JPH11163070A - 半導体装置製造の熱処理工程における温度制御方法 - Google Patents

半導体装置製造の熱処理工程における温度制御方法

Info

Publication number
JPH11163070A
JPH11163070A JP32264397A JP32264397A JPH11163070A JP H11163070 A JPH11163070 A JP H11163070A JP 32264397 A JP32264397 A JP 32264397A JP 32264397 A JP32264397 A JP 32264397A JP H11163070 A JPH11163070 A JP H11163070A
Authority
JP
Japan
Prior art keywords
temperature
substrate
covering member
measuring device
temperature measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP32264397A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11163070A5 (enExample
Inventor
Shusaku Yanagawa
周作 柳川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP32264397A priority Critical patent/JPH11163070A/ja
Publication of JPH11163070A publication Critical patent/JPH11163070A/ja
Publication of JPH11163070A5 publication Critical patent/JPH11163070A5/ja
Withdrawn legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Control Of Temperature (AREA)
JP32264397A 1997-11-25 1997-11-25 半導体装置製造の熱処理工程における温度制御方法 Withdrawn JPH11163070A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32264397A JPH11163070A (ja) 1997-11-25 1997-11-25 半導体装置製造の熱処理工程における温度制御方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32264397A JPH11163070A (ja) 1997-11-25 1997-11-25 半導体装置製造の熱処理工程における温度制御方法

Publications (2)

Publication Number Publication Date
JPH11163070A true JPH11163070A (ja) 1999-06-18
JPH11163070A5 JPH11163070A5 (enExample) 2004-12-02

Family

ID=18146001

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32264397A Withdrawn JPH11163070A (ja) 1997-11-25 1997-11-25 半導体装置製造の熱処理工程における温度制御方法

Country Status (1)

Country Link
JP (1) JPH11163070A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100974502B1 (ko) 2008-03-28 2010-08-10 우진 일렉트로나이트(주) 로내부의 온도감지장치
CN104460764A (zh) * 2014-11-28 2015-03-25 广东工业大学 一种基于去伪控制的模糊pid的挤出机机筒温度控制方法
JP2016076529A (ja) * 2014-10-03 2016-05-12 東京エレクトロン株式会社 温度測定用支持部材及び熱処理装置
WO2023230437A1 (en) * 2022-05-23 2023-11-30 Watlow Electric Manufacturing Company Compliant temperature sensing system

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100974502B1 (ko) 2008-03-28 2010-08-10 우진 일렉트로나이트(주) 로내부의 온도감지장치
JP2016076529A (ja) * 2014-10-03 2016-05-12 東京エレクトロン株式会社 温度測定用支持部材及び熱処理装置
CN104460764A (zh) * 2014-11-28 2015-03-25 广东工业大学 一种基于去伪控制的模糊pid的挤出机机筒温度控制方法
WO2023230437A1 (en) * 2022-05-23 2023-11-30 Watlow Electric Manufacturing Company Compliant temperature sensing system
TWI872551B (zh) * 2022-05-23 2025-02-11 美商瓦特洛威電子製造公司 順應式溫度感測系統

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