JP2001507522A - 電子制御装置 - Google Patents
電子制御装置Info
- Publication number
- JP2001507522A JP2001507522A JP50518999A JP50518999A JP2001507522A JP 2001507522 A JP2001507522 A JP 2001507522A JP 50518999 A JP50518999 A JP 50518999A JP 50518999 A JP50518999 A JP 50518999A JP 2001507522 A JP2001507522 A JP 2001507522A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electronic control
- conductor
- device plug
- casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/061—Disposition
- H01L2224/0612—Layout
- H01L2224/06179—Corner adaptations, i.e. disposition of the bonding areas at the corners of the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48237—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/494—Connecting portions
- H01L2224/4943—Connecting portions the connecting portions being staggered
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S174/00—Electricity: conductors and insulators
- Y10S174/34—PCB in box or housing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Ignition Installations For Internal Combustion Engines (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.ケーシング(1)と、該ケーシング(1)内に配置されており電子制御回路 を有する基板(2)たとえばハイブリッド基板と、前記ケーシング(1)に取り 付けられた少なくとも1つの機器プラグ(4)が設けられており、 該機器プラグ(4)はコンタクト素子(10)を備えており、該コンタクト 素子(10)は前記基板(2)の制御回路と導電接続されている、 電子制御装置において、 ケーシング(1)内で第1の基板(2)とは空間的に分離されて第2の基板 (3)が配置されており、 該第2の基板(3)上に、前記第1の基板(2)上の制御回路と電気的に接 続された電力素子(60)と、該電力素子(60)と導電接続された接続導体路 (21)が配置されており、 該接続導体路(21)は、電力電流を案内する機器プラグ(4)のコンタク ト素子(11)と導電接続されていることを特徴とする、 電子制御回路。 2.プラグ素子(10)を備えた第2の機器プラグ(5)がケーシング(1)に 配置されており、前記第2の基板(3)上に、前記の第1の機器プラグ(4 )と第2の機器プラグ(5)の間に延在する少なくとも1つの貫通導体路(20 )が設けられており、該貫通導体路(20)は素子の介在接続なく、前記機器プ ラグ(4,5)において電力電流を案内するコンタクト素子(11)と導電接続 されている、請求項1記載の電子制御装置。 3.前記第2の基板(3)の接続導体路(21)および貫通導体路(20)と前 記少なくとも1つの機器プラグ(4,5)のコンタクト素子(11)との導電接 続、ならびに前記少なくとも1つの電力素子(60)と前記第1の基板(2)上 の制御回路との電気的な接続は、ボンディングワイヤ(41,42,45)を介 して行われる、請求項1または2記載の電子制御装置。 4.前記第2の基板(3)上に付加的に電力電流を案内する導体路(23)が設 けられており、該導体路(23)の一方の端部(23’)は前記機器プラグ(4 ,5)の高電流コンタクト素子(11)と導電接続されており、該導体路(23 )の他方の端部(23”)は前記第1の基板(2)上の接触面(14)と導電接 続されている、請求項1または2記載の電子制御装置。 5.前記第2の基板(3)上に付加的に信号電流を案内する導体路が設けられて おり、該導体路の一方の端部は、機器プラグ(4,5)のコンタクト素子( 10)と接続されており、該導体路の他方の端部は、前記第1の基板(2)にお ける回路端子と導電接続されている、請求項1または2記載の電子制御装置。 6.前記第2の基板(3)における貫通導体路(20)および/または付加的な 導体路(23)には、それらの一方の端部領域(20”,23”)にコンデンサ (50)が設けられている、請求項2または4記載の電子制御装置。 7.前記第2の基板(3)はDBC基板(Direct-Bonded-Copper-Substrat)で あり、該基板は良好な熱伝導性のセラミックス支持基板から成り、該基板表面上 にたとえば銅から成る金属製導体路構造体が被着されている、請求項1〜6のい ずれか1項記載の電子制御装置。 8.前記第2の基板(3)は、銀から成る導体路構造体を備えたAlO2セラミ ックス基板である、請求項1〜7のいずれか1項記載の電子制御装置。 9.前記第2の基板(3)上に、前記の貫通導体路(20)と接続導体路(21 )から絶縁された少なくとも1つのチップダイオード素子(70)が設けられて おり、該ダイオード素子において第2の基板の方へ向いた下側に、選択的に該ダ イオード素子のアノードまたはカソードを設けることができる、請求項7または 8記載の電子制御装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19727548.6 | 1997-06-28 | ||
DE1997127548 DE19727548A1 (de) | 1997-06-28 | 1997-06-28 | Elektronisches Steuergerät |
PCT/DE1998/000621 WO1999000845A1 (de) | 1997-06-28 | 1998-03-04 | Elektronisches steuergerät |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001507522A true JP2001507522A (ja) | 2001-06-05 |
JP4074347B2 JP4074347B2 (ja) | 2008-04-09 |
Family
ID=7833948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50518999A Expired - Lifetime JP4074347B2 (ja) | 1997-06-28 | 1998-03-04 | 電子制御装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6205031B1 (ja) |
EP (1) | EP0935818B1 (ja) |
JP (1) | JP4074347B2 (ja) |
KR (1) | KR100525936B1 (ja) |
CN (1) | CN100350609C (ja) |
DE (2) | DE19727548A1 (ja) |
WO (1) | WO1999000845A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010532091A (ja) * | 2007-06-30 | 2010-09-30 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 電子モジュールおよび電子モジュールの製造方法 |
WO2022158340A1 (ja) | 2021-01-19 | 2022-07-28 | Tdk株式会社 | 回路基板 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6392148B1 (en) * | 1999-05-10 | 2002-05-21 | Furukawa Electric Co., Ltd. | Wire harness joint |
DE19943258A1 (de) * | 1999-09-10 | 2001-03-15 | Hella Kg Hueck & Co | Elektronisches Gerät für ein Kraftfahrzeug |
US6462955B1 (en) * | 1999-09-13 | 2002-10-08 | Miraco, Inc. | Component alignment casing system |
TW523658B (en) * | 2000-04-29 | 2003-03-11 | Samsung Electronics Co Ltd | Memory modules having conductors at edges thereof and configured to conduct signals to and from the memory modules via the respective edges |
DE20012450U1 (de) * | 2000-07-18 | 2000-11-23 | Rosenberger Hochfrequenztech | Gehäuse für eine integrierte Schaltung |
DE10109329C1 (de) * | 2001-02-27 | 2002-05-02 | Siemens Ag | Schaltungsanordnung |
KR100737135B1 (ko) * | 2001-07-30 | 2007-07-06 | 주식회사 현대오토넷 | 차량의 모터 구동 전자제어유닛 |
WO2003103125A1 (de) * | 2002-05-03 | 2003-12-11 | Jungheinrich Moosburg Gmbh | Schaltungsanordnung zur steuerung elektromotorischer antriebsmittel eines fahrbaren arbeitsgerätes, insbesondere eines flurförderzeugs |
JP2004064912A (ja) * | 2002-07-30 | 2004-02-26 | Hitachi Ltd | 自動車制御装置 |
US20050061555A1 (en) * | 2003-02-04 | 2005-03-24 | Charder Electronic Co., Ltd. | Digital pointer indicator |
US7251553B2 (en) * | 2003-04-30 | 2007-07-31 | Robert Bosch Corporation | Thermal optimization of EMI countermeasures |
US20050227417A1 (en) * | 2004-04-06 | 2005-10-13 | Honeywell International Inc. | Packaging assembly utilizing flip chip and conductive plastic traces |
DE102006021412B3 (de) * | 2006-05-09 | 2007-11-15 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul |
DE102008000825A1 (de) | 2008-03-26 | 2009-10-01 | Robert Bosch Gmbh | Keramik-Metall-Verbundsubstrat |
CA2742011C (en) | 2011-06-02 | 2012-07-17 | Saskatchewan Research Council | Method and system for powering an otto cycle engine using gasoline and compressed natural gas |
DE102011081738A1 (de) | 2011-08-29 | 2013-02-28 | Robert Bosch Gmbh | Verfahren und Vorrichtung zur Belegung eines Steckers für ein Kombiinstrument eines Fahrzeugs und Steckersystem |
EP2840607A1 (en) * | 2013-08-22 | 2015-02-25 | ABB Technology AG | Semiconductor module |
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JPS5484265A (en) * | 1977-11-29 | 1979-07-05 | Bosch Gmbh Robert | Electronic controller |
JPS63196068A (ja) * | 1987-02-06 | 1988-08-15 | シーメンス、アクチエンゲゼルシヤフト | 半導体デバイス |
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JP3508292B2 (ja) * | 1995-05-15 | 2004-03-22 | 株式会社デンソー | 内燃機関用点火装置 |
US5642253A (en) * | 1995-07-31 | 1997-06-24 | Delco Electronics Corporation | Multi-channel ignition coil driver module |
US5703757A (en) * | 1996-01-31 | 1997-12-30 | Alcoa Fujikura Limited | Electronic vehicular junction box having reduced size and weight |
-
1997
- 1997-06-28 DE DE1997127548 patent/DE19727548A1/de not_active Withdrawn
-
1998
- 1998-03-04 JP JP50518999A patent/JP4074347B2/ja not_active Expired - Lifetime
- 1998-03-04 EP EP19980916835 patent/EP0935818B1/de not_active Expired - Lifetime
- 1998-03-04 US US09/254,019 patent/US6205031B1/en not_active Expired - Lifetime
- 1998-03-04 WO PCT/DE1998/000621 patent/WO1999000845A1/de active IP Right Grant
- 1998-03-04 CN CNB988009021A patent/CN100350609C/zh not_active Expired - Fee Related
- 1998-03-04 DE DE59814138T patent/DE59814138D1/de not_active Expired - Lifetime
- 1998-03-04 KR KR10-1999-7001341A patent/KR100525936B1/ko not_active IP Right Cessation
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5484265A (en) * | 1977-11-29 | 1979-07-05 | Bosch Gmbh Robert | Electronic controller |
JPS63196068A (ja) * | 1987-02-06 | 1988-08-15 | シーメンス、アクチエンゲゼルシヤフト | 半導体デバイス |
JPS63306651A (ja) * | 1987-05-23 | 1988-12-14 | ベーベーツエー・ブラウン・ボベリ・アクチエンゲゲゼルシャフト | 電力用半導体装置とその製造方法 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010532091A (ja) * | 2007-06-30 | 2010-09-30 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 電子モジュールおよび電子モジュールの製造方法 |
WO2022158340A1 (ja) | 2021-01-19 | 2022-07-28 | Tdk株式会社 | 回路基板 |
Also Published As
Publication number | Publication date |
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US6205031B1 (en) | 2001-03-20 |
EP0935818B1 (de) | 2007-12-12 |
WO1999000845A8 (de) | 1999-06-10 |
WO1999000845A1 (de) | 1999-01-07 |
EP0935818A1 (de) | 1999-08-18 |
JP4074347B2 (ja) | 2008-04-09 |
KR20000068216A (ko) | 2000-11-25 |
CN1234910A (zh) | 1999-11-10 |
KR100525936B1 (ko) | 2005-11-08 |
DE19727548A1 (de) | 1999-01-07 |
DE59814138D1 (de) | 2008-01-24 |
CN100350609C (zh) | 2007-11-21 |
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