TW440894B - Processing system - Google Patents

Processing system Download PDF

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Publication number
TW440894B
TW440894B TW088119757A TW88119757A TW440894B TW 440894 B TW440894 B TW 440894B TW 088119757 A TW088119757 A TW 088119757A TW 88119757 A TW88119757 A TW 88119757A TW 440894 B TW440894 B TW 440894B
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TW
Taiwan
Prior art keywords
processing
transfer
processed
aforementioned
path
Prior art date
Application number
TW088119757A
Other languages
Chinese (zh)
Inventor
Kiyohisa Tateyama
Masafumi Nomura
Yoshiharu Ota
Shinichiro Araki
Ikuo Yamaki
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP33646498A external-priority patent/JP3420712B2/en
Priority claimed from JP34664398A external-priority patent/JP2000156395A/en
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of TW440894B publication Critical patent/TW440894B/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

Abstract

A processing system includes a transport path, a plurality of first processing portions arranged in a first zone along the transport path for performing vacuum processing of processed objects; a plurality of second processing portions arranged in a second zone along the transport path for performing atmospheric processing of the processed objects; and transport means movably arranged on the transport path for transfer of the processed objects between the first and second zones.

Description

4 4 0 8 9 4 A7 經濟部智慧財產局萸工消費合作社印製 B7五、發明説明（工） 本發明，係關於一種在用於例如半導體晶圓或液晶顯 示器（LCD : Liquid Crystal Display)之基板上，進行照相 平版印刷工程（photo-lithographic process)的處理系.統。 於形成TFT陣列.(Thin Film Trasitor aray)之工程，按 照對於一張玻璃基板構成陣列之層數（例如5次），重覆成 膜前洗淨工程一成膜工程一抗蝕劑塗佈工程一露光工程一 顯像工程一蝕刻工程一抗蝕劑剝離工程。 以往，形成這種TFT陣列時，例如在淨化室（clean room) 内，配置每各工程之裝置、洗淨裝置、成膜裝置、抗蝕劑 塗佈、顯像裝置、露光裝置及研磨裝置，在各裝置間之玻 璃基板之運送則藉自動運送裝置（AGV : Automated Guided Vehicle)來進行。 且說，若像這樣使用AGV在各裝置間進行玻璃基板 之運送時，生產性卻未能升高到所期望者，因此，最近乃 提案有一種在運送路上沿著處理之順序排列所有處理裝置 ，依次施行處理之生產方式。 適用這種生產方式之系統，係將大氣系之處理裝置及 真空系之處理裝置混合配置而成者其中，大氣系之處理 裝置，係沿著大氣系之運送路，由洗淨裝置、抗蝕劑塗佈 、顯像裝置等在大氣中對於玻璃基板施行處理；而真空系 之處理裝置則由成膜裝置、蝕刻裝置及研磨裝置等在真空 中對於玻璃基板進行處理。 在此，在大氣系之運送路舆真空系之處理裝置間，例 如插裝有負載鎖室。在此負載鎖室，若從大氣系之運送路 (請先閲讀背面之注意事項再填寫本頁)4 4 0 8 9 4 A7 Printed by B7 of the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives. V. Description of the Invention (Industrial) The present invention relates to a device used in, for example, semiconductor wafers or liquid crystal displays (LCDs). A processing system for performing a photo-lithographic process on a substrate. In the process of forming a TFT array (Thin Film Trasitor aray), according to the number of layers (for example, 5 times) constituting the array for a glass substrate, repeat the cleaning process before film formation, film formation process, and resist coating process. One exposure process, one imaging process, one etching process, and one resist stripping process. Conventionally, when forming such a TFT array, for example, in a clean room, a device, a cleaning device, a film forming device, a resist coating, a developing device, a light exposure device, and a polishing device for each process are arranged in a clean room. The glass substrates are transported between each device by an automatic guided device (AGV: Automated Guided Vehicle). In addition, if AGV is used to transport glass substrates between devices, productivity has not improved to the expected level. Therefore, recently, a method has been proposed in which all processing devices are arranged along the order of processing on the transportation path. The processing production methods are implemented in turn. The system to which this production method is applied is a mixture of atmospheric processing equipment and vacuum processing equipment. Among them, the atmospheric processing equipment is along the transportation path of the atmospheric system. The glass substrate is processed in the atmosphere by an agent coating device, a developing device, and the like, and the glass substrate is processed by a film forming device, an etching device, and a polishing device in a vacuum processing device. Here, for example, a load lock chamber is inserted between the processing equipment of the atmospheric transportation system and the vacuum system. In this load lock room, if you are transporting from the atmosphere (please read the precautions on the back before filling this page)

、1T 線 本紙張尺度遑用中國國家揉率（CNS } A4*L格（210X297公釐） 4 五、發明説明（ 搬入玻璃基板’則將室内從大氣氛圍氣轉換成真空氛圍氣 之後，把玻璃基板交接於真空系之處理裝置β又，從真空 系之處理裝置向大氣系之運送路交接玻璃基板時，進行逆 動作β 裝 然而’這種系娩’由於在負載鎖室伴隨大氣氛圍氣與 真空氛圍氣之轉換動作，而有玻璃基板在負載鎖室之正前 面成等待狀態等之課題。即，依照這種系統的話，系統全 體之處理速度有可能在真空系之處理裝置與大氣系之運送 路間之玻璃基板之交接速度方面受影準。 訂 本發明’就是為解決這種課題而創作者，其目的係在 於提供一種，在大氣系之領域與真空系之領域間可圓滑地 交接被處理體之處理系統。 線 經 部- 智 慧 財- 產 局 員 工 消 費 合 作 社 印 製 本發明之處理系統，包含有：真空系之第一領域，大 氣系之第二領域；及交接部，其係配置在前述第一領域與 前述第二領域間，且備有可獨立地改換大氣氛圍氣與真空 氛圍氣之多數個交接室，藉此透過該等交接室在前述第一 領域與前述第二領域間進行被處理體之交接。在此，交接 室可配置成多層，也可配置成平面狀。 本發明之處理系統，包含有：大氣系之運送路；處理 部’其係對於被處理艎施行真空系之處理；交接部，其係 •S己置在前述運送路舆前述第一處理部之間，且備有可獨立 地改換大氣氛圍氣與真空氛圍氣之多數個交接室，以便透 過該等交接室在前述運送路舆前述處理部間進行被處理體 之交接；及運送裝置，其係可移動地配置在前述運送路上 本紙張尺度逋用中國國家標準< CNS )八4规格（210Χ297公釐） ，以便對於前述交接部之各室進行被處理體之交接。在此 ，交接室可配置成多層，也可配置成平面狀。 本發明’由於將交接室配置成多層，所以可使用此等 多數徑路之交接部’在大氣系之領域與真空系之領域間園 滑地交接被處理體。·即，藉著配置於上下方向，而使佔有 面積比鄰接多數個交接室而向橫向配置之場合，更為狹窄 。在此，在大氣系之領域雖有必要形成清淨空氣之降流藉 以抑制粒子之附著等’但在這種交接部卻不需要形成清淨 空氣之降流’因此易於交接室之多層化。 本發明之處理系統，包含有：多數個處理室，其係由 前述處理部，對於前述被處理體進行真空系之處理；及交 接裝置，其係配置在前述交接部與前述各處理室間，以便 在前述交接部與前述各處理室間進行被處理艘之交接。藉 此，可使真空系之處理能力提高，且可在其一方維持被處 理體之交接的圓滑度。 本發明之處理系統，係由前述各處理室，對於前述被 處理體分別進行不同之真空系之處理。藉此，可柔軟地吸 收不同處理間之處理能力的差異，且可在其f方維持被處 理體之交接的圓滑度。 本發明之處理系統’包含有：真空系之第一運送路； 大氣系之第二運送路；交接部，其係配置在前述第一運送 路與前述第二運送路問，且備有可獨立地改換大氣氛圍氣 與真空氛圍氣之多數個交接室，以便透過前述交接室在前 述第一運送路舆前述第二運送路間進行被處理艎之交接； A71. The paper size of 1T line paper uses China's national kneading rate (CNS) A4 * L grid (210X297 mm) 4 V. Description of the invention (moved into glass substrate 'will convert the room from atmospheric atmosphere to vacuum atmosphere, and then change the glass The substrate is transferred to the vacuum-type processing device β. When the glass substrate is transferred from the vacuum-type processing device to the atmospheric system, the reverse operation is performed. The operation of changing the vacuum atmosphere may cause problems such as a glass substrate waiting in front of the load lock chamber. That is, according to this system, the processing speed of the entire system may be between the vacuum processing device and the atmospheric system. The transfer speed of glass substrates between transportation paths has been affected. The present invention was created by the creators to solve such problems, and its purpose is to provide a smooth transfer between the fields of atmospheric systems and the fields of vacuum systems. The processing system of the processed object. The Department of Warp-Wisdom Wealth-Production Bureau employee consumer cooperative printed the processing system of the present invention, including: The first field of the air system and the second field of the air system; and the transfer department, which is disposed between the first field and the second field, and has a plurality of independently changeable atmospheric and vacuum atmospheres. The transfer room is used to transfer the objects to be processed between the first area and the second area through the transfer rooms. Here, the transfer room may be configured in multiple layers or in a flat shape. The processing system of the present invention , Including: the transportation system of the atmospheric system; the processing department 'which performs the vacuum system processing on the processed 艎; the transfer department, which is located between the aforementioned first processing department of the transportation route and provided with Most transfer rooms of atmospheric atmosphere and vacuum atmosphere can be changed independently, in order to transfer the objects to be processed between the aforementioned transportation roads and the aforementioned processing units through these transfer rooms; and the transport device, which is movably arranged in the The paper size of the paper on the aforementioned conveyance is in accordance with the Chinese National Standard < CNS) 8 4 size (210 × 297 mm) in order to transfer the objects to be processed to the rooms of the aforementioned transfer department. Here, The junction chamber can be arranged in multiple layers or in a flat shape. The present invention, 'the junction chamber is arranged in multiple layers, so that the junctions of most paths can be used.' The object to be processed is transferred to the ground. That is, when it is arranged in the vertical direction, the occupied area is narrower than in the case where it is arranged laterally adjacent to a plurality of transfer rooms. Here, it is necessary to form a clean area in the atmosphere The downflow of air suppresses the adhesion of particles, etc., but it is not necessary to form a downflow of clean air in such a transfer part, so it is easy to multi-layer the transfer chamber. The processing system of the present invention includes a plurality of processing chambers. A vacuum processing is performed on the object to be processed by the processing unit; and a transfer device is disposed between the transfer unit and the processing chambers, so as to perform the processing between the transfer unit and the processing chambers. Handover. Thereby, the processing capacity of the vacuum system can be improved, and the smoothness of the transfer of the processed object can be maintained on one side. The processing system of the present invention uses the aforementioned processing chambers to perform different vacuum system processes on the objects to be processed, respectively. Thereby, it is possible to softly absorb the difference in processing ability between different processes, and it is possible to maintain the smoothness of the transfer of the processed object on the f side. The processing system of the present invention includes: a first conveying path of the vacuum system; a second conveying path of the atmospheric system; and a transfer unit, which is arranged between the first conveying path and the second conveying path, and is provided independently. Change many transfer rooms with atmospheric atmosphere and vacuum atmosphere, in order to transfer the processed and transferred between the first and second transport routes through the aforementioned transfer room; A7

經濟t智慧財產局員工消費合作社印製 第一運送裝置’其係配置成可在前述第一運送路上移動， 以便在前述交接部與各室之間進行被處理體之交接；及第 二運送裝置，其係配置成可在前述第二運送路上移動，以 便在前述交接部與各室之間進行被處理體之交接。 本發明之處理系統，包含有：真空系之第一運送路； 大氣系之第二運送路；交接部，其係配置在前述第一運送 路與前述第二運送路間’且可改換大氣氛圍氣與真空氛圍 氣’以便在前述第一運送路與前述第二運送路間進行被處 理體之交接；第一處理部，其係沿著前述第一運送路而配 置，以便對於前述被處理體進行真空系之處理；第二處理 部，其係沿著前述第二運送路而配置，以便對於前述被處 理體進行大氣系之處理；第一運送裝置，其係可移動地配 置在前述第一運送路上，以便在前述交接部與前述第一處 理部間進行被處理醴之交接；及第二運送裝置，其係可移 動地配置在前述第二運送路上，以便在前述交接部與前述 第二處理部間進行被處理«之交接。 在此處，如上所述，將所有處理裝置按照處理順序排 列於運送路上，依次施行處理之生產方式，卻有淨化室變 為巨大，設備成本增大等之問題。於是，想出了一種沿著 真空系之運送路配置大氣系之處理部，在真空系之運送路 與大氣系之運送路間配置例如負載鎖之構成。就是，此時 ’並不需要將真空系領域收納在淨化室内，因此可謀求淨 化室之小型化。然而，此時，在負載鎖室也伴隨著大氣氛 圍氣舆真空氛圍氣之轉換動作，因此存在著玻璃基板在負 本紙張尺度適用中國國家檁準（CNS ) M規格（210x297公釐） ! I I I I I 裝— — I I I I 訂— — __ I I I 線 (請先閱讀背面之注意事項再填寫本頁) . 經濟部智慧財產局8工消費合作社印製 五、發明説明（ 載鎖室這邊兒成等待狀態等之課題。 本發明，由於將交接室配置成多層，所以可在真空系 之第一運送路與大氣系之第二運送路間圓滑地交接被處理 體。又，較之鄰接配置多數個交接部之場合，更可使佔有 面積狹窄。又，大氣系之領域雖有必要形成清淨空氣之降 流藉以抑制粒子之附著等，但這種交接部卻少有形成清淨 空氣降流的需要性，因而易行交接部之多層化β 本發明之處理系統，包含有：運送路；多數個第一處 理部’其係配置在沿著前述運送路之第一領域，以便對於 被處理體施行真空系之處理；多數個第二處理部，其係配 置在沿著前述運送路之第二領域，以便對於被處理體進行 大氣系之處理；及運送裝置，其係可移動地配置在前述運 送路上，以便在與前述第一及第二處理部間進行被處理體 之交接。在此處，所謂大氣系，係包含常壓之狀態者。所 謂層（layer)係意味著例如形成在基板上之層•例如，於每 各層，進行照相平版印刷工程〜蝕刻•研磨工程（etching a shing process) β 本發明，乃藉著沿運送路配置處理部而使生產性提高 。又，在此等處理部之中，對於被處理艟施行真空系處理 之第一處理部係配置在第一領域，而對於被處理艎施行大 -氣系處理之第二處理部則配置在第二領域，藉此抑制淨化 室之大型化•即，就用來施行真空系處理之第一處理部來 說，由於處理部内舆周邊之氛圍氣隔斷，而不需要擔心粒 子附著於被處理«，因而不需要收容於淨化室内。因此， 本紙张疋度遑用中國S家揉率（CNS } A4«L格（210X297公釐） (請先閎讀背面之注意事項再填寫本頁)The first transportation device printed by the employee ’s consumer cooperative of the Economic and Intellectual Property Bureau is configured to be movable on the aforementioned first transportation path so as to transfer objects to be processed between the aforementioned transfer section and each room; and a second transportation device It is configured to be movable on the second transport path so as to transfer the object to be processed between the transfer section and the chambers. The processing system of the present invention includes: a first conveying path of the vacuum system; a second conveying path of the atmospheric system; and a transfer unit, which is arranged between the first conveying path and the second conveying path, and can change the atmospheric atmosphere. Air and vacuum atmosphere 'in order to transfer the object between the first transport path and the second transport path; the first processing section is arranged along the first transport path so that Vacuum processing; the second processing unit is arranged along the second transportation path to perform atmospheric processing on the object to be processed; and the first transportation device is movably disposed on the first And a second conveying device, which is movably arranged on the second conveying path so as to be transferred between the transferring section and the second The processing department transfers the processed «. Here, as described above, all the processing devices are arranged on the transportation path in accordance with the processing order and the processing method is sequentially performed, but there are problems such that the clean room becomes huge and the equipment cost increases. Then, a configuration in which an atmospheric system processing unit is arranged along the vacuum system transportation path, and a configuration such as a load lock is arranged between the vacuum system transportation path and the atmospheric system transportation path. That is, at this time, it is not necessary to store the vacuum system area in the clean room, so that the size of the clean room can be reduced. However, at this time, the load lock chamber is also accompanied by the conversion of atmospheric atmosphere and vacuum atmosphere, so there is a glass substrate that applies the Chinese National Standard (CNS) M standard (210x297 mm) in the negative paper size! IIIII Installation — — IIII Order — — __ III line (please read the precautions on the back before filling out this page). Printed by the 8th Industrial Cooperative Cooperative of the Intellectual Property Bureau of the Ministry of Economy In the present invention, since the transfer chamber is arranged in multiple layers, the object to be processed can be smoothly transferred between the first conveying path of the vacuum system and the second conveying path of the atmospheric system. In addition, a plurality of transfer sections are arranged adjacently. In this case, the occupied area can be narrowed. In addition, although it is necessary to form a downflow of clean air in the field of the atmospheric system to suppress the adhesion of particles, etc., such a junction has little need to form a downflow of clean air. Multilayering of the easy-to-transfer section β The processing system of the present invention includes: a transport path; and a plurality of first processing sections are arranged at the first collar along the aforementioned transport path. In order to perform vacuum processing on the object to be processed; most of the second processing sections are arranged in the second area along the aforementioned transportation path to perform atmospheric processing on the object to be processed; and transport devices, which are It is movably arranged on the transportation path so as to transfer objects to be processed between the first and second processing units. Here, the so-called atmospheric system refers to a state including normal pressure. The so-called layer system It means, for example, a layer formed on a substrate. For example, in each layer, a photolithography process to an etching a shing process is performed. Β The present invention improves productivity by arranging a processing section along a transport path. In addition, among these processing units, the first processing unit that performs vacuum processing for the processed plutonium is disposed in the first area, and the second processing unit that performs large-air processing for the processed plutonium is disposed in The second area is to suppress the enlargement of the clean room. That is, for the first processing unit for performing the vacuum system processing, the atmosphere around the processing unit is blocked, and There is no need to worry about particles attaching to the processed «, so it does not need to be stored in a clean room. Therefore, the paper size should be in accordance with China's domestic rubbing rate (CNS) A4« L grid (210X297 mm) (Please read the back (Please fill in this page again)

A7 ------B7____ 五、發明説明（6 ) 本發明’因上述構成而只將第二領域收容於淨化室即可， 所以可抑制淨化室之大型化。 本發明之處理系統，係在被處！體上每一層施行多數 種類之處理以便形成多數層之處理系統者，包含有：運送 路：多數個第一處瑝部，其係沿著前述運送路而配置在第 一領域’以便對於被處理體施行真空系之處理，且，按真 空系之每各處理及每一層來設置，更且在第一領域内按每 -各層區分配置；多數個第二處理部，其係配置在沿著運送 路之第一領域，以便對於被處理體施行大氣系之處理；及 運送裝置，其係在第一及第二處理部間進行交接。 依照本發明，由於沿著運送路配置有處理部，且，在 此等處理部之中對於被處理體施行真空系處理之第一處理 部係配置在第一領域，而對於被處理想施行大氣系處理之 第二處理部則配置在第二領域’所以一面可使生產性提高 ，一面可抑制淨化室之大型化。又，第一處理部由於在第 一領域内按每各層區分配置，所以產生問題時易於弄清在 那一處理部產生問題，可輕易進行問題之蘋在化和分析， 且可使每各層之運送裝置及其他共同（同一）組件化。 本發明之處理系統，係在被處理醴上每層施行多數種 類之處理以形成多數層之處理系統者，包含有：運送路， 其係設成大致直線狀；搬入搬出部，其係配置在前述運送 路之一端，以便進行被處理髏之搬入•搬出；洗淨處理部 ，其係在前述搬入搬出部之附近沿著前述運送路而配置， 以便對於被處理體施行成膜前述洗淨處理；多數個第一處 本紙張尺度適用中國國家橾準（CNS ) A4规格（210X297公釐） ^-- (請先閲讀背面之注意事項再填寫本頁) 訂 線 經濟^-智慧W-產局貝工消費合作社印製 9 A7A7 ------ B7____ V. Description of the invention (6) The present invention ′ only needs to store the second area in the clean room because of the above structure, so the size of the clean room can be suppressed. The processing system of the present invention is in the place! Those who perform most types of processing on each layer of the body to form a processing system for the most layers include: a transport path: a plurality of first crotches, which are arranged in the first area along the aforementioned transport path so as to be processed The vacuum processing is performed in the body, and it is set according to each processing and each layer of the vacuum system, and it is arranged separately in each first layer in the first field; most of the second processing sections are arranged along the transportation The first area of the road is to perform atmospheric treatment on the object to be processed; and a transport device that transfers between the first and second processing units. According to the present invention, since a processing unit is arranged along the conveyance path, and among these processing units, the first processing unit that performs vacuum processing on the object to be processed is arranged in the first area, and the processing is intended to be performed in the atmosphere. The second processing section of the processing system is arranged in the second field. Therefore, productivity can be improved while the size of the clean room can be suppressed. In addition, the first processing section is arranged for each layer in the first field. Therefore, when a problem occurs, it is easy to find out which problem occurred in that processing section. The problem can be easily analyzed and analyzed, and each layer can be analyzed. Conveyor and other common (identical) components. The processing system of the present invention is a processing system that performs a plurality of types of processing on each layer to be processed to form a plurality of layers. The processing system includes: a conveying path, which is arranged in a substantially straight line; and a loading / unloading section, which is arranged in One end of the transport path for carrying in and out of the processed skeleton; the cleaning processing section is arranged along the transport path in the vicinity of the loading and unloading section in order to perform the film-forming cleaning process on the object to be processed. ; Most of the first paper sizes are applicable to China National Standards (CNS) A4 specifications (210X297 mm) ^-(Please read the precautions on the back before filling this page) Threading economy ^ -Smart W-Product Bureau Printed by Shelley Consumer Cooperative 9 A7

理部’其係配置在沿著前述運送路之第一領域俾與前述洗 淨處理鄰接，以便對於被處理體至少施行包括成膜處理、 蚀刻處理、抗蝕劑剝離處理之真空系處理，且，按真空系 之每各處理及每一層來設置，進而在第一領域内按每各層 區分配置；多數個索二處理部，其係配置在前述運送路之 第二領域俾與前述第一領域鄰接，以便對於被處理體至少 施行包括抗飪劑塗佈處理、顯像處理之大氣系處理；露光 處理部，其係在前述第二領域附近配置於前述運送路之另 一端’以便對於被處理艎施行露光處理；及運送裝置，其 係可移動地配置在前述運送路上，以便在與前述各部間進 行被處理鳢之交接。藉此，一面使生產性提高，一面可抑 制淨化室之大型化。又，產生問題時，易於弄清在那一處 理部產生問題’可輕易進行問題之顯在化和分析，且易使 每各層之運送裝置及其他共同（同一）組件化。 本發明之處理系統’係將按前述每各層區分配置之第 一處理部’進一步沿著前述運送路依層之順序而配置，藉 此，可在運送路上圓滑地運送被處理體。 經濟部智慧財產局員工消費合作杜印製 本發明之處理系統，係在按前述每各層區分配置之第 一處理部之附近，按每各層配置必需要的檢查裝置。藉此 ，可一面抑制被處理髖之運送距離至最小一面進行檢查。 本發明之處理系統’係在被處理艘上，每進行多數種 類之處理以形成多數層之處理系統者，包含有：運送路； 多數個第一處理部，其係配置在沿著前述運送路之第一領 域，以便對於被處理體施行真空系之處理，且，按真空系 之每各處理及每一層來設置，進而在第一領域内按每各處 本紙紅遒用中國國家橾奉（CNS)人4狀（210XM7公釐） -It)- A7 B7 ^_____ 經濟奸智慧此產局具工消費合作社印製 五、發明説明（ 理之種類區分配置；多數個第二處理部，其係配置在沿著 前述運送路之第二領域，以便對於被處理體進行大氣系之 處理；及運送裝置，其係可移動地配置在前述運送路上， 以便在第一及第二處理部間進行被處理艘之交接。- 本發明，由於4著運送路配置處理部，且，在此等處 理部之中，對於被處理體施行真空系處理之第一處理部係 配置在第一領域，而對於被處理艘施行大氣系處理之第二 處理部則配置在第二領域，所以可一面使生產性提高，一 面抑制淨化室之大型化。又，第一處理部係在第一領域内 按每各處理之種類區分配置，所以易於進行施加和附帶設 備之共同化。 本發明之處理系統，係在被處理體上按每一層施行多 數種類之處理以形成多數層之處理系統者，包含有：運送 路’其係設成大致直線狀；搬入搬出部，其係配置在前述 運送路之一端，以便進行被處理鍾之搬入搬出；洗淨處理 部’其係在前述搬入搬出部之附近沿著配置在前述運送路 ’以便對於被處理體施行成膜前洗淨處理；多數個第一處 理部’其係配置在沿著前述運送路之第一領域俾舆前述洗 淨處理部鄰接，以便對於被處理艟至少施行包括成膜處理 、蝕刻處理、抗蝕劑剝離處理之真空系處理，且，按真空 -系之每各處理及每一層來設置，進而在第一領域内按每各 層區分配置；多數個第二處理部，其係配置在前述運送路 之第二領域俾與前述第一領域鄰接，以便對於被處理想至 少施行包括抗蝕劑塗佈處理、顯像處理之大氣系處理；露 光處理部，其係在前述第二領域附近，配置於前述運送路 本紙張尺度逮用中國國家揉準（)从規格Ul0><297公羡） ----------^------ΐτ------^ (諳先閱讀背面之注意事項再填寫本頁) · 11 44089 4 at _______ Β7 五、發明説明（〇 ) y 之另一端，以便對於被處理體施行露光處理；及運送裝置 ，其係可移轉地配置在前述運送路上，以便在與前述各部 間進行被處理體之交接。藉此，一面.使生產性提高，一面 可抑制淨化室之大型化。又，易於進行施行和附帶設備之 共同化。· ， 本發明之處理系統，係在前述第一領域内配置有檢查 裝置。藉此’可一面抑制被處理體之運送距離至最小一面 進行檢查。 本發明之處理系統，包含有：第一運送路；第二運送 路’其係配置成舆前述第一運送路大致正交；多數個露光 裝置，其係沿著前述第二運送路而配置，以便對於被處理 體施行露光處理；第一運送裝置，其係可移動地配置在前 述第一運送路上，以便在舆該第二運送路間進行被處理體 之交接；及第二運送裝置，其係可移動地配置在前述第二 運送路上，以便在前述第一運送路舆前述露光裝置間進行 交接。 本發明，由於構成為沿著舆第一運送路大致正交之第 二運送路配置多數個露光裝置，所以即使需要多數個露光 裝置之系統，也不需要像習知那樣用AGV來進行露光裝 置與其他處理部間之被處理艘的運送，而可藉由在運送路 .上移動之運送裝置來進行，可圓滑且迅速地進行運送。又 ，可將所需面積抑低至最小限度，因而可將淨化室之成本 抑低至最小限度。 本發明之處理系統，包含有：第一運送路；處理部， 其係沿著配置在前述第一運送路，以便對於被處理體至少 本紙JK尺度遑用中國國家樣隼（CNS > Α4洗格（210X297公釐} (請先閎讀背面之注意事項再填寫本頁) -、1Τ 線 經濟部智慧財產局员工消費合作社印製 12 A7 B7 經濟部智葸財產局員工消費合作社印製 五、發明説明（10) 施行抗蝕劑塗佈處理、顯像處理；第二運送路，其係配置 成大致與前述第一運送路正交；多數個露光裝置，其係沿 著配置在前述第二運送路，以便對於被處理體施行露光處 理；第一運送裝置，其係可移動地配置在前述第一運送路 上’以便在.其與前述第二運送路間進行被處理體之交接； 及第二運送裝置，其係可移動地配置在前述第二運送路上 ，以便在前述第一運送路與前述露光裝置間進行被處理體 — 之交接。藉此’即使需要多數個露光裝置之系統，也不需 要像習知那樣用AGV來進行露光裝置與其他處理部間之 被處理想之運送，而可藉由在運送路上移動之運送裝置來 進行，可圓滑且迅速地進行運送。又，可將所需面積抑底 至最小限度，因而可將淨化室之成本抑低至最小限度。 本發明之處理系統，包含有：第一運送路；多數個第 一處理部，係配置在沿著前述第一運送路之第一領域，以 便對於被處理體施行真空系處理；處理部，係配置在沿著 前述第一運送路之第二領域，以便對於被處理體施行抗蝕 劑塗佈處理、顯像處理；第二運送路，係配置成大致與第 一運送路正交；多數個露光裝置，係沿著該第二運送路而 配置’以便對於被處理«進露光處理；第一運送裝置，係 可移動地配置在第一運送路上，以便在與第二運送路間進 -行被處理髖之交接；及第二運送裝置，係在舆第一運送路 及露光裝置間進行被處理艏之交接。藉此，即使為需要多 數個露光裝置也不需要像習知那樣用AGV來進行露光裝 置與其他處理部間之被處理艘之運送，可藉在運送路上之 I— I _ ^-- (請先閱讀背面之注意事項再填寫本頁) 訂 ·-線 1紙張尺度逋用中國國家揉準（CNS ) M规格（210><297公釐） 13 Μ· 4 0 8 9 4 Α7 Β7 五、發明武明（U ) 運送裝置來進行，可迅速且圓滑地進行運送。又，可將所 需要之面積抑底至最小限度，且可將淨化室之成本抑低至 最小限度。 係在第二運送路上配置有多數個 可迅速且圓滑地進行被處理體之 本發明之處理系統 之第二運送裝置。藉此 運送。 本發明之處理系統 沿著前述運送路而配置 經濟部智慧財產局員工消費合作社印製 包含有：運送路；處理部，其係 以便對於被處理艎施行給定處理 :運送裝置，其係可移動地配置在前述運送路上，以便在 其與前述處理部間進行被處理體之交接；第一光電變換部 ，其係配置在前述處理部之運送裝置側，以便進行資料之 收發；及第二光電變換部，其係配置在前述運送裝置俾在 前述運送裝置舆前述處理部間進行被處理體之交接時與前 述第一光電變換部相向，以便在舆前述第一光電變換部間 進行資料之收發· 本發明’由於在處理部之運送裝置側配置用來進行資 料之收發的第一光電變換部，同時在運送裝置配置一在舆 第一光電變換部間進行資料之收發的第一光電變換部，以 便該運送裝置與處理部間進行被處理體之交接時與前述第 一光電變換部相向，所以以往值管在運送裝置需要用來與 •各處理進行资料通信之硬«，但本發明卻在運送裝置只設 置一個通用於各處理部之第二光電變換部即可β 本發明之處理系統，包含有：運送路；處理部，其係 沿著配置在前述運送路，以便對被處理體施行給定處理； (請先閲讀背面之注意事項再填寫本頁) 線 14 五、發明説明（ 12 A7 B7 經濟部智慧財產局員工消費合作社印製 檢查部，其係沿著配置在前述運送路，以便進行被處理想 之檢查；運送裝置，其係可移動地配置在前述運送路上， 以便在前述處理部與前述檢查部間進行被處理體之交接； 第一光電變換部，其係配置在前述處理部及前述檢查部之 運送裝置側.，以便進行資料之收發；及第二光電變換部， 其係配置在前述運送裝置俾在前述運送裝置與前述處理部 間進行被處理體之交接時與前述第一光電變換部相向，且 在與前述第一光電變換部間進行資料之收發。 因此，以往，儻管在運送裝置每一處理部需要用來與 各處理部進行資料通信之硬體，但本發明卻在運送裝置只 設置一個通用於各處理部之第二光電變換部即可。又，由 於做成在運送裝置與檢査之間進行資料之收發，所以例如 從檢査部將檢査結果交接於運送裝置，藉此可在進行了檢 查之後進一步由對於被處理饉進行處理之處理部來接收該 檢查結果，根據此檢查結果來判斷是否進行處理。藉此可 對於藉檢查部來判斷為不良之被處理饉，消除進一步之處 理，結果，可提高處理效率。 本發明之處理系統，係在被處理艟上按每層施行多數 種類之處理以形成多數層之處理系統，而是將用來形成被 處理艘之全層的處理部加以一艘化者。 本發明，由於將用形成被處理艘之全層的處理部加以 一體化’所以以往儘管理需要謀求各個別處理部之整合使 之具有處理能力，及需要謀求控制之整合，但本發明從開 始即謀求此等之整合，從而可減輕運送裝置之負擔。 0¾-- (請先閲讀背面之注意事項再填寫本頁) *τ 本紙張尺度逋用中國困家棣率（CNS〉Α4規《格（210X297公釐） 15 經濟部智慧財產局貝工消費合作社印製 A7 ________B7__ 五、發明祝明（13 ) 本發明之處理系統’係在前述處理部，具有擔任一個 處理之專用處理部及擔任兩個以上之兼用處理部者。藉此 可減輕運送裝置之負擔。 本發明之處理系統，係區分為對於被處理體施行真空 系處理的處理部及施行大氣系處理之處理部者β藉此，可 謀淨化室之成本之減低。 以下，根據圖式說明本發明之實施例β 第1圖’係用以形成本發明一實施例之TFT陣列的處 理系統之平面圖。 如第1圖所示’在此處理系統之大致中央，成直線狀 地設有大氣系之運送路10。在此運送路10之一端，設有一 將作為被處理作用之玻璃基板G搬入系統内之同時向系統 外搬出之搬入搬出部20，而運送路1〇之另一端則設有一在 與露光裝置2間進行玻璃基板1〇之掊口部3〇(interface) β又 ’在運送路10之兩側，配置有各種之處理部。從運送路1〇 之一端依序設有：用來進行成膜前述洗淨處理的洗淨處理 領域40、對於玻璃基板施行真空系處理之真空系處理領域 50、對於玻填基板G施行大氣系處理之大空系處理領域7〇 〇 在洗淨處理領域40，沿著運送路1 〇配置有多數個例如 •3台之洗淨器單元（WS)41(scrubber unit);此洗滌器單元41 係用水來電刷洗淨玻璃基板G者* 在真空系處理領域50，沿著運送路1〇按每各處理及每 層設有對於玻璃基板G施行真空系處理之處理部，且按每 本^張尺度逋用中國國家標準（CNS >Λ4规格（210X297公釐) ' -16 - (請先閱讀背面之注意事項再填寫本頁)The processing section is disposed in the first area along the transportation path and is adjacent to the cleaning process so as to perform at least a vacuum system process including a film forming process, an etching process, and a resist peeling process on the object to be processed, and , It is set according to each process and each layer of the vacuum system, and then arranged separately for each layer in the first field; most of the cable two processing units are arranged in the second field of the aforementioned transportation path, and the first field. Adjacent so as to perform at least an atmospheric system treatment including an anti-cooking agent coating treatment and a development treatment on the object to be treated; a dew treatment unit, which is disposed near the second area at the other end of the transportation path, so as to treat the object to be treated (2) performing exposure processing; and a conveying device which is movably arranged on the aforementioned conveying path so as to transfer the treated objects to the aforementioned parts. With this, while increasing productivity, it is possible to suppress the enlargement of the clean room. In addition, when a problem occurs, it is easy to find out which problem occurred in the processing department ', and it is easy to visualize and analyze the problem, and it is easy to make the transport equipment and other common (identical) components of each layer. The processing system of the present invention is a first processing unit that is arranged in accordance with each of the above-mentioned layers, and is further arranged in the order of the layers along the above-mentioned conveying path, whereby the object to be processed can be smoothly conveyed on the conveying path. Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs for consumer cooperation. The processing system of the present invention is located near the first processing section that is separately arranged for each of the foregoing layers, and the necessary inspection devices are arranged for each layer. With this, inspection can be performed while suppressing the transport distance of the treated hip to the minimum. The processing system of the present invention is a processing system on a to-be-processed ship, and each type of processing that is performed to form a plurality of layers includes: a transport path; and a plurality of first processing sections disposed along the aforementioned transport path. The first field is to apply vacuum processing to the object, and it is set for each process and each layer of the vacuum system, and then in the first field, the Chinese paper is used for every place of the paper. CNS) 4 people (210XM7 mm) -It)-A7 B7 ^ _____ Economic wisdom printed by this industrial bureau, printed by industrial and consumer cooperatives V. Description of invention (different types of management and configuration; most of the second processing department, its department It is arranged in a second area along the aforementioned conveying path so as to perform atmospheric processing on the object to be processed; and a conveying device is movably arranged on the aforementioned conveying path so as to be cleaned between the first and second processing sections. Handover of the processing vessel.- In the present invention, since the processing unit is arranged along the four transport paths, and among these processing units, the first processing unit that performs vacuum processing on the object to be processed is arranged in the first area, and The second processing unit for the atmospheric treatment of the ship to be processed is located in the second area, so that the productivity can be improved and the size of the clean room can be suppressed while the first processing unit is in the first area. The types of each process are arranged separately, so it is easy to commonize the application and incidental equipment. The processing system of the present invention is a processing system that performs most types of processing on each layer to be processed to form a plurality of layers, including: The conveying path is arranged substantially linearly; the carrying-in and carrying-out section is arranged at one end of the carrying path for carrying in and out of the processed clock; and the cleaning processing section is arranged near the carrying-in and carrying-out section. It is disposed on the aforementioned transport path so as to perform a pre-film washing process on the object to be processed; most of the first processing sections are disposed in a first area along the aforementioned transport path. To be processed, at least vacuum processing including film forming processing, etching processing, and resist stripping processing is performed. The second processing section is arranged in the second area of the transportation path, and is adjacent to the first area, so that at least Atmospheric system processing for resist coating and development processing; exposed light processing department, which is located near the aforementioned second area, is arranged at the aforementioned paper size of the transportation path, and is used by the Chinese national standard () from the specifications Ul0 > < 297 public envy) ---------- ^ ------ ΐτ ------ ^ (谙 Please read the notes on the back before filling this page) · 11 44089 4 at _______ Β7 Five 2. The other end of the invention description (〇) y, so that the exposed object can be exposed; and the conveying device is movably arranged on the aforementioned conveying path so as to transfer the object to and from the aforementioned parts. With this, while increasing productivity, it is possible to suppress the enlargement of the clean room. In addition, it is easy to carry out commonization of implementation and auxiliary equipment. The processing system of the present invention is provided with an inspection device in the aforementioned first field. In this way, the inspection can be performed while suppressing the transport distance of the object to be minimized. The processing system of the present invention includes: a first conveying path; a second conveying path 'which is configured to be substantially orthogonal to the aforementioned first conveying path; and a plurality of exposure devices which are arranged along the aforementioned second conveying path, So that the exposed object is exposed; the first conveying device is movably arranged on the first conveying path to transfer the object between the second conveying path; and the second conveying device is It is movably arranged on the second transport path so as to transfer between the first exposure path and the exposure device. According to the present invention, since a plurality of exposure devices are arranged along a second transportation path that is substantially orthogonal to the first transportation path, even if a system of a plurality of exposure devices is required, it is not necessary to perform the exposure device with AGV as is conventionally known. The transportation of the ship to be processed with other processing units can be carried out by a transportation device moving on the transportation path, and the transportation can be performed smoothly and quickly. In addition, the required area can be minimized, and the cost of the clean room can be minimized. The processing system of the present invention includes: a first conveying path; and a processing section arranged along the first conveying path so as to use at least the JK standard of the paper for the object to be processed using the Chinese national sample (CNS > A4 washing (210X297 mm) (Please read the notes on the back before filling out this page)-, 1T Printed by the Employee Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 12 A7 B7 Printed by the Employee Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs DESCRIPTION OF THE INVENTION (10) A resist coating process and a development process are performed; a second transport path is arranged substantially orthogonal to the first transport path; and a plurality of exposure devices are arranged along the second A conveying path for exposing the object to be treated; a first conveying device movably disposed on the first conveying path; so as to transfer the object between the second conveying path and the second conveying path; and Two conveying devices, which are movably arranged on the second conveying path so as to transfer objects to be processed between the first conveying path and the light exposure device. The system of the light exposure device does not need to use AGV to transport the light treatment device and other processing units as conventionally known, but can be carried out by the transportation device moving on the transportation road, which can be smooth and rapid. It can also reduce the required area to the minimum, thereby reducing the cost of the clean room to the minimum. The processing system of the present invention includes: a first transportation path; a plurality of first processing sections, It is arranged in the first area along the first conveying path so as to perform vacuum processing on the object to be processed; and the processing section is arranged in the second area along the first conveying path so as to apply resistance to the object to be processed. Etching coating process and development process; the second conveying path is configured to be substantially orthogonal to the first conveying path; a plurality of exposure devices are arranged along the second conveying path, so as to be processed into the exposed light Processing; the first conveying device is movably arranged on the first conveying path so as to transfer between the processed hip and the second conveying path; and the second conveying device is connected to the first Handling of the treated items between the transport path and the exposed light device. This way, even if a large number of exposed devices are required, it is not necessary to use the AGV to transport the treated ship between the exposed device and other processing units as is conventional, and can be borrowed. I— I _ ^-(Please read the precautions on the back before filling in this page) Order --- line 1 paper size using China National Standard (CNS) M specification (210 > < 297 mm ) 13 Μ · 4 0 8 9 4 Α7 Β7 V. Invented the Wuming (U) transportation device to carry out quickly and smoothly. Also, the required area can be minimized, and the clean room can be The cost is reduced to a minimum. It is a second conveying device of the processing system of the present invention in which a plurality of objects can be quickly and smoothly processed on the second conveying path. Take this delivery. The processing system of the present invention is configured along the aforementioned transportation path. The printing of the employee's consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs includes: a transportation path; a processing section for performing a given treatment on a processed object: a transportation device, which is movable The ground is arranged on the transportation path to transfer the object to be processed between the processing unit and the processing unit; the first photoelectric conversion unit is arranged on the transportation device side of the processing unit so as to transmit and receive data; and the second photoelectric The conversion unit is arranged in the transportation device and faces the first photoelectric conversion unit when the object to be processed is transferred between the transportation unit and the processing unit, so as to transmit and receive data between the first photoelectric conversion unit. · In the present invention, since the first photoelectric conversion unit for transmitting and receiving data is arranged on the conveying device side of the processing unit, and the first photoelectric conversion unit for transmitting and receiving data between the first photoelectric conversion units is arranged on the conveying device. So that when the object to be processed is transferred between the conveying device and the processing unit, it faces the first photoelectric conversion unit, so that According to the conventional value, the transportation device needs to be used to communicate data with each process. However, the present invention only needs to provide a second photoelectric conversion unit commonly used in each processing unit in the transportation device. Β The processing system of the present invention , Including: transport path; processing section, which is arranged along the aforementioned transport path in order to perform a given treatment on the object to be processed; (Please read the precautions on the back before filling this page) Line 14 V. Description of the invention ( 12 A7 B7 The Printed Inspection Department of the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs is arranged along the aforementioned transportation path for inspections to be processed. The transportation device is movably arranged on the aforementioned transportation path so that The processing unit and the inspection unit transfer the object to be processed; the first photoelectric conversion unit is arranged on the side of the transportation device of the processing unit and the inspection unit to transmit and receive data; and the second photoelectric conversion unit It is arranged in the transportation device, and faces the first photoelectric conversion unit when the object to be processed is transferred between the transportation device and the processing unit. And transmit and receive data to and from the first photoelectric conversion unit. Therefore, in the past, the hardware used to communicate data with each processing unit was required in each processing unit of the transport device, but the present invention is in the transport device It is only necessary to provide a second photoelectric conversion unit that is commonly used in each processing unit. In addition, since the data is transmitted and received between the transportation device and the inspection, for example, the inspection result can be transferred from the inspection unit to the transportation device. After the inspection is performed, the processing unit that processes the processed plutonium further receives the inspection result, and determines whether to perform processing based on the inspection result. Thereby, the processed puppet that is judged to be defective by the inspection unit can be eliminated, and further processing can be eliminated. As a result, the processing efficiency can be improved. The processing system of the present invention is a processing system that performs most types of processing on each layer to be processed to form a plurality of layers, but will be used to form the entire layer of the ship to be processed The processing department added a shipwright. In the present invention, since the processing units forming the entire layer of the ship to be processed are integrated, in the past, every management needs to seek the integration of the individual processing units so as to have the processing capacity and the integration that requires control, but the invention starts from That is, such integration is sought to reduce the burden on the transport device. 0¾-- (Please read the notes on the back before filling in this page) * τ This paper size is based on the rate of Chinese households (CNS> A4, "Grid (210X297 mm) 15 Shellfish Consumer Cooperative of Intellectual Property Bureau, Ministry of Economic Affairs Print A7 ________B7__ V. Invention Zhu Ming (13) The processing system of the present invention is in the aforementioned processing section, which has a dedicated processing section serving as one processing and two or more concurrent processing sections. This can reduce the transport device. The processing system of the present invention is divided into a processing unit that performs a vacuum system treatment on an object to be processed and a processing unit that performs an atmospheric system treatment β, thereby reducing the cost of a clean room. The following description will be based on the drawings. Embodiment 1 of the present invention FIG. 1 is a plan view of a processing system for forming a TFT array according to an embodiment of the present invention. As shown in FIG. 1, the atmosphere is provided in a straight line at approximately the center of the processing system. The conveying path 10. The conveying path 1 is provided at one end of the conveying path 10 with a loading / unloading unit 20 for moving the glass substrate G, which is to be processed, into the system and out of the system. The other end is provided with a mouth portion 30 (interface) β that carries a glass substrate 10 between the light exposure device 2 and various processing sections on both sides of the transport path 10. From the transport path 10 to the One end is provided in order: a cleaning processing area 40 for performing the aforementioned cleaning treatment for film formation, a vacuum processing area 50 for performing vacuum processing on a glass substrate, and a large space processing area for performing atmospheric processing on a glass-filled substrate G. 70. In the cleaning treatment area 40, a plurality of, for example, three scrubber units (WS) 41 (scrubber unit) are arranged along the transport path 10. The scrubber unit 41 is designed to clean the glass with water. Substrate G * In the vacuum processing area 50, a processing unit for performing vacuum processing on the glass substrate G is provided for each process and each layer along the conveying path 10, and the Chinese national standard is used on a per sheet basis. (CNS > Λ4 specification (210X297 mm) '-16-(Please read the precautions on the back before filling this page)

經濟部智*財產局員工消費合作社印製 A7 -- . - B7 五、發明説明（14) " '一''— - 各層區分配置著》具想言之，從運送路1〇之一端側依序區 分為：對於第-層進行處理之第一處理領域51 '對於第二 層進行處理之第二處理領域52、對於第三層進行處理之第 二處理領域53、對於第四層進行處理之第四處理領域μ、 對於第五層進行處理之第五處理領域55;而在各領域配置 有給定之處理部。 第一處理領域51，係在運送路10之一側配置有一以真 w 空狀態對於玻璃基板G進行蝕刻處理及研磨處理之蝕刻。 研磨單元（E/A:etching/ashing unit)56，而在另一側則配置 有一側則配置有一以真空狀態對於玻璃基板^進行成膜處 理之處理部用的成膜單元（PVD1)及試驗器等之檢查裝置 58 〇 姓刻•研磨單元56，係如第2圖所示，備有：設在運 送路10側之負載鋇室群201 ;設在其深處之運送室2〇2 ;設 在運送室202兩側面的蝕刻處理室2〇3及研磨處理室204 β 負載销室群201，係如第3圖所示，構成多層.(上下多 ^ 數）’例如配置構成有四層的負載鎖室2〇ia〜2〇id。在各 負載鎖室201a〜201d與運送路202之間、及運送室202與各 處理室203，204間’插裝有氣密地密封此等間且可開閉的 閘閥V»又，在用來連通負載鎖室20 la〜20 Id與外側之大 氣氛圍氣的開口 ’也設有閘閥V。蝕刻處理室203，係設 有一將玻璃基板G載置於其中之載物台（stage)205，且將 其内部構成為可抽空。在蝕刻處理室203，例如導入有飪 刻氣體，且可外加高頻電場。藉此，在姓刻處理室203形 成電漿（plasma)，藉由其電漿將玻璃基板G之給定膜蝕刻 本紙張尺度逋用中國國家標準（cns )Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7-.-B7 V. Description of the invention (14) " '一' '--Each layer is arranged separately. Sequentially divided into: the first processing area 51 for the first layer, the second processing area 52 for the second layer, the second processing area 53 for the third layer, and the fourth layer. The fourth processing area μ, the fifth processing area 55 for processing the fifth layer, and a given processing section is arranged in each area. The first processing area 51 is provided on one side of the transport path 10 with an etching process for etching and polishing the glass substrate G in a vacuum state. Grinding unit (E / A: etching / ashing unit) 56, and on the other side, there is a film forming unit (PVD1) and test for a processing unit that vacuum-forms a glass substrate ^ on one side. Checking device 58 such as engraving and grinding unit 56, as shown in Fig. 2, is provided with: a barium chamber group 201 provided on the side of the transport path 10; a transport chamber 2202 provided in the depth thereof; The etching processing chamber 203 and the polishing processing chamber 204 β load pin chamber group 201 provided on both sides of the transport chamber 202 are composed of multiple layers as shown in FIG. 3 (the upper and lower numbers). For example, four layers are arranged. The load lock chamber 20a ~ 20id. Between the load lock chambers 201a to 201d and the transportation path 202, and between the transportation chamber 202 and the processing chambers 203 and 204, a gate valve V that hermetically seals these spaces and is openable is inserted. A gate valve V is also provided in the opening 'that communicates the load lock chambers 20 la to 20 Id with the outside atmosphere. The etching processing chamber 203 is provided with a stage 205 on which the glass substrate G is placed, and the inside thereof is evacuated. In the etching processing chamber 203, for example, a cooking gas is introduced, and a high-frequency electric field can be applied. Thereby, a plasma is formed in the engraving processing chamber 203, and a given film of the glass substrate G is etched by the plasma. The paper standard is in accordance with Chinese National Standards (cns)

装-- (請先閱讀背面之注意事項再填寫本頁) 訂 線·Installation-(Please read the precautions on the back before filling out this page)

Hi —I— I .Hi —I— I.

17 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明（15 ) 成符合於顯像圖案。 研磨處理室204，係設有一將玻璃基板G載置於其中 之載物台206,且將其内部構成為可枷空。該研磨處理室204 ，成為可導入研磨氣體例如臭氡，以便藉研磨氣體來除去 姓刻i理後之抗蚀劑（resist)。 運送室202也構成為可抽空，其中設有基板運送構件 207。基板運送構件207，係為多關節臂型，備有基座208 、中間臂209、一設在前端之基板支接臂210:此等之連接 部可升降且可旋迴。此基板運送構件207,係在與負載鎖 室201a〜210d、處理室203、204間進行玻璃基板G之交接 。在與基板運送構件207之基座208的中間臂209相反之一 邊，設有一構成得可保持玻璃基板G之緩衝器框體211。 藉此暫保持玻璃基板G，藉以謀求產率之提高。 負載鎖室201a〜201d也構成為可抽空，且設有一將玻 璃基板G載置於其中之齒條212及一用來進行玻璃基板G之 對準的定位器（positioner)213。定位器213，係沿著箭形符 號A移動，藉此分別用兩個滾輪214來壓住玻璃基板G之相 向的兩個隅角部，在齒條212上進行玻璃基板G之調整對 準。為了確認對準之終了而使用未圖示之光學感測器 (optical sensor)。關於各負載領室201a〜201d，若要在與 運送路10側間進行玻璃基板G之交接時，將其中作成大氣 氛圍氣，又，若將玻璃基板G運送至處理室203、204側時 ，進行轉換使其中成為真空氛圍氣。 如第1圖所示，成膜單元57，備有：設在運送路10側 之二組負載鏔室群301，301(如第3圖所示配置成多層之負 本紙張尺度邋用中國國家梂準（CNS ) A4it格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) 訂 線 -18 - 經濟奸智慧敗產局員工消費合作社印製 ... A 7 B7 五、發明説明（16 ) 載鎖室）；設在其深處之運送室302;及設在運送室302之 外周的三組成膜室303、304、305。成膜室303、304、305 係例如在真空氛圍氣中，藉PVD將给定之膜成膜於一載置 載物台之玻璃基板G上者；其他之各室具有與蝕刻•研磨 單元56大致同樣之構成。 於第二處理領域52,在運送路之一侧配置有用做處理 部之蝕刻•研磨單元59(E/A2)，其中該處理部係以真空狀 L 對於玻璃基板G進行蝕刻處理及研磨處理者；而在另一側 則配置有用做處理部之成膜單元（CVD1)60，其中該處理 部係以真空狀態藉由CVD對於玻璃基板10進行成膜處理 者。各單元具有與上述第一處理領域51大致同樣之構成。 於第三處理領域53，在運送路之一側配置有用做處理 部之蝕刻•研磨單元（E/A3)61，其中該處理部係以真空狀 態對於玻璃基板G進行蝕刻處理及研磨處理者；而在另一 侧則配置有用做處理部之成膜單元（PVD2)62及試驗器等 之檢查裝置62a，其中該處理部係以真空狀態藉由PVD對 於玻璃基板G進行成膜處理。各單元，具有與上述第一處 理領域51之單元大致同樣之構成。 於第四處理領域54,在運送路10之一側配置有用做處 理部之蝕刻•研磨單元（E/A4)63，其中該處理部係以真空 彼態對於玻璃基板G進行蝕刻處理及研磨處理者；而另一 侧則配置有用做處理部之成膜單元（CVD2)64，其中該處 理部係以真空狀態藉由CVD對於玻璃基板G進行成膜處理 處理者。各單元，具有與上述第一處理領域51大致同樣之 本紙張尺度適用中國國家揉率（CNS ) A4洗格（210X297公釐） ' -19 - ---------^------ir------^ (請先閲讀背面之注意事項再填寫本頁) . 4 4 0 8 9 4 a7 _____B7 五、發明説明（17 ) 構成9 於第五處理領域55，在運送路10之一側配置有用做處 理部之蝕刻•研磨單元（E/A5)65，其中該處理部係以真空 狀態.對於玻璃基板G進行蝕刻處理及研磨處理者；而另一 側則配置有用做處理部之成膜單元（PVD3)66及試驗器等 之檢查裝置67’其中該處理部係以真空狀態藉由PVD對於 玻璃基板G進行成膜處理者。各單元具有與上述第一處理 領域51之單元大致同樣之構成。 於大氣系處理領域70’沿者運送路1〇，配置有對仿玻 璃基板G施行大氣系處理之處理部.具體言之，從運送路 10之一端側依序配置有二組顧像處理單元（DEV)71、72、 二組洗淨處理單元（SCR)73、74、抗姓劑塗佈單元（CT)75 、乾燥處理單元（VD)76、邊緣脫除器（ER)77 » 顯像處理單元71，72，係在配置在單元内之杯（cup) 内’一邊使玻璃基板G旋轉一邊將顴像液供給玻璃基板G上 。洗淨處理單元73，74係藉洗滌器來洗淨玻璃基板上。抗飪 劑塗佈單元75，係在配置在單元内之杯内，一面使玻璃基板 G旋轉一面將抗蝕劑液供給玻璃基板〇上。乾燥處理單元76 ’係用以乾燥處理塗佈有抗蝕劑之玻璃基板G»邊緣脫除器 -單元77 ’係用以除去玻璃基板g之周緣部的抗蚀劑。 透過一用來暫時保持玻璃基板G之中繼部12,將用來 運送如第4圖所示之玻璃基板〇的多數個運送裝置丨丨，串 行地連接於運送路10。運送裝置^，包含有：本髏13，其 本紙張逋用中國國家榡率（CNS ) A4洗( 21〇 χ 297公羡）- ;---- H —^1 · {請先閱讀背面之注意事項再填寫本頁) 訂 線 經濟部智慧財產局員工消費合作社印製 20 經濟«Ρ·智慧財產局員工消費合作社印製 A7 B7 五、發明説明（18 ) 係可沿著運送路1 〇移動；基座構件14，其係對於裝置本體 13上下移動及旋迴移動；及上下二張之基板支持構件15a 、15b，其係在基座構件14上沿著水平方向分別可獨立移 動。藉連結部16來連結基座構件14之中央部與裝置本體13 。藉由内設在本體1，3之未圖示的馬達，使連結部16上下移 動或旋轉，藉此將基座構件14上下移動或旋轉移動。在這 種基座構件之上下移動及旋轉移動、以及基板支持構件15a _ 、15b之水平移動下’進行玻璃基板G之運送《符號17a、 17b，係分別用以引導基板支持構件15a，15b之導軌。運 送裝置11，係構成為：與搬入搬出部20、接口部30、沿著 運送路10而配置的各處理部、中繼部12之間，進行玻璃基 板G之交接。 在搬入搬出部20,設有一與運送路1〇大致正交之運送 路21。在隔著該運送路21之運送路10的相反側，設有卡匣 載置台23，其係用以將分別收納有例如25張之玻璃基板G 的卡匣C(cassette)，例如四個排列著載置在給定位置》又 一 ，在運送路21上，可移動地配置有運送裝置（圖示省略）， 其係自各卡匣C取出應處理之玻璃基板G後交接於運送路 10側’又將處理终了後從運送路10側交接過來的玻璃基板 G送回各卡匣C。此運送裝置，具有與第4圖所示之運送裝 .置同樣之構成。 在接口部30，向大致正交於運送路1〇之方向，設有一 用來運送玻璃基板G之運送路31。此運送路31，係透過暫 時保持玻璃基板G之中繼部12，而連接於運送路10。沿著 本紙張XJLii财 BBJSMUi· ( CNS ) A4*L«· ( 210X297公釐) ^ΐτI 線 (請先閲讀背面之注意事項再填寫本頁) -21 - 40SP 4 A7 B7 五、發明説明（19) 此運送路31，配置有多數台、例如二台之露光裝置（Εχρ)2 。又’在此運送路10上’舆露光裝置2之間設有用來進行 搬入搬出之運送裝置（圖示省略）。此運送裝置，雖可為一 台’但按照需要作成二台以上也可。藉此，可在與露光裝 置2之間既迅速且圓.滑地進行玻璃基板之交接。 其次’根據第5圖來說明這種構成之處理系統的處理 流程。 將自搬入搬出部20之卡匣C交接於運送裝置（圈示省略 )之玻填基板G，交接於運送路1〇之運送裝置π。接著， 將玻璃基板G運送至洗淨處理領域40以進行洗淨處理之後 ’運送至第一處理領域51，就第一層進行成膜處理。此後 ’將玻璃基板G運送至大氣系處理領域70及露光裝置2以 進行照相平版印刷處理。此後，將玻璃基板G運送至第一 處理領域51’就第一層進行飪刻處理及研磨處理（步騍501) 〇 其次，將玻璃基板G運送至洗淨處理領域40進行洗淨 處理之後，運送至第二處理領域52就第二層進行成膜處理 。此後，將玻瑀基板G運送至大氣系處理領琴70及露光裝 置2以進行照相平版印刷處理。此後，將玻璃基板g運送 至第二處理領域52,就第二層進行蝕刻處理及研磨處理（ .步驟502) · 其次，將玻璃基板G運送至洗淨處理領域40進行洗淨 處理之後，運送至第三處理領域53,就第三層進行成膜處 理。此後，將玻璃基板G運送至大氣系處理領域70及露光 本紙乐尺度遮用中國國家樣丰（CNS ) Μ洗格（士1〇><297公煃 (請先閱讀背面之注意事項再填寫本頁) 訂 線 經濟部智慧財產局員工消費合作社印製 22 A7 B7 經濟部智慧財產局貝工消費合作社印製 五、發明説明（2〇 ) 裝置2以進行.照相平版印刷處理。此後，將玻璃基板G運 送至第三處理領域53 ’就第三層進行蝕刻處理及研磨處理 (步驟503)。 其次’將玻璃基板G運送至洗淨處理領域40進行洗淨 淨處理之後’運送至第四處理領域54，就第四層進行成膜 處理。此後，將玻璃基板G運送至大氣系處理領域70及露 光裝置2以進行照相平版印刷處理。此後，將玻璃基板〇 — 運送至第四處理領域54’就第四層進行蝕刻處理及研磨處 理（步驟504)。 其次’將玻璃基板G運送至洗淨處理領域40進行洗淨 處理之後，運送至第五處理領域55，就第五層進行成膜處 理。此後，將玻璃基板G運送至大氣系處理領域70及露光 裝置2以進行照相平版印刷處理。此後，將玻璃基板〇運 送至第五處理領域55’就第五層進行蝕刻處理及研磨處理 (步驟505)。 其後，將玻璃基板G，交接於搬入搬出部20,搬入卡 _ 匣匸内。 在如此構成之處理系統1方面，由於將對於玻璃基板 G施行真空系處理之真空系處理領域50及對於玻璃基板g 進行大氣系處理之大氣系處理領域70，分別配置在另外之 .領域’所以可抑制淨化室之大型化。就是，由於不需要將 真空系處理領域50配置在淨化室内，所以可抑制淨化室之 大型化。又，於真空系處理領域50,由於沿著運送路10, 每各處理及每一層設有一對於玻璃基板G進行真空系處理 ^-- (請先閲讀背面之注意事項再填寫本頁) 訂 線 •ΊΙ. 本紙張尺度適用中國國家揲率（CNS ) A4规格（210X297公釐) 23 A7 B7 五、發明説明（21 ) 之處理部，且按每各層加以區分配置，所以產生問題時易 於弄清那一處理部存在著問題，可易於進行問題之顯在化 和分析，又易將各層之運送裝置及其他共同（同一）組件化 〇 其次說明，如第3圊所示，將負載鎖室配置成多層之 負載室群201的動作。 如第6圈所示，首先打開最上層負載鎖室20 la之運送 路10側的閘閥，從運送路10之運送裝置把玻璃基板G搬入 最上層之負載鎖室2〇la内。 其次’如第7圖所示，關閉最上層負載鏑室20 la之運 送路送路10側閘閥V，進行抽空；打開從上數起第二之負 載鎖室201b的運送路側閘閥，從運送路1〇之運送裝置11將 玻璃基板G搬入第二負載鎖室20ib内。 其次，如第8圖所示，打開最上層負載鎖室20 la之運 送室202側閘閥V，藉基板運送構件207將玻璃基板G搬出 至運送室202側·然後，關閉從上數起第二之負載鎖室201b 之運送路10側閘閥，進行抽空。又，打開從上數起第三之 負載鋇室201c的運送路10側閘閥，從運送路1〇之運送裝置 10將玻璃基板G搬入第三負載鎖室201c内。 其次，如第9圖所示，從運送室202側藉由基板運送構 •件207將真空處理终了之玻璃基板G搬入最上層之負載鎖 室201a内。然後，打開從上數起第二之負載鎖室2〇lb的運 送室202側閘閥，藉由基板運送構件將玻璃基板G運送至 運送室202側。此時，關閉從上數起第三之負載鎖室20 lc 本紙張尺度遑用中國國家樣率（〇^)从规格（2丨0；<297公瘦） (請先閱讀背面之注意Ϋ項再填寫本頁) 訂 線 經濟部智慧財產局貝工消費合作社印製 24 經濟命智慧沐產局we工消*:合作社印製 A7 _B7_ 五、發明説明（22 ) 之運送路側閘閥V，進行抽空。又，打開最下層負載鎖室 201d之運送路10側閘閥V，從運送路10之運送裝置11將玻 璃基板G搬入第四負載鎖室201d内。 其次，如第10圖所示，俟關閉最上層負載鎖室20 la之 運送室202側閘閥V之後，打開運送路10側閘閥V，藉由運 送裝置11將玻璃基板G搬出至運送路10側。然後，藉由基 板運送構件207,將真空處理终了之玻璃基板G從運送室 — 202側搬入從上數起第二之負載鎖室201b内。又，打開從 上數起第三之負載鎖室201c之運送室側閘閥V，藉基板運 送構件207將玻璃基板G搬出至運送室202側，關閉最下層 之負載鎖室201d的運送路10側閘閥V，進行抽空處理。 以下，依次進行這種動作。 在構成如此之處理系統1方面，由於負載鋇室群201中 ，將負載鎖室201a〜20Id配置成多層，所以一面可使負載 鎖室用之佔有面積狹窄，一面在運送路10側與真空系之蝕 刻•研磨單元56等間順暢地圊滑地交接玻璃基板G。 其次說明本發明之其他實施例》 第11圖，係用來形成本實施例之TFT陣列的處理系統 之平面圖。 於此處理系統1’中，對於玻璃基板G施行真空系處理 •之真空處理領域50中的運送路10’，係構成真空系之運送 路’也就是設運送路内成密閉構造，而做成真空氛圍氣。 又，在真空系之運送路10’舆大氣系之運送路10間， 插裝有用做交接部之負載鎖室群12，。負載鎖室群12’，係 本紙張尺度適用中國國家橾準（CNS > A4規格（210X29.7公釐） ---------^------1T------^ (請先閲讀背面之注意事項再填寫本頁) · 25 A 7 " ----—- _______ B7__ 五、發明説明（23 5 " 與第3圖所示者同一之構造，而一如第12圖所示配置成上 下多層，例如，配置成四層負載鎖室^^〜^^之構成。 又各負載鎖至12 a〜12’d，係在與真空系運送路1〇,間 ，及在各負载鎖室12’a〜12’d與大氣系運送路1〇,間，插 裝有將此等間氣密地密封且可開閉之閘閥V。 於各負載鎖室12’a〜12，d進行轉換，俾在與大氣系運 送路10側之間進行玻璃基板G之交接時，將其中作成大氣 氛圍氣’而在與真空系之運送路1〇’側之間進行玻璃基板 G之交接時’將其中作成真空氛圍氣。 構成如此之負載鎖室群12’，進行與第6圖〜第10圏所 示者同樣之動作。即，例如從最上層之負載鎖室12，a依序 進行閘閥V之開閉及玻璃基板G之交接。 在這種處理系統Γ方面，由於將大氣系運送路與真 空系運送路10’間之負載鋇室12’a〜12’d作成多層之構成 ，所以一面可使負載鎖室用之佔有面積狹窄，一面可在大 氣系運送路10舆真空系運送路10’間順暢地且圓滑地進行 玻璃基板G之交接》 第13圖係顯示第2圖或第3圖所示之負載辞室群之抽空 系配管。如該圈所示，在負載鑌室201a〜20Id，分別安裝 有漏泄閥（leak valves)211 a〜21 Id，同時’透過真空閥212a .〜211d來進行抽空•又，此等之閥，係藉由一總括地控制 系統全«之控制部之控制，來進行如下述之開閉。 當將未處理之基板收容於第一層之負載鎖室20 la時， 首先打開第一層之負載鎖室201a的漏泄閥211a，其後，打 本紙張尺度逋用中國國家橾率（CNS ) A4规格(210X297公* ) (請先Μ讀背面之注意事項再填寫本頁) 訂 線 經濟部智慧財產局員工消費合作社印製 26 經濟体智慧財•產局貝工消#合作社印製 A 7 __B7 五、發明説明（24 ) 開入口側閘閥，收容基板。此時’此層之真空閥預先關起 來0 其次，關閉第一層之漏泄閥21 la，並關閉入口側之閉 閥，打開第一層之真空閭。在此處，預先關閉其他真空閥 ，藉此消除對於他層之負載鎖室的影藜》 當將未處理之基板收容於第二層之負載鎖室2〇lb時， 打開第二層之負載鎖室201b的漏泄閥；其後，打開入口側 _ 閘閥’收容基板。此時，預先關閉其他層之真空閥。 其次’關閉第二層之漏泄閥21 la，關閉入口側閉闕及 打開第二層之真空閥，進行抽空。接著，打開真空側閘閥 ，進行真空處理〇 又，將真空閥，一如第14圖所示’作成三通閥，藉此 可免除漏泄閥。 又，本發明並不限定於上述之實施例，可在其技術思 想之範圍做各種之變形。 例如’將第3圖所示之各負載鎖室，作成如第15圖所 — 示之多層構成，藉此可更加提高交接效率。 又，本發明，雖以對於TFT陣列玻璃基板之處理系統 為例，進行了說明，但不用說也可適用於用來處理濾色器 (colorfiter)，及半導艎晶圓等之其他基板的系統。 其次，說明本發明之其他實施例。 第16圖係第1圖所示之處理系統1的部分放大平面圖。 在沿著運送路10而配置（對應於第1圖之洗滌器單元41 乃至邊緣脫除器77)之多數個處理部50la〜50Id的運送路 本紙張尺度適用中國國家揉準（CNS ) A4规格（210X297公釐） ---------1------IT------0 (請先Μ讀背面之注意事項再填寫本頁) . -27 - A7 _________B7_ 五、發明説明（25 ) 側’設有用來進行資料收發之第一光電變換部502。將運 送路裝置11在處理部50la〜50Id間進行玻璃基板G之交接 時進行資料收發之光電變換部503，.設在與第一光電變換 部502相向之位置❶藉此，在處理部2〇ia〜5〇ld與運送裝 置11間進行資料之互送。 例如，如第17囷所示，當運送裝置η在其與處理部501a 間進行玻璃基板G之交接時，設在運送裝置11的第二光電 變換部503與設在處理部5〇la的第一光電變換部50便相向 ，在此間可進行資料之互送。 以往’每處理部501a〜501d需要用來與各處理部501a 〜501d進行資料通信之硬艎；反觀本實施例，可藉著其構 成而在運送裝置11設置通用於各處理部之一個第二光電變 換部503即可。藉此，可謀零件件數之削減。尤其是第i圖 所示之處理系統1設有數龐大之處理部，所以可藉著適用 本發明於這種處理系統1而削減相當多之零件件數•再者 ’第1圖所示之處理系統1，由於進行TFT形成用之一貫之 處理，所以有時候由檢查裝置中途判定不良品之玻璃基板 G也會流入其後之處理路線·於是，將檢查幕置之檢査資 料’自設在檢査裝置之第一光電變換部502交付給設在運 送裝置11之第二光電變換部503。其後，從運送裝置11將 .玻璃基板G交接於下一處理部時，首先自運送裝置11將此 資料交付給該處理部•此時，作成由該處理部側拒絕由檢 查裝置判定為不良品之玻璃基板G的交接也可。藉此，免 除玻璃基板G之無用的交接，提高系統全髏之處理效率。 本紙張尺度適用中國國家椹準（CNS ) A4規格（210X297公釐)~ " -28 - {請先閲讀背面之注意事項再填寫本頁) 訂 涑 經濟部智慧財產局員工消費合作社印製_ 五、 發明説明（ 26 經 濟 部- 智 慧 財· 產 局 負 工 消 費 合 作 社 印 製 其次，說明本發明之其他實施例。 第19圊，係本發明其他實施例之處理系統的平面圖。 依照第1圖所示之處理系統的真空系處理系統5〇，雖 沿著運送路，每各處理及每層設有對於玻璃基板^施行真 空系處理之處理部’·進而按每各層加以區分配置，但依照 實施例之處理系統81的真空系處理領域82，卻將對於玻璃 基板G施行真空系之處理按各處理之每一種類加以區分配 置。具想s之，從運送路之一端側依序區分為，用來進行 成膜處理之第一處理領域83'用來進行姓刻處理及研磨處 理之第二處理領域84,且，在各領域分別配置有給定之處 理部。又，在第一處理領域83與第二處理領域84之間，設 有一配置有檢査裝置85之檢查領域86。 第一處理領域83 ’係於運送路1 〇之一側配置有對於第 一層〜第三層施行成膜處理之成膜單元87〜89，另一側則 配置有對於第四層〜第五層施行成膜處理之成旗單元90〜 91 〇 第二處理領域84，係於運送路1 〇之一側配置有對於第 一層〜第三層施行蝕刻.研磨處理之蝕刻•研磨單元92〜 94 ’而另一側則配置有對於第四層〜第五層施行蝕刻•蝕 研磨處理之蝕刻•研磨單元95〜96。 如此，依照本實施例之處理系統81，不但與上述實施 例同樣可抑制淨化室之大型化，且就用來施行其空系處理 部，在真空系處理領域82内按各處理之每一種類加以區分 配置，所以易於進行施力及附帶設備之共同化。 本紙浪尺度逋用中國固家橾準（CNS ) A4规格（210X297公釐） ----襄------ΤΓ------Φ (請先閱讀背面之注意事項再填寫本頁) · 29 Α7 Β7 27 440894 "" — Μ - 五、發明説明（ 其次，說明本發明之其他實施例。 第20圖為一斜視圖，顯示本實施例之處理系統的構成。 {請先Μ锖背面之注意事項再填寫本頁) 該圖示之處理系統101，係將用.來形成基板G全層之 處理裝置予以一體化者。具體言之，連接有：搬入搬出裝 置（C/S)102、洗淨裝置（WS)103、對於第一層之真空系處 理裝置104'對於第二層之真空系處理裝置1〇5、對於第三 層之真空系處理裝置106、對於第四層之真空系處理裝置 107、對於第五層之真空系處理裝置1〇8、洗滌器洗淨裝置 109、抗蝕劑塗佈裝置110、顯像處理裝置在各裝置 之中央，與鄰接裝置之間，設有用來進行玻璃基板G之交 接的運送路112及運送裝置（未圊示ρ 铢 經濟部智慧財產局邕工消費合作社印製 在此處，搬入搬出裝置102，係將玻璃基板g搬入系 統内之同時向系統外搬出之裝置者。洗淨裝置1〇3係在運 送路112之兩側具有洗滌器單元113。對於第一層之真空系 處理裝置104，係在運送路112之兩側僙有蝕刻•研磨單元 114及成膜單元.115。對於第二層之真空系處理裝置1〇5， 係在運送路112之兩侧備有蝕刻.研磨單元U6及成膜單元 117。對於第三層之真空系處理裝置1〇6,係在運送路112 之兩側備有飪刻•研磨單元118及成膜單元119。對於第四 層之真空系處理裝置107係在運送路112之兩側備有蝕刻· 研磨單元120及成膜單元121。對於第五層之真空系處理裝 置108，係在運送路112之兩側備有蝕刻.研磨單元122及 成膜單元123。洗滌器洗淨裝置1〇9，係在運送路112之一 側備有洗滌器洗淨單元124。抗蝕劑塗佈裝置11〇，係在運 30 經濟#·智慧W-產局資工消Φ合作社印製. - A7 ------------ B7 五、發明説明（28) 送路112之一側備有抗蝕劑塗佈單元125及邊緣脫除器126 。顯像處理裝置111係在運送路丨12之一側備有抗蝕劑塗佈 單元125及邊緣脫除器126。顯像處理裝置U1係在運送路 112之一側備有顯像處理單元127。露光裝置（未圖示）係鄰 • 接於顯像裝置111且與之連接著。 於上述實施例，在第1圖、第19圖及第20圖所示之處 理系統的運送路10上方，裝載一用來維持運送路内之洗淨 、 度的過遽器’從處理系統上方取進外部空氣以便在運送路 10形成降流也可。此時，在運送路10之周圍設置隔壁，以 便防止處理系統外之氛圍氣進入運送路10内。藉此即使將 處理系統設置於淨化室外，也可維持運送路内之洗淨度， 系統本身構成淨化室，藉此可實現局部性之淨化室化。 像這樣’如依本發明，由於把用來形成玻璃基板G之 全層的處理部加以一想化，故以往必需將各個別之處理部 謀求處理能力的整合，且也謀求控制之整合；反觀本發明 ^ 一開始即謀求此等之整合，因而可減輕使用者之負擔。 又’本發明並不限定於上述實施例，在其技術思想之 範圍内可做各種之變形β 例如’本發明，雖以對於TFT陣列玻璃基板之處理系 統為例進行了說明，但不用說也可適用於用來處理濾色器 * .、及半導髏晶圓等之其他基板的系統。 圖式之簡單說明 第1圖，係本發明一實施例之處理系統的平面圖。 第2圖為一水平斷面圖，係顧示第1圖所示之蝕刻•研 本紙張適用中困國家橾準（CNS ) ( 21GX297公釐) " ~ -31 - 裝 訂 線 (請先閲讀背面之注意事項再填寫本頁) Α7 ___£Ζ_ 一^- 五、發明説明（29 ) 磨單元之一例》 第3圖，係第2圊所示之負載鎖（load lock)室群之枭面 圖。 第4圖，係顯示運送裝置之構成的斜視圖。 第5圖，係顯本.實施例之處理系統的處理流程。 第6圈為一正面圖’係顯示本實施例之負載鎖室群之 動作。 第7圊為一正面圈，係顯示本實施例之負載鎖室群之 動作。 第8圖為一正面圖’係顯示本實施例之負載鎖室群之 動作。 第9圖為一正面圖，係顯示本實施例之負載鎖室群之 動作。 第10圖為一正面圖，係顯示本實施例之負載鎖室群之 動作。 第11圖係本發明其他實施例之處理系統的平面圖。 第12圖為一正面圈，係類示第11圖所示之負載鎖室之 構成。 經濟部智慧財產局員工消費合作社印製 第13圈，係第2圈乃至第3圊所示之負載鎖室群的抽空 系之配管。 第14圖，係第13圖所示之真空閥的變形例。 第15圈，係顯示第3圖所示之負載鋇室的變形例。 第16圖，係本發明其他實施例之處理系統的部分放大 平面圖。 本紙張尺度遑用中两國家橾率（CNS ) A4规格（210X297公釐） 32 A7 B7 五、發明説明（3〇) 第17圖，係顯示第16圊所示之處理系統的動作。 第18圖，係顯示第16圖所示之處理系統的動作。 第19圖，係本發明其他實施形態之處理系統的平面圖 〇 第20圖為一斜視圊，係本發明其他實施形態之處理系 統的構成。 ---------1------IT------^ (請先閲讀背面之注意事項再填寫本頁) · 經濟伞智慧札產局費工消費合作社印製. 本紙張尺度逋用中國國家標率（CNS ) A4規格（210X297公釐） 33 —i* Ο , _B7_ 五、發明説明（31 ) 元件標號對照 1…處理系統 Γ…處理系統 2…露光裝置 - 10…運送路 10’…運送路 11…運送裝置 12···中繼部 12’…負載鎖室群 12’a〜12’d…負載鎖室 13…裝置本體 14…基座構件 15a，15b…基板支持構件 16…連結部 17b…導軌 20…搬入搬出部 3 0…接口部 40…洗淨處理領域 41…洗滌器單元 50，50’…真空系處理領域 51…第一處理領域 52…第二處理領域 53…第三處理領域 本紙張尺度遑用中國國家橾準（CNS ) A4规格（210X297公釐） -34 - 經濟砵智慧財產局員工消贲合作社印製. A7 B7 五、發明説明（32 ) 54".第四處理領域 55·.·第五處理領域 56…蝕刻•研磨單元 57，60，62…成膜單元 58…檢查裝.置 61，63…蝕刻•研磨單元 62a，67…檢查裝置 _ 64，65，66…成膜單元 70…大氣系處理領域 71，72…顯像處理單元 73，74…洗淨處理單元 75…抗蝕劑塗佈單元 76…乾燥處理單元 77…邊緣脫除器 81…處理系統 82…真空系處理領域 83···第一處理領域 84…第二處理領域 85…檢查裝置 86…檢查領域 87〜89…成膜單元 90〜91…成膜單元 92〜96…蝕刻•研磨單元 101…處理系統 本紙張尺度適用中國國家橾準（CNS ) A4规格（210X297公釐） ---------^------IT------^ (請先閲讀背面之注意事項再填寫本頁) · 35 440894 A7 經濟部智慧財產局貝工消费合作社印製 B7五、發明説明（33 ) 102…搬入搬出裝置 103…洗淨裝置 104〜108···真空系處理裝置 109…洗滌器洗淨裝置 110…抗蝕劑塗佈裝·置 111…顯像處理裝置 112…運送路 113…洗滌器單元 114，116，118，120…蝕刻•研磨單元 115，119…成膜單元 201…負載鎖室 201a〜201d."負載鎖室 202，302.··運送室 203…蝕刻處理室 204…研磨處理室 207…基板運送構件 208…基座 209…中間臂 210…基板支持臂 211a〜21 Id…漏泄閥 -212…齿條 212a〜211d…真空閥 213…定位器 301…負載鎖室群 (請先閲讀背面之注意事項再填寫本頁)17 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of Invention (15) It conforms to the development pattern. The polishing processing chamber 204 is provided with a stage 206 on which the glass substrate G is placed, and the inside thereof can be emptied. The polishing processing chamber 204 is capable of introducing a polishing gas such as stinky so as to remove the resist after the polishing process by the polishing gas. The transfer chamber 202 is also configured to be evacuable, and a substrate transfer member 207 is provided therein. The substrate conveying member 207 is a multi-joint arm type, and is provided with a base 208, an intermediate arm 209, and a substrate supporting arm 210 provided at the front end: these connecting portions can be raised and lowered and swiveled. This substrate transporting member 207 transfers the glass substrate G between the load lock chambers 201a to 210d and the processing chambers 203 and 204. A buffer frame 211 configured to hold the glass substrate G is provided on the side opposite to the intermediate arm 209 of the base 208 of the substrate transfer member 207. Thereby, the glass substrate G is temporarily held, thereby improving the productivity. The load lock chambers 201a to 201d are also configured to be evacuated, and are provided with a rack 212 for placing the glass substrate G therein and a positioner 213 for aligning the glass substrate G. The positioner 213 is moved along the arrow symbol A, whereby the two corners of the glass substrate G facing each other are pressed by two rollers 214, and the glass substrate G is aligned on the rack 212. To confirm the end of alignment, an optical sensor (not shown) is used. Regarding each of the load-bearing chambers 201a to 201d, when the glass substrate G is to be transferred to and from the transport path 10 side, the atmosphere is created in the glass substrate G, and when the glass substrate G is transported to the processing chambers 203 and 204, The conversion is performed so that it becomes a vacuum atmosphere. As shown in FIG. 1, the film forming unit 57 includes two sets of load chambers 301 and 301 provided on the side of the conveying path 10 (as shown in FIG. 3, the negative paper size is arranged in multiple layers, and the country of China is used).梂 Jun (CNS) A4it (210X297 mm) (Please read the notes on the back before filling out this page) LINE-18-Printed by the Consumer Cooperatives of the Economic and Intellectual Property Loss Bureau ... A 7 B7 V. Invention Explanation (16) Load lock chamber); a transport chamber 302 provided in the deep part thereof; and a three-component film chamber 303, 304, 305 provided outside the transport chamber 302. The film forming chambers 303, 304, and 305 are, for example, those in which a given film is formed on a glass substrate G on a stage by PVD in a vacuum atmosphere; each of the other chambers has a shape similar to that of the etching and polishing unit 56. The same composition. In the second processing area 52, an etching and polishing unit 59 (E / A2) serving as a processing section is arranged on one side of the conveying path, and the processing section performs vacuum processing and polishing processing on the glass substrate G with a vacuum L. ; On the other side, a film-forming unit (CVD1) 60 serving as a processing section is disposed, wherein the processing section is a film-forming processor for the glass substrate 10 by CVD in a vacuum state. Each unit has a configuration substantially the same as that of the first processing area 51 described above. In the third processing area 53, an etching / grinding unit (E / A3) 61 serving as a processing section is arranged on one side of the conveying path, wherein the processing section performs etching processing and polishing processing on the glass substrate G in a vacuum state; On the other side, a film forming unit (PVD2) 62 serving as a processing unit and an inspection device 62a, such as a tester, are disposed. The processing unit performs a film forming process on the glass substrate G by PVD in a vacuum state. Each unit has substantially the same configuration as the unit in the first processing area 51 described above. In the fourth processing area 54, an etching / polishing unit (E / A4) 63 serving as a processing section is arranged on one side of the conveying path 10, wherein the processing section performs etching processing and polishing processing on the glass substrate G in a vacuum state. The other side is equipped with a film forming unit (CVD2) 64 which is used as a processing part, and the processing part is a person who performs a film forming process on the glass substrate G by CVD in a vacuum state. Each unit has the same paper size as the above-mentioned first processing area 51. Applicable to the Chinese national kneading rate (CNS) A4 washing grid (210X297 mm) '-19---------- ^ --- --- ir ------ ^ (Please read the notes on the back before filling this page). 4 4 0 8 9 4 a7 _____B7 V. Description of the invention (17) Composition 9 In the fifth processing area 55, in An etching / polishing unit (E / A5) 65 serving as a processing section is disposed on one side of the transport path 10, and the processing section is in a vacuum state. The glass substrate G is subjected to etching processing and polishing processing; and the other side is configured It is useful as a film forming unit (PVD3) 66 of a processing unit and an inspection device 67 'such as a tester, in which the processing unit is a film forming process for the glass substrate G by PVD in a vacuum state. Each unit has substantially the same configuration as the unit in the first processing area 51 described above. A processing unit for performing atmospheric processing on the imitation glass substrate G is disposed along the transport path 10 of the atmospheric processing area 70 ′. Specifically, two sets of image processing units are sequentially arranged from one end side of the transport path 10. (DEV) 71, 72, two cleaning treatment units (SCR) 73, 74, anti-surname agent coating unit (CT) 75, drying treatment unit (VD) 76, edge remover (ER) 77 »Imaging The processing units 71 and 72 are provided in a cup disposed in the unit, and the imaging liquid is supplied to the glass substrate G while the glass substrate G is rotated. The cleaning processing units 73 and 74 use a scrubber to clean the glass substrate. The anticorrosive coating unit 75 is placed in a cup arranged in the unit, and the resist liquid is supplied onto the glass substrate 0 while the glass substrate G is rotated. The drying processing unit 76 'is used to dry-process the resist-coated glass substrate G »edge stripper-unit 77' is used to remove the resist on the peripheral edge portion of the glass substrate g. Through a relay section 12 for temporarily holding the glass substrate G, a plurality of conveying devices for conveying the glass substrate 0 as shown in Fig. 4 are connected in series to the conveying path 10. Conveying device ^, including: the skull 13, whose paper was washed with Chinese National Standard (CNS) A4 (21〇χ 297 public envy)-; ---- H — ^ 1 · {Please read the back Note: Please fill in this page again.) Order line Printed by the Employees 'Cooperatives of the Intellectual Property Bureau of the Ministry of Economy 20 Printed by the economy «P · Printed by the Employees' Cooperatives of the Intellectual Property Bureau A7 B7 V. Description of the invention (18) It can be moved along the transportation path 1〇 A base member 14 that moves up and down and rotates around the device body 13; and two upper and lower substrate support members 15a and 15b that are independently movable on the base member 14 along the horizontal direction, respectively. The central portion of the base member 14 and the device body 13 are connected by the connecting portion 16. A motor (not shown) built into the main body 1, 3 moves or rotates the connecting portion 16 up and down, thereby moving the base member 14 up or down. The above-mentioned base member is moved up and down and rotated, and the substrate support members 15a and 15b are horizontally moved, and the glass substrate G is conveyed. The symbols 17a and 17b are used to guide the substrate support members 15a and 15b, respectively. guide. The transport device 11 is configured to transfer the glass substrate G to and from the loading / unloading section 20, the interface section 30, each processing section disposed along the transport path 10, and the relay section 12. The loading / unloading section 20 is provided with a transport path 21 substantially orthogonal to the transport path 10. On the opposite side of the transport path 10 across the transport path 21, there is provided a cassette mounting table 23 for storing cassettes C (cassettes) each containing, for example, 25 glass substrates G, for example, four arrays "It is placed at a given position." Furthermore, on the conveying path 21, a conveying device (not shown) is movably arranged, which takes out the glass substrate G to be processed from each cassette C and transfers it to the conveying path 10 side. 'The glass substrate G handed over from the conveyance path 10 side after the completion of processing is returned to each cassette C. This transport device has the same configuration as the transport device shown in FIG. The interface section 30 is provided with a transport path 31 for transporting the glass substrate G in a direction substantially orthogonal to the transport path 10. This transport path 31 is connected to the transport path 10 through the relay section 12 that temporarily holds the glass substrate G. Along the paper XJLii Choi BBJSMUi · (CNS) A4 * L «· (210X297 mm) ^ ΐτI (Please read the precautions on the back before filling this page) -21-40SP 4 A7 B7 V. Description of the invention (19 ) This transport path 31 is provided with a plurality of exposure devices (eg, two exposure devices (Eχρ) 2). A transport device (not shown) is provided between the exposure device 2 on the transport path 10 for carrying in and out. Although this transport device may be one, two or more may be produced as required. Thereby, the glass substrate can be quickly and smoothly transferred to and from the exposure apparatus 2. Next, the processing flow of the processing system having such a configuration will be described with reference to Fig. 5. The cassette C from the loading / unloading unit 20 is transferred to the glass-filled substrate G of the transfer device (circle omitted), and transferred to the transfer device π of the transfer path 10. Next, the glass substrate G is transported to the cleaning processing area 40 to perform a cleaning process, and then the glass substrate G is transported to the first processing area 51 to perform a film forming process on the first layer. Thereafter, the glass substrate G is transported to the atmospheric processing area 70 and the exposure apparatus 2 for photolithographic processing. After that, the glass substrate G is transported to the first processing area 51 ', and the first layer is subjected to cooking treatment and polishing processing (step 501). Second, the glass substrate G is transported to the cleaning processing area 40 for cleaning processing. The film is transported to the second processing area 52 for the second layer. Thereafter, the glass gob substrate G is transported to the atmospheric processing collar 70 and the exposure apparatus 2 for photolithographic processing. Thereafter, the glass substrate g is transported to the second processing area 52, and the second layer is subjected to an etching treatment and a polishing treatment (step 502). Next, the glass substrate G is transported to the cleaning processing area 40 for cleaning processing, and then transported. In the third processing area 53, the third layer is subjected to a film forming process. After that, the glass substrate G was transported to the atmospheric processing area 70 and the exposed paper was covered by the Chinese National Standard Samples (CNS) M Washer (Jr. 10) < 297 Gong (Please read the precautions on the back before (Fill in this page) Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 22 A7 B7 Printed by the Shell ’s Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the Invention (2) Device 2 for photolithographic processing. Thereafter, The glass substrate G is transported to the third processing area 53 '. The third layer is subjected to an etching process and a polishing process (step 503). Next, the glass substrate G is transported to the cleaning processing area 40 and subjected to a cleaning process. In the fourth processing area 54, the fourth layer is subjected to film formation processing. Thereafter, the glass substrate G is transported to the atmospheric system processing area 70 and the exposure apparatus 2 for photolithography processing. Thereafter, the glass substrate 0 is transported to the fourth processing In the field 54 ', the fourth layer is subjected to an etching process and a polishing process (step 504). Next, the glass substrate G is transported to the cleaning process field 40, and after the cleaning process, the glass substrate G is transported to the fifth layer. In the processing area 55, the fifth layer is subjected to film formation processing. Thereafter, the glass substrate G is transported to the atmospheric processing area 70 and the exposure apparatus 2 for photolithography processing. Thereafter, the glass substrate 0 is transported to the fifth processing area 55. 'The fifth layer is subjected to an etching process and a polishing process (step 505). Thereafter, the glass substrate G is handed over to the carry-in and carry-out section 20 and carried into the card _ box. In the processing system 1 thus constituted, The vacuum processing area 50 in which the glass substrate G is subjected to vacuum processing and the atmospheric processing area 70 in which the glass substrate g is subjected to atmospheric processing are disposed in separate areas. Therefore, the size of the clean room can be suppressed. Since the vacuum processing area 50 needs to be arranged in the clean room, the size of the clean room can be suppressed. In the vacuum processing area 50, the glass substrate G is provided for each process and each layer along the transport path 10. Vacuum treatment ^-(Please read the precautions on the back before filling this page) Threading • ΊΙ. This paper size is applicable to China National Standard (CNS) A4 specifications (210X297mm) 23 A7 B7 V. The processing section of the invention description (21), which is divided and arranged for each layer, so when a problem occurs, it is easy to clarify that there is a problem in that processing section, and it is easy to visualize the problem. The analysis and analysis also facilitate the assembly of the transport devices on each floor and other common (identical) components. Secondly, as shown in Figure 3, the operation of arranging the load lock chambers into a multi-layer load chamber group 201 is shown in the sixth circle. First, open the gate valve on the conveying path 10 side of the uppermost load lock chamber 20a, and carry the glass substrate G from the conveying device of the conveying path 10 into the uppermost loadlock chamber 20a. Secondly, as shown in FIG. 7, Close the gate valve V on the side of the conveying path 10 of the upper load chamber 20 la and evacuate it; open the gate valve on the side of the second load lock chamber 201b from the top and open the glass substrate from the conveying device 11 of the conveying path 10 G is moved into the second load lock chamber 20ib. Next, as shown in FIG. 8, the gate valve V on the side of the transport chamber 202 of the uppermost load lock chamber 20 la is opened, and the glass substrate G is carried out to the side of the transport chamber 202 by the substrate transport member 207. Then, the second position from the top is closed. The gate valve on the side of the transport path 10 of the load lock chamber 201b is evacuated. Furthermore, the gate valve on the side of the transport path 10 of the third load barium chamber 201c from the top is opened, and the glass substrate G is carried into the third load lock chamber 201c from the transport device 10 of the transport path 10. Next, as shown in Fig. 9, the glass substrate G that has undergone the vacuum processing is transferred into the uppermost load lock chamber 201a by the substrate transfer structure 207 from the transfer chamber 202 side. Then, the gate valve on the transfer chamber 202 side of the second load lock chamber 20 lb from the top is opened, and the glass substrate G is transferred to the transfer chamber 202 side by the substrate transfer member. At this time, close the third load lock chamber 20 lc from the top. Use the Chinese national sample rate (〇 ^) from the specification (2 丨 0; < 297 male thin) (please read the note on the back first) Please fill in this page again) Printed by the Bureau of Intellectual Property Bureau of the Ministry of Economic Affairs, printed by the Cooper ’s Consumer Cooperatives, 24, and printed by the Economic and Wisdom Industry Bureau *: Cooperatives printed A7 _B7_. Take the time. Then, the gate valve V on the conveyance path 10 side of the lowermost load lock chamber 201d is opened, and the glass substrate G is carried into the fourth load lock chamber 201d from the conveyance device 11 of the conveyance path 10. Next, as shown in FIG. 10, after closing the gate valve V on the side of the conveyance chamber 202 of the uppermost load lock chamber 20a, the gate valve V on the side of the conveyance path 10 is opened, and the glass substrate G is carried out to the side of the conveyance path 10 by the conveyance device 11. . Then, the glass substrate G that has undergone the vacuum processing is transferred from the transfer chamber to the load lock chamber 201b from the top by the substrate transfer member 207. Further, the transfer chamber side gate valve V of the third load lock chamber 201c from the top is opened, and the glass substrate G is carried out to the transfer chamber 202 side by the substrate transfer member 207, and the transfer path 10 side of the lowermost load lock chamber 201d is closed. The gate valve V is evacuated. Hereinafter, such operations are performed in order. In the configuration of such a processing system 1, since the load lock chambers 201a to 20Id are arranged in multiple layers in the load barium chamber group 201, the area occupied by the load lock chamber can be narrowed while the conveyance path 10 side is connected to the vacuum system. The etching / polishing unit 56 smoothly transfers the glass substrate G smoothly. Next, another embodiment of the present invention will be described. FIG. 11 is a plan view of a processing system for forming a TFT array of this embodiment. In this processing system 1 ′, the conveyance path 10 ′ in the vacuum processing field 50 that performs vacuum processing and glass processing on the glass substrate G is a conveyance path ′ that constitutes a vacuum system, that is, a closed structure is formed in the conveyance path. Vacuum atmosphere. In addition, a load lock chamber group 12 serving as a transfer section is inserted between 10 conveyance paths of the vacuum system and 10 conveyance paths of the atmospheric system. Load lock chamber group 12 ', this paper size applies to China National Standard (CNS > A4 size (210X29.7mm) --------- ^ ------ 1T ---- -^ (Please read the notes on the back before filling this page) · 25 A 7 " --------- _______ B7__ V. Description of the invention (23 5 " Same structure as shown in Figure 3, And as shown in FIG. 12, it is arranged in upper and lower layers, for example, it is configured as a four-layer load lock chamber ^^ ~ ^^. Each load lock is 12 a to 12'd, and is connected to the vacuum system transportation path 1 〇 ， 间 ， and each load lock chamber 12'a ~ 12'd and the atmospheric system transport path 10, between, these gates are hermetically sealed and can be opened and closed gate valve V. In each load lock chamber 12'a ~ 12, d. When transferring the glass substrate G to the 10th side of the atmospheric transportation path, create an atmospheric atmosphere 'and transfer it to the 10' side of the vacuum transportation path. When the glass substrate G is transferred, a vacuum atmosphere is formed therein. Such a load lock chamber group 12 'is constituted, and the same operations as those shown in Figs. 6 to 10 (i) are performed. That is, for example, from the top load lock The chambers 12, a sequentially carry out the opening and closing of the gate valve V and the transfer of the glass substrate G. In this processing system Γ, the barium chambers 12'a to 12 'are loaded between the atmosphere-based transportation path and the vacuum-based transportation path 10'. d is made of a multilayer structure, so that the area occupied by the load lock chamber can be narrowed, and the glass substrate G can be smoothly and smoothly transferred between the atmospheric system transportation path 10 and the vacuum system transportation path 10 '"FIG. 13 It shows the evacuated piping of the load cell group shown in Figure 2 or 3. As shown in this circle, leakage valves 211 a to 21 Id are installed in the load chamber 201a to 20Id, respectively. At the same time, the evacuation is performed through the vacuum valves 212a. To 211d. Moreover, these valves are controlled by the control section of the overall control system to open and close as described below. When storing unprocessed substrates When the load lock chamber 20a on the first floor is opened, the leakage valve 211a of the load lock chamber 201a on the first floor is opened first, and then the paper size is printed using the Chinese National Standard (CNS) A4 specification (210X297 male *). (Please read the notes on the back before filling this page) Printed by the Intellectual Property Bureau of the Ministry of Online Economics, printed by the consumer co-operatives of the economy. 26 Economies of Intelligent Property • Production Bureau, Bei Gong Xiao #Cooperative printed by A 7 __B7 V. Description of the invention (24) Open the inlet gate valve to accommodate the substrate. At this time, 'this layer of The vacuum valve is closed in advance. Secondly, the leakage valve 21 a on the first floor is closed, and the closing valve on the inlet side is closed to open the vacuum on the first floor. Here, other vacuum valves are closed in advance, thereby eliminating other layers. When the unprocessed substrate is accommodated in the load lock chamber 20lb on the second floor, the leakage valve of the load lock chamber 201b on the second floor is opened; thereafter, the inlet side gate valve is opened. Contain the substrate. At this time, close the vacuum valves of other layers in advance. Next, 'close the leakage valve 21a of the second floor, close the inlet side and close the vacuum valve of the second floor, and evacuate. Next, the vacuum-side gate valve is opened for vacuum treatment. Furthermore, the vacuum valve is made as a three-way valve as shown in FIG. 14 to avoid the leakage valve. The present invention is not limited to the embodiments described above, and various modifications can be made within the scope of the technical idea. For example, 'the load lock chambers shown in FIG. 3 are formed into a multilayer structure as shown in FIG. 15, thereby improving the transfer efficiency. In addition, although the present invention has been described using a processing system for a TFT array glass substrate as an example, it goes without saying that it can also be applied to processing other substrates such as a color filter and a semiconductor wafer. system. Next, other embodiments of the present invention will be described. Fig. 16 is a partially enlarged plan view of the processing system 1 shown in Fig. 1. In the conveying path of the plurality of processing units 50la to 50Id arranged along the conveying path 10 (corresponding to the scrubber unit 41 and even the edge remover 77 in FIG. 1), the paper size is applicable to the Chinese National Standard (CNS) A4 standard. (210X297mm) --------- 1 ------ IT ------ 0 (Please read the notes on the back before filling in this page). -27-A7 _________B7_ Five The invention description (25) side is provided with a first photoelectric conversion unit 502 for data transmission and reception. The photoelectric conversion section 503 for transmitting and receiving data to and from the conveyance path device 11 during the transfer of the glass substrate G between the processing sections 50a to 50Id is provided at a position opposite to the first photoelectric conversion section 502. Thus, the processing section 2 ia ~ 50ld and the delivery device 11 exchange data. For example, as shown in FIG. 17 (a), when the transfer device η transfers the glass substrate G between it and the processing section 501a, the second photoelectric conversion section 503 provided in the transfer device 11 and the first photoelectric conversion section 503 provided in the processing section 50a A photoelectric conversion unit 50 faces each other, and data can be transmitted and received there. In the past, each of the processing units 501a to 501d needed to communicate data with each of the processing units 501a to 501d. In contrast, in this embodiment, a second unit common to each processing unit can be provided in the transport device 11 by its configuration. The photoelectric conversion unit 503 may be sufficient. This can reduce the number of parts. In particular, the processing system 1 shown in FIG. I is provided with a large number of processing units, so that the present invention can be applied to such a processing system 1 to reduce a considerable number of parts. Furthermore, the processing shown in FIG. 1 In System 1, since the TFT formation process is always performed, the glass substrate G that is judged to be defective by the inspection device may also flow into the subsequent processing route. Therefore, the inspection data of the inspection screen is set in the inspection. The first photoelectric conversion unit 502 of the device is delivered to the second photoelectric conversion unit 503 provided in the transport device 11. Thereafter, when the glass substrate G is transferred from the transporting device 11 to the next processing unit, the material is first delivered to the processing unit from the transporting device 11. At this time, it is rejected by the processing unit side and determined by the inspection device as not Good quality glass substrate G may be transferred. Thereby, the useless transfer of the glass substrate G is avoided, and the processing efficiency of the whole system is improved. This paper size applies to China National Standards (CNS) A4 (210X297 mm) ~ " -28-{Please read the precautions on the back before filling out this page) Order printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs_ V. Description of the Invention (26 Ministry of Economic Affairs-Intellectual Property, Production and Industrial Bureau, Consumer Cooperative Co-operatives Printed next, explaining other embodiments of the present invention. Section 19, is a plan view of the processing system of other embodiments of the present invention. According to Figure 1 The vacuum processing system 50 of the processing system shown is provided with a processing unit for performing vacuum processing on glass substrates ^ for each process and each layer along the transport path. In the vacuum system processing field 82 of the processing system 81 of the embodiment, the vacuum system processing for the glass substrate G is classified and arranged for each type of each processing. It is conceivable to sequentially distinguish from one end side of the transport path into The first processing area 83 'for performing film formation processing is the second processing area 84 for performing surname engraving processing and polishing processing, and a given place is arranged in each field In addition, an inspection area 86 equipped with an inspection device 85 is provided between the first processing area 83 and the second processing area 84. The first processing area 83 is disposed on one side of the transport path 100. The first to third layer film-forming units 87 to 89 are subjected to film formation processing, and the other side is provided with the fourth to fifth layer film-forming units 90 to 91 to be processed. Second processing area 84 An etching / polishing unit 92 ~ 94 'for polishing treatment is disposed on one side of the transport path 10, and the other side is disposed for the fourth to fifth layers. Etching and polishing units 95 to 96 for etching and etch polishing. In this way, according to the processing system 81 of this embodiment, not only can the size of the clean room be suppressed in the same manner as the above embodiment, but also it is used to implement its air processing unit. In the vacuum processing area 82, each type of processing is divided and arranged, so it is easy to apply force and common equipment. The paper size is in accordance with China Goods Standard (CNS) A4 (210X297 mm) ---- xiang ------ ΤΓ --- --- Φ (Please read the notes on the back before filling out this page) · 29 Α7 Β7 27 440894 " " — Μ-V. Description of the invention (Secondly, other embodiments of the invention will be described. Figure 20 is a An oblique view showing the configuration of the processing system of this embodiment. {Please note the precautions on the back of Μ 锖 before filling out this page.) The processing system 101 shown in the figure is a processing device that will be used to form the entire layer of substrate G. Specifically, connected are: a loading / unloading device (C / S) 102, a cleaning device (WS) 103, a vacuum processing device 104 'for the first layer, and a vacuum processing device 1 for the second layer. 5. Vacuum processing device 106 for the third layer, vacuum processing device 107 for the fourth layer, vacuum processing device 108 for the fifth layer, scrubber cleaning device 109, and resist coating device 110. The development processing device is located in the center of each device and between adjacent devices, and is provided with a conveying path 112 for conveying the glass substrate G and a conveying device (not shown). Control here, move in and out 102 is a device that carries the glass substrate g into the system and simultaneously carries it out of the system. The cleaning device 103 includes scrubber units 113 on both sides of the transport path 112. For the vacuum processing device 104 of the first layer, there are an etching and polishing unit 114 and a film forming unit 115 on both sides of the conveying path 112. For the vacuum processing apparatus 105 of the second layer, an etching and polishing unit U6 and a film forming unit 117 are provided on both sides of the transport path 112. For the vacuum processing device 10 of the third layer, a cooking / grinding unit 118 and a film forming unit 119 are provided on both sides of the conveying path 112. The fourth-stage vacuum processing apparatus 107 is provided with an etching and polishing unit 120 and a film forming unit 121 on both sides of the transport path 112. The fifth-stage vacuum processing unit 108 is provided with an etching, polishing unit 122 and a film forming unit 123 on both sides of the transport path 112. The scrubber washing device 109 is provided with a scrubber washing unit 124 on one side of the transport path 112. The resist coating device 11 is printed in the 30 economic # · Wisdom W-Printed by the Industrial and Commercial Cooperatives Φ.-A7 ------------ B7 V. Description of the invention (28 A resist coating unit 125 and an edge stripper 126 are provided on one side of the conveying path 112. The development processing device 111 is provided with a resist coating unit 125 and an edge stripper 126 on one side of the transport path 12. The development processing unit U1 is provided with a development processing unit 127 on one side of the transport path 112. The exposure device (not shown) is adjacent to the display device 111 and connected to it. In the above embodiment, a conveyer 10 for maintaining the washing and degree in the conveying path is installed above the conveying path 10 of the processing system shown in FIGS. 1, 19 and 20 from above the processing system. The outside air may be taken in so as to form a downflow in the transport path 10. At this time, a partition wall is provided around the transportation path 10 to prevent the atmosphere outside the processing system from entering the transportation path 10. Therefore, even if the processing system is installed outside the purification room, the cleanliness in the transportation path can be maintained, and the system itself constitutes a purification room, thereby achieving localized purification room. In this way, according to the present invention, since the processing units for forming the entire layers of the glass substrate G are visualized, it has been necessary to integrate the processing capabilities of the individual processing units and also the integration of control; The present invention ^ seeks such integration from the beginning, thereby reducing the burden on the user. Also, the present invention is not limited to the above embodiments, and various modifications can be made within the scope of its technical ideas. For example, the present invention has been described using a TFT array glass substrate processing system as an example, but needless to say Applicable to systems for processing color filters *, and other substrates such as semiconductor wafers. Brief Description of the Drawings Fig. 1 is a plan view of a processing system according to an embodiment of the present invention. Figure 2 is a horizontal cross-sectional view, which is shown in Figure 1. The etched and ground paper shown in Figure 1 is applicable to the countries with difficulty (CNS) (21GX297 mm) " ~ -31-Gutter (please read first Note on the back, please fill out this page again) Α7 ___ £ Z_ One ^-V. Description of the Invention (29) An Example of Grinding Unit "Figure 3 is the front face of the load lock room group shown in Figure 2 Illustration. Fig. 4 is a perspective view showing the structure of the transport device. FIG. 5 shows the processing flow of the processing system of the present embodiment. The sixth circle is a front view 'showing the operation of the load lock chamber group of this embodiment. The seventh circle is a front circle, which shows the actions of the load lock chamber group of this embodiment. Fig. 8 is a front view 'showing the operation of the load lock chamber group of this embodiment. Fig. 9 is a front view showing the operation of the load lock chamber group of this embodiment. Fig. 10 is a front view showing the operation of the load lock chamber group of this embodiment. Fig. 11 is a plan view of a processing system according to another embodiment of the present invention. Fig. 12 is a front circle, which shows the structure of the load lock chamber shown in Fig. 11. Printed on the 13th circle by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, it is the piping of the evacuation system of the load lock room group shown on the second and third laps. FIG. 14 is a modification of the vacuum valve shown in FIG. 13. On the 15th circle, a modified example of the barium-loaded chamber shown in FIG. 3 is shown. Fig. 16 is a partially enlarged plan view of a processing system according to another embodiment of the present invention. In this paper, the two countries' CNS A4 specifications (210X297 mm) 32 A7 B7 V. Description of the invention (30) Figure 17 shows the operation of the processing system shown in Figure 16. Fig. 18 shows the operation of the processing system shown in Fig. 16. Fig. 19 is a plan view of a processing system according to another embodiment of the present invention. Fig. 20 is a squint view showing the structure of a processing system according to another embodiment of the present invention. --------- 1 ------ IT ------ ^ (Please read the precautions on the back before filling in this page) . This paper uses China National Standard (CNS) A4 size (210X297 mm) 33 —i * Ο, _B7_ V. Description of the invention (31) Component number comparison 1… Processing system Γ… Processing system 2… Exposure device- 10 ... Transportation route 10 '... Transportation route 11 ... Transportation device 12 ... Relay section 12' ... Load lock chamber group 12'a ~ 12'd ... Load lock chamber 13 ... Device body 14 ... Base members 15a, 15b … Substrate supporting member 16… connecting portion 17 b… guide rail 20… carrying in / out portion 3 0… interface portion 40… cleaning processing area 41… scrubber unit 50, 50 ′… vacuum processing area 51… first processing area 52… The second processing area 53 ... The third processing area This paper uses the Chinese National Standard (CNS) A4 size (210X297 mm) -34-Printed by the Consumers' Cooperative of the Economic and Intellectual Property Bureau. A7 B7 V. Description of the invention ( 32) 54 ". Fourth processing area 55 .... Fifth processing area 56 ... Etching and polishing unit 57, 60, 62 ... Membrane unit 58 ... inspection unit 61,63 ... etching and polishing unit 62a, 67 ... inspection unit_64,65,66 ... film formation unit 70 ... atmospheric processing area 71,72 ... development processing unit 73,74 ... Cleaning processing unit 75 ... resist coating unit 76 ... drying processing unit 77 ... edge stripper 81 ... processing system 82 ... vacuum processing area 83 ... first processing area 84 ... second processing area 85 ... inspection Device 86 ... Inspection area 87 ~ 89 ... Film-forming units 90-91 ... Film-forming units 92-96 ... Etching and grinding unit 101 ... Processing system This paper size is applicable to China National Standard (CNS) A4 (210X297 mm)- -------- ^ ------ IT ------ ^ (Please read the notes on the back before filling out this page) · 35 440894 A7 Printed by the Shellfish Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs System B7 V. Description of the invention (33) 102 ... In and out device 103 ... Cleaning device 104 ~ 108 ... Vacuum processing device 109 ... Washer cleaning device 110 ... Resist coating device ... 111 ... Development Processing device 112 ... transportation path 113 ... washer unit 114, 116, 118, 120 ... etching / polishing unit 1 15,119 ... Film forming unit 201 ... Load lock chambers 201a to 201d. &Quot; Load lock chambers 202, 302 ... · Transfer chamber 203 ... Etching process chamber 204 ... Polishing process chamber 207 ... Substrate transport member 208 ... Base 209 ... Intermediate arm 210 ... Substrate support arm 211a ~ 21 Id ... Leak valve -212 ... Rack 212a ~ 211d ... Vacuum valve 213 ... Positioner 301 ... Load lock chamber group (Please read the precautions on the back before filling this page)

,1T 線 本紙浪尺度適用申國困家標準（CNS ) Α4規格（210Χ297公釐） 36 A 7 B7 五、發明説明（34) 303，304，305…成膜室 501a〜501d…處理部 502…第一光電變換部 503…第二光電變換部 G…玻璃基板 · (請先閲讀背面之注意事項再填寫本f ) 經濟.豕智慧休產局員工消費合作社印製 本紙浪尺度適用中國國家標準（CNS ) A4C格（2丨0X297公釐） 37, 1T line paper wave standard applies to the National Standards for China (CNS) A4 specification (210 × 297 mm) 36 A 7 B7 V. Description of the invention (34) 303, 304, 305 ... Film forming chambers 501a ~ 501d ... Processing section 502 ... The first photoelectric conversion unit 503 ... the second photoelectric conversion unit G ... glass substrate · (Please read the precautions on the back before filling in this f) Economy. CNS) A4C grid (2 丨 0X297 mm) 37

Claims (1)

第881 19757號專利申請案申請專利範圍修正本 煩請n.·'Γ:?f·^^ f 日炉 #1£..1^-^急€..:.''.“‘.';1.'^、篆难予|/»-' ; U__ 經濟部智慧財產局員工消费合作社印製 修正日期：90年3月 I 一種處理系統，包含有： 第一領域，係對於被處理體施行真空系之處理； 第二領域，係對於被處理體施行大氣系之處理；及 交接部，係配置在前述第一領域與前述第二領域間 ’且備有可獨立地改換大氣氛圍氣與真空氛圍氣之多數 個交接室，藉此透過該等交接室在前述第一領域與前述 第二領域間進行被處理體之交接β 2. —種處理系統，包含有： 大氣系之運送路； 處理部，係對於被處理施行真空系之處理； 交接部，係配置在前送運送路與前述第一處理部之 間，且備有可獨立地改換大氣氛圍氣與真空氛圍氣之多 數個交接室，以便透過該等交接室在前述運送路與前述 處理部間進行被處理體之交接；及 運送裝置，係可移動地配置在前述運送路上，以更 對於前述交接部之各室進行被處理體之交接。 3.如申請專利範圍第2項所述之處理系統，包含有多數個 處理室，係由前述處理部，對於前述被處理體進行真空 系之處理；及 交接裝置，係配置在前述交接部與前述各處理室間 ’以便在前述交接部與前述各處理室間進行被處理體之 交接。 本紙張尺度適用_國國家楳準（CNS)A4規格（210 X 297公釐） 38 丨丨！ ---丨丨' --------訂--------- {請先閲讀背面之注意事項再填寫本頁) A8B8C8D8 經1部智«財產局員工消費合作社印製 申請專利範圍 (如申請專利範圍第3項所述之處理系統，其係由前述處 理室，對於前述被處理體分別進行不同之真空系處理。 5. 一種處理系統，包含有： 真空系之第一運送路； 大氣系之第二運送路； 交接部，係配置在前述第一運送路與前述第二運送 路間，且備有可獨立地改變大氣氛圍氣與真空氛圍氣之 多數個交接室，以便透過前述交接室在前述第一運送路 與前述第二運送路進行被處理體之交接； 第一運送裝置，係配置成可在第一運送路上移動， 以便在前述交接部與各室之間進行被處理艘之交接；及 第二運送裝置，係配置成可在前述第二運送路上移 動，以便前述交接部與各室之間進行被處理體之交接。 6. 如申請專利範圍第1至5項中任一項所述之處理系統，其 中 前述交接室係排列成多層。 7· —種處理系統，包含有·· 真空系之第一運送路； 大氣系之第二運送路； 交接部，其係配置在前述第一運送路與前述第二運 送路間，且可改換大氣氛圍氣與真空氛圍氣，以便在前 述第一運送路與第二運送路間進行被處理體之交接； 第一處理部，係沿著前述第一運送路而配置，以更 對於前述被處理體進行真空系之處理； 本紙張尺度適用中國國家標準（CNS)A4规格(210 * 297公* > 39 — — — — — — — — — — — —— ·1111111 ·1!11111 (請先閱讀背面之注意事項再填寫本頁) 六 經濟部智慧財產局員工消費合作社印製 ， B8 C8 —____Π>8 ' ----------- 申請專利範圍 - 第二處理部’係沿著前述第二運送路而配置，以便 對前述被處理體進行大氣系之處理· 第-運送裝置’係可移動地配置在前述第—運送路 上，以便在前述交接部與前述第一處理部間進行被處理 體之交接；及 第二運送裝置，係可移動地配置在前述第二運送路 上，以更在前述交接部與前述第二處理部間進行處理體 之交接。 8·如申請專利範圍第7項所述之處理系統，其中前述交接 部，可獨立地改換大氣氛圍氣與真空氛圍氣。 9. 如申請專利範圍第8項所述之處理系統，其中前述交接 室，係排列成多層。 10. —種處理系統，包含有： 運送路； 多數個第一處理部，係配置在沿著前述運送路之第 一領域，以便對於被處理«施行真空系之處理； 多數個第二處理部，係配置在沿著前述運送路之第 二領域，以便對於被處理«施行大氣系之處理；及 運送裝置，係可移動地配置在前述運送路上，以便 在舆前述第一及第二處理部間進行被處理體之交接。 11. 如申請專利範圍第10項所述之處理系統，其中前述第一 處理部，係按真空系之每各處理及每一層來設置，更且 在第一領域内接每各層區分配置。 12. —種處理系統，其係在被處理逋上每一層施行多數種類 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) •V裝---— II--訂---------^ 40No. 881 19757 Patent Application Amendment of the Patent Scope Please n. · 'Γ:? F · ^^ f 日 炉 # 1 £ ..1 ^-^ 急 € .. :: `` .. ;; 1. '^ 、 篆 难 予 | / »-'; U__ Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy Date of revision: March 1990 I A processing system, including: The first field is implemented on the object Vacuum processing; the second area is the treatment of the atmosphere with the object; and the transfer department is located between the first area and the second area, and it can be changed the atmosphere and vacuum independently. Atmospheric transfer rooms, through which transfer of objects to be processed between the aforementioned first area and the aforementioned second area is performed through these transfer rooms. Β 2. A processing system including: an atmospheric transportation path; processing The transfer unit is a vacuum system for the processed unit. The transfer unit is located between the forward conveyance path and the first processing unit, and has a number of transfer rooms that can independently change the atmosphere and vacuum atmosphere. In order to pass the transfer room in the aforementioned transportation path and the aforementioned processing Transfer of the object to be processed between them; and a conveying device, which is movably arranged on the aforementioned conveying path, so as to transfer the object to be processed to each room of the aforementioned transfer department. 3. As described in item 2 of the scope of patent application The processing system includes a plurality of processing chambers, and the processing unit performs vacuum processing on the object to be processed; and a transfer device is disposed between the transfer unit and the processing chambers so that the transfer unit and the Handling of objects to be processed between the aforementioned processing chambers. This paper size is applicable to _National Standards (CNS) A4 (210 X 297 mm) 38 丨 丨! --- 丨 丨 '------- -Order --------- {Please read the notes on the back before filling this page) A8B8C8D8 The scope of patent application (printed in the scope of patent application No. 3) was printed by the Ministry of Intellectual Property Cooperative Consumer Cooperative The processing system comprises a vacuum processing system for the object to be processed by the aforementioned processing chamber. 5. A processing system includes: a first transportation path of the vacuum system; a second transportation path of the atmospheric system; unit, It is arranged between the first transport path and the second transport path, and has a plurality of transfer rooms that can independently change the atmospheric atmosphere and the vacuum atmosphere, so that the first transfer path and the second transfer path can be passed through the transfer room. The conveying path transfers the object to be processed; the first conveying device is configured to be movable on the first conveying path so as to transfer the processed ship between the aforementioned transfer section and each room; and the second conveying device is configured It is possible to move on the aforementioned second transportation path so that the object to be processed can be transferred between the aforementioned transfer section and each room. 6. The processing system according to any one of claims 1 to 5, wherein the aforementioned transfer The rooms are arranged in multiple layers. 7. A processing system including a vacuum first transport path, an atmospheric second transport path, and a transfer unit, which is arranged between the first transport path and the second transport path and can be changed Atmospheric atmosphere and vacuum atmosphere so as to transfer objects to be processed between the first transport path and the second transport path; the first processing unit is arranged along the first transport path so as to be more suitable for the processed The paper is processed in a vacuum system; this paper size is in accordance with China National Standard (CNS) A4 specifications (210 * 297 male * &39; 39 — — — — — — — — — — — — 1111111 · 1! 11111 (please first Read the notes on the back and fill in this page) 6. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, B8 C8 —____ Π > 8 '----------- Scope of Patent Application-Second Processing Department It is arranged along the second conveying path so as to perform atmospheric processing on the object to be processed. The first conveying device is movably disposed on the first conveying path so that the transfer section and the first processing section Advance The transfer of the object to be processed; and the second conveying device is movably arranged on the second conveying path so as to further transfer the processed object between the aforementioned transfer section and the aforementioned second processing section. The processing system according to item 7, wherein the transfer unit can independently change the atmosphere and vacuum atmosphere. 9. The processing system according to item 8 of the scope of patent application, wherein the transfer room is arranged in multiple layers 10. A processing system including: a conveying path; a plurality of first processing sections arranged in a first area along the aforementioned conveying path so as to perform a vacuum processing on the processed object; a plurality of second processing Department, which is arranged in the second area along the aforementioned transportation path, so as to carry out the processing of the atmospheric system for the processing; and the transportation device is movably arranged on the aforementioned transportation path so as to perform the first and second processing in the foregoing. Handover of the object to be processed between the departments. 11. The processing system as described in item 10 of the scope of patent application, wherein the first processing department is in accordance with the vacuum system. And each layer is set, and each layer is configured separately in the first field. 12. —A processing system, which implements most types on each layer of the processed paper. The paper size is applicable to the Chinese National Standard (CNS) A4 specification. (210 X 297 mm) (Please read the precautions on the back before filling out this page) • V Pack ---— II--Order --------- ^ 40 申請專利範圍 之處理以便形碑多數層之處理系統者，也含有： 運送路，係設置成大致直線狀； 搬入搬出_，係配置在前述運送路之一端，以便進 行被處理體之4入搬出； 洗淨處理部，係在前述搬入搬出之附近沿著前述運 送路而配置，以便對於被處理體施行成膜前洗淨處理； 多數個第一處理部，係配置在沿著前述運送路之第 一領域俾與前f洗淨處理部鄰接，以便對於被處理體至 少施行包括成+處理、蝕刻處理、抗蝕劑剝離之真空系 處理，且，按真空系之每各處理及每一層來設置，更且 在第一領域内桉每各層區分配置； 多數個第J-處理部，係配置在前述運送路之第二領 領域鄰接，以便對於被處理體至少施行 處理、顯像處理之大氣系處理； 域俾與前述第 包括抗蝕劑塗 露光處理部，係在前述第二領域附近配置於前述運 送路之另一端 交接部，係 部間，且，具有 -------裝--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 以便對對於被處理體施行露光處理； 配置在前述第一處理部與前述第二處理 可獨立地改換大氣氛圍氣與真空氛圍氣 之多數個交接芤，以便透過前述交接室在前述第一處理 部與前述第+軋理部間進行被處理體之交接；及 運送裝置，其係可移動地配置在前述運送路上，以 便在前述第一 4理部與前述第二處理部間進行被處理 體之交接。 13·如申請專利範第11或12項所述之處理系統，其中，按 f紙張尺度適用中國國家標準（CNS)A4 A格（210 X 297公爱） -41 A8 B8 C8 D8 六、申請專利範圍 前述每各層區分配置之第一處理部，係進一步沿著前述 運送路依層之順序而配置。 14. 如申請專利範圍第丨丨或12項之任一項所述之處理系統 ’其中在按前述每各層區分配置之第一處理部之附近， 按每各層配置必需要的檢查裝置。 15. 如申請專利範圍第u項所述之處理系統，其中前述第一 處理部，係在第一領域内接各處理之每一種類區分配置 〇 16. 如申請專利範園第11項所述之處理系統，其中前述第二 處理部，係在第二領域内按各處理之每一種類區分配置 〇 17. 如申請專利範圍第15或16項所述之處理系統，其中，前 述檢査裝置係配置在前述第一領域内。 18. —種處理系統，包含有： 第一運送路； 第二運送路，係配置成與前述第一運送路大致正交 9 多數個露光裝置，係沿著第二運送路而配置，以便 ‘對於被處理«施行露光處理； 第一運送裝置，係可移動地配置在前述第一運送路 上’以便在舆前述第二運送路間進行被處理體之交接； 及 第二運送裝置’係可移動地配置在前述第二運送路 上’以便在前述第一運送路與前述露光裝置間進行交接 本紙張尺度適用中國國家標準（CNS)A4規格<210 X 297公釐〉 (請先閱讀背面之注意事項再填寫本頁) 訂---------_y 經濟部智慧財產局員工消費合作社印製 42 Α8 Β8 C8Those who have applied for a patent scope of processing in order to form a multi-layer processing system for monuments also include: a conveying path, which is set to be approximately linear; The cleaning processing unit is arranged along the transportation path in the vicinity of the loading and unloading, so as to perform a washing process on the object before being formed into a film. Most of the first processing units are arranged along the transportation path. The first area 邻接 is adjacent to the front f cleaning treatment unit, so that at least a vacuum system process including a formation process, an etching process, and a resist peeling process is performed on the object to be processed. It is set up, and each layer is arranged separately in the first field; most of the J-processing sections are arranged adjacent to the second field of the transportation path, so that at least the processing and imaging processing atmosphere is performed on the object to be processed. The processing unit; the domain and the aforementioned first resist exposure light processing unit are arranged at the other end of the transportation path near the second area, And, with ------- installation -------- order --------- line (please read the precautions on the back before filling this page) employee of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the consumer cooperative so as to perform exposure processing on the object to be processed; disposed in the first processing section and the second processing, the plurality of transfer ridges of the atmospheric atmosphere and the vacuum atmosphere can be changed independently, so as to pass through the transfer room in the foregoing The first processing unit transfers the object to be processed between the first + rolling unit; and a transport device which is movably arranged on the transport path so as to be performed between the first fourth processing unit and the second processing unit. Handover of the object. 13. The processing system described in item 11 or 12 of the patent application model, in which the Chinese National Standard (CNS) A4 A grid (210 X 297 public love) is applied according to the f paper standard -41 A8 B8 C8 D8 The first processing section in which each of the aforementioned layers is separately arranged is further arranged in the order of layers along the aforementioned transport path. 14. The processing system according to any one of the scope of the patent application 丨 丨 or 12 ′, in which the necessary inspection device is arranged for each layer near the first processing section which is separately arranged for each layer. 15. The processing system described in item u of the scope of patent application, wherein the aforementioned first processing section is configured for each type of each processing in the first field. 16. As described in item 11 of the patent application park The processing system, in which the aforementioned second processing section is separately arranged for each type of each processing in the second field. 17. The processing system described in item 15 or 16 of the scope of patent application, wherein the aforementioned inspection device is Arranged in the aforementioned first area. 18. A processing system comprising: a first conveying path; a second conveying path configured to be approximately orthogonal to the first conveying path; a plurality of exposure devices are arranged along the second conveying path so that For the processed «light exposure processing is performed; the first conveying device is movably arranged on the aforementioned first conveying path 'so as to transfer the object between the aforementioned second conveying paths; and the second conveying apparatus is movable It is arranged on the second transport path 'to transfer between the first transport path and the exposure device. The paper size applies the Chinese National Standard (CNS) A4 specification < 210 X 297 mm> (Please read the note on the back first) (Please fill in this page again for matters) Order ---------_ y Printed by Employee Consumption Cooperative of Intellectual Property Bureau, Ministry of Economic Affairs 42 Α8 Β8 C8 /、、申睛專利範圍 iy_} . _ 經濟部智慧財產局員工消費合作社ep·製 ο 19. 如申請專利範圍第18項所述之處理系統其更包含一處 理部’其係沿著前述第一運送路而配置，以便對於被處 理體至少施行抗蝕劑塗佈處理、顯像處理者。 20. 如申請專利範圍第18項所述之處理系統更包含： 第一處理部，係配置在沿著前述第一運送路之第一 領域，以便對於被處理體施行真空系之處理；及 第二處理部，係配置在沿著前述第一運送路之第二 領域’以便對於被處理體至少施行抗蝕劑塗佈處理、顯 像處理。 21. 如申請專利範圍第18乃至20項之任一項所述之處理系， 統’其中前述第二運送裝置，係多數配置在前述第二運 送路上。 22. 如申請專利範圍第7、9或15項所述之處理系統，其更包 含有： 第一光電變換部，係配置在前述處理部之運送裝置 側，以便進行資料之收發；及 第二光電變換部，係配置在前述運送裝置俾在前述 運送裝置與前述處理部間進行被處理體交接時與前述 第一光電變換部相向，以便在與前述第一變換部間進行 資料之收發。 23. 如申請專利範圍第10、12或18項所述之處理系統，其中 備有檢査部，其係沿著前述運送路而配置，以便進 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐〉 43 — — — — — — — — — — — — — ^--------訂·！-----•線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消费合作社印製 44089 4 os -----——__ 六、申請專利範圍 行被處理體之檢查； 月j述運送裝置，係可移動地配置在前述運送路上， 以便在與前述處理部及檢查部之間進行被處理體之交 接。 24. 如申凊專利範圍第1()、12或18項所述之處理系統，其中 前述處理系統’係在被處理體上按每一層施行多數種類 之處理以形成多數層者，且，將用來形成被處理體之全 層的處理部加以一體化者。 25. 如申請專利範圍第24項所述之處理系統，其中在前述處 理部備有擔任一個處理之專用處理部、及擔任二個以 上之處理的兼用處理部。 26. 如申請專利範圍第25項所述之處理系統，其係區分為： 對於被處理體施行真空系處理之處理部；及施行大氣系 處理之處理部。 本紙張尺度適用中國國家標準（CNS)A4規格（210 * 297公» ) 44 (請先閱讀背面之注意事項再填寫本頁) -· I I I I I I I ^ « — — — — — — I— I W>rllllll1llf — — — —------(./ 、、 The patent scope of Shenyan iy_}. _ Employee Cooperative Cooperative ep · system of the Intellectual Property Bureau of the Ministry of Economic Affairs 19. The processing system described in item 18 of the scope of patent application further includes a processing department ' It is arranged along a transport path so that at least a resist coating process and a development process are performed on the object to be processed. 20. The processing system described in item 18 of the scope of patent application further comprises: a first processing section disposed in a first area along the aforementioned first transport path so as to perform vacuum processing on the object to be processed; and The two processing units are arranged in a second area along the first conveyance path so as to perform at least a resist coating process and a development process on the object to be processed. 21. The processing system according to any one of claims 18 to 20 in the scope of the patent application, wherein the above-mentioned second conveying device is mostly arranged on the aforementioned second conveying path. 22. The processing system according to item 7, 9, or 15 of the scope of the patent application, further comprising: a first photoelectric conversion section, which is arranged on the side of the transport device of the aforementioned processing section, so as to transmit and receive data; and The photoelectric conversion unit is arranged in the transportation device, and when the object to be processed is transferred between the transportation device and the processing unit, the photoelectric conversion unit faces the first photoelectric conversion unit so as to transmit and receive data to and from the first conversion unit. 23. The processing system according to item 10, 12, or 18 of the scope of the patent application, which includes an inspection section, which is arranged along the aforementioned transportation path so that the paper size applies the Chinese National Standard (CNS) A4 specification ( 210 X 297 mm> 43 — — — — — — — — — — — — ^ -------- Order ·! ----- • Line (Please read the notes on the back before filling in this Page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 44089 4 os ---------__ VI. Inspection of the subject to be applied for in the scope of patent application; The transportation device described in the month is movably arranged on the aforementioned transportation road In order to transfer the object to be processed with the aforementioned processing department and inspection department. 24. The processing system described in the scope of application of patent No. 1 (), 12 or 18, wherein the aforementioned processing system is being processed Those who perform most types of processing on each layer to form a plurality of layers, and who integrate the entire processing unit that forms the object to be processed. 25. The processing system described in item 24 of the scope of patent application , Of which there is a Dedicated processing unit and concurrent processing unit serving as two or more processes. 26. The processing system described in item 25 of the scope of patent application is divided into: a processing unit that performs a vacuum system on the object to be processed; and Atmospheric processing department. This paper size is in accordance with Chinese National Standard (CNS) A4 specifications (210 * 297) »44 (Please read the precautions on the back before filling out this page)-· IIIIIII ^« — — — — — — I— I W > rllllll1llf — — — — —------ (.
TW088119757A 1998-11-12 1999-11-11 Processing system TW440894B (en)

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JP33646498A JP3420712B2 (en) 1998-11-12 1998-11-12 Processing system
JP34664398A JP2000156395A (en) 1998-11-20 1998-11-20 Treatment system

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JP3686866B2 (en) * 2001-12-18 2005-08-24 株式会社日立製作所 Semiconductor manufacturing apparatus and manufacturing method
US7207766B2 (en) * 2003-10-20 2007-04-24 Applied Materials, Inc. Load lock chamber for large area substrate processing system
US7665951B2 (en) * 2006-06-02 2010-02-23 Applied Materials, Inc. Multiple slot load lock chamber and method of operation
US8070408B2 (en) 2008-08-27 2011-12-06 Applied Materials, Inc. Load lock chamber for large area substrate processing system

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JP3340181B2 (en) * 1993-04-20 2002-11-05 株式会社東芝 Semiconductor manufacturing method and system
JPH07172578A (en) * 1993-12-15 1995-07-11 Ebara Corp Tunnel carrying device
JPH09104983A (en) * 1995-08-05 1997-04-22 Kokusai Electric Co Ltd Substrate treating device
JPH10209241A (en) * 1997-01-16 1998-08-07 Dainippon Screen Mfg Co Ltd Substrate transfer device and substrate treatment device provided with it

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