JP2001110712A - 塗布膜除去装置及び塗布膜除去方法 - Google Patents
塗布膜除去装置及び塗布膜除去方法Info
- Publication number
- JP2001110712A JP2001110712A JP28969799A JP28969799A JP2001110712A JP 2001110712 A JP2001110712 A JP 2001110712A JP 28969799 A JP28969799 A JP 28969799A JP 28969799 A JP28969799 A JP 28969799A JP 2001110712 A JP2001110712 A JP 2001110712A
- Authority
- JP
- Japan
- Prior art keywords
- coating film
- substrate
- rinsing liquid
- outer edge
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 97
- 239000011248 coating agent Substances 0.000 title claims abstract description 96
- 238000000034 method Methods 0.000 title claims description 36
- 239000000758 substrate Substances 0.000 claims abstract description 95
- 230000007246 mechanism Effects 0.000 claims abstract description 94
- 239000007788 liquid Substances 0.000 claims abstract description 90
- 230000002093 peripheral effect Effects 0.000 claims abstract description 15
- 238000001514 detection method Methods 0.000 claims description 36
- 238000007599 discharging Methods 0.000 claims description 21
- 230000008859 change Effects 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000005507 spraying Methods 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 92
- 238000012545 processing Methods 0.000 description 37
- 239000004065 semiconductor Substances 0.000 description 18
- 101100327917 Caenorhabditis elegans chup-1 gene Proteins 0.000 description 13
- 230000008569 process Effects 0.000 description 12
- 238000001816 cooling Methods 0.000 description 9
- 238000011161 development Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000002904 solvent Substances 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000004528 spin coating Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 102100028780 AP-1 complex subunit sigma-2 Human genes 0.000 description 1
- 102100033029 Carbonic anhydrase-related protein 11 Human genes 0.000 description 1
- 101100055680 Homo sapiens AP1S2 gene Proteins 0.000 description 1
- 101000867841 Homo sapiens Carbonic anhydrase-related protein 11 Proteins 0.000 description 1
- 101001075218 Homo sapiens Gastrokine-1 Proteins 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28969799A JP2001110712A (ja) | 1999-10-12 | 1999-10-12 | 塗布膜除去装置及び塗布膜除去方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28969799A JP2001110712A (ja) | 1999-10-12 | 1999-10-12 | 塗布膜除去装置及び塗布膜除去方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001110712A true JP2001110712A (ja) | 2001-04-20 |
| JP2001110712A5 JP2001110712A5 (enExample) | 2005-07-21 |
Family
ID=17746584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28969799A Pending JP2001110712A (ja) | 1999-10-12 | 1999-10-12 | 塗布膜除去装置及び塗布膜除去方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001110712A (enExample) |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007235089A (ja) * | 2006-02-02 | 2007-09-13 | Sokudo:Kk | 基板処理装置 |
| JP2008060302A (ja) * | 2006-08-31 | 2008-03-13 | Sokudo:Kk | 基板処理装置 |
| JP2008098520A (ja) * | 2006-10-13 | 2008-04-24 | Tokyo Electron Ltd | 周辺露光装置、塗布、現像装置、周辺露光方法及び塗布、現像方法並びに記憶媒体 |
| JP2009071028A (ja) * | 2007-09-13 | 2009-04-02 | Sokudo:Kk | 基板処理装置および基板処理方法 |
| JP2011238950A (ja) * | 2006-02-02 | 2011-11-24 | Sokudo Co Ltd | 基板処理装置 |
| JP2012143704A (ja) * | 2011-01-12 | 2012-08-02 | Tokyo Electron Ltd | 塗布膜除去方法及びその装置 |
| JP2012222238A (ja) * | 2011-04-12 | 2012-11-12 | Tokyo Electron Ltd | 基板処理方法、その基板処理方法を実行させるためのプログラムを記録した記録媒体、基板処理装置及び基板処理システム |
| JP2012220896A (ja) * | 2011-04-13 | 2012-11-12 | Tokyo Electron Ltd | 周辺露光方法及び周辺露光装置 |
| KR20140058335A (ko) | 2012-11-06 | 2014-05-14 | 도쿄엘렉트론가부시키가이샤 | 기판 주연부의 도포막 제거 방법, 기판 처리 장치 및 기억 매체 |
| WO2016152308A1 (ja) * | 2015-03-25 | 2016-09-29 | 株式会社Ｓｃｒｅｅｎホールディングス | 塗布方法 |
| JP2016207895A (ja) * | 2015-04-24 | 2016-12-08 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| JP2018032766A (ja) * | 2016-08-25 | 2018-03-01 | 株式会社Ｓｃｒｅｅｎホールディングス | 周縁部処理装置および周縁部処理方法 |
| JP2018142677A (ja) * | 2017-02-28 | 2018-09-13 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| KR20190008102A (ko) | 2017-07-14 | 2019-01-23 | 도쿄엘렉트론가부시키가이샤 | 기판 위치 조정 방법, 기억 매체 및 기판 처리 시스템 |
| JP2020188124A (ja) * | 2019-05-14 | 2020-11-19 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
| CN113439235A (zh) * | 2019-02-28 | 2021-09-24 | 东京毅力科创株式会社 | 基片处理装置、基片处理方法和存储介质 |
| US11231651B2 (en) | 2017-04-13 | 2022-01-25 | SCREEN Holdings Co., Ltd. | Peripheral processing apparatus and peripheral processing method |
| US12224187B2 (en) | 2021-08-27 | 2025-02-11 | Kioxia Corporation | Substrate processing apparatus for manufacturing semiconductor device |
-
1999
- 1999-10-12 JP JP28969799A patent/JP2001110712A/ja active Pending
Cited By (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8932672B2 (en) | 2006-02-02 | 2015-01-13 | Screen Semiconductor Solutions Co., Ltd. | Substrate processing apparatus |
| JP2011238950A (ja) * | 2006-02-02 | 2011-11-24 | Sokudo Co Ltd | 基板処理装置 |
| JP2007235089A (ja) * | 2006-02-02 | 2007-09-13 | Sokudo:Kk | 基板処理装置 |
| US9477162B2 (en) | 2006-02-02 | 2016-10-25 | Screen Semiconductor Solutions Co., Ltd. | Substrate processing method |
| JP2008060302A (ja) * | 2006-08-31 | 2008-03-13 | Sokudo:Kk | 基板処理装置 |
| JP2008098520A (ja) * | 2006-10-13 | 2008-04-24 | Tokyo Electron Ltd | 周辺露光装置、塗布、現像装置、周辺露光方法及び塗布、現像方法並びに記憶媒体 |
| US7651285B2 (en) | 2006-10-13 | 2010-01-26 | Tokyo Electron Limited | Edge exposure apparatus, coating and developing apparatus, edge exposure method and coating and developing method, and storage medium |
| JP2009071028A (ja) * | 2007-09-13 | 2009-04-02 | Sokudo:Kk | 基板処理装置および基板処理方法 |
| US8894775B2 (en) | 2007-09-13 | 2014-11-25 | Screen Semiconductor Solutions Co., Ltd. | Substrate processing apparatus and substrate processing method |
| JP2012143704A (ja) * | 2011-01-12 | 2012-08-02 | Tokyo Electron Ltd | 塗布膜除去方法及びその装置 |
| JP2012222238A (ja) * | 2011-04-12 | 2012-11-12 | Tokyo Electron Ltd | 基板処理方法、その基板処理方法を実行させるためのプログラムを記録した記録媒体、基板処理装置及び基板処理システム |
| JP2012220896A (ja) * | 2011-04-13 | 2012-11-12 | Tokyo Electron Ltd | 周辺露光方法及び周辺露光装置 |
| JP2014091105A (ja) * | 2012-11-06 | 2014-05-19 | Tokyo Electron Ltd | 基板周縁部の塗布膜除去方法、基板処理装置及び記憶媒体 |
| TWI558469B (zh) * | 2012-11-06 | 2016-11-21 | 東京威力科創股份有限公司 | 基板周緣部之塗布膜除去方法、基板處理裝置及記憶媒體 |
| KR102086170B1 (ko) * | 2012-11-06 | 2020-05-27 | 도쿄엘렉트론가부시키가이샤 | 기판 주연부의 도포막 제거 방법, 기판 처리 장치 및 기억 매체 |
| KR20140058335A (ko) | 2012-11-06 | 2014-05-14 | 도쿄엘렉트론가부시키가이샤 | 기판 주연부의 도포막 제거 방법, 기판 처리 장치 및 기억 매체 |
| WO2016152308A1 (ja) * | 2015-03-25 | 2016-09-29 | 株式会社Ｓｃｒｅｅｎホールディングス | 塗布方法 |
| US10569297B2 (en) | 2015-03-25 | 2020-02-25 | SCREEN Holdings Co., Ltd. | Coating method |
| US9993840B2 (en) | 2015-04-24 | 2018-06-12 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus and substrate processing method |
| JP2016207895A (ja) * | 2015-04-24 | 2016-12-08 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| US20180056646A1 (en) * | 2016-08-25 | 2018-03-01 | SCREEN Holdings Co., Ltd. | Peripheral portion processing device and peripheral portion processing method |
| JP2018032766A (ja) * | 2016-08-25 | 2018-03-01 | 株式会社Ｓｃｒｅｅｎホールディングス | 周縁部処理装置および周縁部処理方法 |
| CN107785293B (zh) * | 2016-08-25 | 2022-08-19 | 株式会社斯库林集团 | 周缘部处理装置及周缘部处理方法 |
| CN107785293A (zh) * | 2016-08-25 | 2018-03-09 | 株式会社斯库林集团 | 周缘部处理装置及周缘部处理方法 |
| KR101972225B1 (ko) * | 2016-08-25 | 2019-04-24 | 가부시키가이샤 스크린 홀딩스 | 주연부 처리 장치 및 주연부 처리 방법 |
| US10286648B2 (en) * | 2016-08-25 | 2019-05-14 | SCREEN Holdings Co., Ltd. | Peripheral portion processing device and peripheral portion processing method |
| TWI660787B (zh) * | 2016-08-25 | 2019-06-01 | 日商斯庫林集團股份有限公司 | 周緣部處理裝置及周緣部處理方法 |
| KR20180023836A (ko) * | 2016-08-25 | 2018-03-07 | 가부시키가이샤 스크린 홀딩스 | 주연부 처리 장치 및 주연부 처리 방법 |
| JP2018142677A (ja) * | 2017-02-28 | 2018-09-13 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| US11231651B2 (en) | 2017-04-13 | 2022-01-25 | SCREEN Holdings Co., Ltd. | Peripheral processing apparatus and peripheral processing method |
| US12411414B2 (en) | 2017-04-13 | 2025-09-09 | SCREEN Holdings Co., Ltd. | Peripheral processing method |
| US10529604B2 (en) | 2017-07-14 | 2020-01-07 | Tokyo Electron Limited | Substrate position adjustment method, storage medium and substrate treatment system |
| KR20190008102A (ko) | 2017-07-14 | 2019-01-23 | 도쿄엘렉트론가부시키가이샤 | 기판 위치 조정 방법, 기억 매체 및 기판 처리 시스템 |
| CN113439235A (zh) * | 2019-02-28 | 2021-09-24 | 东京毅力科创株式会社 | 基片处理装置、基片处理方法和存储介质 |
| JP2020188124A (ja) * | 2019-05-14 | 2020-11-19 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
| JP7304737B2 (ja) | 2019-05-14 | 2023-07-07 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
| JP2023118801A (ja) * | 2019-05-14 | 2023-08-25 | 東京エレクトロン株式会社 | ノズル、吐出口部材およびノズルアーム |
| US12224187B2 (en) | 2021-08-27 | 2025-02-11 | Kioxia Corporation | Substrate processing apparatus for manufacturing semiconductor device |
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