TW294821B - - Google Patents
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- Publication number
- TW294821B TW294821B TW084109275A TW84109275A TW294821B TW 294821 B TW294821 B TW 294821B TW 084109275 A TW084109275 A TW 084109275A TW 84109275 A TW84109275 A TW 84109275A TW 294821 B TW294821 B TW 294821B
- Authority
- TW
- Taiwan
- Prior art keywords
- processing
- wafer
- liquid
- item
- patent application
- Prior art date
Links
- 238000012545 processing Methods 0.000 claims description 195
- 239000007788 liquid Substances 0.000 claims description 127
- 238000000576 coating method Methods 0.000 claims description 92
- 239000000758 substrate Substances 0.000 claims description 67
- 238000000034 method Methods 0.000 claims description 50
- 230000008569 process Effects 0.000 claims description 39
- 239000012530 fluid Substances 0.000 claims description 26
- 238000003672 processing method Methods 0.000 claims description 24
- 238000001035 drying Methods 0.000 claims description 23
- 238000011049 filling Methods 0.000 claims description 13
- 239000012528 membrane Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 9
- 238000005406 washing Methods 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 230000002079 cooperative effect Effects 0.000 claims description 4
- 238000011010 flushing procedure Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 239000003085 diluting agent Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 2
- 230000009471 action Effects 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- 229920002545 silicone oil Polymers 0.000 claims description 2
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- 238000007689 inspection Methods 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 124
- 239000011248 coating agent Substances 0.000 description 82
- 230000007246 mechanism Effects 0.000 description 25
- 238000012546 transfer Methods 0.000 description 14
- 239000000243 solution Substances 0.000 description 10
- 238000003860 storage Methods 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 9
- 230000033001 locomotion Effects 0.000 description 9
- 238000001816 cooling Methods 0.000 description 7
- 238000011161 development Methods 0.000 description 7
- 230000018109 developmental process Effects 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 230000007723 transport mechanism Effects 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 238000012805 post-processing Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 230000002940 repellent Effects 0.000 description 2
- 239000005871 repellent Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 241001070941 Castanea Species 0.000 description 1
- 235000014036 Castanea Nutrition 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000009916 joint effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24080694A JP3230128B2 (ja) | 1994-09-09 | 1994-09-09 | 処理装置 |
| JP26191694A JP3164739B2 (ja) | 1994-09-30 | 1994-09-30 | 塗布膜形成方法及びその装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW294821B true TW294821B (enExample) | 1997-01-01 |
Family
ID=26534934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW084109275A TW294821B (enExample) | 1994-09-09 | 1995-09-05 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US5665200A (enExample) |
| KR (1) | KR0167481B1 (enExample) |
| TW (1) | TW294821B (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW346649B (en) * | 1996-09-24 | 1998-12-01 | Tokyo Electron Co Ltd | Method for wet etching a film |
| KR100521701B1 (ko) * | 1996-11-27 | 2006-01-12 | 동경 엘렉트론 주식회사 | 도포막형성장치및도포막형성방법 |
| US5904863A (en) * | 1997-04-30 | 1999-05-18 | Coates Asi, Inc. | Process for etching trace side walls |
| JP3926890B2 (ja) * | 1997-06-11 | 2007-06-06 | 東京エレクトロン株式会社 | 処理システム |
| TW421818B (en) | 1997-07-04 | 2001-02-11 | Tokyo Electron Ltd | Process solution supplying apparatus |
| JPH1133471A (ja) * | 1997-07-23 | 1999-02-09 | Tokyo Electron Ltd | 塗布装置 |
| JP3320648B2 (ja) | 1997-12-04 | 2002-09-03 | 東京エレクトロン株式会社 | レジスト膜の形成方法及びレジスト膜の形成装置 |
| US6527007B2 (en) * | 1998-12-16 | 2003-03-04 | Carl Cheung Tung Kong | Fluid transfer system |
| JP3998386B2 (ja) * | 2000-01-26 | 2007-10-24 | 三菱電機株式会社 | 液晶表示装置の製造装置および液晶表示装置の製造方法 |
| EP1124252A2 (en) * | 2000-02-10 | 2001-08-16 | Applied Materials, Inc. | Apparatus and process for processing substrates |
| US6616762B2 (en) | 2000-10-13 | 2003-09-09 | Tokyo Electron Limited | Treatment solution supply apparatus and treatment solution supply method |
| US6797063B2 (en) | 2001-10-01 | 2004-09-28 | Fsi International, Inc. | Dispensing apparatus |
| US6680263B2 (en) * | 2002-02-12 | 2004-01-20 | Sandia National Laboratories | Method for applying a photoresist layer to a substrate having a preexisting topology |
| US7449099B1 (en) * | 2004-04-13 | 2008-11-11 | Novellus Systems, Inc. | Selectively accelerated plating of metal features |
| US7819079B2 (en) | 2004-12-22 | 2010-10-26 | Applied Materials, Inc. | Cartesian cluster tool configuration for lithography type processes |
| US7396412B2 (en) | 2004-12-22 | 2008-07-08 | Sokudo Co., Ltd. | Coat/develop module with shared dispense |
| US7699021B2 (en) | 2004-12-22 | 2010-04-20 | Sokudo Co., Ltd. | Cluster tool substrate throughput optimization |
| US7798764B2 (en) | 2005-12-22 | 2010-09-21 | Applied Materials, Inc. | Substrate processing sequence in a cartesian robot cluster tool |
| US7651306B2 (en) | 2004-12-22 | 2010-01-26 | Applied Materials, Inc. | Cartesian robot cluster tool architecture |
| US7942514B2 (en) * | 2006-12-21 | 2011-05-17 | Xerox Corporation | Keying elements for solid ink loader |
| US7694688B2 (en) | 2007-01-05 | 2010-04-13 | Applied Materials, Inc. | Wet clean system design |
| US7950407B2 (en) * | 2007-02-07 | 2011-05-31 | Applied Materials, Inc. | Apparatus for rapid filling of a processing volume |
| JP6145061B2 (ja) * | 2014-03-04 | 2017-06-07 | 東京エレクトロン株式会社 | 接合システムおよび接合方法 |
| EP3144962A4 (en) * | 2014-12-02 | 2018-01-10 | Sigma-Technology Inc. | Cleaning method and cleaning device using micro/nano-bubbles |
| CN104808446B (zh) * | 2015-05-07 | 2021-02-02 | 合肥京东方光电科技有限公司 | 一种涂布机 |
| US12018672B2 (en) | 2020-04-02 | 2024-06-25 | Idex Health And Science Llc | Precision volumetric pump with a bellows hermetic seal |
| JP7667035B2 (ja) * | 2021-08-27 | 2025-04-22 | キオクシア株式会社 | 基板処理装置および半導体装置の製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS609129A (ja) * | 1983-06-29 | 1985-01-18 | Fujitsu Ltd | ウエツト処理装置 |
| JP2843134B2 (ja) * | 1990-09-07 | 1999-01-06 | 東京エレクトロン株式会社 | 塗布装置および塗布方法 |
| JP2949547B2 (ja) * | 1993-02-08 | 1999-09-13 | 東京エレクトロン株式会社 | 処理装置及び処理方法 |
-
1995
- 1995-09-05 TW TW084109275A patent/TW294821B/zh active
- 1995-09-07 KR KR1019950029398A patent/KR0167481B1/ko not_active Expired - Fee Related
- 1995-09-07 US US08/524,528 patent/US5665200A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR960012286A (ko) | 1996-04-20 |
| US5665200A (en) | 1997-09-09 |
| KR0167481B1 (ko) | 1999-02-01 |
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