JP2001338990A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP2001338990A
JP2001338990A JP2000155585A JP2000155585A JP2001338990A JP 2001338990 A JP2001338990 A JP 2001338990A JP 2000155585 A JP2000155585 A JP 2000155585A JP 2000155585 A JP2000155585 A JP 2000155585A JP 2001338990 A JP2001338990 A JP 2001338990A
Authority
JP
Japan
Prior art keywords
gate electrode
region
semiconductor device
source
active region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2000155585A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001338990A5 (enExample
Inventor
Shigetoshi Takeda
重利 竹田
Taiji Ema
泰示 江間
Gillingham Peter Bruce
ブルース ギリンガム ピーター
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mosaid Technologies Inc
Fujitsu Ltd
Original Assignee
Mosaid Technologies Inc
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mosaid Technologies Inc, Fujitsu Ltd filed Critical Mosaid Technologies Inc
Priority to JP2000155585A priority Critical patent/JP2001338990A/ja
Priority to US09/750,068 priority patent/US6529397B2/en
Priority to KR1020010000209A priority patent/KR100704252B1/ko
Priority to TW090110312A priority patent/TW531849B/zh
Priority to EP01401381A priority patent/EP1158529A1/en
Publication of JP2001338990A publication Critical patent/JP2001338990A/ja
Publication of JP2001338990A5 publication Critical patent/JP2001338990A5/ja
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C15/00—Digital stores in which information comprising one or more characteristic parts is written into the store and in which information is read-out by searching for one or more of these characteristic parts, i.e. associative or content-addressed stores
    • G11C15/04—Digital stores in which information comprising one or more characteristic parts is written into the store and in which information is read-out by searching for one or more of these characteristic parts, i.e. associative or content-addressed stores using semiconductor elements
    • G11C15/043—Digital stores in which information comprising one or more characteristic parts is written into the store and in which information is read-out by searching for one or more of these characteristic parts, i.e. associative or content-addressed stores using semiconductor elements using capacitive charge storage elements
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C15/00—Digital stores in which information comprising one or more characteristic parts is written into the store and in which information is read-out by searching for one or more of these characteristic parts, i.e. associative or content-addressed stores
    • G11C15/04—Digital stores in which information comprising one or more characteristic parts is written into the store and in which information is read-out by searching for one or more of these characteristic parts, i.e. associative or content-addressed stores using semiconductor elements

Landscapes

  • Semiconductor Memories (AREA)
JP2000155585A 2000-05-26 2000-05-26 半導体装置 Ceased JP2001338990A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2000155585A JP2001338990A (ja) 2000-05-26 2000-05-26 半導体装置
US09/750,068 US6529397B2 (en) 2000-05-26 2000-12-29 Memory-logic semiconductor device
KR1020010000209A KR100704252B1 (ko) 2000-05-26 2001-01-03 반도체 장치
TW090110312A TW531849B (en) 2000-05-26 2001-04-30 Memory-logic semiconductor device
EP01401381A EP1158529A1 (en) 2000-05-26 2001-05-25 Memory-logic semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000155585A JP2001338990A (ja) 2000-05-26 2000-05-26 半導体装置

Publications (2)

Publication Number Publication Date
JP2001338990A true JP2001338990A (ja) 2001-12-07
JP2001338990A5 JP2001338990A5 (enExample) 2007-07-12

Family

ID=18660511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000155585A Ceased JP2001338990A (ja) 2000-05-26 2000-05-26 半導体装置

Country Status (5)

Country Link
US (1) US6529397B2 (enExample)
EP (1) EP1158529A1 (enExample)
JP (1) JP2001338990A (enExample)
KR (1) KR100704252B1 (enExample)
TW (1) TW531849B (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003052829A1 (fr) * 2001-12-14 2003-06-26 Hitachi, Ltd. Dispositif semi-conducteur et procede de fabrication correspondant
JP2004128266A (ja) * 2002-10-03 2004-04-22 Fujitsu Ltd 半導体装置
US7498627B2 (en) 2003-07-14 2009-03-03 Renesas Technology Corp. Semiconductor device including a TCAM having a storage element formed with a DRAM
JP2022022397A (ja) * 2011-10-13 2022-02-03 株式会社半導体エネルギー研究所 半導体装置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6706635B2 (en) * 2002-06-05 2004-03-16 Texas Instruments Incorporated Innovative method to build a high precision analog capacitor with low voltage coefficient and hysteresis
US6744654B2 (en) * 2002-08-21 2004-06-01 Micron Technology, Inc. High density dynamic ternary-CAM memory architecture
KR100604911B1 (ko) * 2004-10-20 2006-07-28 삼성전자주식회사 하부전극 콘택을 갖는 반도체 메모리 소자 및 그 제조방법
US7714315B2 (en) * 2006-02-07 2010-05-11 Qimonda North America Corp. Thermal isolation of phase change memory cells
TWI469354B (zh) 2008-07-31 2015-01-11 Semiconductor Energy Lab 半導體裝置及其製造方法
US9666719B2 (en) * 2008-07-31 2017-05-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
SG178057A1 (en) * 2009-10-16 2012-03-29 Semiconductor Energy Lab Logic circuit and semiconductor device
US8259518B2 (en) * 2010-06-08 2012-09-04 Sichuan Kiloway Electronics Inc. Low voltage and low power memory cell based on nano current voltage divider controlled low voltage sense MOSFET
KR102358481B1 (ko) * 2017-06-08 2022-02-04 삼성전자주식회사 반도체 소자 및 그의 제조 방법
US12308618B2 (en) * 2021-04-26 2025-05-20 Lumentum Operations Llc Matrix addressable vertical cavity surface emitting laser array
CN117690864A (zh) * 2023-11-01 2024-03-12 武汉新芯集成电路制造有限公司 一种存储器件的制造方法及存储器件

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03166761A (ja) * 1989-11-27 1991-07-18 Mitsubishi Electric Corp 半導体集積回路装置
JPH11111974A (ja) * 1997-09-30 1999-04-23 Matsushita Electron Corp 半導体装置およびその製造方法
JPH11243180A (ja) * 1998-02-25 1999-09-07 Sony Corp 半導体装置の製造方法
JPH11274321A (ja) * 1998-03-25 1999-10-08 Citizen Watch Co Ltd メモリ素子の構造
JP2002541610A (ja) * 1999-03-31 2002-12-03 モサイド・テクノロジーズ・インコーポレイテッド ダイナミック連想記憶セル

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4247919A (en) 1979-06-15 1981-01-27 Texas Instruments Incorporated Low power quasi-static storage cell
US5196910A (en) 1987-04-24 1993-03-23 Hitachi, Ltd. Semiconductor memory device with recessed array region
US4791606A (en) 1987-09-01 1988-12-13 Triad Semiconductors International Bv High density CMOS dynamic CAM cell
KR100212098B1 (ko) 1987-09-19 1999-08-02 가나이 쓰도무 반도체 집적회로 장치 및 그 제조 방법과 반도체 집적 회로 장치의 배선기판 및 그 제조 방법
US5346834A (en) * 1988-11-21 1994-09-13 Hitachi, Ltd. Method for manufacturing a semiconductor device and a semiconductor memory device
US5146300A (en) 1989-11-27 1992-09-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor integrated circuit device having improved stacked capacitor and manufacturing method therefor
JPH0669449A (ja) 1992-08-18 1994-03-11 Sony Corp ダイナミックｒａｍの配線構造およびその製造方法
US5432356A (en) * 1993-04-02 1995-07-11 Fujitsu Limited Semiconductor heterojunction floating layer memory device and method for storing information in the same
JP2836596B2 (ja) 1996-08-02 1998-12-14 日本電気株式会社 連想メモリ
US5949696A (en) 1997-06-30 1999-09-07 Cypress Semiconductor Corporation Differential dynamic content addressable memory and high speed network address filtering
JP3914618B2 (ja) * 1997-09-24 2007-05-16 エルピーダメモリ株式会社 半導体集積回路装置
US6072711A (en) * 1997-12-12 2000-06-06 Lg Semicon Co., Ltd. Ferroelectric memory device without a separate cell plate line and method of making the same
JPH11224495A (ja) * 1998-02-05 1999-08-17 Hitachi Ltd 半導体集積回路装置
JP3166761B2 (ja) 1998-11-24 2001-05-14 トヨタ車体株式会社 貨物車両のプラットフォーム支持装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03166761A (ja) * 1989-11-27 1991-07-18 Mitsubishi Electric Corp 半導体集積回路装置
JPH11111974A (ja) * 1997-09-30 1999-04-23 Matsushita Electron Corp 半導体装置およびその製造方法
JPH11243180A (ja) * 1998-02-25 1999-09-07 Sony Corp 半導体装置の製造方法
JPH11274321A (ja) * 1998-03-25 1999-10-08 Citizen Watch Co Ltd メモリ素子の構造
JP2002541610A (ja) * 1999-03-31 2002-12-03 モサイド・テクノロジーズ・インコーポレイテッド ダイナミック連想記憶セル

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003052829A1 (fr) * 2001-12-14 2003-06-26 Hitachi, Ltd. Dispositif semi-conducteur et procede de fabrication correspondant
JPWO2003052829A1 (ja) * 2001-12-14 2005-04-28 株式会社日立製作所 半導体装置及びその製造方法
CN100336226C (zh) * 2001-12-14 2007-09-05 株式会社日立制作所 半导体器件
US7408218B2 (en) 2001-12-14 2008-08-05 Renesas Technology Corporation Semiconductor device having plural dram memory cells and a logic circuit
US7683419B2 (en) 2001-12-14 2010-03-23 Renesas Technology Corp. Semiconductor device having plural DRAM memory cells and a logic circuit and method for manufacturing the same
US7804118B2 (en) 2001-12-14 2010-09-28 Renesas Technology Corp. Semiconductor device having plural DRAM memory cells and a logic circuit and method for manufacturing the same
US8106441B2 (en) 2001-12-14 2012-01-31 Renesas Electronics Corporation Semiconductor device having plural DRAM memory cells and a logic circuit and method for manufacturing the same
JP2004128266A (ja) * 2002-10-03 2004-04-22 Fujitsu Ltd 半導体装置
US7498627B2 (en) 2003-07-14 2009-03-03 Renesas Technology Corp. Semiconductor device including a TCAM having a storage element formed with a DRAM
US7508022B2 (en) 2003-07-14 2009-03-24 Renesas Technology Corp. Semiconductor device including a TCAM having a storage element formed with a DRAM
JP2022022397A (ja) * 2011-10-13 2022-02-03 株式会社半導体エネルギー研究所 半導体装置
JP7220273B2 (ja) 2011-10-13 2023-02-09 株式会社半導体エネルギー研究所 半導体装置

Also Published As

Publication number Publication date
EP1158529A1 (en) 2001-11-28
US6529397B2 (en) 2003-03-04
KR100704252B1 (ko) 2007-04-06
KR20010107522A (ko) 2001-12-07
TW531849B (en) 2003-05-11
US20010046151A1 (en) 2001-11-29

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