JP2002083974A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JP2002083974A JP2002083974A JP2001057201A JP2001057201A JP2002083974A JP 2002083974 A JP2002083974 A JP 2002083974A JP 2001057201 A JP2001057201 A JP 2001057201A JP 2001057201 A JP2001057201 A JP 2001057201A JP 2002083974 A JP2002083974 A JP 2002083974A
- Authority
- JP
- Japan
- Prior art keywords
- film
- less
- semiconductor film
- semiconductor
- degrees
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0312—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
- H10D30/0314—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral top-gate TFTs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0321—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
- H10D30/6715—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes characterised by the doping profiles, e.g. having lightly-doped source or drain extensions
- H10D30/6717—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes characterised by the doping profiles, e.g. having lightly-doped source or drain extensions the source and the drain regions being asymmetrical
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6731—Top-gate only TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
- H10D30/6739—Conductor-insulator-semiconductor electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
- H10D30/6743—Silicon
- H10D30/6745—Polycrystalline or microcrystalline silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/40—Crystalline structures
- H10D62/405—Orientations of crystalline planes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0221—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies
- H10D86/0223—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies comprising crystallisation of amorphous, microcrystalline or polycrystalline semiconductor materials
- H10D86/0225—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies comprising crystallisation of amorphous, microcrystalline or polycrystalline semiconductor materials using crystallisation-promoting species, e.g. using a Ni catalyst
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13454—Drivers integrated on the active matrix substrate
Landscapes
- Recrystallisation Techniques (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001057201A JP2002083974A (ja) | 2000-06-19 | 2001-03-01 | 半導体装置 |
| US09/882,265 US6787807B2 (en) | 2000-06-19 | 2001-06-18 | Semiconductor device |
| JP2001185684A JP4827325B2 (ja) | 2000-06-19 | 2001-06-19 | 半導体装置の作製方法 |
| US10/834,093 US6956235B2 (en) | 2000-06-19 | 2004-04-29 | Semiconductor device |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000183848 | 2000-06-19 | ||
| JP2000-183848 | 2000-06-19 | ||
| JP2001057201A JP2002083974A (ja) | 2000-06-19 | 2001-03-01 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002083974A true JP2002083974A (ja) | 2002-03-22 |
Family
ID=26594233
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001057201A Pending JP2002083974A (ja) | 2000-06-19 | 2001-03-01 | 半導体装置 |
| JP2001185684A Expired - Fee Related JP4827325B2 (ja) | 2000-06-19 | 2001-06-19 | 半導体装置の作製方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001185684A Expired - Fee Related JP4827325B2 (ja) | 2000-06-19 | 2001-06-19 | 半導体装置の作製方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US6787807B2 (enExample) |
| JP (2) | JP2002083974A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011046048A1 (en) * | 2009-10-16 | 2011-04-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| JP2019068080A (ja) * | 2012-03-28 | 2019-04-25 | 株式会社半導体エネルギー研究所 | 信号処理装置 |
| JP2022095719A (ja) * | 2009-01-16 | 2022-06-28 | 株式会社半導体エネルギー研究所 | 半導体装置 |
Families Citing this family (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4056571B2 (ja) * | 1995-08-02 | 2008-03-05 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6335445B1 (en) * | 1997-03-24 | 2002-01-01 | Societe De Conseils De Recherches Et D'applications Scientifiques (S.C.R.A.S.) | Derivatives of 2-(iminomethyl)amino-phenyl, their preparation, their use as medicaments and the pharmaceutical compositions containing them |
| JP3980159B2 (ja) * | 1998-03-05 | 2007-09-26 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| TWI263336B (en) * | 2000-06-12 | 2006-10-01 | Semiconductor Energy Lab | Thin film transistors and semiconductor device |
| US6828587B2 (en) | 2000-06-19 | 2004-12-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP2002083974A (ja) | 2000-06-19 | 2002-03-22 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| US7503975B2 (en) * | 2000-06-27 | 2009-03-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and fabrication method therefor |
| JP4865122B2 (ja) * | 2000-07-04 | 2012-02-01 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6703265B2 (en) * | 2000-08-02 | 2004-03-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
| US7045444B2 (en) * | 2000-12-19 | 2006-05-16 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device that includes selectively adding a noble gas element |
| US6858480B2 (en) * | 2001-01-18 | 2005-02-22 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
| JP4993810B2 (ja) * | 2001-02-16 | 2012-08-08 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4718700B2 (ja) * | 2001-03-16 | 2011-07-06 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US7052943B2 (en) * | 2001-03-16 | 2006-05-30 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device |
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| US6994083B2 (en) * | 2001-12-21 | 2006-02-07 | Trudell Medical International | Nebulizer apparatus and method |
| TWI300950B (en) * | 2002-11-29 | 2008-09-11 | Adv Lcd Tech Dev Ct Co Ltd | Semiconductor structure, semiconductor device, and method and apparatus for manufacturing the same |
| JP3791616B2 (ja) * | 2003-02-06 | 2006-06-28 | セイコーエプソン株式会社 | 配線基板、電気光学装置及びその製造方法並びに電子機器 |
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| JP2007220825A (ja) * | 2006-02-15 | 2007-08-30 | Sumco Corp | シリコンウェーハの製造方法 |
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| US7715951B2 (en) * | 2007-08-28 | 2010-05-11 | Consert, Inc. | System and method for managing consumption of power supplied by an electric utility |
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| US9614026B2 (en) | 2013-03-13 | 2017-04-04 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | High mobility transport layer structures for rhombohedral Si/Ge/SiGe devices |
| CN108028214B (zh) * | 2015-12-30 | 2022-04-08 | 玛特森技术公司 | 用于毫秒退火系统的气体流动控制 |
| US20180082622A1 (en) * | 2016-09-22 | 2018-03-22 | Hopil Bae | Techniques for testing electrically configurable digital displays, and associated display architecture |
| US10014311B2 (en) | 2016-10-17 | 2018-07-03 | Micron Technology, Inc. | Methods of forming an array of elevationally-extending strings of memory cells, methods of forming polysilicon, elevationally-extending strings of memory cells individually comprising a programmable charge storage transistor, and electronic components comprising polysilicon |
| CN118764008B (zh) * | 2024-09-06 | 2025-02-11 | 泉州市三安集成电路有限公司 | 支撑基板、复合基板、电子器件和模块 |
Family Cites Families (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US14625A (en) * | 1856-04-08 | William w | ||
| US43662A (en) * | 1864-08-02 | Improved spring bed-bottom | ||
| US38889A (en) * | 1863-06-16 | Improved horse-collar | ||
| US8286A (en) * | 1851-08-05 | Spbietg-bolt | ||
| US14535A (en) * | 1856-03-25 | Water-wheel | ||
| JPH0658966B2 (ja) | 1982-05-17 | 1994-08-03 | キヤノン株式会社 | 半導体素子 |
| JPH0752718B2 (ja) * | 1984-11-26 | 1995-06-05 | 株式会社半導体エネルギー研究所 | 薄膜形成方法 |
| JP2588388B2 (ja) * | 1986-08-08 | 1997-03-05 | 株式会社 半導体エネルギー研究所 | 被膜作製方法 |
| JPH02219234A (ja) | 1989-02-20 | 1990-08-31 | Seiko Epson Corp | 半導体装置 |
| US5162933A (en) | 1990-05-16 | 1992-11-10 | Nippon Telegraph And Telephone Corporation | Active matrix structure for liquid crystal display elements wherein each of the gate/data lines includes at least a molybdenum-base alloy layer containing 0.5 to 10 wt. % of chromium |
| US5849601A (en) * | 1990-12-25 | 1998-12-15 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method for manufacturing the same |
| JP2840699B2 (ja) | 1990-12-12 | 1998-12-24 | 株式会社 半導体エネルギー研究所 | 被膜形成装置及び被膜形成方法 |
| JPH04349619A (ja) | 1991-05-28 | 1992-12-04 | Nippondenso Co Ltd | 単結晶半導体膜の製造方法 |
| JPH06333857A (ja) * | 1993-05-27 | 1994-12-02 | Semiconductor Energy Lab Co Ltd | 成膜装置および成膜方法 |
| JPH06349735A (ja) | 1993-06-12 | 1994-12-22 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| SG64308A1 (en) | 1993-07-26 | 1999-04-27 | Seiko Epson Corp | Thin-film semiconductor device method of fabricating thin-film semiconductor device and display system using the same |
| US5923962A (en) * | 1993-10-29 | 1999-07-13 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a semiconductor device |
| JP3431033B2 (ja) | 1993-10-29 | 2003-07-28 | 株式会社半導体エネルギー研究所 | 半導体作製方法 |
| TW264575B (enExample) * | 1993-10-29 | 1995-12-01 | Handotai Energy Kenkyusho Kk | |
| JP2860869B2 (ja) | 1993-12-02 | 1999-02-24 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
| TW251379B (en) | 1994-01-28 | 1995-07-11 | Nat Science Committee | Process of polysilicon, Ge or Si-Ge thin film transistor |
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| US5985703A (en) | 1994-10-24 | 1999-11-16 | Banerjee; Sanjay | Method of making thin film transistors |
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| JPH08271880A (ja) | 1995-04-03 | 1996-10-18 | Toshiba Corp | 遮光膜,液晶表示装置および遮光膜形成用材料 |
| TW310478B (en) | 1995-12-08 | 1997-07-11 | Nat Science Council | A method to fabricate thin film transistor |
| US5943560A (en) | 1996-04-19 | 1999-08-24 | National Science Council | Method to fabricate the thin film transistor |
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| JPH11204434A (ja) | 1998-01-12 | 1999-07-30 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
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| TWI263336B (en) | 2000-06-12 | 2006-10-01 | Semiconductor Energy Lab | Thin film transistors and semiconductor device |
| JP2002083974A (ja) | 2000-06-19 | 2002-03-22 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
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-
2001
- 2001-03-01 JP JP2001057201A patent/JP2002083974A/ja active Pending
- 2001-06-18 US US09/882,265 patent/US6787807B2/en not_active Expired - Fee Related
- 2001-06-19 JP JP2001185684A patent/JP4827325B2/ja not_active Expired - Fee Related
-
2004
- 2004-04-29 US US10/834,093 patent/US6956235B2/en not_active Expired - Fee Related
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|---|---|---|---|---|
| JP2022095719A (ja) * | 2009-01-16 | 2022-06-28 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2023076500A (ja) * | 2009-01-16 | 2023-06-01 | 株式会社半導体エネルギー研究所 | 液晶表示装置 |
| US11735133B2 (en) | 2009-01-16 | 2023-08-22 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and electronic device including the same |
| US12027133B2 (en) | 2009-01-16 | 2024-07-02 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and electronic device including the same |
| WO2011046048A1 (en) * | 2009-10-16 | 2011-04-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US8421068B2 (en) | 2009-10-16 | 2013-04-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US9666678B2 (en) | 2009-10-16 | 2017-05-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US10074747B2 (en) | 2009-10-16 | 2018-09-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US10777682B2 (en) | 2009-10-16 | 2020-09-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US11837461B2 (en) | 2009-10-16 | 2023-12-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US12389631B2 (en) | 2009-10-16 | 2025-08-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| JP2019068080A (ja) * | 2012-03-28 | 2019-04-25 | 株式会社半導体エネルギー研究所 | 信号処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20040201022A1 (en) | 2004-10-14 |
| JP2002094077A (ja) | 2002-03-29 |
| US20020038889A1 (en) | 2002-04-04 |
| US6787807B2 (en) | 2004-09-07 |
| US6956235B2 (en) | 2005-10-18 |
| JP4827325B2 (ja) | 2011-11-30 |
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