JP2001319203A - Non-contact data carrier - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact data carrier in which an IC chip can be easily and simply packaged on an antenna coil. SOLUTION: This non-contact data carrier is provided with a resin base material 11, a metallic antenna coil 13 provided almost all over the upper surface of the resin base material 11 and an IC chip body 23 joined through a conductive caulking member 25 to the antenna coil 13. The IC chip body 23 has an insulated substrate 21, a conductive pattern layer 22 provided on the insulated substrate 21 and an IC chip 20 connected to the conductive pattern layer 22. The conductive pattern layer 22 of the IC chip body 23 is conducted through the conductive caulking member 25 to the antenna coil 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact data carrier having a resin base material, an antenna and an IC chip, and more particularly to a non-contact data carrier capable of easily mounting an IC chip.

[0002]

2. Description of the Related Art Conventionally, non-contact data carriers have been used in distribution systems and the like. Such a non-contact data carrier is used, for example, by being attached to a product packaging box or the product itself.

A non-contact data carrier generally includes a resin base material, a metal antenna coil provided on the resin base material, and an IC chip connected to the antenna coil.

When an electromagnetic wave is emitted from a reader to a non-contact type data carrier, an induced voltage is generated in an antenna coil to operate an IC chip.

[0005]

The non-contact type data carrier includes the metal antenna coil provided on the resin substrate as described above and the IC chip connected to the antenna coil. When mounting the IC chip on the antenna coil, the IC chip is arranged at a predetermined position on the antenna coil, and the IC chip is heated and pressed on the antenna coil.

However, it is difficult to position and arrange the IC chip at a predetermined position on the antenna coil, so that it takes a long time to mount the IC chip.

[0007] The present invention has been made in view of the above points, and an object of the present invention is to provide a non-contact type data carrier on which an IC chip can be easily and easily mounted.

[0008]

The present invention provides a resin substrate,
An antenna provided on a resin base material and an IC chip connected to the antenna are provided. The IC chip includes an insulating substrate, a conductive pattern layer provided on the insulating substrate, and a conductive pattern layer. A non-contact type data carrier having an IC chip connected thereto, wherein the IC chip body is connected to the antenna by a conductive pattern layer.

According to the present invention, an IC chip composed of an insulating substrate, a conductive pattern layer, and an IC chip is prepared in advance, and the IC chip is connected to the antenna with the conductive pattern layer connected to the antenna.
A C chip body is provided on a resin substrate. Therefore, there is no need to position and arrange the IC chip at a predetermined position of the antenna.
Mounting of the C chip becomes easy.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 show a first embodiment of a contactless data carrier according to the present invention.

As shown in FIGS. 1 to 3, for example, a non-contact type data carrier 10 such as an IC card or an IC tag is used.
Is an aluminum metal formed by etching using a photoresist layer (not shown) over substantially the entire area of the upper surface of the resin substrate 11 (one side of the resin substrate 11). An antenna coil 13 and an IC chip body 23 provided on the antenna coil 13 are provided.

Of these, the IC chip body 23 is the insulating substrate 2
1 and a conductive pattern layer 2 provided on an insulating substrate 21
2 and the IC chip 20 connected to the conductive pattern layer 22
And The conductive pattern layer 22 of the IC chip body 23 is connected to a pair of ends 13a and 13b of the antenna coil 13 via a conductive caulking member 25 as described later. In place of the antenna coil 13, an area receiving / transmitting type antenna 33 shown in FIG. 5 may be used.

A metal reinforcing member 26 made of a metal plate is provided on the upper surface of the resin substrate 11 in order to reinforce strength when the IC chip 23 is provided on the antenna coil 13.

The pair of ends 13 of the antenna coil 13
a and 13b are arranged inside and outside the antenna coil 13, respectively.

As shown in FIG. 1, a first protective layer 15 is provided on the upper surface of the resin substrate 11 so as to cover the antenna coil 13 and the IC chip 23.

Next, the material and shape of each part will be described.

As the resin substrate 11, for example, paper or nonwoven fabric can be used in addition to a plastic film such as polyester, polyethylene, polypropylene and polyimide, but polyester and polyimide are mainly used because of their chemical resistance and heat resistance. . Usually, the shape of the antenna coil 13 is about 40 mm × 40 mm, but the antenna coil 13 may be formed in a card shape or the like depending on the intended use and required performance. The thickness of the resin substrate 11 is 30 to 200 μm.
It has become.

The metal antenna coil 13 is made of aluminum and has a thickness of about 5 to 100 μm, but preferably 15 to 30 μm from the viewpoint of cost and electrical characteristics. Further, the IC chip 20 has a size of 1.5 mm ×
Those having a size of 1.5 mm square and a thickness of about 180 μm are used.

The metal reinforcing member 26 is made of aluminum and formed at the same time as the antenna coil 13, but may be made of another metal.

The first protective layer 15 is made of, for example, polyester, PVC, polyimide, polypropylene, polyethylene, etc., but is mainly made of polyester in terms of strength and heat resistance.

The non-contact data carrier 10 having such a configuration is used by being attached to, for example, a product packaging box or the product itself. That is, an induced electromotive force is generated in the antenna coil 13 by an electromagnetic wave from a reader of a distribution system (not shown),
3, the IC chip 20 connected via the conductive caulking member 25 and the conductive pattern layer 22 operates, and the IC chip 2
Information from 0 is transmitted to the reader.

Next, a method of manufacturing a non-contact type data carrier having such a configuration will be described. First, the resin substrate 11 is prepared, and the antenna coil 13 is formed on the upper surface of the resin substrate 11 by an etching method using a photoresist layer.

At the same time, a metal reinforcing member 26 is provided on the upper surface of the resin substrate 11 by an etching method. Note that the metal reinforcing member 26 may be provided on the resin substrate 11 by sticking.

On the other hand, as shown in FIG.
A conductive pattern layer 22 is provided thereon, and an IC chip 20 is further connected to the conductive pattern layer 22 so that an IC
A chip body 23 is prepared.

Next, as shown in FIG. 1, an IC chip 23 is mounted on the resin base 11 and the antenna coil 13. Next, the conductive pattern layer 22 and the insulating substrate 21 of the IC chip body 23, and a pair of end portions 13a of the coil 13,
13b and the conductive caulking member 2 penetrating through the resin base material 11
5 is provided, the conductive caulking member 25 is caulked, and the resin base material 11 and the antenna coil 13 are joined.

In this case, the pair of ends 13 of the coil 13
a and 13b are electrically connected to the IC chip 20 via the conductive pattern layer 22. Since the metal reinforcing member 26 is formed on the resin base material 11 when caulking the Dentsu caulking member 25, the force applied to the conductive caulking member 25 can be received by the metal reinforcing member 26, 1
1 is prevented from sagging and shrinking.

Thereafter, the first protective layer 15 is overlaid on the antenna coil 13 and the IC chip body 23 on the upper surface side of the resin base material 11, and the first protective layer 15 is formed on the antenna coil 13 and the IC chip body 23 by lamination. The layer 15 is fixed by pressing.

As described above, according to the present embodiment, the IC chip body 23 including the insulating substrate 21, the conductive pattern layer 22, and the IC chip 20 is prepared in advance.
Since this IC chip body 23 is connected to the antenna coil 13 on the resin base material 11 by the conductive caulking member 25, the mounting work of the IC chip 20 can be performed without positioning the antenna coil 13 and the IC chip 20. .
Therefore, the mounting operation of the IC chip 20 can be performed easily and easily.

Next, a second embodiment of the present invention will be described with reference to FIG. In the embodiment shown in FIG. 4, an IC chip body 23 including an insulating substrate 21, a conductive pattern layer 22, and an IC chip 20 is arranged on the lower surface of the resin substrate 11, and an insulating adhesive 14 is used. The IC chip 23 is bonded to the resin substrate 11 by using the conductive caulking member 25.

In FIG. 4, another configuration is shown in FIGS.
Is substantially the same as the first embodiment shown in FIG. In FIG. 4, the same parts as those in the first embodiment shown in FIGS. 1 to 3 are denoted by the same reference numerals, and detailed description is omitted.

In FIG. 4, a first protective layer 15 is provided to cover the antenna coil 13, and a second protective layer 16 is provided to cover the IC chip 23.

Next, referring to FIGS. 6 and 7, the third embodiment of the present invention will be described.
An embodiment will be described. The embodiment shown in FIGS. 6 and 7 includes an insulating substrate 21 of an IC chip body 23,
The conductive pattern layer 22 is formed in an elongated shape,
Other configurations are substantially the same as those of the first embodiment shown in FIGS.

In FIGS. 6 and 7, the same parts as those in the first embodiment shown in FIGS. 1 to 3 are denoted by the same reference numerals, and the detailed description is omitted.

As shown in FIGS. 6 and 7, since the insulating substrate 21 and the conductive pattern layer 22 of the IC chip body 23 are formed in an elongated shape, a pair of ends 13a and 13b of the antenna coil 13 are formed. The IC chip body 23 can be easily connected between the pair of ends 13a and 13b even if they are apart from each other.

[0035]

As described above, according to the present invention, an IC chip body composed of an insulating substrate, a conductive pattern layer, and an IC chip is prepared in advance, and this IC chip body is bonded to a resin base material. The IC chip can be easily and easily mounted without the need to position the antenna and the IC chip.

[Brief description of the drawings]

FIG. 1 is a side view showing a first embodiment of a contactless data carrier according to the present invention.

FIG. 2 is a side view showing an IC chip body.

FIG. 3 is a plan view showing a first embodiment of a non-contact data carrier according to the present invention.

FIG. 4 is a side view showing a contactless data carrier according to a second embodiment of the present invention.

FIG. 5 is a diagram illustrating an area receiving / transmitting antenna.

FIG. 6 is a plan view showing a third embodiment of the contactless data carrier according to the present invention.

FIG. 7 is an enlarged view of an IC chip body.

[Explanation of symbols]

 Reference Signs List 10 Non-contact data carrier 11 Resin base material 13 Antenna coil 15 First protective layer 16 Second protective layer 20 IC chip 21 Insulating substrate 22 Conductive pattern layer 23 IC chip body 25 Conductive caulking member 26 Metal reinforcing member

Claims (3)

[Claims] 1. An electronic device comprising: a resin base; an antenna provided on the resin base; and an IC chip connected to the antenna, wherein the IC chip is provided on an insulating substrate and on the insulating substrate. Conductive pattern layer and I connected to the conductive pattern layer.
A non-contact data carrier, comprising: a C chip; and the IC chip body is connected to the antenna by a conductive pattern layer. 2. The non-contact data carrier according to claim 1, wherein the IC chip is provided on the same side of the resin substrate as the antenna. 3. The non-contact data carrier according to claim 1, wherein the IC chip body is provided on a side of the resin base opposite to the antenna.