JPH10233420A5 - - Google Patents

Info

Publication number
JPH10233420A5
JPH10233420A5 JP1996337071A JP33707196A JPH10233420A5 JP H10233420 A5 JPH10233420 A5 JP H10233420A5 JP 1996337071 A JP1996337071 A JP 1996337071A JP 33707196 A JP33707196 A JP 33707196A JP H10233420 A5 JPH10233420 A5 JP H10233420A5
Authority
JP
Japan
Prior art keywords
processed
substrate
monitor
foreign matter
film thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1996337071A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10233420A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP33707196A priority Critical patent/JPH10233420A/ja
Priority claimed from JP33707196A external-priority patent/JPH10233420A/ja
Publication of JPH10233420A publication Critical patent/JPH10233420A/ja
Publication of JPH10233420A5 publication Critical patent/JPH10233420A5/ja
Pending legal-status Critical Current

Links

JP33707196A 1996-12-17 1996-12-17 半導体製造装置 Pending JPH10233420A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33707196A JPH10233420A (ja) 1996-12-17 1996-12-17 半導体製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33707196A JPH10233420A (ja) 1996-12-17 1996-12-17 半導体製造装置

Publications (2)

Publication Number Publication Date
JPH10233420A JPH10233420A (ja) 1998-09-02
JPH10233420A5 true JPH10233420A5 (enExample) 2004-10-07

Family

ID=18305162

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33707196A Pending JPH10233420A (ja) 1996-12-17 1996-12-17 半導体製造装置

Country Status (1)

Country Link
JP (1) JPH10233420A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100364090B1 (ko) * 2000-07-10 2002-12-11 주식회사 아펙스 유전체 박막형성장치
JP4514942B2 (ja) * 2000-12-07 2010-07-28 株式会社アルバック 成膜装置
JP4584531B2 (ja) * 2002-08-02 2010-11-24 株式会社日立製作所 異物モニタリングシステム
JP5440414B2 (ja) * 2010-06-22 2014-03-12 株式会社島津製作所 プラズマｃｖｄ成膜装置
CN118362078B (zh) * 2024-06-19 2024-08-16 嘉祥洪润电碳有限公司 一种用于石墨表面碳化硅涂层测厚工装

Similar Documents

Publication Publication Date Title
JPH10107121A5 (enExample)
EP1094501A3 (en) Substrate processing apparatus and substrate processing method
JP2001345294A5 (enExample)
MY131229A (en) Wafer planarization apparatus
EP0537364A4 (en) Apparatus and method for manufacturing semiconductor device
JP2003282669A5 (enExample)
SG63810A1 (en) Wafer processing apparatus wafer processing method and semiconductor substrate fabrication method
SG52824A1 (en) Vacuum processing apparatus and semiconductor manufacturing line using the same
JP2022107898A5 (enExample)
JP2003124284A5 (enExample)
EP1297900A3 (en) Coating device and coating method
SG73498A1 (en) Wafer processing apparatus and method wafer convey robot semiconductor substrate fabrication method and semiconductor fabrication apparatus
JPH10233420A5 (enExample)
JP2001210693A5 (enExample)
EP0948031A3 (en) Semiconductor fabrication line with contamination preventing function
TW367530B (en) Multiple substrate processing apparatus for enhanced throughput
JP2000323384A5 (enExample)
JPS5375683A (en) Wafer transporting apparatus
JP2000150619A5 (enExample)
JPS5245874A (en) Transfer device of semiconductor substrate holding device
JPH0395951A (ja) 半導体製造装置クリーニング用基体
FI933128A0 (fi) Menetelmä ja laite kontaktinystyjen muodostamiseksi kemiallisesti puolijohdekiekoille
JPH03142929A (ja) 洗浄装置
JPS58200551A (ja) ウエハ搬送装置
JPS5381069A (en) Production of susceptor in cvd device