ATE535015T1 - Substrathalter, bühnenvorrichtung und belichtungsvorrichtung - Google Patents

Substrathalter, bühnenvorrichtung und belichtungsvorrichtung

Info

Publication number
ATE535015T1
ATE535015T1 AT05774525T AT05774525T ATE535015T1 AT E535015 T1 ATE535015 T1 AT E535015T1 AT 05774525 T AT05774525 T AT 05774525T AT 05774525 T AT05774525 T AT 05774525T AT E535015 T1 ATE535015 T1 AT E535015T1
Authority
AT
Austria
Prior art keywords
substrate holder
stage
substrate
exposure
circumferential edge
Prior art date
Application number
AT05774525T
Other languages
English (en)
Inventor
Yuichi Shibazaki
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Application granted granted Critical
Publication of ATE535015T1 publication Critical patent/ATE535015T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
AT05774525T 2004-09-01 2005-08-29 Substrathalter, bühnenvorrichtung und belichtungsvorrichtung ATE535015T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004253978 2004-09-01
PCT/JP2005/015687 WO2006025341A1 (ja) 2004-09-01 2005-08-29 基板ホルダ及びステージ装置並びに露光装置

Publications (1)

Publication Number Publication Date
ATE535015T1 true ATE535015T1 (de) 2011-12-15

Family

ID=35999993

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05774525T ATE535015T1 (de) 2004-09-01 2005-08-29 Substrathalter, bühnenvorrichtung und belichtungsvorrichtung

Country Status (8)

Country Link
US (2) US20070252970A1 (de)
EP (1) EP1796143B1 (de)
JP (1) JP4779973B2 (de)
KR (1) KR101187611B1 (de)
AT (1) ATE535015T1 (de)
HK (1) HK1101622A1 (de)
TW (1) TWI394226B (de)
WO (1) WO2006025341A1 (de)

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EP3226073A3 (de) 2003-04-09 2017-10-11 Nikon Corporation Belichtungsverfahren und -vorrichtung sowie verfahren zur herstellung der vorrichtung
TWI609409B (zh) 2003-10-28 2017-12-21 尼康股份有限公司 照明光學裝置、曝光裝置、曝光方法以及元件製造方法
TWI512335B (zh) 2003-11-20 2015-12-11 尼康股份有限公司 光束變換元件、光學照明裝置、曝光裝置、以及曝光方法
TWI614795B (zh) 2004-02-06 2018-02-11 Nikon Corporation 光學照明裝置、曝光裝置、曝光方法以及元件製造方法
US7324185B2 (en) 2005-03-04 2008-01-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8248577B2 (en) 2005-05-03 2012-08-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP3232270A3 (de) 2005-05-12 2017-12-13 Nikon Corporation Optisches projektionssystem, belichtungsvorrichtung und belichtungsverfahren
US7607647B2 (en) * 2007-03-20 2009-10-27 Kla-Tencor Technologies Corporation Stabilizing a substrate using a vacuum preload air bearing chuck
US20090009733A1 (en) * 2007-07-06 2009-01-08 Canon Kabushiki Kaisha Exposure apparatus
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
JP5267029B2 (ja) 2007-10-12 2013-08-21 株式会社ニコン 照明光学装置、露光装置及びデバイスの製造方法
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US8145349B2 (en) 2008-05-14 2012-03-27 Formfactor, Inc. Pre-aligner search
US8336188B2 (en) * 2008-07-17 2012-12-25 Formfactor, Inc. Thin wafer chuck
EP2221668B1 (de) * 2009-02-24 2021-04-14 ASML Netherlands B.V. Lithographischer Apparat und Positionierungsanordnung
CN102203677B (zh) * 2009-11-25 2013-11-06 恩斯克科技有限公司 曝光装置以及基板的曝光方法
KR101703716B1 (ko) * 2009-12-15 2017-02-08 주식회사 탑 엔지니어링 스테이지 및 이를 구비하는 디스펜서
JP5620574B2 (ja) * 2010-06-07 2014-11-05 カスケード マイクロテックインコーポレイテッドＣａｓｃａｄｅ Ｍｉｃｒｏｔｅｃｈ，Ｉｎｃｏｒｐｏｒａｔｅｄ プローブステーション用高電圧チャック
DE202012013639U1 (de) * 2011-12-01 2018-12-06 solar-semi GmbH Vorrichtung zum Bearbeiten eines Substrats
JP6066149B2 (ja) * 2013-05-23 2017-01-25 株式会社ニコン 基板保持方法及び装置、並びに露光方法及び装置
KR20170137050A (ko) 2015-04-10 2017-12-12 에베 그룹 에. 탈너 게엠베하 2개의 기판을 결합하기 위한 기판 홀더 및 방법.
US10978332B2 (en) * 2016-10-05 2021-04-13 Prilit Optronics, Inc. Vacuum suction apparatus
SG11202002228UA (en) 2017-10-12 2020-04-29 Asml Netherlands Bv Substrate holder for use in a lithographic apparatus
US11081383B2 (en) * 2017-11-24 2021-08-03 Taiwan Semiconductor Manufacturing Co., Ltd. Substrate table with vacuum channels grid
KR101982833B1 (ko) * 2018-11-27 2019-05-28 주식회사 엠오티 워크테이블 처짐 보정 기능을 구비한 글래스 검사 장치
KR101983385B1 (ko) * 2018-11-27 2019-05-28 주식회사 엠오티 워크테이블의 처짐 보정 장치
CN113075865B (zh) * 2020-01-06 2022-11-08 夏泰鑫半导体(青岛)有限公司 一种用于处理半导体衬底的装置和方法
JP1700777S (de) * 2021-03-15 2021-11-29

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JP4029183B2 (ja) 1996-11-28 2008-01-09 株式会社ニコン 投影露光装置及び投影露光方法
EP0890136B9 (de) * 1996-12-24 2003-12-10 ASML Netherlands B.V. In zwei richtungen ausgewogenes positioniergerät, sowie lithographisches gerät mit einem solchen positioniergerät
AU2747999A (en) * 1998-03-26 1999-10-18 Nikon Corporation Projection exposure method and system
JP3810039B2 (ja) * 1998-05-06 2006-08-16 キヤノン株式会社 ステージ装置
US6225796B1 (en) * 1999-06-23 2001-05-01 Texas Instruments Incorporated Zero temperature coefficient bandgap reference circuit and method
JP3260340B2 (ja) * 1999-08-23 2002-02-25 太平洋セメント株式会社 複合セラミックスおよびその製造方法
US6426790B1 (en) * 2000-02-28 2002-07-30 Nikon Corporation Stage apparatus and holder, and scanning exposure apparatus and exposure apparatus
JP4700819B2 (ja) 2000-03-10 2011-06-15 キヤノン株式会社 基板保持装置、半導体製造装置および半導体デバイス製造方法
JP2002246450A (ja) * 2001-02-20 2002-08-30 Nikon Corp 基板保持装置及び基板搬送方法
EP1274121A1 (de) * 2001-06-29 2003-01-08 Infineon Technologies SC300 GmbH & Co. KG Halbleiterwaferhalter
KR100588124B1 (ko) * 2002-11-12 2006-06-09 에이에스엠엘 네델란즈 비.브이. 리소그래피장치 및 디바이스제조방법
JP2006054364A (ja) 2004-08-13 2006-02-23 Nikon Corp 基板吸着装置、露光装置

Also Published As

Publication number Publication date
US20100141924A1 (en) 2010-06-10
JPWO2006025341A1 (ja) 2008-05-08
HK1101622A1 (en) 2007-10-18
JP4779973B2 (ja) 2011-09-28
EP1796143B1 (de) 2011-11-23
TW200625504A (en) 2006-07-16
KR101187611B1 (ko) 2012-10-08
TWI394226B (zh) 2013-04-21
EP1796143A1 (de) 2007-06-13
EP1796143A4 (de) 2009-06-17
US8717543B2 (en) 2014-05-06
WO2006025341A1 (ja) 2006-03-09
KR20070044818A (ko) 2007-04-30
US20070252970A1 (en) 2007-11-01

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