JPH0493159U - - Google Patents

Info

Publication number
JPH0493159U
JPH0493159U JP40142290U JP40142290U JPH0493159U JP H0493159 U JPH0493159 U JP H0493159U JP 40142290 U JP40142290 U JP 40142290U JP 40142290 U JP40142290 U JP 40142290U JP H0493159 U JPH0493159 U JP H0493159U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP40142290U
Other versions
JP2543452Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990401422U priority Critical patent/JP2543452Y2/ja
Publication of JPH0493159U publication Critical patent/JPH0493159U/ja
Application granted granted Critical
Publication of JP2543452Y2 publication Critical patent/JP2543452Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1990401422U 1990-12-21 1990-12-21 半導体装置 Expired - Fee Related JP2543452Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990401422U JP2543452Y2 (ja) 1990-12-21 1990-12-21 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990401422U JP2543452Y2 (ja) 1990-12-21 1990-12-21 半導体装置

Publications (2)

Publication Number Publication Date
JPH0493159U true JPH0493159U (ja) 1992-08-13
JP2543452Y2 JP2543452Y2 (ja) 1997-08-06

Family

ID=31879518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990401422U Expired - Fee Related JP2543452Y2 (ja) 1990-12-21 1990-12-21 半導体装置

Country Status (1)

Country Link
JP (1) JP2543452Y2 (ja)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001507522A (ja) * 1997-06-28 2001-06-05 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 電子制御装置
JP2003298253A (ja) * 2002-03-29 2003-10-17 Denso Corp 電子制御装置の筐体構造及び電子制御装置の搭載構造
WO2005117116A1 (ja) * 2004-05-31 2005-12-08 Sanken Electric Co., Ltd. 半導体装置
WO2005124862A1 (ja) * 2004-06-18 2005-12-29 Sanken Electric Co., Ltd. 半導体装置
JP2007250901A (ja) * 2006-03-16 2007-09-27 Nec Corp 回路基板、移動通信端末
WO2008026485A1 (en) * 2006-08-31 2008-03-06 Daikin Industries, Ltd. Electric power converter
US7612448B2 (en) 2004-12-13 2009-11-03 Daikin Industries, Ltd. Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner
WO2009136591A1 (ja) * 2008-05-08 2009-11-12 トヨタ自動車株式会社 半導体装置
CN102074554A (zh) * 2009-11-19 2011-05-25 Nec爱克赛斯科技株式会社 导热板以及电子部件的安装方法
JP2013084675A (ja) * 2011-10-06 2013-05-09 Shindengen Electric Mfg Co Ltd 半導体素子の電気接続構造
JP2013157398A (ja) * 2012-01-27 2013-08-15 Mitsubishi Electric Corp 半導体装置およびその製造方法
JPWO2013124940A1 (ja) * 2012-02-23 2015-05-21 パナソニックＩｐマネジメント株式会社 樹脂封止型半導体装置及びその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02291160A (ja) * 1989-04-28 1990-11-30 Mitsubishi Electric Corp 半導体装置
JPH04164384A (ja) * 1990-10-29 1992-06-10 Nec Corp 電力用混成集積回路
JP3032443U (ja) * 1996-06-14 1996-12-24 典生 河野 眼鏡フレーム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02291160A (ja) * 1989-04-28 1990-11-30 Mitsubishi Electric Corp 半導体装置
JPH04164384A (ja) * 1990-10-29 1992-06-10 Nec Corp 電力用混成集積回路
JP3032443U (ja) * 1996-06-14 1996-12-24 典生 河野 眼鏡フレーム

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001507522A (ja) * 1997-06-28 2001-06-05 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 電子制御装置
JP2003298253A (ja) * 2002-03-29 2003-10-17 Denso Corp 電子制御装置の筐体構造及び電子制御装置の搭載構造
WO2005117116A1 (ja) * 2004-05-31 2005-12-08 Sanken Electric Co., Ltd. 半導体装置
WO2005124862A1 (ja) * 2004-06-18 2005-12-29 Sanken Electric Co., Ltd. 半導体装置
US7612448B2 (en) 2004-12-13 2009-11-03 Daikin Industries, Ltd. Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner
JP2007250901A (ja) * 2006-03-16 2007-09-27 Nec Corp 回路基板、移動通信端末
WO2008026485A1 (en) * 2006-08-31 2008-03-06 Daikin Industries, Ltd. Electric power converter
US8030661B2 (en) 2006-08-31 2011-10-04 Daikin Industries, Ltd. Power conversion apparatus
WO2009136591A1 (ja) * 2008-05-08 2009-11-12 トヨタ自動車株式会社 半導体装置
JP2009272482A (ja) * 2008-05-08 2009-11-19 Toyota Motor Corp 半導体装置
CN102074554A (zh) * 2009-11-19 2011-05-25 Nec爱克赛斯科技株式会社 导热板以及电子部件的安装方法
US8278750B2 (en) 2009-11-19 2012-10-02 Nec Access Technica, Ltd Heat conduction board and mounting method of electronic components
JP2013084675A (ja) * 2011-10-06 2013-05-09 Shindengen Electric Mfg Co Ltd 半導体素子の電気接続構造
JP2013157398A (ja) * 2012-01-27 2013-08-15 Mitsubishi Electric Corp 半導体装置およびその製造方法
JPWO2013124940A1 (ja) * 2012-02-23 2015-05-21 パナソニックＩｐマネジメント株式会社 樹脂封止型半導体装置及びその製造方法

Also Published As

Publication number Publication date
JP2543452Y2 (ja) 1997-08-06

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Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 19960423

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19970225

LAPS Cancellation because of no payment of annual fees