JP2001518719A5 - - Google Patents
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- Publication number
- JP2001518719A5 JP2001518719A5 JP2000514343A JP2000514343A JP2001518719A5 JP 2001518719 A5 JP2001518719 A5 JP 2001518719A5 JP 2000514343 A JP2000514343 A JP 2000514343A JP 2000514343 A JP2000514343 A JP 2000514343A JP 2001518719 A5 JP2001518719 A5 JP 2001518719A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- region
- conductive type
- photodiode
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 description 22
- 239000004065 semiconductor Substances 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/941,800 | 1997-09-30 | ||
| US08/941,800 US5859450A (en) | 1997-09-30 | 1997-09-30 | Dark current reducing guard ring |
| PCT/US1998/014024 WO1999017380A1 (en) | 1997-09-30 | 1998-07-06 | Dark current reducing guard ring |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001518719A JP2001518719A (ja) | 2001-10-16 |
| JP2001518719A5 true JP2001518719A5 (https=) | 2006-01-05 |
| JP4309574B2 JP4309574B2 (ja) | 2009-08-05 |
Family
ID=25477082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000514343A Expired - Fee Related JP4309574B2 (ja) | 1997-09-30 | 1998-07-06 | フォトダイオードおよびセンサ・アレイ |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US5859450A (https=) |
| EP (1) | EP1034570B1 (https=) |
| JP (1) | JP4309574B2 (https=) |
| KR (1) | KR100371457B1 (https=) |
| AU (1) | AU8291798A (https=) |
| DE (1) | DE69833760T2 (https=) |
| RU (1) | RU2178600C1 (https=) |
| TW (1) | TW441119B (https=) |
| WO (1) | WO1999017380A1 (https=) |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100253372B1 (ko) * | 1997-12-08 | 2000-04-15 | 김영환 | 반도체 소자 및 그 제조방법 |
| TW396645B (en) * | 1998-06-16 | 2000-07-01 | United Microelectronics Corp | Manufacturing method of CMOS sensor devices |
| US6545711B1 (en) * | 1998-11-02 | 2003-04-08 | Agilent Technologies, Inc. | Photo diode pixel sensor array having a guard ring |
| US6073343A (en) * | 1998-12-22 | 2000-06-13 | General Electric Company | Method of providing a variable guard ring width between detectors on a substrate |
| US6147366A (en) * | 1999-02-08 | 2000-11-14 | Intel Corporation | On chip CMOS optical element |
| US6310366B1 (en) * | 1999-06-16 | 2001-10-30 | Micron Technology, Inc. | Retrograde well structure for a CMOS imager |
| US6445014B1 (en) | 1999-06-16 | 2002-09-03 | Micron Technology Inc. | Retrograde well structure for a CMOS imager |
| US6512401B2 (en) | 1999-09-10 | 2003-01-28 | Intel Corporation | Output buffer for high and low voltage bus |
| US7133074B1 (en) | 1999-09-28 | 2006-11-07 | Zoran Corporation | Image sensor circuits including sampling circuits used therein for performing correlated double sampling |
| US6465862B1 (en) * | 1999-10-05 | 2002-10-15 | Brannon Harris | Method and apparatus for implementing efficient CMOS photo sensors |
| US6627475B1 (en) | 2000-01-18 | 2003-09-30 | Taiwan Semiconductor Manufacturing Company | Buried photodiode structure for CMOS image sensor |
| US6194258B1 (en) | 2000-01-18 | 2001-02-27 | Taiwan Semiconductor Manufacturing Company | Method of forming an image sensor cell and a CMOS logic circuit device |
| DE10003472C1 (de) | 2000-01-27 | 2001-04-26 | Infineon Technologies Ag | Zufallszahlengenerator |
| US6309905B1 (en) | 2000-01-31 | 2001-10-30 | Taiwan Semiconductor Manufacturing Company | Stripe photodiode element with high quantum efficiency for an image sensor cell |
| WO2001067518A1 (en) * | 2000-03-09 | 2001-09-13 | Koninklijke Philips Electronics N.V. | Solid state imaging sensor in a submicron technology and method of manufacturing and use of a solid state imaging sensor |
| US6365926B1 (en) | 2000-09-20 | 2002-04-02 | Eastman Kodak Company | CMOS active pixel with scavenging diode |
| KR20020096336A (ko) * | 2001-06-19 | 2002-12-31 | 삼성전자 주식회사 | 씨모스형 촬상 장치 |
| US20030049925A1 (en) * | 2001-09-10 | 2003-03-13 | Layman Paul Arthur | High-density inter-die interconnect structure |
| KR100454074B1 (ko) * | 2001-12-26 | 2004-10-26 | 동부전자 주식회사 | 반도체 소자의 이미지 센서 제조 방법 |
| US6534356B1 (en) | 2002-04-09 | 2003-03-18 | Taiwan Semiconductor Manufacturing Company | Method of reducing dark current for an image sensor device via use of a polysilicon pad |
| WO2004042823A1 (en) * | 2002-11-05 | 2004-05-21 | Universitaet Karlsruhe | Monolithic active pixel dosimeter |
| US6818930B2 (en) * | 2002-11-12 | 2004-11-16 | Micron Technology, Inc. | Gated isolation structure for imagers |
| KR100907884B1 (ko) * | 2002-12-31 | 2009-07-15 | 동부일렉트로닉스 주식회사 | 반도체 포토 다이오드 및 이의 제조 방법 |
| US6897082B2 (en) * | 2003-06-16 | 2005-05-24 | Micron Technology, Inc. | Method of forming well for CMOS imager |
| KR100535924B1 (ko) * | 2003-09-22 | 2005-12-09 | 동부아남반도체 주식회사 | 시모스 이미지 센서 및 그 제조방법 |
| US7180049B2 (en) * | 2004-11-08 | 2007-02-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Image sensor with optical guard rings and method for forming the same |
| US7348651B2 (en) * | 2004-12-09 | 2008-03-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Pinned photodiode fabricated with shallow trench isolation |
| US7342268B2 (en) * | 2004-12-23 | 2008-03-11 | International Business Machines Corporation | CMOS imager with Cu wiring and method of eliminating high reflectivity interfaces therefrom |
| US7564083B2 (en) * | 2005-02-25 | 2009-07-21 | United Microelectronics Corp. | Active pixel sensor |
| KR100949753B1 (ko) * | 2005-08-31 | 2010-03-25 | 후지쯔 마이크로일렉트로닉스 가부시키가이샤 | 포토 다이오드, 고체 촬상 장치, 및 그 제조 방법 |
| WO2008113067A2 (en) * | 2007-03-15 | 2008-09-18 | Johns Hopkins University | Deep submicron and nano cmos single photon photodetector pixel with event based circuits for readout data-rate reduction |
| US7598575B1 (en) * | 2007-09-12 | 2009-10-06 | National Semiconductor Corporation | Semiconductor die with reduced RF attenuation |
| US8188578B2 (en) * | 2008-05-29 | 2012-05-29 | Mediatek Inc. | Seal ring structure for integrated circuits |
| US8815634B2 (en) * | 2008-10-31 | 2014-08-26 | Varian Semiconductor Equipment Associates, Inc. | Dark currents and reducing defects in image sensors and photovoltaic junctions |
| US8138531B2 (en) * | 2009-09-17 | 2012-03-20 | International Business Machines Corporation | Structures, design structures and methods of fabricating global shutter pixel sensor cells |
| US9171726B2 (en) | 2009-11-06 | 2015-10-27 | Infineon Technologies Ag | Low noise semiconductor devices |
| JP5631668B2 (ja) * | 2010-09-02 | 2014-11-26 | Nttエレクトロニクス株式会社 | アバランシ・フォトダイオード |
| KR101804268B1 (ko) | 2010-11-02 | 2018-01-11 | 삼성전자주식회사 | 후면수광 이미지 센서에서 노이즈 차단을 위한 깊은 가드링 구조 및 잡음방지영역을 갖는 이미지센서 및 그 제조방법 |
| RU2497319C1 (ru) * | 2012-02-28 | 2013-10-27 | Федеральное государственное автономное образовательное учреждение высшего профессионального образования "Национальный исследовательский университет "Высшая школа экономики" | Печатная плата для бортовой радиоэлектронной аппаратуры космических аппаратов |
| KR102678796B1 (ko) | 2023-01-13 | 2024-06-26 | 주식회사 트루픽셀 | 단일 광자 검출기, 전자 장치, 및 라이다 장치 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS526097A (en) * | 1975-07-03 | 1977-01-18 | Moririka:Kk | Planar type photodiode |
| US4096622A (en) * | 1975-07-31 | 1978-06-27 | General Motors Corporation | Ion implanted Schottky barrier diode |
| US4137109A (en) * | 1976-04-12 | 1979-01-30 | Texas Instruments Incorporated | Selective diffusion and etching method for isolation of integrated logic circuit |
| US4261095A (en) * | 1978-12-11 | 1981-04-14 | International Business Machines Corporation | Self aligned schottky guard ring |
| US4414737A (en) * | 1981-01-30 | 1983-11-15 | Tokyo Shibaura Denki Kabushiki Kaisha | Production of Schottky barrier diode |
| US4691435A (en) * | 1981-05-13 | 1987-09-08 | International Business Machines Corporation | Method for making Schottky diode having limited area self-aligned guard ring |
| JPS58115873A (ja) * | 1981-12-28 | 1983-07-09 | Fujitsu Ltd | 半導体受光素子 |
| US4507853A (en) * | 1982-08-23 | 1985-04-02 | Texas Instruments Incorporated | Metallization process for integrated circuits |
| US4549914A (en) * | 1984-04-09 | 1985-10-29 | At&T Bell Laboratories | Integrated circuit contact technique |
| JPS6191973A (ja) * | 1984-10-11 | 1986-05-10 | Kanegafuchi Chem Ind Co Ltd | 耐熱性薄膜光電変換素子およびその製法 |
| US4656732A (en) * | 1984-09-26 | 1987-04-14 | Texas Instruments Incorporated | Integrated circuit fabrication process |
| US4722910A (en) * | 1986-05-27 | 1988-02-02 | Analog Devices, Inc. | Partially self-aligned metal contact process |
| US5221856A (en) * | 1989-04-05 | 1993-06-22 | U.S. Philips Corp. | Bipolar transistor with floating guard region under extrinsic base |
| JPH036860A (ja) * | 1989-06-02 | 1991-01-14 | Nec Corp | 固体撮像素子 |
| JP2661341B2 (ja) * | 1990-07-24 | 1997-10-08 | 三菱電機株式会社 | 半導体受光素子 |
| JPH0582823A (ja) * | 1991-09-20 | 1993-04-02 | Sharp Corp | フオトトランジスタ |
| JPH0677452A (ja) * | 1992-06-26 | 1994-03-18 | Nikon Corp | 固体撮像装置 |
| RU2071146C1 (ru) * | 1992-10-27 | 1996-12-27 | Воронежское высшее военное авиационное инженерное училище | Интегральная схема |
| US5438217A (en) * | 1994-04-29 | 1995-08-01 | General Electric Company | Planar avalanche photodiode array with sidewall segment |
| US5614744A (en) * | 1995-08-04 | 1997-03-25 | National Semiconductor Corporation | CMOS-based, low leakage active pixel array with anti-blooming isolation |
| US5841158A (en) * | 1996-03-01 | 1998-11-24 | Foveonics, Inc. | Low-stress photodiode with reduced junction leakage |
| JPH09321332A (ja) * | 1996-05-31 | 1997-12-12 | Oki Electric Ind Co Ltd | 半導体受光素子の製造方法 |
| JP2996943B2 (ja) * | 1998-03-09 | 2000-01-11 | 株式会社東芝 | 半導体受光装置及びその製造方法 |
-
1997
- 1997-09-30 US US08/941,800 patent/US5859450A/en not_active Expired - Fee Related
-
1998
- 1998-07-06 AU AU82917/98A patent/AU8291798A/en not_active Abandoned
- 1998-07-06 DE DE69833760T patent/DE69833760T2/de not_active Expired - Fee Related
- 1998-07-06 EP EP98933209A patent/EP1034570B1/en not_active Expired - Lifetime
- 1998-07-06 KR KR10-2000-7003432A patent/KR100371457B1/ko not_active Expired - Fee Related
- 1998-07-06 JP JP2000514343A patent/JP4309574B2/ja not_active Expired - Fee Related
- 1998-07-06 WO PCT/US1998/014024 patent/WO1999017380A1/en not_active Ceased
- 1998-07-06 RU RU2000111514/28A patent/RU2178600C1/ru not_active IP Right Cessation
- 1998-07-14 TW TW087111407A patent/TW441119B/zh not_active IP Right Cessation
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