integrally with a base material of the coil substrate. 8. An IC module substrate in which an IC chip and a connecting conductor are sealed on a first rigid substrate, and a second rigid substrate having a lower rigidity than the substrate used for the IC module substrate. A coil substrate on which a conductor for providing a coil for an antenna is formed on a base material having rigidity; a connection member for electrically connecting the IC module substrate to the coil substrate; At least a region corresponding to the IC module substrate among the inlets connected to the module substrate and the coil substrate is formed in an opening,
A wireless device comprising: a core sheet made of a material that can be melted by heat from the outside and flow around the IC module substrate; and a top sheet attached to each of the surfaces of the core sheet. card. 9. The wireless card according to claim 8, wherein the top sheet is laminated on the core sheet.