JPH10233420A - 半導体製造装置 - Google Patents
半導体製造装置Info
- Publication number
- JPH10233420A JPH10233420A JP33707196A JP33707196A JPH10233420A JP H10233420 A JPH10233420 A JP H10233420A JP 33707196 A JP33707196 A JP 33707196A JP 33707196 A JP33707196 A JP 33707196A JP H10233420 A JPH10233420 A JP H10233420A
- Authority
- JP
- Japan
- Prior art keywords
- film thickness
- monitor
- substrate
- processed
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 239000010408 film Substances 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000010409 thin film Substances 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 7
- 238000012546 transfer Methods 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 7
- 239000000126 substance Substances 0.000 abstract description 26
- 230000005856 abnormality Effects 0.000 abstract description 11
- 238000012545 processing Methods 0.000 abstract description 5
- 238000012937 correction Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 21
- 238000012544 monitoring process Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33707196A JPH10233420A (ja) | 1996-12-17 | 1996-12-17 | 半導体製造装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33707196A JPH10233420A (ja) | 1996-12-17 | 1996-12-17 | 半導体製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10233420A true JPH10233420A (ja) | 1998-09-02 |
| JPH10233420A5 JPH10233420A5 (enExample) | 2004-10-07 |
Family
ID=18305162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33707196A Pending JPH10233420A (ja) | 1996-12-17 | 1996-12-17 | 半導体製造装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10233420A (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002174502A (ja) * | 2000-12-07 | 2002-06-21 | Ulvac Japan Ltd | 軸出し装置、膜厚測定装置、成膜装置、軸出し方法及び膜厚測定方法 |
| KR100364090B1 (ko) * | 2000-07-10 | 2002-12-11 | 주식회사 아펙스 | 유전체 박막형성장치 |
| JP2004071671A (ja) * | 2002-08-02 | 2004-03-04 | Hitachi Ltd | 異物モニタリングシステムおよびプロセス処理装置並びに電子商取引方法 |
| JP2012009514A (ja) * | 2010-06-22 | 2012-01-12 | Shimadzu Corp | プラズマｃｖｄ成膜装置 |
| CN118362078A (zh) * | 2024-06-19 | 2024-07-19 | 嘉祥洪润电碳有限公司 | 一种用于石墨表面碳化硅涂层测厚工装 |
-
1996
- 1996-12-17 JP JP33707196A patent/JPH10233420A/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100364090B1 (ko) * | 2000-07-10 | 2002-12-11 | 주식회사 아펙스 | 유전체 박막형성장치 |
| JP2002174502A (ja) * | 2000-12-07 | 2002-06-21 | Ulvac Japan Ltd | 軸出し装置、膜厚測定装置、成膜装置、軸出し方法及び膜厚測定方法 |
| JP2004071671A (ja) * | 2002-08-02 | 2004-03-04 | Hitachi Ltd | 異物モニタリングシステムおよびプロセス処理装置並びに電子商取引方法 |
| US8045148B2 (en) | 2002-08-02 | 2011-10-25 | Hitachi High-Technologies Corporation | System for monitoring foreign particles, process processing apparatus and method of electronic commerce |
| US8254662B2 (en) | 2002-08-02 | 2012-08-28 | Hitachi High-Technologies Corporation | System for monitoring foreign particles, process processing apparatus and method of electronic commerce |
| JP2012009514A (ja) * | 2010-06-22 | 2012-01-12 | Shimadzu Corp | プラズマｃｖｄ成膜装置 |
| CN118362078A (zh) * | 2024-06-19 | 2024-07-19 | 嘉祥洪润电碳有限公司 | 一种用于石墨表面碳化硅涂层测厚工装 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Effective date: 20040416 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
|
| A131 | Notification of reasons for refusal |
Effective date: 20040518 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20041130 |