JP2001158966A5 - - Google Patents

Download PDF

Info

Publication number
JP2001158966A5
JP2001158966A5 JP1999341962A JP34196299A JP2001158966A5 JP 2001158966 A5 JP2001158966 A5 JP 2001158966A5 JP 1999341962 A JP1999341962 A JP 1999341962A JP 34196299 A JP34196299 A JP 34196299A JP 2001158966 A5 JP2001158966 A5 JP 2001158966A5
Authority
JP
Japan
Prior art keywords
pores
liquid
solvent
substrate
solvent vapor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1999341962A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001158966A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP34196299A priority Critical patent/JP2001158966A/ja
Priority claimed from JP34196299A external-priority patent/JP2001158966A/ja
Priority to TW089125438A priority patent/TW469492B/zh
Priority to US09/726,552 priority patent/US6517642B2/en
Priority to KR1020000072227A priority patent/KR20010062031A/ko
Priority to EP00126292A priority patent/EP1106712A1/en
Publication of JP2001158966A publication Critical patent/JP2001158966A/ja
Priority to US10/315,170 priority patent/US6780245B2/en
Publication of JP2001158966A5 publication Critical patent/JP2001158966A5/ja
Pending legal-status Critical Current

Links

JP34196299A 1999-12-01 1999-12-01 金属ないし金属化合物薄膜の作製方法 Pending JP2001158966A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP34196299A JP2001158966A (ja) 1999-12-01 1999-12-01 金属ないし金属化合物薄膜の作製方法
TW089125438A TW469492B (en) 1999-12-01 2000-11-30 Method and apparatus of producing thin film of metal or metal compound
US09/726,552 US6517642B2 (en) 1999-12-01 2000-12-01 Method and apparatus of producing thin film of metal or metal compound
KR1020000072227A KR20010062031A (ko) 1999-12-01 2000-12-01 금속 또는 금속화합물의 박막 제작방법 및 제작장치
EP00126292A EP1106712A1 (en) 1999-12-01 2000-12-01 Method and apparatus of producing thin film of metal or metal compound
US10/315,170 US6780245B2 (en) 1999-12-01 2002-12-10 Method and apparatus of producing thin film of metal or metal compound

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34196299A JP2001158966A (ja) 1999-12-01 1999-12-01 金属ないし金属化合物薄膜の作製方法

Publications (2)

Publication Number Publication Date
JP2001158966A JP2001158966A (ja) 2001-06-12
JP2001158966A5 true JP2001158966A5 (enExample) 2005-04-07

Family

ID=18350121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34196299A Pending JP2001158966A (ja) 1999-12-01 1999-12-01 金属ないし金属化合物薄膜の作製方法

Country Status (5)

Country Link
US (2) US6517642B2 (enExample)
EP (1) EP1106712A1 (enExample)
JP (1) JP2001158966A (enExample)
KR (1) KR20010062031A (enExample)
TW (1) TW469492B (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010101743A (ko) * 1999-11-30 2001-11-14 마에다 시게루 금속박막의 성막방법 및 그 장치
JP3479833B2 (ja) * 2000-08-22 2003-12-15 日本電気株式会社 レーザ修正方法および装置
US7087100B2 (en) * 2001-01-31 2006-08-08 General Electric Company Preparation of nanosized copper and copper compounds
US6855584B2 (en) * 2001-03-29 2005-02-15 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device
US7253032B2 (en) * 2001-04-20 2007-08-07 Semiconductor Energy Laboratory Co., Ltd. Method of flattening a crystallized semiconductor film surface by using a plate
JP4854866B2 (ja) * 2001-04-27 2012-01-18 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2003007579A (ja) * 2001-06-19 2003-01-10 Matsushita Electric Ind Co Ltd 有機薄膜形成方法
JP4825373B2 (ja) * 2001-08-14 2011-11-30 ローム株式会社 強誘電体薄膜の製造方法およびこれを用いた強誘電体メモリの製造方法
DE10225606A1 (de) * 2002-06-07 2004-01-08 Daimlerchrysler Ag Halbleiterbauelement und Verfahren zur Herstellung
GB0225202D0 (en) 2002-10-30 2002-12-11 Hewlett Packard Co Electronic components
US6897151B2 (en) * 2002-11-08 2005-05-24 Wayne State University Methods of filling a feature on a substrate with copper nanocrystals
JP2004298669A (ja) * 2003-03-28 2004-10-28 Seiko Epson Corp セラミックス材料の塗布方法およびセラミックス膜
US7255943B2 (en) * 2003-05-14 2007-08-14 Hoya Corporation Glass substrate for a magnetic disk, magnetic disk, and methods of producing the glass substrate and the magnetic disk
US7867565B2 (en) * 2003-06-30 2011-01-11 Imec Method for coating substrates
US7579044B2 (en) * 2004-11-08 2009-08-25 Brewer Science Inc. Process and device for coating the outer edge of a substrate during microelectronics manufacture
US7521705B2 (en) 2005-08-15 2009-04-21 Micron Technology, Inc. Reproducible resistance variable insulating memory devices having a shaped bottom electrode
GB2432044A (en) * 2005-11-04 2007-05-09 Seiko Epson Corp Patterning of electronic devices by brush painting onto surface energy modified substrates
US20070117287A1 (en) * 2005-11-23 2007-05-24 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus
US7727901B2 (en) 2007-05-03 2010-06-01 Innovalight, Inc. Preparation of group IV semiconductor nanoparticle materials and dispersions thereof
WO2009129353A1 (en) * 2008-04-15 2009-10-22 Purdue Research Foundation Metallized silicon substrate for indium gallium nitride light-emitting diode
US8309185B2 (en) * 2010-05-04 2012-11-13 National Tsing Hua University Nanoparticle film and forming method and application thereof
US8552490B2 (en) * 2010-06-18 2013-10-08 United Microelectronics Corp. Nonvolatile memory device with a high-K charge storage layer having a U-shaped,cross-sectional structure
JP6255650B2 (ja) * 2013-05-13 2018-01-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP5760060B2 (ja) * 2013-09-27 2015-08-05 株式会社茨城技研 金属皮膜形成方法並びに金属皮膜形成製品の製造方法及び製造装置
US20150118487A1 (en) * 2013-10-25 2015-04-30 Colin A. Wolden Plasma-assisted nanofabrication of two-dimensional metal chalcogenide layers
KR101503735B1 (ko) 2014-01-20 2015-03-19 연세대학교 산학협력단 원자층 증착법으로 증착된 금속 산화물을 이용한 금속 황화물 합성 방법
CN104498944B (zh) * 2015-01-13 2017-10-17 南昌航空大学 一种利用纳米核壳粒子粉末激光熔覆制备表面陶瓷涂层方法
CN105506619A (zh) * 2015-12-31 2016-04-20 四川腾达电梯制造有限公司 一种电梯导轨表面处理工艺
JP7120757B2 (ja) * 2017-12-12 2022-08-17 株式会社Jcu 酸化物膜形成用塗布剤、酸化物膜の製造方法及び金属めっき構造体の製造方法
US12225641B2 (en) * 2019-12-20 2025-02-11 Applied Materials, Inc. Bake devices for handling and uniform baking of substrates
CN113957434B (zh) * 2021-10-22 2022-11-04 燕山大学 一种在低碳钢表面制备高硬度高耐磨熔覆层的方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR359002A (fr) 1905-10-30 1906-03-14 Anilin Fabrikation Ag Procédé de production d'un colorant nouveau de la série du triphénylméthane
FR732279A (fr) * 1931-05-02 1932-09-15 Procédé d'application d'or, d'argent et de platine sur métaux, notamment sur fers et aciers inoxydables
FR1214354A (fr) * 1957-11-12 1960-04-08 Power Jets Res & Dev Ltd Perfectionnements apportés aux traitements de pièces métalliques pour les rendre résistantes à la corrosion
US3540863A (en) * 1968-01-22 1970-11-17 Sylvania Electric Prod Art of protectively metal coating columbium and columbium - alloy structures
FR2157728A1 (en) * 1971-10-29 1973-06-08 Armines Niobium and niobium alloys - coated with silicon chromium and cobalt or nickel-contg mixt
FR2314267A1 (fr) * 1975-06-12 1977-01-07 Anvar Procede pour le traitement superficiel des aciers et produits obtenus
JPS5853068B2 (ja) * 1978-01-28 1983-11-26 工業技術院長 耐食性被覆された鉄又は鉄合金及びその製法
US4395440A (en) * 1980-10-09 1983-07-26 Matsushita Electric Industrial Co., Ltd. Method of and apparatus for manufacturing ultrafine particle film
GB2149800B (en) * 1983-10-22 1987-04-08 Nippon Paint Co Ltd Steel coating for preventing hydrogen embrittlement
US4820591A (en) * 1987-05-11 1989-04-11 Exxon Research And Engineering Company Corrosion resistant article and method of manufacture
US4800064A (en) * 1988-01-14 1989-01-24 Gte Products Corporation Process for producing tungsten heavy alloy sheet using hydrometallurgically produced tungsten heavy alloy
DE3830848C1 (enExample) * 1988-09-10 1989-12-21 Boehler Ag, 4005 Meerbusch, De
US5587111A (en) * 1990-03-29 1996-12-24 Vacuum Metallurgical Co., Ltd. Metal paste, process for producing same and method of making a metallic thin film using the metal paste
US5834374A (en) * 1994-09-30 1998-11-10 International Business Machines Corporation Method for controlling tensile and compressive stresses and mechanical problems in thin films on substrates
JPH09281329A (ja) * 1996-04-17 1997-10-31 Ricoh Co Ltd 偏光子とその製造方法
JP2967734B2 (ja) * 1996-10-18 1999-10-25 日本電気株式会社 薄膜の形成方法
JP3205793B2 (ja) 1996-12-19 2001-09-04 株式会社巴製作所 超微粒子及びその製造方法
JP3356968B2 (ja) * 1997-07-08 2002-12-16 住友大阪セメント株式会社 透明導電膜とその製造方法および表示装置
US6124215A (en) * 1997-10-06 2000-09-26 Chartered Semiconductor Manufacturing Ltd. Apparatus and method for planarization of spin-on materials
US6168694B1 (en) * 1999-02-04 2001-01-02 Chemat Technology, Inc. Methods for and products of processing nanostructure nitride, carbonitride and oxycarbonitride electrode power materials by utilizing sol gel technology for supercapacitor applications

Similar Documents

Publication Publication Date Title
JP2001158966A5 (enExample)
Axet et al. Coordination chemistry on carbon surfaces
CN110804395B (zh) 一种防覆冰涂料、防覆冰材料及其制备方法
JP2007509769A5 (enExample)
CN104959086B (zh) 利用柔性超疏水表面纸张制备液体弹珠的方法
JPH02233593A (ja) ダイヤモンド被膜の付着方法
CN105886789A (zh) 一种超重力过滤复合净化铝及铝合金熔体的方法
CN110258131A (zh) 一种固化碳毡防护涂层
CN109575065A (zh) 一种高纯正硅酸乙酯的生产方法及生产系统
TW200632995A (en) Single wafer dryer and drying methods
JP4382162B2 (ja) 部材被膜およびその製造方法
CN105503265B (zh) 一种石墨加热炉内石墨热场表面制备SiC涂层的方法
CN111218151A (zh) 纳米碳化硅/石墨烯复合材料、其制备、包含其的表面保护性涂层组合物及用途
CN102019168A (zh) 一种碳纳米管固相微萃取头的制备方法
JP2005514189A5 (enExample)
JP2004223244A (ja) 物体を消毒するための消毒室
CN110412011A (zh) 一种氧化钼纳米片表面增强拉曼散射基底的制备方法
CN1166791C (zh) 用陶瓷过滤器过滤铝熔体中非金属夹杂物的方法
CN103964439B (zh) 一种磨料级SiC颗粒表面纯净化处理方法
CN111733386B (zh) 一种金刚石颗粒真空微蒸发镀钼方法
TW200633623A (en) Air blown chip heat dissipation device and manufacturing method thereof
KR102172600B1 (ko) 고방열성 질화규소 기판의 제조방법
CN210322798U (zh) 一种用于制备氧化钼纳米片表面增强拉曼散射基底的装置
CN100348777C (zh) SiC陶瓷颗粒表面镀钨方法
CN108218427B (zh) 一种耐烧蚀的用于碳基耗散防热复合材料的三元合金耗散剂及方法