JPH10321547A5 - - Google Patents

Info

Publication number
JPH10321547A5
JPH10321547A5 JP1997131854A JP13185497A JPH10321547A5 JP H10321547 A5 JPH10321547 A5 JP H10321547A5 JP 1997131854 A JP1997131854 A JP 1997131854A JP 13185497 A JP13185497 A JP 13185497A JP H10321547 A5 JPH10321547 A5 JP H10321547A5
Authority
JP
Japan
Prior art keywords
heat
processing vessel
plate
treatment apparatus
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997131854A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10321547A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP13185497A priority Critical patent/JPH10321547A/ja
Priority claimed from JP13185497A external-priority patent/JPH10321547A/ja
Publication of JPH10321547A publication Critical patent/JPH10321547A/ja
Publication of JPH10321547A5 publication Critical patent/JPH10321547A5/ja
Pending legal-status Critical Current

Links

JP13185497A 1997-05-22 1997-05-22 熱処理装置 Pending JPH10321547A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13185497A JPH10321547A (ja) 1997-05-22 1997-05-22 熱処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13185497A JPH10321547A (ja) 1997-05-22 1997-05-22 熱処理装置

Publications (2)

Publication Number Publication Date
JPH10321547A JPH10321547A (ja) 1998-12-04
JPH10321547A5 true JPH10321547A5 (enExample) 2005-04-07

Family

ID=15067683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13185497A Pending JPH10321547A (ja) 1997-05-22 1997-05-22 熱処理装置

Country Status (1)

Country Link
JP (1) JPH10321547A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001007039A (ja) 1999-06-18 2001-01-12 Hitachi Ltd 半導体集積回路装置の製造方法
US6485603B1 (en) * 1999-07-01 2002-11-26 Applied Materials, Inc. Method and apparatus for conserving energy within a process chamber
JP2002075899A (ja) * 2000-08-31 2002-03-15 Ulvac-Riko Inc 円形状平板試料の均熱装置
JP4029613B2 (ja) * 2001-12-25 2008-01-09 ウシオ電機株式会社 閃光放射装置および光加熱装置
JP4321213B2 (ja) 2003-10-24 2009-08-26 ウシオ電機株式会社 加熱ユニット
US7239804B2 (en) 2004-03-23 2007-07-03 Canon Kabushiki Kaisha Cooling device, and apparatus and method for manufacturing image display panel using cooling device
JP5077018B2 (ja) 2008-03-31 2012-11-21 東京エレクトロン株式会社 熱処理装置
JP2010021171A (ja) * 2008-07-08 2010-01-28 Renesas Technology Corp 半導体装置の製造方法およびそれに用いる半導体製造装置
CN115707800A (zh) * 2021-08-20 2023-02-21 北京北方华创微电子装备有限公司 一种用于半导体工艺腔室的加热装置和半导体设备
CN119753641B (zh) * 2025-03-06 2025-05-16 蓝河科技(绍兴)有限公司 设有旋转基座的气相生长设备
CN119776809B (zh) * 2025-03-06 2025-05-06 蓝河科技(绍兴)有限公司 设有固定基座的气相生长设备

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