JP2000323384A5 - - Google Patents

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Publication number
JP2000323384A5
JP2000323384A5 JP1999128338A JP12833899A JP2000323384A5 JP 2000323384 A5 JP2000323384 A5 JP 2000323384A5 JP 1999128338 A JP1999128338 A JP 1999128338A JP 12833899 A JP12833899 A JP 12833899A JP 2000323384 A5 JP2000323384 A5 JP 2000323384A5
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JP
Japan
Prior art keywords
kyariahe
unloading
substrate
specific
developing machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1999128338A
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English (en)
Japanese (ja)
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JP4365934B2 (ja
JP2000323384A (ja
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Publication date
Application filed filed Critical
Priority to JP12833899A priority Critical patent/JP4365934B2/ja
Priority claimed from JP12833899A external-priority patent/JP4365934B2/ja
Priority to US09/563,322 priority patent/US6445441B1/en
Publication of JP2000323384A publication Critical patent/JP2000323384A/ja
Publication of JP2000323384A5 publication Critical patent/JP2000323384A5/ja
Application granted granted Critical
Publication of JP4365934B2 publication Critical patent/JP4365934B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP12833899A 1999-05-10 1999-05-10 露光装置、半導体製造装置およびデバイス製造方法 Expired - Fee Related JP4365934B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP12833899A JP4365934B2 (ja) 1999-05-10 1999-05-10 露光装置、半導体製造装置およびデバイス製造方法
US09/563,322 US6445441B1 (en) 1999-05-10 2000-05-03 Exposure apparatus, semiconductor manufacturing apparatus, and semiconductor manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12833899A JP4365934B2 (ja) 1999-05-10 1999-05-10 露光装置、半導体製造装置およびデバイス製造方法

Publications (3)

Publication Number Publication Date
JP2000323384A JP2000323384A (ja) 2000-11-24
JP2000323384A5 true JP2000323384A5 (enExample) 2006-06-22
JP4365934B2 JP4365934B2 (ja) 2009-11-18

Family

ID=14982337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12833899A Expired - Fee Related JP4365934B2 (ja) 1999-05-10 1999-05-10 露光装置、半導体製造装置およびデバイス製造方法

Country Status (2)

Country Link
US (1) US6445441B1 (enExample)
JP (1) JP4365934B2 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030029926A (ko) * 2000-09-06 2003-04-16 가부시키가이샤 니콘 노광장치 및 디바이스 제조방법
JP2002158170A (ja) * 2000-09-08 2002-05-31 Nikon Corp 露光装置及びデバイス製造方法
US6690993B2 (en) * 2000-10-12 2004-02-10 R. Foulke Development Company, Llc Reticle storage system
JP2002252161A (ja) * 2001-02-23 2002-09-06 Hitachi Ltd 半導体製造システム
JP3788296B2 (ja) * 2001-09-10 2006-06-21 株式会社ダイフク クリーンルーム用の物品保管設備
JP4126189B2 (ja) * 2002-04-10 2008-07-30 株式会社日立ハイテクノロジーズ 検査条件設定プログラム、検査装置および検査システム
JP2004158510A (ja) * 2002-11-01 2004-06-03 Canon Inc デバイス製造装置
EP2613195B1 (en) * 2003-04-11 2015-12-16 Nikon Corporation Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
CN101436003B (zh) 2003-06-19 2011-08-17 株式会社尼康 曝光装置及器件制造方法
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
KR100856579B1 (ko) * 2007-01-18 2008-09-04 홍운식 웨이퍼의 노광 에너지 정보를 축적하는 시스템에 의해 누적된 웨이퍼의 노광 에너지 정보를 이용한 노광용 마스크의 관리방법
US8237911B2 (en) * 2007-03-15 2012-08-07 Nikon Corporation Apparatus and methods for keeping immersion fluid adjacent to an optical assembly during wafer exchange in an immersion lithography machine
JP5940328B2 (ja) * 2012-03-14 2016-06-29 株式会社アドテックエンジニアリング 露光描画装置、プログラム及び露光描画方法
JP6312379B2 (ja) 2013-07-19 2018-04-18 キヤノン株式会社 リソグラフィ装置、リソグラフィ方法、リソグラフィシステム、プログラム、物品の製造方法
JP6745673B2 (ja) * 2016-08-05 2020-08-26 東京エレクトロン株式会社 半導体システム

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2539447B2 (ja) * 1987-08-12 1996-10-02 株式会社日立製作所 枚葉キャリアによる生産方法
JP2869826B2 (ja) 1991-08-28 1999-03-10 キヤノン株式会社 半導体製造方法
JP3412193B2 (ja) * 1993-06-29 2003-06-03 株式会社ニコン 露光装置
JP2994553B2 (ja) * 1994-04-08 1999-12-27 大日本スクリーン製造株式会社 基板処理装置
JP3892493B2 (ja) * 1995-11-29 2007-03-14 大日本スクリーン製造株式会社 基板処理システム
JPH1055944A (ja) * 1996-08-08 1998-02-24 Toshiba Corp パターン転写装置
JPH1098086A (ja) 1996-09-20 1998-04-14 Canon Inc 半導体製造装置および露光制御方法
JPH10154646A (ja) * 1996-11-22 1998-06-09 Nikon Corp 搬送装置
TW376542B (en) * 1997-03-04 1999-12-11 Canon Kk Exposure unit, exposure system and device manufacturing method
US6275744B1 (en) * 1997-08-01 2001-08-14 Kokusai Electric Co., Ltd. Substrate feed control
WO1999050712A1 (en) * 1998-03-26 1999-10-07 Nikon Corporation Exposure method and system, photomask, method of manufacturing photomask, micro-device and method of manufacturing micro-device

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