JP2001326270A5 - - Google Patents

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Publication number
JP2001326270A5
JP2001326270A5 JP2001040169A JP2001040169A JP2001326270A5 JP 2001326270 A5 JP2001326270 A5 JP 2001326270A5 JP 2001040169 A JP2001040169 A JP 2001040169A JP 2001040169 A JP2001040169 A JP 2001040169A JP 2001326270 A5 JP2001326270 A5 JP 2001326270A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001040169A
Other languages
Japanese (ja)
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JP2001326270A (ja
JP4700819B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2001040169A external-priority patent/JP4700819B2/ja
Priority to JP2001040169A priority Critical patent/JP4700819B2/ja
Priority to US09/799,060 priority patent/US6862080B2/en
Priority to EP10151068A priority patent/EP2192608A1/en
Priority to EP01302152A priority patent/EP1132948B1/en
Priority to DE60136119T priority patent/DE60136119D1/de
Priority to EP07075481A priority patent/EP1843382B1/en
Priority to DE60142862T priority patent/DE60142862D1/de
Publication of JP2001326270A publication Critical patent/JP2001326270A/ja
Priority to US10/931,984 priority patent/US6982784B2/en
Priority to US11/220,677 priority patent/US7102735B2/en
Publication of JP2001326270A5 publication Critical patent/JP2001326270A5/ja
Publication of JP4700819B2 publication Critical patent/JP4700819B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2001040169A 2000-03-10 2001-02-16 基板保持装置、半導体製造装置および半導体デバイス製造方法 Expired - Fee Related JP4700819B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2001040169A JP4700819B2 (ja) 2000-03-10 2001-02-16 基板保持装置、半導体製造装置および半導体デバイス製造方法
US09/799,060 US6862080B2 (en) 2000-03-10 2001-03-06 Substrate holding device, semiconductor manufacturing apparatus and device manufacturing method
DE60142862T DE60142862D1 (de) 2000-03-10 2001-03-09 Substrathaltevorrichtung
EP01302152A EP1132948B1 (en) 2000-03-10 2001-03-09 Substrate holding device and method of mounting a substrate to a substrate holding device
DE60136119T DE60136119D1 (de) 2000-03-10 2001-03-09 Einrichtung zum Halten eines Substrats und Verfahren zur Aufbringung eines Substrats auf einen Substrathalter
EP07075481A EP1843382B1 (en) 2000-03-10 2001-03-09 Substrate holding device
EP10151068A EP2192608A1 (en) 2000-03-10 2001-03-09 Substrate holding device
US10/931,984 US6982784B2 (en) 2000-03-10 2004-09-02 Substrate holding device, semiconductor manufacturing apparatus and device manufacturing method
US11/220,677 US7102735B2 (en) 2000-03-10 2005-09-08 Substrate holding device, semiconductor manufacturing apparatus and device manufacturing method

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2000066378 2000-03-10
JP2000066378 2000-03-10
JP2000-66378 2000-03-10
JP2001040169A JP4700819B2 (ja) 2000-03-10 2001-02-16 基板保持装置、半導体製造装置および半導体デバイス製造方法

Publications (3)

Publication Number Publication Date
JP2001326270A JP2001326270A (ja) 2001-11-22
JP2001326270A5 true JP2001326270A5 (enExample) 2008-04-03
JP4700819B2 JP4700819B2 (ja) 2011-06-15

Family

ID=26587170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001040169A Expired - Fee Related JP4700819B2 (ja) 2000-03-10 2001-02-16 基板保持装置、半導体製造装置および半導体デバイス製造方法

Country Status (4)

Country Link
US (3) US6862080B2 (enExample)
EP (3) EP1132948B1 (enExample)
JP (1) JP4700819B2 (enExample)
DE (2) DE60142862D1 (enExample)

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