JP3888674B2 - Non-contact data communication medium and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
TECHNICAL FIELD The present invention relates to a technique for joining opposing conductive terminals of a non-contact data communication medium having external terminals, and more particularly, a card and sheet-shaped information communication medium represented by an IC card, an IC tag, etc. The present invention relates to a technique for joining an antenna terminal of an IC module and a terminal terminal of a transmitting / receiving antenna coil in a so-called combination card having both non-contact interfaces.
[0002]
[Prior art]
Conventionally, as this type of technology, for example, a technology using a conductive paste, that is, an uncured conductive paste is applied to one or both surfaces of a conductive terminal facing each other and left at room temperature or heated in a pressurized state. There is a method of obtaining an electrical connection between both conductive terminals by curing.
[0003]
That is, in FIG. 5 which shows a planar form, for example, the terminal terminal 4 (two places of the start end and the end) of the antenna coil 2 arranged in the card substrate 1 such as polyethylene terephthalate (PET) or polyvinyl chloride (PVC). Is exposed on the IC module fitting joint surface 3 formed in the card substrate 1, and the IC module is fitted with the antenna terminal facing the terminal terminal 4 (in a face-down manner).
[0004]
6 and 7 are enlarged views of the fitting and joining, and the antenna terminal on the IC module side and the terminal terminal of the antenna coil with a conductive adhesive 8 such as silver or copper paste interposed therebetween. 4 is bonded to the bonding surface 3 with the thermosetting film 7 at the same time.
[0005]
[Problems to be solved by the invention]
However, in such a conventional method, the antenna coil wire itself has a small cross-sectional area, and the portion that is applied to the joining is limited to a small area approximately half the upper part of the antenna coil wire, so that the joining strength is weak and the joining reliability is low. I had a problem of low nature.
[0006]
Furthermore, in such a conventional method, the accuracy of the application amount of the conductive adhesive 8 is strictly required, but the viscosity variation due to environmental conditions such as time, temperature, and humidity is large, so that the accuracy of the application amount is high. It was extremely difficult to guarantee, and as a result, there were problems such as contact failure due to insufficient application amount, short circuit abnormality between other terminals due to excessive application amount, or appearance failure due to leakage to the surface layer. .
[0007]
Therefore, the problem to be solved by the present invention is to overcome the various problems of the above-described conventional methods, and can reliably and strongly and easily join the conductive terminals, compared to the conventional, It is an object of the present invention to provide a bonding technique for conductive terminals which can obtain much higher bonding reliability and can reduce the cost by improving the yield.
[0008]
Another object of the present invention is to provide a data communication medium having a non-contact function that is inexpensive while maintaining high reliability by using the improved joining technique of the conductive terminals.
[0009]
[Means for Solving the Problems]
The present invention solves the above-mentioned problems by forming a recess locally in the joint surface portion where the terminal terminal of the antenna coil is exposed, thereby increasing the area of the terminal terminal. An attempt is made to obtain a contactless data communication medium that is highly inexpensive and inexpensive.
[0010]
That is, the present invention relates to a non-contact data communication medium in which an IC module is fitted in a card base material, and the antenna terminal of the IC module is joined to a terminal terminal of an antenna coil arranged in the card base material. The antenna coil is made of a metal wire, and has a recess in the terminal terminal of the antenna coil of the base material such that the terminal floats in a hollow shape, and the junction terminal is injected into the recess. A non-contact data communication medium embedded in a conductive adhesive . Further, in the method of manufacturing a non-contact data communication medium in which the IC module is fitted into the card base material, and the antenna terminal of the IC module is joined to the terminal terminal of the antenna coil arranged in the card base material. The antenna coil is made of a metal wire, and a recess is provided in a terminal terminal portion of the antenna coil of the base material, and a conductive adhesive is injected into the recess in a form in which the joint terminal is floated, and the bonding is performed. A method of manufacturing a non-contact data communication medium in which a terminal is embedded in a conductive adhesive and the antenna terminal is connected.
[0011]
Moreover, this invention is a non-contact data communication medium in which the said dent was formed by laser irradiation.
[0012]
Further, the present invention is a non-contact data communication medium in which the metal wire constituting the antenna coil is a coated conductor, the recess is formed by laser irradiation, and the insulating film of the coated conductor is destroyed and removed.
[0013]
The present invention is also a non-contact data communication medium in which the recess is formed by machining.
[0014]
Further, the present invention is a non-contact data communication medium in which the metal wire constituting the antenna coil is a coated conductor, the recess is formed by machining, and the insulating film of the coated conductor is destroyed and removed.
[0015]
In the present invention, the antenna coil is made of a metal wire, and a recess is formed by laser irradiation at the terminal portion of the antenna coil, and at the same time, the metal wire covering the antenna coil is formed by laser irradiation. And a method of manufacturing a non-contact data communication medium having an external terminal for destroying and removing the insulating film of the coated conductor.
[0016]
In the present invention, the antenna coil is a metal wire, and a recess is formed by machining in the joint terminal portion at the end of the antenna coil. At the same time, the coating of the metal wire constituting the antenna coil is formed by machining. A method of manufacturing a non-contact data communication medium having an external electrode that is formed and breaks and removes the insulating film of the coated conductor.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a case where the embodiment of the present invention is applied to a combination type IC card (hereinafter abbreviated as an IC card) which is a data communication medium having both contact and non-contact functions will be described with reference to the drawings. .
[0018]
FIG. 1 is a plan view of an IC card according to an embodiment of the present invention, in which terminal terminals 14 (two places) of an antenna coil 12 made of a coated conductor arranged in a card base 11 made of PET-G material. The IC module fitting joint surface 13 formed in the card base 11 is exposed.
[0019]
Here, a recess 19 is formed in advance in the local portion of the joint surface 13 immediately below the terminal terminal 14 of the antenna coil by laser beam machining or mechanical grinding, or the laser beam is directly above the terminal terminal 14. The film of the terminal terminal 14 may be thermally decomposed to be removed by destruction, and at the same time, a dent may be formed in the portion immediately below. In the latter case, even in the shaded portion of the antenna coil wire, it is sufficiently removed if it is a general film such as urethane resin, and the dent formed on the joining surface 3 made of PET material is at a level that does not hinder the bottom surface. It can be processed flat and is the main point of the present invention.
[0020]
FIG. 2 is an explanatory diagram before IC module fitting and joining in the IC card manufacturing method according to the embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of the local area in the vicinity of the IC module fitting joint surface 13, in which the terminal terminal 14 of the antenna coil with the wire rod exposed is arranged in a form just bridged to the recess 19.
[0021]
FIG. 3 is an explanatory view showing a state in which resin is injected into the recess in the IC card manufacturing method according to the embodiment of the present invention. FIG. 3 shows a state in which silver paste or other conductive adhesive 18 is injected into the entire recess 19 by using a dispenser or the like in an amount sufficient to bury the terminal terminal 14, following FIG. 2.
[0022]
FIG. 4 is an explanatory view showing a state in which the joining of the IC module and the card substrate is completed in the IC card manufacturing method according to the embodiment of the present invention. FIG. 4 shows a state in which the basic structure of the IC card is completed by further fitting and positioning the IC module so that the antenna terminals face the predetermined terminal terminals 14 respectively.
[0023]
Here, the thermosetting film 17 is sandwiched between the bonding surface 13 on the card substrate side and the peripheral surface of the antenna terminal on the IC module side so that the IC module is firmly bonded to the card substrate 11. Then, a heating and pressing jig is applied from the contact terminal surface side of the IC module to cure the conductive adhesive 18 and the thermosetting film 17 at the same time, thereby joining the antenna and the IC module. To complete.
[0024]
In the case of the IC card according to the present invention, the wire cloth is exposed over the entire surface of the antenna terminal terminal 14 which is finer than the conventional one, and the area involved in the joining is increased. Further, since the terminal terminal 14 has a hollow floating shape due to the presence of the recess 19, an ideal structure in which the terminal terminal 14 can be entirely embedded in the conductive adhesive 18 is realized.
[0025]
【The invention's effect】
As described above, in the IC card to which the present invention is applied, the junction between the antenna terminal and the antenna terminal of the IC module can be kept strong and highly reliable.
[0026]
Therefore, according to the present invention, it is possible to significantly improve the occurrence of troubles in joining between conductive terminals, which has been a problem under various usage conditions and environmental conditions, and to achieve high reliability and low cost due to improved yield. It is possible to provide a suitable non-contact data communication medium that realizes the above.
[0027]
In the above, only the embodiment of the IC card has been described. However, the present invention is not limited to this, and any IC tag, light, magnetism, dielectric, and a composite card shape, sheet shape, label shape, etc. Needless to say, the technique of the present invention can be applied to a data communication medium.
[0028]
Furthermore, the technology of the present invention is not limited to a data communication medium, and can be applied to any situation where a strong and reliable bonding between a plurality of opposing electrode terminals is required. Is possible.
[Brief description of the drawings]
FIG. 1 is a plan view of an IC card according to an embodiment of the present invention.
FIG. 2 is an explanatory view of the vicinity of the IC module fitting front surface in the IC card manufacturing method according to the embodiment of the present invention.
FIG. 3 is an explanatory view showing a state in which resin is injected into a recess in the IC card manufacturing method according to the embodiment of the present invention.
FIG. 4 is an explanatory diagram of a state where the joining of the IC module and the card base is completed in the IC card manufacturing method according to the embodiment of the present invention.
FIG. 5 is a schematic plan view of a conventional IC card.
FIG. 6 is a schematic cross-sectional view of a main part of a conventional IC card (immediately before joining).
FIG. 7 is a schematic cross-sectional view of a main part of a conventional IC card (after joining).
[Explanation of symbols]
1 Card Base 2 Antenna Coil 3 Bonding Surface (Surface that Adheres Card Base and IC Module)
4 Terminal terminal of antenna coil 5 Contact terminal of IC module 6 Mold resin 7 Thermosetting film 8 Conductive adhesive 11 Card substrate 12 Antenna coil 13 Bonding surface (surface for bonding card substrate and IC module)
14 Terminal terminal 15 of the antenna coil 15 Contact terminal 16 of the IC module 16 Mold resin 17 Thermosetting film 18 Conductive adhesive 19 Recess (just below the terminal terminal of the antenna coil)

Claims (4)

In a non-contact data communication medium in which an IC module is fitted into a card substrate, and the antenna terminal of the IC module is bonded to a terminal terminal of an antenna coil arranged in the card substrate, the antenna coil is a metal In the conductive adhesive comprising a wire , having a recess in the terminal terminal of the antenna coil of the base material such that the terminal floats in a hollow shape, and the joint terminal is injected into the recess A non-contact data communication medium characterized by being embedded in a non-contact data communication medium. In the method of manufacturing a non-contact data communication medium in which an IC module is fitted into a card base material, and an antenna terminal of the IC module is joined to a terminal terminal of an antenna coil disposed in the card base material, the antenna The coil is made of a metal wire, and a recess is provided in the terminal terminal portion of the antenna coil of the base material, and a conductive adhesive is injected into the recess in a form in which the joint terminal floats in a hollow state. A method of manufacturing a non-contact data communication medium, wherein the antenna terminal is connected by being embedded in a conductive adhesive. The method of manufacturing a non-contact data communication medium according to claim 2 , wherein the recess is formed by laser irradiation. The metal wire material constituting the antenna coil is the insulated conductive wires, by laser irradiation, thereby forming the recess, the non-contact according to claim 2 or 3, characterized in that destroying removing the insulating coating of the coated conductive wire A method for manufacturing a data communication medium.

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