KR0167481B1 - 기판처리방법 및 기판처리장치 - Google Patents

기판처리방법 및 기판처리장치 Download PDF

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Publication number
KR0167481B1
KR0167481B1 KR1019950029398A KR19950029398A KR0167481B1 KR 0167481 B1 KR0167481 B1 KR 0167481B1 KR 1019950029398 A KR1019950029398 A KR 1019950029398A KR 19950029398 A KR19950029398 A KR 19950029398A KR 0167481 B1 KR0167481 B1 KR 0167481B1
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KR
South Korea
Prior art keywords
processing
substrate
wafer
liquid
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019950029398A
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English (en)
Korean (ko)
Other versions
KR960012286A (ko
Inventor
아키히로 후지모토
다카시 다케쿠마
기요미 소노베
Original Assignee
이노우에 아키라
도오교오 에레구토론 가부시끼 가이샤
다카시마 히로시
도오교오 에레구토론 큐우슈우 가부시끼 가이샤
후지나카 요시아키
가부시키 가이샤 이와키
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP24080694A external-priority patent/JP3230128B2/ja
Priority claimed from JP26191694A external-priority patent/JP3164739B2/ja
Application filed by 이노우에 아키라, 도오교오 에레구토론 가부시끼 가이샤, 다카시마 히로시, 도오교오 에레구토론 큐우슈우 가부시끼 가이샤, 후지나카 요시아키, 가부시키 가이샤 이와키 filed Critical 이노우에 아키라
Publication of KR960012286A publication Critical patent/KR960012286A/ko
Application granted granted Critical
Publication of KR0167481B1 publication Critical patent/KR0167481B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Materials For Photolithography (AREA)
KR1019950029398A 1994-09-09 1995-09-07 기판처리방법 및 기판처리장치 Expired - Fee Related KR0167481B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP24080694A JP3230128B2 (ja) 1994-09-09 1994-09-09 処理装置
JP94-240806 1994-09-09
JP94-261916 1994-09-30
JP26191694A JP3164739B2 (ja) 1994-09-30 1994-09-30 塗布膜形成方法及びその装置

Publications (2)

Publication Number Publication Date
KR960012286A KR960012286A (ko) 1996-04-20
KR0167481B1 true KR0167481B1 (ko) 1999-02-01

Family

ID=26534934

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950029398A Expired - Fee Related KR0167481B1 (ko) 1994-09-09 1995-09-07 기판처리방법 및 기판처리장치

Country Status (3)

Country Link
US (1) US5665200A (enExample)
KR (1) KR0167481B1 (enExample)
TW (1) TW294821B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150104036A (ko) * 2014-03-04 2015-09-14 도쿄엘렉트론가부시키가이샤 접합 시스템 및 접합 방법
US12018672B2 (en) 2020-04-02 2024-06-25 Idex Health And Science Llc Precision volumetric pump with a bellows hermetic seal

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW346649B (en) * 1996-09-24 1998-12-01 Tokyo Electron Co Ltd Method for wet etching a film
KR100521701B1 (ko) * 1996-11-27 2006-01-12 동경 엘렉트론 주식회사 도포막형성장치및도포막형성방법
US5904863A (en) * 1997-04-30 1999-05-18 Coates Asi, Inc. Process for etching trace side walls
JP3926890B2 (ja) * 1997-06-11 2007-06-06 東京エレクトロン株式会社 処理システム
TW421818B (en) 1997-07-04 2001-02-11 Tokyo Electron Ltd Process solution supplying apparatus
JPH1133471A (ja) * 1997-07-23 1999-02-09 Tokyo Electron Ltd 塗布装置
JP3320648B2 (ja) 1997-12-04 2002-09-03 東京エレクトロン株式会社 レジスト膜の形成方法及びレジスト膜の形成装置
US6527007B2 (en) * 1998-12-16 2003-03-04 Carl Cheung Tung Kong Fluid transfer system
JP3998386B2 (ja) * 2000-01-26 2007-10-24 三菱電機株式会社 液晶表示装置の製造装置および液晶表示装置の製造方法
EP1124252A2 (en) * 2000-02-10 2001-08-16 Applied Materials, Inc. Apparatus and process for processing substrates
US6616762B2 (en) 2000-10-13 2003-09-09 Tokyo Electron Limited Treatment solution supply apparatus and treatment solution supply method
US6797063B2 (en) 2001-10-01 2004-09-28 Fsi International, Inc. Dispensing apparatus
US6680263B2 (en) * 2002-02-12 2004-01-20 Sandia National Laboratories Method for applying a photoresist layer to a substrate having a preexisting topology
US7449099B1 (en) * 2004-04-13 2008-11-11 Novellus Systems, Inc. Selectively accelerated plating of metal features
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7396412B2 (en) 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7942514B2 (en) * 2006-12-21 2011-05-17 Xerox Corporation Keying elements for solid ink loader
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US7950407B2 (en) * 2007-02-07 2011-05-31 Applied Materials, Inc. Apparatus for rapid filling of a processing volume
EP3144962A4 (en) * 2014-12-02 2018-01-10 Sigma-Technology Inc. Cleaning method and cleaning device using micro/nano-bubbles
CN104808446B (zh) * 2015-05-07 2021-02-02 合肥京东方光电科技有限公司 一种涂布机
JP7667035B2 (ja) * 2021-08-27 2025-04-22 キオクシア株式会社 基板処理装置および半導体装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS609129A (ja) * 1983-06-29 1985-01-18 Fujitsu Ltd ウエツト処理装置
JP2843134B2 (ja) * 1990-09-07 1999-01-06 東京エレクトロン株式会社 塗布装置および塗布方法
JP2949547B2 (ja) * 1993-02-08 1999-09-13 東京エレクトロン株式会社 処理装置及び処理方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150104036A (ko) * 2014-03-04 2015-09-14 도쿄엘렉트론가부시키가이샤 접합 시스템 및 접합 방법
US12018672B2 (en) 2020-04-02 2024-06-25 Idex Health And Science Llc Precision volumetric pump with a bellows hermetic seal

Also Published As

Publication number Publication date
KR960012286A (ko) 1996-04-20
US5665200A (en) 1997-09-09
TW294821B (enExample) 1997-01-01

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