CN102074554A - 导热板以及电子部件的安装方法 - Google Patents
导热板以及电子部件的安装方法 Download PDFInfo
- Publication number
- CN102074554A CN102074554A CN2010102588876A CN201010258887A CN102074554A CN 102074554 A CN102074554 A CN 102074554A CN 2010102588876 A CN2010102588876 A CN 2010102588876A CN 201010258887 A CN201010258887 A CN 201010258887A CN 102074554 A CN102074554 A CN 102074554A
- Authority
- CN
- China
- Prior art keywords
- heat
- lead frame
- circuit board
- pcb
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
- H05K2201/10765—Leads folded back, i.e. bent with an angle of 180 deg
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本发明涉及导热板以及电子部件的安装方法。一种导热板,包括:散热部件;热传导部件,其布置在所述散热部件上并向其传导热量;引线框,其形成为导线图案的形状,并布置在所述热传导部件上;印刷电路板,其安装有用于对第一电子部件进行控制的第二电子部件;其中,所述第一电子部件和所述印刷电路板被焊接到所述引线框。
Description
技术领域
本发明涉及导热板,开涉及电子部件的安装方法。
本申请基于2009年11月19日提交的日本专利申请No.2009-263897并要求其优先权,该申请的全部内容通过引用方式结合于此。
背景技术
近年来,电子设备的高性能和微型化要求高效率和高密度地安装电子部件(例如半导体器件),对于安装各种电子部件的电路板也需要微型化和高密度安装。因此,开发了将功率半导体器件(例如开关器件)与对其进行控制的控制电路结合为一体并改善了散热特性的模块。
日本专利中请公开No.11-233712公开了一种电子设备,其中,功率半导体器件以及以高密度布置了控制电路的印刷电路板被分别安装在引线框上。这些引线框在散热器上布置于树脂层的两侧,并由树脂覆盖。用导线将功率半导体器件和安装在引线框上的印刷电路板电连接。
日本专利申请公开No.2008-21819公开了一种电子设备,该设备设有带开口的金属板、热传导树脂层、引线框、功率器件以及控制部分。引线框布置在树脂层上,树脂层布置在金属板上。功率器件布置在引线框上,并与之电连接。因此,树脂层和引线框位于功率器件与金属板之间。控制部分安装在印刷电路板上,并布置在金属板的开口处。因此,印刷电路板和树脂层位于控制部分与引线框之间。同时,由穿过树脂层的多个管脚将印刷电路板与引线框电连接。由此,与功率器件和控制部分相连的导线长度变短,减小了噪声的影响。
此外,日本专利中请公开No.2008-210920公开了一种电路模块,该电路模块设有金属板、热传导层、引线框、印刷电路板、功率系统电子部件以及信号系统电子部件。热传导层、引线框以及印刷电路板依次布置在金属板上。印刷电路板设有多个开口。位于开口中的引线框使同一表面成为印刷电路板的安装表面。功率系统电子部件需要散热,并安装在引线框那侧;信号系统电子部件需要高密度安装,并安装在印刷电路板那侧。由此,将功率系统电子部件与信号系统电子部件相连的导线长度变短,减小了噪声的影响。
但是,日本专利中请公开No.11-233712具有这样的缺点:需要对其进行涂料树脂和引线接合处理,并由于将功率系统的电子部件与信号系统的电子部件相连的导线长度变长而使噪声的影响变得严重。另一方面,日本专利申请公开No.2008-21819和日本专利申请公开No.2008-210920具有这样的优点:因为两个系统的电子部件都直接安装在引线框上,使得可以形成几乎同一表面,所以导线长度变短。因此,减小了噪声的影响。但是,由于日本专利申请公开No.2008-21819和日本专利申请公开No.2008-210920的电子设备只能在印刷电路板的一个表面中安装电子部件,所以不能执行电子部件的高密度安装。
发明内容
本发明的主要目的是在不需要为安装电子部件而执行引线接合处理的情况下减小噪声的影响,并对安装各种电子部件的电路板实现高密度安装和高性能。
一种导热板包括:散热部件;热传导部件,其布置在散热部件上并向其传导热量;引线框,其形成为导线图案的形状,并布置在热传导部件上;印刷电路板,其安装有用于对第一电子部件进行控制的第二电子部件;其中,第一电子部件和印刷电路板被焊接到引线框。
附图说明
根据下文结合附图进行的详细说明,可以理解本发明的示例性特征和优点,在附图中:
图1A是根据本发明第一示例性实施例的导热板的剖视图;
图1B是图1A的导热板的俯视图;
图2是根据第一示例性实施例的导热板的立体图;
图3是安装方法的流程图;
图4是引线框单元的俯视图;
图5是根据第一示例性实施例的另一种导热板的立体图;
图6是根据第一示例性实施例的另一种导热板的立体图;
图7是根据第示例性实施例的另一种导热板的立体图;
图8A是根据本发明第二示例性实施例的导热板的剖视图;
图8B是根据本发明第二示例性实施例的另一种导热板的剖视图;
图8C是图8B的导热板的仰视图。
具体实施方式
在本发明中,在不使用引线接合处理的情况下,将功率半导体器件(第一电子部件)和安装了对该功率半导体器件进行控制的控制电路(第二电子部件)的印刷电路板直接焊接到引线框。半导体器件不是裸安装产品,而是经过封装。
<第一示例性实施例>
下文对本发明的第一示例性实施例进行说明。图1A是根据本发明第示例性实施例的导热板的剖视图。图1B是图1A的导热板的俯视图。
如图1A所示,导热板2包括金属板10、具有电绝缘特性的树脂层20、引线框30、功率半导体器件40、控制电路50、印刷电路板60和焊料70。树脂层20在金属板10上形成膜的形状,并用作热传导层,将功率半导体器件40产生的热量向金属板10传导。从金属板将热量向大气散发。引线框30在金属板10上布置在树脂层20的两侧,以在不使用导线的情况下将功率半导体器件40与安装了控制电路50的印刷电路板60电连接。同时,树脂层20具有粘性,用作将引线框30保持至金属板10的粘合剂。功率半导体器件40和印刷电路板60布置在引线框30上,并用焊料70直接连接到引线框30。焊接所用的焊料保护剂(solder resist)在图1A和图1B中未示出。在图1A和图1B示出的示例中,仅在印刷电路板60的正面上布置了控制电路50。
功率半导体器件40是用于对电动机等进行驱动的开关器件。控制电路50是包含微计算机、外围电路等的电路,并对功率半导体器件40进行控制。功率半导体器件40被封装,并与引线框30焊接。另外,在印刷电路板60上安装控制电路是因为:对于印刷电路板60,可以实现不能由引线框30实现的高密度连线。
如图1B所示,引线框30被形成为导线图案形状,该形状包括宽图案宽度的大电流容量引线框30a和窄图案宽度的小电流容量引线框30b、30c,小信号(例如控制电路50与功率半导体器件40之间的控制信号)被传送到所述小电流容量引线框。下文中,大电流容量引线框30a和小电流容量引线框30b、30c将在合适之处称为引线框30。引线框适于大电流容量的导体,因为其连线导体的厚度有几百微米。
如上所述,功率半导体器件40以及安装了控制电路50的印刷电路板60被连接到引线框30。图2是印刷电路板60的立体图,该印刷电路板在其边缘部分包括半圆形触点端子55a。触点端子55a和引线框30用图2中未示出的焊料连接。
下面说明这样的导热板2A中电子部件的安装方法。图3是示出电子部件安装方法的流程图。
首先在金属板10上形成树脂层20(步骤S1)。接着布置引线框30(步骤S2)。如图4所示,用刻蚀技术或冲孔技术形成引线框30。同时,支撑部分64与周边部分63连接,使得多个引线框30不会分开。下文中,与支撑部分64相连的引线框30将称为引线框单元65。
在树脂层20上布置了引线框单元65之后,用切割工具(例如钳子)切割引线框30和支撑部分64的边界。如果用切割工具切割支撑部分64,则可能在切割平面中产生毛刺。在此情况下,当执行金属板10的冲孔时,执行引线框30和支撑部分64的边界区域的半切割。可以通过仅将支撑部分64弯折来执行引线框30和支撑部分64的切割,而不产生毛刺。
在树脂层20上布置了引线框30之后,布置功率半导体器件40和安装了控制电路50的印刷电路板60(步骤S3)。对引线框30和连接端子55a进行焊接。
另外,将引线框30与印刷电路板60等进行连接的方法不限于图2所示的方法。例如,也可以使用图5所示的方法。即,将弯折成L字形的引线框30的尖端部分56插入到印刷电路板60的端部附近区域中形成的通孔形状的触点端子55b中。在这种方法中,由于引线框30的尖端部分56被插入到触点端子55b中,所以插入状态不容易解除。因此具有能够容易地执行可靠焊接的优点。此外,作为触点端子55b的形状,不仅可以使用圆形,而且可以使用椭圆形和矩形。
如图6所示,还可以有将引线框30与印刷电路板60等相连的其他方法。即,在印刷电路板60的边缘部分设置焊盘状的触点端子55c,并将引线框30的尖端部分57弯折成Z字形。尖端部分57与触点端子55c接触,并被焊接。由于尖端部分57与触点端子55c进行表面接触,所以该方法具有接触电阻小的优点。
如图7所示,还可以由将引线框30与印刷电路板60等相连的其他方法。即,在印刷电路板60的边缘部分形成半圆形的触点端子55a。引线框30的尖端部分58被弯折成L字形,半圆形弯折方59设在尖端部分58。弯折方59被插入触点端子5a中并焊接。由于引线框30的弯折方59被插入印刷电路板60的触点端子55a中,所以插入状态不容易解除。因此具有能够容易地执行可靠焊接的优点。
通过使用导热板2,功率半导体器件40中产生的热量经过树脂层20而传导至金属板10。因此,由于用具有高散热特性的金属板10作为散热器,所以整个模块的温度升高容易得到抑制。另外,也可以用高导热性的陶瓷代替金属板来起到散热器的作用。此外,控制电路50和印刷电路板60可以由树脂层覆盖并可以得到保护。图1A和图1B示出了用保持部分材料61将引线框30保持至树脂层20的示例。因此,通过保持部分材料61能够实现抑制引线框30剥落的优点。
这样,功率半导体器件40和安装了控制电路50的印刷电路板60直接焊接到引线框30。因此,由于不需要引线接合处理,所以缩短了导热板2的制造处理。此外,由于功率半导体器件40等直接焊接到引线框30,所以减小了噪声的影响。此外,由于功率半导体器件40以及安装了控制电路50的印刷电路板60安装在引线框30上,所以实现了电路板的高密度安装和高性能。
<第二示例性实施例>
下面说明本发明的第二示例性实施例。图8A是根据本发明第二示例性实施例的导热板2B的剖视图。图8B是根据本发明第二示例性实施例的另一种导热板2C的剖视图。图8C是图8B的导热板2C的仰视图。
在这种示例性实施例中,为了使得控制电路50能够安装在印刷电路板60的正面和背面,在金属板中形成有预定的空间。通过这种空间避免了金属板与安装在印刷电路板背面的控制电路之间的干扰。由此,实现了电路板的高密度安装和高性能。此外,因为该空间使热传导路径变长,所以还减小了从功率半导体器件40向控制电路50传导的热量。即,抑制了控制电路50的温度升高,并且构成控制电路50的半导体器件具有难以受到热影响的优点。
在图8A中,设有凹部K1作为该空间,并在金属板10B中具有预定深度,树脂层20布置在金属板10B上。在图8B中,在金属板10C中设有孔部K2作为该空间,树脂层20布置在金属板10C上。印刷电路板60安装在引线框30上,并与之由焊料70连接。用于焊接的焊料保护剂在图8A、图8B和图8C中未示出。
导热板2B和2C能够在两侧安装布置有控制电路50等的印刷电路板60。此外,还实现了对整个模块的温度升高进行抑制、缩短制造处理以及减小噪声影响。
另外,在不脱离本发明含义的范围内,可以对上述方案进行各种改变。前文对各种实施例的说明是为了使本领域技术人员能够制造和使用本发明。此外,本领域技术人员容易想到对于这些示例性实施例的各种修改,本申请中限定的概括性原理和具体示例在不使用创造性劳动的情况下即可应用于其他实施例。因此,本发明不应认为局限于本申请中所描述的具体实施例,而是应当与由权利要求及其等同含义的限定所定义的最广阔范围相一致。还应当注意,发明人的意图是即使在审查过程中对权利要求进行了修改的情况下,也保有所要求保护的发明的全部等同物。
Claims (10)
1.一种导热板,包括:
散热部件;
热传导部件,其布置在所述散热部件上并向其传导热量;
引线框,其形成为导线图案的形状,并布置在所述热传导部件上;以及
印刷电路板,其安装有用于对第一电子部件进行控制的第二电子部件;其中,
所述第一电子部件和所述印刷电路板被焊接到所述引线框。
2.根据权利要求1所述的导热板,其中,
所述第二电子部件安装在所述印刷电路板的两侧。
3.根据权利要求2所述的导热板,还包括:
干扰防止部,其避免安装在所述印刷电路板背面上的所述第二电子部件与所述热传导部件之间的干扰。
4.根据权利要求3所述的导热板,其中,
干扰防止部是形成于所述金属板中的凹部或孔部。
5.根据权利要求1所述的导热板,还包括:
保持部件,其将所述引线框至少保持至所述树脂层。
6.根据权利要求1所述的导热板,其中,
所述印刷电路板设有通孔形状的触点端子,并且
所述引线框设有L字形的尖端部分,其中,
所述尖端部分被插入所述触点端子并与之焊接。
7.根据权利要求1所述的导热板,其中,
所述印刷电路板设有焊盘形状的触点端子,并且
所述引线框设有Z字形的尖端部分,其中,
所述尖端部分与所述触点端子进行表面接触并与之焊接。
8.根据权利要求1所述的导热板,其中,
所述印刷电路板设有形成于边缘部分的半圆形的触点端子,并且
所述引线框设有L字形的尖端部分,其中,
所述尖端部分被插入所述触点端子并与之焊接。
9.一种电子部件的安装方法,包括:
用于将热传导部件安装在散热部件上的处理步骤;
用于将导线图案形状的引线框安装在所述热传导部件上的处理步骤;
用于将第一电子部件和印刷电路板安装在所述引线框上的处理步骤,所述印刷电路板安装了用于对所述第一电子部件进行控制的第二电子部件;以及
用焊料将所述第一电子部件与所述印刷电路板电连接的处理步骤。
10.根据权利要求9所述的电子部件的安装方法,还包括:
用于在所述引线框的两侧安装所述第二电子部件的处理步骤。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009-263897 | 2009-11-19 | ||
JP2009263897A JP5106519B2 (ja) | 2009-11-19 | 2009-11-19 | 熱伝導基板及びその電子部品実装方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102074554A true CN102074554A (zh) | 2011-05-25 |
Family
ID=44011170
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010102588876A Pending CN102074554A (zh) | 2009-11-19 | 2010-08-18 | 导热板以及电子部件的安装方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8278750B2 (zh) |
JP (1) | JP5106519B2 (zh) |
CN (1) | CN102074554A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108141951A (zh) * | 2015-08-04 | 2018-06-08 | 保时捷股份公司 | 电接触装置 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012069764A (ja) | 2010-09-24 | 2012-04-05 | On Semiconductor Trading Ltd | 回路装置およびその製造方法 |
KR101278393B1 (ko) * | 2010-11-01 | 2013-06-24 | 삼성전기주식회사 | 파워 패키지 모듈 및 그의 제조방법 |
EP2635097B1 (en) | 2012-02-28 | 2021-07-07 | Electrolux Home Products Corporation N.V. | An electric and/or electronic circuit including a printed circuit board, a separate circuit board and a power connector |
US9967984B1 (en) * | 2015-01-14 | 2018-05-08 | Vlt, Inc. | Power adapter packaging |
US10264664B1 (en) | 2015-06-04 | 2019-04-16 | Vlt, Inc. | Method of electrically interconnecting circuit assemblies |
KR102218895B1 (ko) * | 2015-06-30 | 2021-02-23 | 삼성전기주식회사 | 리드프레임 및 이를 포함하는 적층 패키지 모듈 |
JP6728591B2 (ja) * | 2015-08-10 | 2020-07-22 | 日産自動車株式会社 | 電力変換装置 |
US10617007B2 (en) * | 2016-03-17 | 2020-04-07 | Telefonaktiebolaget Lm Ericsson (Publ) | Printed circuit board, a terminal and a method of assembling a printed circuit board module |
JP6790684B2 (ja) * | 2016-09-30 | 2020-11-25 | 富士電機株式会社 | 半導体装置 |
JP2019075522A (ja) * | 2017-10-19 | 2019-05-16 | 株式会社デンソー | 半導体モジュール |
CN109346449B (zh) * | 2018-11-13 | 2024-04-16 | 北方电子研究院安徽有限公司 | 一种大功率高电压ltcc模块散热封装 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0493159U (zh) * | 1990-12-21 | 1992-08-13 | ||
JPH08130282A (ja) * | 1994-10-31 | 1996-05-21 | Fuji Electric Co Ltd | 半導体装置 |
US5942797A (en) * | 1996-04-02 | 1999-08-24 | Fuji Electric Co. Ltd. | Power semiconductor module |
US20010052639A1 (en) * | 2000-06-13 | 2001-12-20 | Fairchild Korea Semiconductor Ltd. | Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof |
US20030057573A1 (en) * | 2001-09-26 | 2003-03-27 | Kabushiki Kaisha Toshiba | Semiconductor device |
US7061080B2 (en) * | 2001-06-11 | 2006-06-13 | Fairchild Korea Semiconductor Ltd. | Power module package having improved heat dissipating capability |
US7405467B2 (en) * | 2005-05-25 | 2008-07-29 | Cyntec Co., Ltd. | Power module package structure |
CN101276799A (zh) * | 2007-03-26 | 2008-10-01 | 三菱电机株式会社 | 半导体装置及其制造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62134254U (zh) * | 1986-02-14 | 1987-08-24 | ||
JPH11233712A (ja) * | 1998-02-12 | 1999-08-27 | Hitachi Ltd | 半導体装置及びその製法とそれを使った電気機器 |
JP4533152B2 (ja) * | 2005-01-06 | 2010-09-01 | 三菱電機株式会社 | 半導体装置 |
JP4882562B2 (ja) * | 2006-07-13 | 2012-02-22 | パナソニック株式会社 | 熱伝導基板とその製造方法及び電源ユニット及び電子機器 |
JP5003202B2 (ja) * | 2007-02-26 | 2012-08-15 | パナソニック株式会社 | 熱伝導基板とその製造方法及び回路モジュール |
JP2009224529A (ja) * | 2008-03-17 | 2009-10-01 | Fuji Electric Device Technology Co Ltd | 半導体装置およびその製造方法 |
-
2009
- 2009-11-19 JP JP2009263897A patent/JP5106519B2/ja active Active
-
2010
- 2010-06-22 US US12/820,611 patent/US8278750B2/en active Active
- 2010-08-18 CN CN2010102588876A patent/CN102074554A/zh active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0493159U (zh) * | 1990-12-21 | 1992-08-13 | ||
JPH08130282A (ja) * | 1994-10-31 | 1996-05-21 | Fuji Electric Co Ltd | 半導体装置 |
US5942797A (en) * | 1996-04-02 | 1999-08-24 | Fuji Electric Co. Ltd. | Power semiconductor module |
US20010052639A1 (en) * | 2000-06-13 | 2001-12-20 | Fairchild Korea Semiconductor Ltd. | Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof |
US7061080B2 (en) * | 2001-06-11 | 2006-06-13 | Fairchild Korea Semiconductor Ltd. | Power module package having improved heat dissipating capability |
US20030057573A1 (en) * | 2001-09-26 | 2003-03-27 | Kabushiki Kaisha Toshiba | Semiconductor device |
US7405467B2 (en) * | 2005-05-25 | 2008-07-29 | Cyntec Co., Ltd. | Power module package structure |
CN101276799A (zh) * | 2007-03-26 | 2008-10-01 | 三菱电机株式会社 | 半导体装置及其制造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108141951A (zh) * | 2015-08-04 | 2018-06-08 | 保时捷股份公司 | 电接触装置 |
Also Published As
Publication number | Publication date |
---|---|
JP5106519B2 (ja) | 2012-12-26 |
JP2011108924A (ja) | 2011-06-02 |
US8278750B2 (en) | 2012-10-02 |
US20110116236A1 (en) | 2011-05-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102074554A (zh) | 导热板以及电子部件的安装方法 | |
KR101388328B1 (ko) | 통합 tht 히트 스프레더 핀을 구비한 리드 프레임 기반 오버-몰딩 반도체 패키지와 그 제조 방법 | |
JP3897824B2 (ja) | 電力構造部品のための支持体基板と冷却部材を含む装置及びその製造方法 | |
CN101920721B (zh) | 电子控制装置 | |
JP4438004B2 (ja) | 回路構成体 | |
US9980364B2 (en) | Wiring substrate and manufacturing method thereof | |
JP2018525826A (ja) | レーザ部品およびその製造方法 | |
JP5240982B2 (ja) | 熱コンジット | |
JP2007095984A (ja) | 半導体モジュール | |
JP5748547B2 (ja) | 半導体装置 | |
JP4522271B2 (ja) | 電子装置及びこれに用いられる放熱板アセンブリ | |
US20060274497A1 (en) | Electronic apparatus with thermal module | |
JP5904573B2 (ja) | コネクタ | |
JP2007299874A (ja) | 熱伝導性基板及び電気伝導性基板 | |
EP2200408B1 (en) | Circuit board device, in particular for an electric power consuming device in a motor vehicle | |
JP2002118215A (ja) | 半導体装置 | |
JPH11195747A (ja) | 電子回路モジュール | |
JP5848890B2 (ja) | 積層配線基板及びその製造方法 | |
CN211376627U (zh) | 一种逆变器 | |
EP4322313A2 (en) | A battery pack and an electric tool including the battery pack | |
EP2323465B1 (en) | Electrical circuit with heat sink | |
WO2010055912A1 (ja) | 電子回路装置 | |
KR20220014720A (ko) | 파워 모듈 및 게이트 보드의 통합 구조 | |
JP4677865B2 (ja) | 回路基板 | |
JP2008078264A (ja) | 配線用基板及び配線用基板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110525 |