JP2001330962A5 - - Google Patents
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- JP2001330962A5 JP2001330962A5 JP2000146224A JP2000146224A JP2001330962A5 JP 2001330962 A5 JP2001330962 A5 JP 2001330962A5 JP 2000146224 A JP2000146224 A JP 2000146224A JP 2000146224 A JP2000146224 A JP 2000146224A JP 2001330962 A5 JP2001330962 A5 JP 2001330962A5
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- Japan
- Prior art keywords
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- thermal expansion
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- metal
- Prior art date
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- 239000000203 mixture Substances 0.000 description 16
- 229920000642 polymer Polymers 0.000 description 14
- 239000002184 metal Substances 0.000 description 13
- 239000002243 precursor Substances 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 239000011888 foil Substances 0.000 description 6
- 229920005575 poly(amic acid) Polymers 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 5
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 4
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 150000003918 triazines Chemical class 0.000 description 4
- HHLMWQDRYZAENA-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)C=C1 HHLMWQDRYZAENA-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 229940111121 antirheumatic drug quinolines Drugs 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 150000002475 indoles Chemical class 0.000 description 3
- 239000003504 photosensitizing agent Substances 0.000 description 3
- 150000003230 pyrimidines Chemical class 0.000 description 3
- 150000003248 quinolines Chemical class 0.000 description 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- MLZQBMZXBHDWJM-UHFFFAOYSA-N 6-anilino-1h-1,3,5-triazine-2,4-dithione Chemical compound N1C(=S)NC(=S)N=C1NC1=CC=CC=C1 MLZQBMZXBHDWJM-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 125000004427 diamine group Chemical group 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 150000002923 oximes Chemical class 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 150000003233 pyrroles Chemical class 0.000 description 2
- 150000000000 tetracarboxylic acids Chemical group 0.000 description 2
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- FZFBUAUMWGOLRR-UHFFFAOYSA-N 1-sulfanyl-1,3,5-triazinane-2,4,6-trione Chemical class SN1C(=O)NC(=O)NC1=O FZFBUAUMWGOLRR-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- QOSSAOTZNIDXMA-UHFFFAOYSA-N Dicylcohexylcarbodiimide Chemical compound C1CCCCC1N=C=NC1CCCCC1 QOSSAOTZNIDXMA-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical compound C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 150000005041 phenanthrolines Chemical class 0.000 description 1
- 125000005561 phenanthryl group Chemical group 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920002577 polybenzoxazole Polymers 0.000 description 1
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- LZOZLBFZGFLFBV-UHFFFAOYSA-N sulfene Chemical compound C=S(=O)=O LZOZLBFZGFLFBV-UHFFFAOYSA-N 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- -1 triazine thiols Chemical class 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- UHUUYVZLXJHWDV-UHFFFAOYSA-N trimethyl(methylsilyloxy)silane Chemical compound C[SiH2]O[Si](C)(C)C UHUUYVZLXJHWDV-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000146224A JP4513170B2 (ja) | 2000-05-18 | 2000-05-18 | 感光性重合体組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000146224A JP4513170B2 (ja) | 2000-05-18 | 2000-05-18 | 感光性重合体組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001330962A JP2001330962A (ja) | 2001-11-30 |
| JP2001330962A5 true JP2001330962A5 (OSRAM) | 2007-06-28 |
| JP4513170B2 JP4513170B2 (ja) | 2010-07-28 |
Family
ID=18652615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000146224A Expired - Fee Related JP4513170B2 (ja) | 2000-05-18 | 2000-05-18 | 感光性重合体組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4513170B2 (OSRAM) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1818722A4 (en) | 2004-12-03 | 2010-02-17 | Tokyo Ohka Kogyo Co Ltd | CHEMICALLY AMPLIFIED PHOTORESIST COMPOSITION, PHOTORESIST LAMINATE, METHOD FOR PRODUCING PHOTORESIST COMPOSITION, METHOD FOR PRODUCING PHOTORESIST PATTERN, AND METHOD FOR PRODUCING JUNCTION TERMINAL |
| JP4925732B2 (ja) * | 2005-06-07 | 2012-05-09 | 旭化成イーマテリアルズ株式会社 | ポジ型感光性樹脂組成物 |
| JP5061435B2 (ja) * | 2005-08-01 | 2012-10-31 | 東レ株式会社 | 耐熱樹脂前駆体組成物およびそれを用いた半導体装置 |
| JP2007078812A (ja) * | 2005-09-12 | 2007-03-29 | Sumitomo Bakelite Co Ltd | 感光性樹脂組成物、それを用いた半導体装置、表示素子 |
| WO2008123233A1 (ja) * | 2007-03-30 | 2008-10-16 | Zeon Corporation | 感放射線樹脂組成物、アクティブマトリックス基板及びその製造方法 |
| JP5747437B2 (ja) * | 2009-04-14 | 2015-07-15 | 日立化成デュポンマイクロシステムズ株式会社 | 感光性樹脂組成物及びこれを用いた回路形成用基板 |
| JP2011084637A (ja) * | 2009-10-15 | 2011-04-28 | Asahi Kasei E-Materials Corp | ポリイミド樹脂組成物、及びポリイミド金属積層板 |
| JP6048257B2 (ja) * | 2013-03-25 | 2016-12-21 | 東レ株式会社 | 耐熱性樹脂及びその前駆体組成物 |
| JP6390165B2 (ja) * | 2014-05-21 | 2018-09-19 | 日立化成デュポンマイクロシステムズ株式会社 | ポリイミド前駆体、該ポリイミド前駆体を含む感光性樹脂組成物、それを用いたパターン硬化膜の製造方法及び半導体装置 |
| JP7035632B2 (ja) * | 2018-03-05 | 2022-03-15 | Ｈｄマイクロシステムズ株式会社 | 感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品 |
| CN114207522B (zh) | 2019-07-29 | 2026-03-06 | 旭化成株式会社 | 负型感光性树脂组合物、聚酰亚胺的制造方法、固化浮雕图案的制造方法和半导体装置 |
| JP7814119B2 (ja) * | 2021-08-04 | 2026-02-16 | 旭化成株式会社 | 感光性樹脂組成物、ポリイミドの製造方法、硬化レリーフパターンの製造方法、及び半導体装置 |
| WO2024048296A1 (ja) * | 2022-08-29 | 2024-03-07 | 富士フイルム株式会社 | 感光性組成物、転写フィルム、積層体の製造方法、積層体、半導体パッケージ、樹脂 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2844219B2 (ja) * | 1988-08-24 | 1999-01-06 | 旭化成工業株式会社 | 低応力ポリイミド前駆体、及びポリイミド複合成形体の製造方法 |
| JPH06118645A (ja) * | 1992-10-02 | 1994-04-28 | Japan Synthetic Rubber Co Ltd | 感光性樹脂組成物 |
| DE59403359D1 (de) * | 1993-05-14 | 1997-08-21 | Ocg Microelectronic Materials | Verfahren zur Herstellung von Reliefstrukturen durch i-Linien-Bestrahlung |
| US5856065A (en) * | 1996-03-27 | 1999-01-05 | Olin Microelectronic Chemicals, Inc. | Negative working photoresist composition based on polyimide primers |
| JPH11160880A (ja) * | 1997-11-28 | 1999-06-18 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた感光性フィルム |
-
2000
- 2000-05-18 JP JP2000146224A patent/JP4513170B2/ja not_active Expired - Fee Related
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