JPH10321547A - 熱処理装置 - Google Patents

熱処理装置

Info

Publication number
JPH10321547A
JPH10321547A JP13185497A JP13185497A JPH10321547A JP H10321547 A JPH10321547 A JP H10321547A JP 13185497 A JP13185497 A JP 13185497A JP 13185497 A JP13185497 A JP 13185497A JP H10321547 A JPH10321547 A JP H10321547A
Authority
JP
Japan
Prior art keywords
wafer
heat
temperature
heat treatment
treatment apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13185497A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10321547A5 (enExample
Inventor
Shoji Ishihara
将司 石原
Akinori Tanaka
昭典 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Denki Electric Inc
Original Assignee
Kokusai Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Co Ltd filed Critical Kokusai Electric Co Ltd
Priority to JP13185497A priority Critical patent/JPH10321547A/ja
Publication of JPH10321547A publication Critical patent/JPH10321547A/ja
Publication of JPH10321547A5 publication Critical patent/JPH10321547A5/ja
Pending legal-status Critical Current

Links

JP13185497A 1997-05-22 1997-05-22 熱処理装置 Pending JPH10321547A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13185497A JPH10321547A (ja) 1997-05-22 1997-05-22 熱処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13185497A JPH10321547A (ja) 1997-05-22 1997-05-22 熱処理装置

Publications (2)

Publication Number Publication Date
JPH10321547A true JPH10321547A (ja) 1998-12-04
JPH10321547A5 JPH10321547A5 (enExample) 2005-04-07

Family

ID=15067683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13185497A Pending JPH10321547A (ja) 1997-05-22 1997-05-22 熱処理装置

Country Status (1)

Country Link
JP (1) JPH10321547A (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002075899A (ja) * 2000-08-31 2002-03-15 Ulvac-Riko Inc 円形状平板試料の均熱装置
US6403475B1 (en) 1999-06-18 2002-06-11 Hitachi, Ltd. Fabrication method for semiconductor integrated device
US6485603B1 (en) * 1999-07-01 2002-11-26 Applied Materials, Inc. Method and apparatus for conserving energy within a process chamber
US7218847B2 (en) 2003-10-24 2007-05-15 Ushio Denki Kabushiki Kasiha Heating unit for heating a workpiece with light-absorbing heat conducting layer
CN100380613C (zh) * 2001-12-25 2008-04-09 优志旺电机株式会社 闪光辐射装置与光加热装置
KR100842641B1 (ko) 2004-03-23 2008-06-30 캐논 가부시끼가이샤 냉각장치와, 이 냉각장치를 사용한 화상표시패널의제조장치 및 제조방법
WO2009122913A1 (ja) * 2008-03-31 2009-10-08 東京エレクトロン株式会社 熱処理装置
JP2010021171A (ja) * 2008-07-08 2010-01-28 Renesas Technology Corp 半導体装置の製造方法およびそれに用いる半導体製造装置
CN115707800A (zh) * 2021-08-20 2023-02-21 北京北方华创微电子装备有限公司 一种用于半导体工艺腔室的加热装置和半导体设备
CN119753641A (zh) * 2025-03-06 2025-04-04 蓝河科技(绍兴)有限公司 设有旋转基座的气相生长设备
CN119776809A (zh) * 2025-03-06 2025-04-08 蓝河科技(绍兴)有限公司 设有固定基座的气相生长设备

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6403475B1 (en) 1999-06-18 2002-06-11 Hitachi, Ltd. Fabrication method for semiconductor integrated device
US6485603B1 (en) * 1999-07-01 2002-11-26 Applied Materials, Inc. Method and apparatus for conserving energy within a process chamber
JP2002075899A (ja) * 2000-08-31 2002-03-15 Ulvac-Riko Inc 円形状平板試料の均熱装置
CN100380613C (zh) * 2001-12-25 2008-04-09 优志旺电机株式会社 闪光辐射装置与光加热装置
US7218847B2 (en) 2003-10-24 2007-05-15 Ushio Denki Kabushiki Kasiha Heating unit for heating a workpiece with light-absorbing heat conducting layer
KR100842641B1 (ko) 2004-03-23 2008-06-30 캐논 가부시끼가이샤 냉각장치와, 이 냉각장치를 사용한 화상표시패널의제조장치 및 제조방법
WO2009122913A1 (ja) * 2008-03-31 2009-10-08 東京エレクトロン株式会社 熱処理装置
JP2009246061A (ja) * 2008-03-31 2009-10-22 Tokyo Electron Ltd 熱処理装置
CN101855708B (zh) 2008-03-31 2012-10-10 东京毅力科创株式会社 热处理装置
JP2010021171A (ja) * 2008-07-08 2010-01-28 Renesas Technology Corp 半導体装置の製造方法およびそれに用いる半導体製造装置
CN115707800A (zh) * 2021-08-20 2023-02-21 北京北方华创微电子装备有限公司 一种用于半导体工艺腔室的加热装置和半导体设备
CN119753641A (zh) * 2025-03-06 2025-04-04 蓝河科技(绍兴)有限公司 设有旋转基座的气相生长设备
CN119776809A (zh) * 2025-03-06 2025-04-08 蓝河科技(绍兴)有限公司 设有固定基座的气相生长设备

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