JP2000231614A - Data carrier which can be read by electromagnetic wave - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize the inexpensive mass production of a data carrier suitable as an air tag by loading an electronic part module so that it straddles spiral conductor patterns. SOLUTION: A data carrier DC has a data carrier main body 100 where spiral conductor patterns (antenna coils) 102 formed of copper foil are held on one face of a polyethylene terephthalate substrate 101 and an electronic part module 200 where a bear chip IC 202 is mounted on a small piece 201 formed of glass epoxy. In the module 200, the small piece 201 is loaded on the data carrier main body 100 so that it straddles (crosses) a circular conductor bundle 102a constituting the conductor patterns 102. Electric connection with the conductor patterns 102 is executed in the inner peripheral terminal pad 103 and the outer peripheral terminal pad 104 of the conductor patterns 102.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to, for example, air tags,
The present invention relates to an electromagnetic wave readable data carrier suitable for a distribution management label, an unmanned ticket gate, and the like, and more particularly to an electromagnetic wave readable data carrier that can be mass-produced at low cost.

[0002]

2. Description of the Related Art As an electromagnetic wave readable data carrier of this type, for example, an airline tag described in Japanese Patent Application Laid-Open No. 6-243358 is known. In the near future, this airline tag is expected to be used in a disposable manner for the management of customer luggage at airports. A huge demand of 10,000 sheets is expected. Therefore, it is desired to establish an ultra-low-cost mass production technology for this kind of airline tag.

The aeronautical tag described in the above publication comprises a rectangular PET film base on one side of which a spiral conductive pattern serving as an antenna coil and an IC component serving as a transmitting / receiving circuit and a memory are mounted. ing. 13.56 MHz is scheduled as the frequency of the reading electromagnetic wave.

A spiral conductor pattern serving as an antenna coil can be formed by selectively corroding an aluminum foil adhered to one side of a PET film by etching. Therefore, the resist is formed by a known photolithography technique, followed by a wet etching step, etc.
A continuous production line by TR (Roll To Roll) can be realized. On the other hand, IC components such as a transmission / reception circuit and a memory are formed as a single-chip flip chip, and the flip chip is bonded and fixed to a PET film base via an anisotropic conductive sheet.

[0005]

However, in the aerial tag having the above structure, since the IC components mounted on the PET film base are brittle in a flip chip structure, they are easily broken when the base is bent. There is a disadvantage that it will. This disadvantage can be solved by forming a potting portion that covers and protects the flip chip, but the thermosetting resin used for the potting portion is cured at 120 ° C.
Since heating for 30 minutes is necessary, there are problems that the continuous production line stagnates by that amount, and that the PET film cannot withstand such long-time heating.

In addition, in the aerial tag having the above-described structure, since the flip chip is directly mounted on the PET film base, electrical connection between the flip chip and the antenna coil is possible. In order to achieve this, both the inner and outer peripheral terminals of the spiral conductor pattern serving as the antenna coil must be juxtaposed to one side of the inner and outer periphery of the spiral conductor pattern. For this purpose, there is no other way than to jump over the circulating conductor bundle with a jumper member or to dive under the circulating conductor bundle with the back surface side conductor. The method of straddling with a jumper member causes an increase in cost due to an increase in man-hours.
The method of immersing in the backside conductor requires a double-sided conductor base material, which increases the cost. Furthermore, since the size of the flip chip is about 1.5 mm × 1.5 mm and the distance between the pair of terminal pads is about 1 mm, high precision positioning is required for the arrangement of the conductor pattern for flip chip connection. As a result, the product yield decreases.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and has as its object to provide electromagnetic wave readable data suitable as, for example, an airline tag, a logistics management label, and an unmanned ticket pass. It is to enable ultra-low-cost mass production of carriers.

[0008]

The invention described in claim 1 of the present application is directed to a data in which a spiral conductive pattern constituting an antenna coil is held on a film-like, sheet-like, or thin-plate-like insulating base. Carrier body, film form,
An electronic component module comprising a sheet-shaped or thin plate-shaped insulating small piece holding an electronic component constituting a transmission / reception circuit or a memory, and forming a potting portion for covering and protecting the electronic component, The electronic component module is mounted on the main body of the data carrier such that the insulating small pieces straddle the spiral conductor bundle forming the spiral conductor pattern, and the electrical connection with the spiral conductor pattern is made by the spiral conductor pattern. And separately performed on an inner peripheral side and an outer peripheral side of the data carrier.

According to such a configuration, the completed electronic component on the data carrier is protected by the potting portion, and does not break or break even when bent or subjected to an external impact. Further, since the potting process is not included in the manufacturing process of the data carrier main body, the continuous manufacturing line does not stagnate. Also, in the production of electronic component modules, even in batch processing, an amount corresponding to the production speed of the data carrier main body can be produced. In addition, the electronic component itself is electrically connected to the antenna coil via the insulating small piece on which it is mounted, eliminating the need for jumper members and backside conductors for juxtaposing the antenna coil pads on one of the inner and outer circumferences. is there. Therefore, the data carrier body is produced on a continuous production line, while the electronic component module is produced in a batch process, and then the two are combined. Mass production becomes possible.

According to a second aspect of the present invention, the electronic component mounting surface of the insulating small piece constituting the electronic component module and the spiral conductor pattern forming surface of the insulating base constituting the data carrier body face each other. The electromagnetic wave readable data carrier according to claim 1, wherein the electronic component module is mounted on the data carrier body.

According to such a configuration, a single-sided conductor substrate can be used for the insulating small pieces, and the through-hole processing is not required, so that the cost can be further reduced.

According to the invention described in claim 3 of the present application, the potting portion for covering and protecting the electronic component on the insulating small piece is provided directly above the spiral conductor bundle of the spiral conductor formed on the insulating base. The electromagnetic wave readable data carrier according to claim 2, wherein the data carrier is located.

According to such a configuration, since the potting portion is interposed between the electronic component and the circulating conductor bundle and insulation between them is maintained, the electronic component is arranged directly above the circulating conductor bundle. This can minimize the connection pad space arranged on both sides of the circulating conductor bundle.

The invention according to claim 4 of the present application is characterized in that a light-shielding material is used as a material of the insulating small pieces constituting the electronic component module.
3. An electromagnetic wave readable data carrier according to any one of 3.

According to such a configuration, the destruction of the analog circuit in the IC constituting the electronic component due to light exposure can be prevented.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a data carrier according to the present invention will be described below with reference to the accompanying drawings.

As described above, the electromagnetic wave readable data carrier according to the present invention is formed by holding a spiral conductive pattern constituting an antenna coil on a film-shaped, sheet-shaped or thin-plate-shaped insulating base. An electronic component formed by holding a data carrier body and a film-shaped, sheet-shaped, or thin-plated insulated small piece to hold an electronic component constituting a transmitting / receiving circuit, a memory, and the like, and forming a potting portion that covers and protects the electronic component. The electronic component module is mounted on the data carrier main body so that the insulating small pieces straddle the spiral conductor bundle forming the spiral conductor pattern, and the electric component is electrically connected to the spiral conductor pattern. The electrical connection is performed separately on the inner peripheral side and the outer peripheral side of the spiral conductor pattern.

(First Embodiment) An example of an embodiment of a data carrier is shown in FIG. As shown in these figures, this data carrier DC has a 25 μm thick PE.
A data carrier body 100 holding a 10 μm thick copper foil spiral conductor pattern (corresponding to an antenna coil) 102 on one surface of a T (polyethylene terephthalate) base 101, and a 70 μm thick glass epoxy small piece 2.
01 and an electronic component module 200 in which a bare chip IC 202 is mounted. Then, the electronic component module 200 is configured such that the small piece 201 has the spiral conductor pattern 1.
02 is mounted on the data carrier main body 100 so as to straddle (in other words, intersect) the circling conductor bundle 102a constituting the helical conductor pattern 102, and the electric connection with the helical conductor pattern 102 Side terminal pad 10
3 and the outer peripheral terminal pad 104.

An example of a mounting structure of the electronic component module 200 is shown in an enlarged sectional view of FIG. 1 and 2
The method of manufacturing the data carrier body 100 and the electronic component module 200 shown in FIG.

FIG. 3 shows an example of a process for forming the spiral conductor pattern 102 constituting the antenna coil. The procedure for forming the spiral conductor pattern 102 serving as an antenna coil on one surface of the PET film base 101 will be described with reference to FIG.

(Step A) First, a Cu-PET laminated base material 1 is prepared. As an example, one side of a PET film 2 having a thickness of 25 μm is
Thick copper foil 3 is overlaid, and this is placed at 150 ° C. under a pressure of 5 kg / cm.
^Under the conditions of ² , lamination and bonding are performed through thermal lamination. As a result, the C with the copper foil 3 adhered to the surface of the PET film 2
The u-PET laminate 1 is completed.

(Step B) Next, a spiral etching resist pattern 4 is formed on the surface of the copper foil 3 of the Cu-PET laminate 1. That is, an insulative etching resist ink is formed on the copper foil 3 by using, for example, an offset printing method in a spiral shape having the number of turns, the line width, the pitch, and the inner and outer circumferences to obtain the necessary L value and Q value as the characteristics of the coil. Print. At this time, a resist ink that is cured by heat or active energy rays is used. Ultraviolet rays or electron beams are used as the active energy rays. When ultraviolet rays are used, a photopolymerizing agent is added to a resist ink.

(Step C) Next, on the surface of the copper foil 3 of the Cu-PET laminated material 1, a conductive electrode is used to form a required electrode shape at a position for making electrical connection with the electrode of the electronic component module 200. Conductive etching resist pattern 5
a and 5b are formed. These resist patterns 5a, 5b
Is formed by the same offset printing as in the above step, and a thermosetting conductive adhesive that is cured by heat treatment at 120 ° C. for about 20 minutes is used as the resist ink. In addition, the printing of the conductive ink in this step may use a commonly-used screen printing method, and as an ink material,
For example, a mixture in which a photopolymerizing agent is added to a mixture of Ag particles and a thermoplastic adhesive, or a solder paste may be used.

(Step D) Then, the copper foil portion 6 exposed from the etching resist patterns 4, 5a, 5b is removed by performing a conventionally known etching, and a spiral conductor pattern serving as an antenna coil (102 in FIG. 1). To form In this etching process, the copper foil 3 is removed using FeCl ₂ (120 g / l) as an etchant at 50 ° C. Thereafter, in general, unless the insulating etching resist 4 formed in the step B is removed, the electronic component cannot be mounted on the circuit, that is, on the spiral pattern forming the antenna coil. In the present invention, the conductive resist patterns 5a and 5b are provided as described in the step C, and it is not necessary to remove the insulating resist by mounting the electronic components at these positions. That is, according to the present invention, the step of removing the etching resist can be omitted, and the effect that the etching resist 4 also functions as an insulating protective layer on the surface of the copper foil circuit pattern can be obtained.

(Step E) Finally, in the present embodiment, a convex portion (potting portion) of an electronic component module described later.
Is press-formed in the through hole 7 into which can be inserted. By the above, PE
The data carrier body 100 in which the spiral conductor pattern 8 (102) serving as an antenna coil is held on one side of the T film base 2 (101) is completed.

Next, FIG. 4 shows an example of a production process of the electronic component module 200. Referring to the figure, a bare chip I, which is an electronic component constituting a transmitting / receiving circuit, a memory, etc., is placed on a film-shaped or sheet-shaped insulating small piece 201.
C202, and the bare chip IC 202
The procedure for forming the resin potting 15 to cover and protect (14) will be described.

(Step A) First, in the first step, 70 μm
Thick copper-foiled glass epoxy tape 9 (for example, CS-
3524 (manufactured by Risho Kogyo KK) is prepared. In the drawing, reference numeral 10 denotes a glass epoxy tape base material, and reference numeral 11 denotes a copper foil adhered on the tape base material 10.

(Step B) Next, the copper foil 1 of the tape base material 10
1 is processed into a required wiring pattern shape. At the same time, copper foil 1
1 are separated from each other by two conductor regions 11a, 11
In order to form b, processing of the hole or groove 12 and the like is also performed.
As a processing method at this time, conventionally known etching may be used, but in the case where the shape of the wiring pattern is simple, press processing can be performed at lower cost.

(Step C) Next, the anisotropic conductive film 13 is laminated on the surface of the copper foil 11. This anisotropic conductive film 1
3 is obtained by dispersing and mixing conductive particles in an insulating resin film base material, which has an insulating property in both a plane direction and a thickness direction in a normal state, When pressure is applied locally, only the portion to which the pressure is applied is crushed and has a property of conducting locally only in the thickness direction. As a film substrate, for example, if a flexible one based on a thermoplastic resin is used,
Even if the data carrier main body 100 is deformed by bending or the like, no problem such as close separation occurs.

(Step D) Next, the anisotropic conductive film 13
The bare chip IC 14 as an electronic component (FIG. 1)
Is mounted on the conductor pattern formed by the copper foil 11 on the surface of the glass epoxy tape base material 10. The bare chip IC 14, which is an electronic component, is configured as a so-called surface mount type component in which connection bumps 14a, 14b protrude from the bottom surface. The bumps 14 a and 14 b protruding from the bottom are fixed to the resin material forming the anisotropic conductive film 13 by being fused into the anisotropic conductive film 13. Also, a large number of conductive particles are dispersed and mixed in the resin material constituting the anisotropic conductive film 13, and these are densely interposed between the bumps 14 a and 14 b and the conductive pattern of the copper foil 11. Thus, electrical continuity between the bumps 14a, 14b and the conductor pattern of the copper foil 11 is ensured. The bare chip IC 14 is mounted by placing the IC 14 at a predetermined position,
While heating the anisotropic conductive film 13 at 60 ° C. for a heating time of 20 seconds, the IC 14 was heated at a load pressure of 21.7 kg / cm ^2.
Is pressed against the base material 10. Then, the film material constituting the anisotropic conductive film 13 is locally softened and melted, and the bumps 14a and 14b protruding from the bottom surface of the bare chip IC 14 are fixed to the film material, while the conductive particles in the film material come into close contact with each other. Electrical coupling is performed.

(Step E) Next, the bare chip IC 14 as an electronic component is sealed by potting with a resin to complete an electronic component module (corresponding to 200 in FIG. 1).
The potting portion 15 is made of, for example, a thermosetting resin,
This is performed by supplying the bare chip IC 14 as an electronic component so as to cover the bare chip IC 14 by a method such as a dispenser or screen printing, and curing the same through a heat treatment at a temperature of 120 ° C. for a time of one hour.

In the above process, the material of the insulating small piece 201 for mounting the electronic component is PET.
A (polyethylene terephthalate) film or a polyimide film may be used.

Next, the electronic component module 200 is mounted on the data carrier main body 100 such that the insulating small pieces 201 straddle the spiral conductor bundle 102a constituting the spiral conductor pattern 102, and the spiral conductor pattern Referring to FIG. 5, a procedure for making electrical connection to the inner and outer peripheral sides of the spiral conductor pattern 102 separately and separately will be described with reference to FIG.

(Step A) First, the electronic component module 20
0, the electronic component mounting surface faces the conductive pattern forming surface of the data carrier main body 100, and the electronic component module 200 straddles the orbiting conductor bundle 102a constituting the spiral conductor pattern 102 (in other words, crossing). Do)
Thus, the electronic component module 200 is mounted on the data carrier main body 100. At this time, the potting portion 15 covering the bare chip IC 14 which is an electronic component is received in the hole 7 opened on the data carrier main body 100 side. Further, on the electronic component module 200 side,
The pair of copper foil regions 11a, 11b that are electrically connected to the bumps 14a, 14a of the bare chip IC 14 are formed on the data carrier body 100 side by a pair of conductive resist patterns 5
a, 5b. That is, the copper foil regions 11a and 11b on the electronic component module 200 side and the conductive resist patterns 5a and 5b on the data carrier main body 100 side face each other.

(Step B) Next, the indenters 16a and 16b heated at a temperature of 160 ° C. are applied from above the electronic component module 200, particularly, directly above the pair of conductive resist patterns 5a and 5b, with a load pressure of 21.7 kg for a time. Press for 20 seconds. At this time, the film base material constituting the anisotropic conductive film 13 is locally softened and melted, and the electronic component module 2
00 terminal areas 11a and 11b and the data carrier body 1
The 00-side conductive resist patterns 5a and 5b are bonded and fixed. Further, the conductive particles in the anisotropic conductive film 13 are locally in close contact only with the portions corresponding to the indenters 16a and 16b, and only the portions are conductive in the thickness direction to secure the electrical connection between the two. On the other hand, the anisotropic conductive film portion without deformation can be used for bonding the electronic component module 200 and the data carrier body 100 while maintaining insulation, and the etching resist 4 on the surface of the spiral conductive pattern 102 remains as an insulating material. The electronic component module 200
The wiring pattern (not shown) on the insulating base piece 10 (201) also serves as a jumper member connecting the inner and outer peripheries of the spiral conductor pattern 102. As a result, unlike the conventional structure, the spiral conductor pattern 102 and the bare chip IC can be used without using a jumper member or a back wiring pattern.
14 can be electrically connected.

The above steps complete the electromagnetic wave readable data carrier 1 according to the present invention. In this embodiment, in particular, the etching mask is formed by a high-speed printing method such as offset or gravure printing. And the etching mask is performed by two-color continuous printing of an insulating resist ink and a conductive ink, thereby eliminating the necessity of removing the etching mask, greatly reducing the etching process required by the conventional photolithography method. Can be reduced.

(Second Embodiment) In this embodiment, solder is used in place of the anisotropic conductive film 13 in the configuration of the electronic component module 200 of the first embodiment. The manufacturing process of the electronic component module 200 according to the second embodiment will be described with reference to FIG.

(Step A) First, in the first step, 70 μm
Thick copper-foiled glass epoxy tape 9 (for example, CS-
3524 (manufactured by Risho Kogyo KK) is prepared. In the drawing, reference numeral 10 denotes a glass epoxy tape base material, and reference numeral 11 denotes a copper foil adhered on the tape base material 10.

(Step B) Next, the copper foil 1 of the tape base material 10
1 is processed into a required wiring pattern shape. At the same time, copper foil 1
1 are separated from each other by two conductor regions 11a and 11
In order to form b, processing of the hole or groove 12 and the like is also performed.
As a processing method at this time, conventionally known etching may be used, but in the case where the shape of the wiring pattern is simple, press processing can be performed at lower cost.

(Step C) Next, a solder paste 17 is supplied to a predetermined position of the copper foil wiring pattern on the tape base material 10 by a screen printing method, an offset printing method, a gravure printing method, a dispenser or the like. Then 120
After drying at a temperature of about 5 minutes, the solder paste 17 is dried.

(Step D) Next, an adhesive 18 is applied to the surface of the base material 9 other than the terminals and the like to which the solder paste has been applied. At this time, the acrylic adhesive (for example, DB-5541:
After printing and coating with Diabond Industrial Co., Ltd.
C., formed after drying for 10 minutes.

The adhesive 18 can be used as a temporary fixing member during a bonding step when the electronic component module 200 is mounted on the data carrier main body 100 in a subsequent step, and further reinforces the bonding strength by soldering. There is also an effect. However, if sufficient strength can be obtained only by the bonding force of the solder 17, the adhesive 18 is not necessary.

(Step E) Next, a bare chip IC 14, which is an electronic component similar to that of the first embodiment, having connection bumps 14 a and 14 b protruding from the bottom surface, is connected to connection terminal portions on a wiring pattern made of copper foil 11. After the arrangement, the bare chip IC 14 is mounted on the glass epoxy tape 9 through a conventionally known process such as reflow.

If a low-melting solder such as a Su—Zn or Su—Bi solder is used as the solder paste 17 used at this time, a material having poor heat resistance such as PET (polyethylene terephthalate) is used as the base material 10. Can be.

(Step F) Next, a potting portion 15 is formed by sealing the bare chip IC, which is an electronic component, with a resin in the same manner as in the first embodiment.

Next, the electronic component module 200 prepared in the step shown in FIG.
Circular conductor bundle 102 constituting spiral conductor pattern 102
The procedure of mounting on the data carrier main body 100 so as to straddle a and separately performing the electrical connection with the spiral conductor pattern separately on the inner peripheral side and the outer peripheral side of the spiral conductor pattern 102 is as follows. This will be described with reference to FIG.

(Step A) First, the electronic component module 20
0, the electronic component mounting surface faces the conductive pattern forming surface of the data carrier main body 100, and the electronic component module 200 straddles the orbiting conductor bundle 102a constituting the spiral conductor pattern 102 (in other words, crossing). Do)
Thus, the electronic component module 200 is mounted on the data carrier main body 100. At this time, the potting portion 15 covering the bare chip IC 14 which is an electronic component is received in the hole 7 opened on the data carrier main body 100 side. Further, on the electronic component module 200 side,
The pair of copper foil regions 11a and 11b that are electrically connected to the bumps 14a and 14b of the bare chip IC 14 are located directly above the pair of conductive resist patterns 5a and 5b on which the conductive resist is disposed on the data carrier body 100 side. . That is, the copper foil area 1 on the electronic component module 200 side
1a, 11b and the conductive resist patterns 5a, 5b on the data carrier main body 100 side are opposed to each other.
At this time, when the adhesive 18 is applied on the electronic component module 200, the electronic component module 200 and the data carrier main body 100 on which the conductive pattern 8 serving as an antenna coil is mounted are adhered and fixed. It can be performed stably.

(Step B) Next, the indenters 16a and 16b heated at a temperature of 120 ° C. are applied from above the electronic component module 200, particularly, directly above the pair of conductive resist patterns 5a and 5b with a load pressure of 10 kg / cm ^2. For 1 second. Then, the solder paste 17 on the electronic component module 200 side and the conductive resist patterns 5a and 5b (using solder paste or thermoplastic conductive Ag paste) on the data carrier main body 100 side soften and melt, and the copper on the electronic component module 200 side becomes copper. The foil regions 11a, 11b and the resist patterns 5a,
5b is adhesively fixed. At this time, since the etching resist 4 on the surface of the spiral conductive pattern remains as an insulating material, the wiring circuit on the base material of the electronic component module 200 can also serve as a jumper wire connecting the inner and outer circumferences of the coil. In addition, if the adhesive 18 is applied, the adhesive 18 improves the bonding strength between the electronic component module 200 and the data carrier main body 100 and can also serve as an insulating material.

(Third Embodiment) Next, the electronic component mounting surface of the insulating small piece 201 constituting the electronic component module 200 and the spiral conductor pattern forming surface of the insulating base 101 constituting the data carrier main body 100 will be described. The electronic component module 200 is mounted on the data carrier main body 100 so that the electronic component module 200 faces the electronic component, and the potting portion 15 that covers and protects the electronic component on the insulating small piece 201 is formed by a spiral formed on the insulating substrate 101. Conductor pattern 10
FIGS. 8A and 8B show an embodiment in which the second conductor bundle 102a is located immediately above the second conductor bundle 102a. In addition,
FIG. 8B is a cross-sectional view taken along line BB in FIG.

As shown in the figure, the insulating base piece 201 constituting the electronic component module 200 is formed in a strip shape.
Are mounted, and the potting portion 15 is formed by coating with resin. Further, on the lower surface of the insulating base piece 201, there are formed strip-shaped conductor regions 19a and 19b which are electrically connected to a pair of terminals of the bare chip IC 14. These conductor regions 19a and 19b are formed of a thermosetting conductive adhesive. On the other hand, a pair of terminal pads having conductive resist patterns 5a, 5b applied on their surfaces are arranged on the data carrier main body 100 side facing the conductor regions 19a, 19b. The conductive resist patterns 5a,
As 5b, a thermoplastic conductive adhesive is used. The terminal pads are formed in the spiral conductor pattern 102.
Are electrically connected to terminals on the inner and outer peripheral sides. for that reason,
Electronic component module 2 on data carrier body 100
When pressure is applied at 180 ° C. for 5 seconds in a state where 00 is overlapped, the two are bonded and the electrical connection with the antenna coil is completed. In addition, since the potting portion 15 surrounding the bare chip IC 14 is located directly above the conductor bundle 8, the occupied area of the terminal pads arranged on both sides thereof is minimized. In particular, in this example, a material having a light shielding property is used as the material of the insulating small piece 201. Here, as the light-shielding material, for example, 25 m
Examples include a thick white PET film (UL-9: manufactured by Teijin Limited), an ultraviolet cut film, various colored films, and the like. Therefore, there is an effect that the analog circuit forming surface on the IC chip can be protected from destruction due to light exposure. The heating indenter is used in the mounting methods of FIGS. 5 and 7 described above. However, as shown in FIG. 9, aluminum is used as the conductor circuit 21 on the base material 20 of the electronic component module 200. For example, the bump 1 of the electronic component 14 may be formed by a known ultrasonic bonding method.
It was confirmed that 4a and 14b could be joined on the conductor circuit 21 in a short time of 1.9 seconds. In FIG. 9, reference numeral 20 denotes a PET film having a thickness of 38 μm, and reference numeral 21 denotes an aluminum foil having a thickness of 18 μm. They are laminated and bonded by a heat lamination treatment at a temperature of 150 ° C. and a pressure of 5 kg / cm ² via a urethane-based adhesive.

[0051]

As is apparent from the above description, according to the present invention, ultra-low-cost mass production of electromagnetic wave-readable data carriers suitable for air tags, distribution management labels, unmanned ticket gates, etc. Becomes possible.

[Brief description of the drawings]

FIG. 1 is a front view showing an example of a data carrier capable of reading electromagnetic waves according to the present invention.

FIG. 2 is a sectional view showing details of a mounting structure of an electronic component module in the data carrier shown in FIG.

FIG. 3 is a process chart showing a method for manufacturing the data carrier body in the first embodiment.

FIG. 4 is a process chart illustrating a method for manufacturing an electronic component module according to the first embodiment.

FIG. 5 is a process chart showing a method for mounting the electronic component module on the data carrier body in the first embodiment.

FIG. 6 is a process chart illustrating a method for manufacturing an electronic component module according to the second embodiment.

FIG. 7 is a process chart showing a method of mounting an electronic component module on a data carrier body according to a second embodiment.

FIG. 8 is a plan view and a cross-sectional view illustrating a mounting structure of an electronic component module according to a third embodiment.

FIG. 9 is a sectional view showing another example of the structure of the electronic component module.

[Explanation of symbols]

 DC data carrier 100 Data carrier main body 101 PET base 102 Spiral conductor pattern 102a Circular conductor bundle 103 Inner peripheral terminal pad 104 Outer peripheral terminal pad 200 Electronic component module 201 Insulating piece 202 Bare chip IC 1 Cu-PET laminated base material 2 PET film 3 Copper foil 4 Insulating etching resist pattern 5a, 5b Conductive etching resist pattern 6 Exposed area of copper foil 7 Through hole 8 Conductor bundle 9 Glass epoxy tape 10 Base material 11 Copper foil 11a, 11b Copper foil area to be a terminal Reference Signs List 12 holes or grooves 13 anisotropic conductive film 14 bare chip IC 14a, 14b bump 15 potting portion 16a, 16b heating indenter 17 solder paste 18 adhesive 19a, 19b conductive area 20 base material 21 conductive circuit

Claims (4)

[Claims] 1. A data carrier main body in which a spiral conductive pattern forming an antenna coil is held on a film-shaped, sheet-shaped, or thin-plated insulating base; and a film-shaped, sheet-shaped, or thin-plate-shaped insulating substrate. An electronic component module in which a small piece holds an electronic component that constitutes a transmitting / receiving circuit, a memory, and the like, and further has an electronic component module formed by forming a potting portion that covers and protects the electronic component. The small piece is mounted on the data carrier main body so as to straddle the spiral conductor bundle constituting the spiral conductor pattern, and the electrical connection with the spiral conductor pattern is performed on the inner peripheral side and the outer peripheral side of the spiral conductor pattern. An electromagnetic wave readable data carrier, which is performed separately and separately. 2. An electronic component module according to claim 1, wherein an electronic component mounting surface of the insulating small piece constituting the electronic component module and a spiral conductor pattern forming surface of the insulating base constituting the data carrier body face each other. The electromagnetic wave readable data carrier according to claim 1, wherein the data carrier is mounted on a carrier body. 3. A potting portion for covering and protecting an electronic component on an insulating small piece is located directly above a spiral conductor bundle of a spiral conductor formed on an insulating substrate. An electromagnetic wave readable data carrier according to claim 1. 4. The electromagnetic wave readable data carrier according to claim 1, wherein a light-shielding material is used as a material of the insulating small pieces constituting the electronic component module.