JP2001210693A5 - - Google Patents
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- Publication number
- JP2001210693A5 JP2001210693A5 JP2000017223A JP2000017223A JP2001210693A5 JP 2001210693 A5 JP2001210693 A5 JP 2001210693A5 JP 2000017223 A JP2000017223 A JP 2000017223A JP 2000017223 A JP2000017223 A JP 2000017223A JP 2001210693 A5 JP2001210693 A5 JP 2001210693A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- chamber
- outside air
- processing chamber
- film forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 description 11
- 238000004140 cleaning Methods 0.000 description 7
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000017223A JP3998386B2 (ja) | 2000-01-26 | 2000-01-26 | 液晶表示装置の製造装置および液晶表示装置の製造方法 |
| US09/715,022 US6461437B1 (en) | 2000-01-26 | 2000-11-20 | Apparatus used for fabricating liquid crystal device and method of fabricating the same |
| CNB001364952A CN1196173C (zh) | 2000-01-26 | 2000-12-27 | 液晶显示装置的制造装置和液晶显示装置的制造方法 |
| KR10-2001-0003540A KR100381807B1 (ko) | 2000-01-26 | 2001-01-22 | 액정 표시 장치의 제조 장치 및 액정 표시 장치의 제조 방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000017223A JP3998386B2 (ja) | 2000-01-26 | 2000-01-26 | 液晶表示装置の製造装置および液晶表示装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001210693A JP2001210693A (ja) | 2001-08-03 |
| JP2001210693A5 true JP2001210693A5 (enExample) | 2005-04-07 |
| JP3998386B2 JP3998386B2 (ja) | 2007-10-24 |
Family
ID=18544249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000017223A Expired - Fee Related JP3998386B2 (ja) | 2000-01-26 | 2000-01-26 | 液晶表示装置の製造装置および液晶表示装置の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6461437B1 (enExample) |
| JP (1) | JP3998386B2 (enExample) |
| KR (1) | KR100381807B1 (enExample) |
| CN (1) | CN1196173C (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI270626B (en) * | 2002-04-23 | 2007-01-11 | Display Mfg Service Co Ltd | Wet processing bath and fluid supplying system for liquid crystal display manufacturing equipment |
| JP4219799B2 (ja) * | 2003-02-26 | 2009-02-04 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP4833512B2 (ja) * | 2003-06-24 | 2011-12-07 | 東京エレクトロン株式会社 | 被処理体処理装置、被処理体処理方法及び被処理体搬送方法 |
| DE20321795U1 (de) * | 2003-12-11 | 2010-03-04 | Voith Patent Gmbh | Vorrichtung zum Reinigen wenigsten einer Prozesskammer zum Beschichten wenigstens eines Substrats |
| US7422653B2 (en) * | 2004-07-13 | 2008-09-09 | Applied Materials, Inc. | Single-sided inflatable vertical slit valve |
| US8075953B2 (en) * | 2005-09-15 | 2011-12-13 | Hiap L. Ong and Kyoritsu Optronics Co., Ltd | Thin organic alignment layers with a batch process for liquid crystal displays |
| JP4765986B2 (ja) * | 2007-03-23 | 2011-09-07 | 村田機械株式会社 | 搬送システム |
| JP5190215B2 (ja) * | 2007-03-30 | 2013-04-24 | 東京エレクトロン株式会社 | ターボ分子ポンプの洗浄方法 |
| KR20130041089A (ko) * | 2010-06-21 | 2013-04-24 | 가부시키가이샤 알박 | 기판 반전 장치, 진공 성막 장치 및 기판 반전 방법 |
| WO2012082198A1 (en) * | 2010-12-13 | 2012-06-21 | Tp Solar, Inc. | Dopant applicator system and method of applying vaporized doping compositions to pv solar wafers |
| JP5472283B2 (ja) * | 2011-12-21 | 2014-04-16 | 株式会社安川電機 | ロボットのアーム構造およびロボット |
| US9837271B2 (en) | 2014-07-18 | 2017-12-05 | Asm Ip Holding B.V. | Process for forming silicon-filled openings with a reduced occurrence of voids |
| US9443730B2 (en) * | 2014-07-18 | 2016-09-13 | Asm Ip Holding B.V. | Process for forming silicon-filled openings with a reduced occurrence of voids |
| US10460932B2 (en) | 2017-03-31 | 2019-10-29 | Asm Ip Holding B.V. | Semiconductor device with amorphous silicon filled gaps and methods for forming |
| CN109712906B (zh) * | 2017-10-25 | 2021-05-11 | 长鑫存储技术有限公司 | 具有清洗功能的晶圆存储装置及半导体生产设备 |
| TWI842826B (zh) * | 2019-02-22 | 2024-05-21 | 荷蘭商Asm Ip私人控股有限公司 | 基材處理設備及處理基材之方法 |
| CN118086860A (zh) * | 2024-04-29 | 2024-05-28 | 成都晨发泰达航空科技股份有限公司 | 一种转子叶片化学气相沉积铝涂层装置及方法 |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4406709A (en) * | 1981-06-24 | 1983-09-27 | Bell Telephone Laboratories, Incorporated | Method of increasing the grain size of polycrystalline materials by directed energy-beams |
| NL8103979A (nl) * | 1981-08-26 | 1983-03-16 | Bok Edward | Methode en inrichting voor het aanbrengen van een film vloeibaar medium op een substraat. |
| US4827954A (en) * | 1982-11-23 | 1989-05-09 | Interlab, Inc. | Automated work transfer system having an articulated arm |
| JPS6162739A (ja) * | 1984-09-03 | 1986-03-31 | Sanki Eng Co Ltd | クリ−ントンネル |
| JPH0736418B2 (ja) * | 1986-05-19 | 1995-04-19 | 富士通株式会社 | ウエーハキャリア |
| US4951601A (en) * | 1986-12-19 | 1990-08-28 | Applied Materials, Inc. | Multi-chamber integrated process system |
| US5024570A (en) * | 1988-09-14 | 1991-06-18 | Fujitsu Limited | Continuous semiconductor substrate processing system |
| US6391117B2 (en) * | 1992-02-07 | 2002-05-21 | Canon Kabushiki Kaisha | Method of washing substrate with UV radiation and ultrasonic cleaning |
| JPH05218176A (ja) * | 1992-02-07 | 1993-08-27 | Tokyo Electron Tohoku Kk | 熱処理方法及び被処理体の移載方法 |
| JPH05271973A (ja) * | 1992-03-25 | 1993-10-19 | Orc Mfg Co Ltd | 紫外線洗浄方法 |
| JPH05315310A (ja) * | 1992-05-01 | 1993-11-26 | Kawasaki Steel Corp | 半導体基板の湿式洗浄方法及び湿式洗浄装置 |
| SG46344A1 (en) * | 1992-11-16 | 1998-02-20 | Tokyo Electron Ltd | Method and apparatus for manufacturing a liquid crystal display substrate and apparatus and method for evaluating semiconductor crystals |
| EP0608620B1 (en) * | 1993-01-28 | 1996-08-14 | Applied Materials, Inc. | Vacuum Processing apparatus having improved throughput |
| JP3120395B2 (ja) * | 1993-03-10 | 2000-12-25 | 東京エレクトロン株式会社 | 処理装置 |
| US5474410A (en) * | 1993-03-14 | 1995-12-12 | Tel-Varian Limited | Multi-chamber system provided with carrier units |
| US5527390A (en) * | 1993-03-19 | 1996-06-18 | Tokyo Electron Kabushiki | Treatment system including a plurality of treatment apparatus |
| JP3654597B2 (ja) * | 1993-07-15 | 2005-06-02 | 株式会社ルネサステクノロジ | 製造システムおよび製造方法 |
| TW273574B (enExample) * | 1993-12-10 | 1996-04-01 | Tokyo Electron Co Ltd | |
| US5472086A (en) * | 1994-03-11 | 1995-12-05 | Holliday; James E. | Enclosed sealable purgible semiconductor wafer holder |
| TW294821B (enExample) * | 1994-09-09 | 1997-01-01 | Tokyo Electron Co Ltd | |
| JP3288200B2 (ja) * | 1995-06-09 | 2002-06-04 | 東京エレクトロン株式会社 | 真空処理装置 |
| US5667592A (en) * | 1996-04-16 | 1997-09-16 | Gasonics International | Process chamber sleeve with ring seals for isolating individual process modules in a common cluster |
| US6039059A (en) * | 1996-09-30 | 2000-03-21 | Verteq, Inc. | Wafer cleaning system |
| JP3330300B2 (ja) * | 1997-02-28 | 2002-09-30 | 東京エレクトロン株式会社 | 基板洗浄装置 |
| US6045620A (en) * | 1997-07-11 | 2000-04-04 | Applied Materials, Inc. | Two-piece slit valve insert for vacuum processing system |
| JP3425592B2 (ja) * | 1997-08-12 | 2003-07-14 | 東京エレクトロン株式会社 | 処理装置 |
| JPH11102849A (ja) * | 1997-09-17 | 1999-04-13 | Lsi Logic Corp | 半導体ウエハ上のパーティクル除去方法及び装置 |
| US6270582B1 (en) * | 1997-12-15 | 2001-08-07 | Applied Materials, Inc | Single wafer load lock chamber for pre-processing and post-processing wafers in a vacuum processing system |
| TW444275B (en) * | 1998-01-13 | 2001-07-01 | Toshiba Corp | Processing device, laser annealing device, laser annealing method, manufacturing device and substrate manufacturing device for panel display |
| US6270306B1 (en) * | 1998-01-14 | 2001-08-07 | Applied Materials, Inc. | Wafer aligner in center of front end frame of vacuum system |
| US6343609B1 (en) * | 1998-08-13 | 2002-02-05 | International Business Machines Corporation | Cleaning with liquified gas and megasonics |
| US6337174B1 (en) * | 1998-09-17 | 2002-01-08 | Samsung Electronics Co., Ltd. | Method of stripping a photoresist from a semiconductor substrate dimethylacetamide or a combination of monoethanolamine and dimethylsulfoxide |
-
2000
- 2000-01-26 JP JP2000017223A patent/JP3998386B2/ja not_active Expired - Fee Related
- 2000-11-20 US US09/715,022 patent/US6461437B1/en not_active Expired - Lifetime
- 2000-12-27 CN CNB001364952A patent/CN1196173C/zh not_active Expired - Fee Related
-
2001
- 2001-01-22 KR KR10-2001-0003540A patent/KR100381807B1/ko not_active Expired - Fee Related
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