JPH11163070A5 - - Google Patents

Info

Publication number
JPH11163070A5
JPH11163070A5 JP1997322643A JP32264397A JPH11163070A5 JP H11163070 A5 JPH11163070 A5 JP H11163070A5 JP 1997322643 A JP1997322643 A JP 1997322643A JP 32264397 A JP32264397 A JP 32264397A JP H11163070 A5 JPH11163070 A5 JP H11163070A5
Authority
JP
Japan
Prior art keywords
temperature
control method
treatment process
semiconductor device
heat treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP1997322643A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11163070A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP32264397A priority Critical patent/JPH11163070A/ja
Priority claimed from JP32264397A external-priority patent/JPH11163070A/ja
Publication of JPH11163070A publication Critical patent/JPH11163070A/ja
Publication of JPH11163070A5 publication Critical patent/JPH11163070A5/ja
Withdrawn legal-status Critical Current

Links

JP32264397A 1997-11-25 1997-11-25 半導体装置製造の熱処理工程における温度制御方法 Withdrawn JPH11163070A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32264397A JPH11163070A (ja) 1997-11-25 1997-11-25 半導体装置製造の熱処理工程における温度制御方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32264397A JPH11163070A (ja) 1997-11-25 1997-11-25 半導体装置製造の熱処理工程における温度制御方法

Publications (2)

Publication Number Publication Date
JPH11163070A JPH11163070A (ja) 1999-06-18
JPH11163070A5 true JPH11163070A5 (enExample) 2004-12-02

Family

ID=18146001

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32264397A Withdrawn JPH11163070A (ja) 1997-11-25 1997-11-25 半導体装置製造の熱処理工程における温度制御方法

Country Status (1)

Country Link
JP (1) JPH11163070A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100974502B1 (ko) 2008-03-28 2010-08-10 우진 일렉트로나이트(주) 로내부의 온도감지장치
JP2016076529A (ja) * 2014-10-03 2016-05-12 東京エレクトロン株式会社 温度測定用支持部材及び熱処理装置
CN104460764A (zh) * 2014-11-28 2015-03-25 广东工业大学 一种基于去伪控制的模糊pid的挤出机机筒温度控制方法
WO2023230437A1 (en) * 2022-05-23 2023-11-30 Watlow Electric Manufacturing Company Compliant temperature sensing system

Similar Documents

Publication Publication Date Title
EP1453083A4 (en) NITRISING METHOD FOR AN INSULATION FILM, SEMICONDUCTOR ELEMENT AND METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT, SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD
DE19880398T1 (de) Substrattemperatur-Meßvorrichtung, Substrattemperatur-Meßverfahren Substraterwärmungsverfahren und Wärmebehandlungsvorrichtung
EP1041612A4 (en) METHOD FOR THERMALLY TREATING A SILICON WAFER, AND SILICON WAFER
DE69434773D1 (de) Vorrichtung zur schnellen thermischen Behandlung zur Herstellung von Halbleiterwafern
AU2001296004A1 (en) Temperature measuring method, heat treating device and method, computer program,and radiation thermometer
JP2004509361A5 (enExample)
JPS5430777A (en) Manufacture of semiconductor device
EP0715342A3 (en) Device for the heat treatment of single disks and method for producing a reactor vessel therefor
JP2001250776A5 (enExample)
JPH11163070A5 (enExample)
JP2000323384A5 (enExample)
JPH10321547A5 (enExample)
GB0329268D0 (en) Method and apparatus for heat-treating an article and a fixture for use in the same
KR960015722A (ko) 고온 열처리를 포함하는 반도체 장치의 제조 방법
JP2563779B2 (ja) アルミニウム・シリコン合金の処理法
NO142215C (no) Utgangsmateriale for fremstilling av formede og ved hydrotermisk behandling herdede gjenstander, og fremgangsmaate ved fremstilling av utgangsmaterialet
EP1205269A4 (en) MOLDED SLAM FOR SHADOW MASK, METHOD FOR HEAT TREATMENT AND MATERIAL THEREFOR
EP0855621A3 (en) Manufacturing method and apparatus for semiconductor device
JP2005142258A5 (enExample)
JPH01174917U (enExample)
JPS51147283A (en) Manufacturing process of semiconductor device
KR960009103A (ko) 실리콘 웨이퍼 열처리용 조합지그(jig) 및 그 제조방법
JPS5230932A (en) Manufacturing process for sheathed heater
JPS51123317A (en) A process for producing textured polyester filaments
JPS6459915A (en) Heat treatment device for resist coated substrate