JP2001118904A5 - - Google Patents

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Publication number
JP2001118904A5
JP2001118904A5 JP1999296094A JP29609499A JP2001118904A5 JP 2001118904 A5 JP2001118904 A5 JP 2001118904A5 JP 1999296094 A JP1999296094 A JP 1999296094A JP 29609499 A JP29609499 A JP 29609499A JP 2001118904 A5 JP2001118904 A5 JP 2001118904A5
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JP
Japan
Prior art keywords
substrate
atmosphere
load lock
processing
processing chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP1999296094A
Other languages
English (en)
Japanese (ja)
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JP2001118904A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP29609499A priority Critical patent/JP2001118904A/ja
Priority claimed from JP29609499A external-priority patent/JP2001118904A/ja
Priority to US09/691,068 priority patent/US6805748B1/en
Publication of JP2001118904A publication Critical patent/JP2001118904A/ja
Publication of JP2001118904A5 publication Critical patent/JP2001118904A5/ja
Withdrawn legal-status Critical Current

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JP29609499A 1999-10-19 1999-10-19 ロードロック室を備えた基板処理装置および被処理基板の搬送方法 Withdrawn JP2001118904A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP29609499A JP2001118904A (ja) 1999-10-19 1999-10-19 ロードロック室を備えた基板処理装置および被処理基板の搬送方法
US09/691,068 US6805748B1 (en) 1999-10-19 2000-10-19 Substrate processing system with load-lock chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29609499A JP2001118904A (ja) 1999-10-19 1999-10-19 ロードロック室を備えた基板処理装置および被処理基板の搬送方法

Publications (2)

Publication Number Publication Date
JP2001118904A JP2001118904A (ja) 2001-04-27
JP2001118904A5 true JP2001118904A5 (enExample) 2004-11-18

Family

ID=17829059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29609499A Withdrawn JP2001118904A (ja) 1999-10-19 1999-10-19 ロードロック室を備えた基板処理装置および被処理基板の搬送方法

Country Status (2)

Country Link
US (1) US6805748B1 (enExample)
JP (1) JP2001118904A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003045947A (ja) * 2001-07-27 2003-02-14 Canon Inc 基板処理装置及び露光装置
JP2003109995A (ja) * 2001-09-28 2003-04-11 Hitachi Kokusai Electric Inc 基板処理方法
JP4040499B2 (ja) * 2003-03-06 2008-01-30 キヤノン株式会社 ロードロック室、処理システム及び処理方法
SG115629A1 (en) 2003-03-11 2005-10-28 Asml Netherlands Bv Method and apparatus for maintaining a machine part
SG115631A1 (en) 2003-03-11 2005-10-28 Asml Netherlands Bv Lithographic projection assembly, load lock and method for transferring objects
JP4468021B2 (ja) 2003-03-25 2010-05-26 キヤノン株式会社 ロードロックシステム及び露光処理システム並びにデバイスの製造方法
JP4564742B2 (ja) * 2003-12-03 2010-10-20 キヤノン株式会社 露光装置及びデバイス製造方法
JP2006245257A (ja) * 2005-03-03 2006-09-14 Canon Inc 処理装置、当該処理装置を有する露光装置、保護機構
JP2010161169A (ja) * 2009-01-07 2010-07-22 Ulvac Japan Ltd 真空処理装置、真空処理方法
CN113140483A (zh) * 2021-03-03 2021-07-20 上海璞芯科技有限公司 一种晶圆的传片方法和传片平台
US20250210378A1 (en) * 2023-12-20 2025-06-26 Axcelis Technologies, Inc. System and method for dynamic loadlock pressure control

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5607511A (en) 1992-02-21 1997-03-04 International Business Machines Corporation Method and apparatus for low temperature, low pressure chemical vapor deposition of epitaxial silicon layers
US5044314A (en) 1986-10-15 1991-09-03 Advantage Production Technology, Inc. Semiconductor wafer processing apparatus
JPH01268859A (ja) 1988-04-20 1989-10-26 Casio Comput Co Ltd 透明導電膜の形成方法および形成装置
JPH04277025A (ja) * 1991-03-06 1992-10-02 Hitachi Ltd 真空処理装置
JP2933403B2 (ja) 1991-03-15 1999-08-16 株式会社日立製作所 半導体パッケージ気密封止方法及び半導体パッケージ気密封止装置
JP3054900B2 (ja) 1993-03-10 2000-06-19 セイコーインスツルメンツ株式会社 微細加工装置
KR100267617B1 (ko) 1993-04-23 2000-10-16 히가시 데쓰로 진공처리장치 및 진공처리방법
JP3386651B2 (ja) 1996-04-03 2003-03-17 株式会社東芝 半導体装置の製造方法および半導体製造装置
JP3737570B2 (ja) * 1996-07-30 2006-01-18 大日本スクリーン製造株式会社 基板処理装置
US5943230A (en) * 1996-12-19 1999-08-24 Applied Materials, Inc. Computer-implemented inter-chamber synchronization in a multiple chamber substrate processing system
US5837059A (en) * 1997-07-11 1998-11-17 Brooks Automation, Inc. Automatic positive pressure seal access door
US6275744B1 (en) 1997-08-01 2001-08-14 Kokusai Electric Co., Ltd. Substrate feed control
WO1999022403A1 (en) * 1997-10-24 1999-05-06 Memc Electronic Materials, Inc. Process and apparatus for preparation of epitaxial silicon layers free of grown-in defects
US6086952A (en) 1998-06-15 2000-07-11 Applied Materials, Inc. Chemical vapor deposition of a copolymer of p-xylylene and a multivinyl silicon/oxygen comonomer
US6110232A (en) * 1998-10-01 2000-08-29 Taiwan Semiconductor Manufacturing Company, Ltd. Method for preventing corrosion in load-lock chambers
US6468384B1 (en) 2000-11-09 2002-10-22 Novellus Systems, Inc. Predictive wafer temperature control system and method
JP4616983B2 (ja) 2000-11-22 2011-01-19 キヤノン株式会社 位置検出装置、該検出装置を用いた投影露光装置及びデバイス製造方法
US6508062B2 (en) 2001-01-31 2003-01-21 Applied Materials, Inc. Thermal exchanger for a wafer chuck
US6672864B2 (en) 2001-08-31 2004-01-06 Applied Materials, Inc. Method and apparatus for processing substrates in a system having high and low pressure areas

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