JP2001203263A5 - - Google Patents

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Publication number
JP2001203263A5
JP2001203263A5 JP2000012026A JP2000012026A JP2001203263A5 JP 2001203263 A5 JP2001203263 A5 JP 2001203263A5 JP 2000012026 A JP2000012026 A JP 2000012026A JP 2000012026 A JP2000012026 A JP 2000012026A JP 2001203263 A5 JP2001203263 A5 JP 2001203263A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000012026A
Other versions
JP2001203263A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000012026A priority Critical patent/JP2001203263A/ja
Priority claimed from JP2000012026A external-priority patent/JP2001203263A/ja
Priority to US09/709,403 priority patent/US6693008B1/en
Priority to TW089128142A priority patent/TW477061B/zh
Priority to KR1020010003154A priority patent/KR100716075B1/ko
Publication of JP2001203263A publication Critical patent/JP2001203263A/ja
Priority to US10/721,230 priority patent/US20040106292A1/en
Priority to US11/055,745 priority patent/US7060589B2/en
Priority to US11/149,539 priority patent/US7074691B2/en
Priority to US11/149,538 priority patent/US7208391B2/en
Priority to KR1020060080347A priority patent/KR100719015B1/ko
Priority to KR1020060080350A priority patent/KR100719429B1/ko
Priority to US11/653,321 priority patent/US20070114631A1/en
Publication of JP2001203263A5 publication Critical patent/JP2001203263A5/ja
Pending legal-status Critical Current

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JP2000012026A 2000-01-20 2000-01-20 半導体集積回路装置の製造方法および半導体集積回路装置 Pending JP2001203263A (ja)

Priority Applications (11)

Application Number Priority Date Filing Date Title
JP2000012026A JP2001203263A (ja) 2000-01-20 2000-01-20 半導体集積回路装置の製造方法および半導体集積回路装置
US09/709,403 US6693008B1 (en) 2000-01-20 2000-11-13 Method of manufacturing a semiconductor integrated circuit device and a semiconductor integrated circuit device
TW089128142A TW477061B (en) 2000-01-20 2000-12-28 Method for manufacturing semiconductor integrated circuit device and semiconductor integrated circuit device
KR1020010003154A KR100716075B1 (ko) 2000-01-20 2001-01-19 반도체 집적 회로 장치의 제조 방법
US10/721,230 US20040106292A1 (en) 2000-01-20 2003-11-26 Method of manufacturing a semiconductor integrated circuit device and a semiconductor integrated circuit device
US11/055,745 US7060589B2 (en) 2000-01-20 2005-02-11 Method for manufacturing a semiconductor integrated circuit device that includes covering the bottom of an isolation trench with spin-on glass and etching back the spin-on glass to a predetermined depth
US11/149,539 US7074691B2 (en) 2000-01-20 2005-06-10 Method of manufacturing a semiconductor integrated circuit device that includes forming dummy patterns in an isolation region prior to filling with insulating material
US11/149,538 US7208391B2 (en) 2000-01-20 2005-06-10 Method of manufacturing a semiconductor integrated circuit device that includes forming an isolation trench around active regions and filling the trench with two insulating films
KR1020060080347A KR100719015B1 (ko) 2000-01-20 2006-08-24 반도체 집적 회로 장치의 제조 방법
KR1020060080350A KR100719429B1 (ko) 2000-01-20 2006-08-24 반도체 집적 회로 장치의 제조 방법
US11/653,321 US20070114631A1 (en) 2000-01-20 2007-01-16 Method of manufacturing a semiconductor integrated circuit device and a semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000012026A JP2001203263A (ja) 2000-01-20 2000-01-20 半導体集積回路装置の製造方法および半導体集積回路装置

Publications (2)

Publication Number Publication Date
JP2001203263A JP2001203263A (ja) 2001-07-27
JP2001203263A5 true JP2001203263A5 (ja) 2007-03-08

Family

ID=18539805

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000012026A Pending JP2001203263A (ja) 2000-01-20 2000-01-20 半導体集積回路装置の製造方法および半導体集積回路装置

Country Status (4)

Country Link
US (5) US6693008B1 (ja)
JP (1) JP2001203263A (ja)
KR (3) KR100716075B1 (ja)
TW (1) TW477061B (ja)

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