JP2000343707A5 - - Google Patents

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Publication number
JP2000343707A5
JP2000343707A5 JP1999158646A JP15864699A JP2000343707A5 JP 2000343707 A5 JP2000343707 A5 JP 2000343707A5 JP 1999158646 A JP1999158646 A JP 1999158646A JP 15864699 A JP15864699 A JP 15864699A JP 2000343707 A5 JP2000343707 A5 JP 2000343707A5
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JP
Japan
Prior art keywords
movable member
element substrate
metal layer
movable
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1999158646A
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English (en)
Japanese (ja)
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JP3592136B2 (ja
JP2000343707A (ja
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Publication date
Application filed filed Critical
Priority claimed from JP15864699A external-priority patent/JP3592136B2/ja
Priority to JP15864699A priority Critical patent/JP3592136B2/ja
Priority to CA002309232A priority patent/CA2309232C/en
Priority to US09/577,979 priority patent/US6513911B1/en
Priority to EP00111683A priority patent/EP1057637B1/en
Priority to DE60036326T priority patent/DE60036326T2/de
Priority to AU37839/00A priority patent/AU773724B2/en
Priority to CNB001087819A priority patent/CN1133541C/zh
Publication of JP2000343707A publication Critical patent/JP2000343707A/ja
Publication of JP2000343707A5 publication Critical patent/JP2000343707A5/ja
Publication of JP3592136B2 publication Critical patent/JP3592136B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP15864699A 1999-06-04 1999-06-04 液体吐出ヘッドおよびその製造方法と微小電気機械装置の製造方法 Expired - Fee Related JP3592136B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP15864699A JP3592136B2 (ja) 1999-06-04 1999-06-04 液体吐出ヘッドおよびその製造方法と微小電気機械装置の製造方法
CA002309232A CA2309232C (en) 1999-06-04 2000-05-24 Micro-electromechanical device, liquid discharge head, and method of manufacture therefor
US09/577,979 US6513911B1 (en) 1999-06-04 2000-05-25 Micro-electromechanical device, liquid discharge head, and method of manufacture therefor
DE60036326T DE60036326T2 (de) 1999-06-04 2000-05-31 Mikroelektromechanisches Gerät, Flüssigkeitsausstosskopf und Verfahren zu seiner Herstellung
EP00111683A EP1057637B1 (en) 1999-06-04 2000-05-31 Micro-electromechanical device, liquid discharge head, and method of manufacture therefor
AU37839/00A AU773724B2 (en) 1999-06-04 2000-06-01 Micro-electromechanical device, liquid discharge head, and method of manufacture therefor
CNB001087819A CN1133541C (zh) 1999-06-04 2000-06-02 微型电动机械器件、喷液头及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15864699A JP3592136B2 (ja) 1999-06-04 1999-06-04 液体吐出ヘッドおよびその製造方法と微小電気機械装置の製造方法

Publications (3)

Publication Number Publication Date
JP2000343707A JP2000343707A (ja) 2000-12-12
JP2000343707A5 true JP2000343707A5 (enExample) 2004-07-22
JP3592136B2 JP3592136B2 (ja) 2004-11-24

Family

ID=15676268

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15864699A Expired - Fee Related JP3592136B2 (ja) 1999-06-04 1999-06-04 液体吐出ヘッドおよびその製造方法と微小電気機械装置の製造方法

Country Status (7)

Country Link
US (1) US6513911B1 (enExample)
EP (1) EP1057637B1 (enExample)
JP (1) JP3592136B2 (enExample)
CN (1) CN1133541C (enExample)
AU (1) AU773724B2 (enExample)
CA (1) CA2309232C (enExample)
DE (1) DE60036326T2 (enExample)

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* Cited by examiner, † Cited by third party
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US7344218B2 (en) * 2003-11-06 2008-03-18 Canon Kabushiki Kaisha Printhead driving method, printhead substrate, printhead, head cartridge and printing apparatus
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JP4537246B2 (ja) * 2004-05-06 2010-09-01 キヤノン株式会社 インクジェット記録ヘッド用基体の製造方法及び該方法により製造された前記基体を用いた記録ヘッドの製造方法
WO2006001531A1 (en) * 2004-06-28 2006-01-05 Canon Kabushiki Kaisha Liquid discharge head manufacturing method, and liquid discharge head obtained using this method
EP1855142A3 (en) 2004-07-29 2008-07-30 Idc, Llc System and method for micro-electromechanical operating of an interferometric modulator
JP4137027B2 (ja) * 2004-08-16 2008-08-20 キヤノン株式会社 インクジェットヘッド用基板、該基板の製造方法および前記基板を用いるインクジェットヘッド
JP4182035B2 (ja) * 2004-08-16 2008-11-19 キヤノン株式会社 インクジェットヘッド用基板、該基板の製造方法および前記基板を用いるインクジェットヘッド
US20060066932A1 (en) * 2004-09-27 2006-03-30 Clarence Chui Method of selective etching using etch stop layer
US7405861B2 (en) * 2004-09-27 2008-07-29 Idc, Llc Method and device for protecting interferometric modulators from electrostatic discharge
US7417783B2 (en) * 2004-09-27 2008-08-26 Idc, Llc Mirror and mirror layer for optical modulator and method
US7349136B2 (en) * 2004-09-27 2008-03-25 Idc, Llc Method and device for a display having transparent components integrated therein
US7373026B2 (en) * 2004-09-27 2008-05-13 Idc, Llc MEMS device fabricated on a pre-patterned substrate
US7327510B2 (en) * 2004-09-27 2008-02-05 Idc, Llc Process for modifying offset voltage characteristics of an interferometric modulator
US7429334B2 (en) * 2004-09-27 2008-09-30 Idc, Llc Methods of fabricating interferometric modulators by selectively removing a material
US20060067650A1 (en) * 2004-09-27 2006-03-30 Clarence Chui Method of making a reflective display device using thin film transistor production techniques
US7161730B2 (en) 2004-09-27 2007-01-09 Idc, Llc System and method for providing thermal compensation for an interferometric modulator display
US7492502B2 (en) * 2004-09-27 2009-02-17 Idc, Llc Method of fabricating a free-standing microstructure
US7553684B2 (en) * 2004-09-27 2009-06-30 Idc, Llc Method of fabricating interferometric devices using lift-off processing techniques
US20060065366A1 (en) * 2004-09-27 2006-03-30 Cummings William J Portable etch chamber
US7369296B2 (en) * 2004-09-27 2008-05-06 Idc, Llc Device and method for modifying actuation voltage thresholds of a deformable membrane in an interferometric modulator
US7684104B2 (en) * 2004-09-27 2010-03-23 Idc, Llc MEMS using filler material and method
JP4630680B2 (ja) * 2005-01-31 2011-02-09 キヤノン株式会社 半導体素子の製造方法およびインクジェット記録ヘッドの製造方法
TW200628877A (en) * 2005-02-04 2006-08-16 Prime View Int Co Ltd Method of manufacturing optical interference type color display
US7472975B2 (en) * 2005-07-08 2009-01-06 Canon Kabushiki Kaisha Substrate for ink jet printing head, ink jet printing head, ink jet printing apparatus, and method of blowing fuse element of ink jet printing head
EP2495212A3 (en) * 2005-07-22 2012-10-31 QUALCOMM MEMS Technologies, Inc. Mems devices having support structures and methods of fabricating the same
JP2009503564A (ja) * 2005-07-22 2009-01-29 クアルコム，インコーポレイテッド Ｍｅｍｓデバイスのための支持構造、およびその方法
CN101228093B (zh) 2005-07-22 2012-11-28 高通Mems科技公司 具有支撑结构的mems装置及其制造方法
JP2009509786A (ja) 2005-09-30 2009-03-12 クォルコム・メムズ・テクノロジーズ・インコーポレーテッド Ｍｅｍｓ装置及びｍｅｍｓ装置における相互接続
US7630114B2 (en) * 2005-10-28 2009-12-08 Idc, Llc Diffusion barrier layer for MEMS devices
US7795061B2 (en) * 2005-12-29 2010-09-14 Qualcomm Mems Technologies, Inc. Method of creating MEMS device cavities by a non-etching process
US7382515B2 (en) * 2006-01-18 2008-06-03 Qualcomm Mems Technologies, Inc. Silicon-rich silicon nitrides as etch stops in MEMS manufacture
US7652814B2 (en) 2006-01-27 2010-01-26 Qualcomm Mems Technologies, Inc. MEMS device with integrated optical element
US7547568B2 (en) * 2006-02-22 2009-06-16 Qualcomm Mems Technologies, Inc. Electrical conditioning of MEMS device and insulating layer thereof
US7450295B2 (en) * 2006-03-02 2008-11-11 Qualcomm Mems Technologies, Inc. Methods for producing MEMS with protective coatings using multi-component sacrificial layers
US7643203B2 (en) 2006-04-10 2010-01-05 Qualcomm Mems Technologies, Inc. Interferometric optical display system with broadband characteristics
US20070249078A1 (en) * 2006-04-19 2007-10-25 Ming-Hau Tung Non-planar surface structures and process for microelectromechanical systems
US7417784B2 (en) * 2006-04-19 2008-08-26 Qualcomm Mems Technologies, Inc. Microelectromechanical device and method utilizing a porous surface
US7711239B2 (en) 2006-04-19 2010-05-04 Qualcomm Mems Technologies, Inc. Microelectromechanical device and method utilizing nanoparticles
US7527996B2 (en) * 2006-04-19 2009-05-05 Qualcomm Mems Technologies, Inc. Non-planar surface structures and process for microelectromechanical systems
US7623287B2 (en) * 2006-04-19 2009-11-24 Qualcomm Mems Technologies, Inc. Non-planar surface structures and process for microelectromechanical systems
US7369292B2 (en) * 2006-05-03 2008-05-06 Qualcomm Mems Technologies, Inc. Electrode and interconnect materials for MEMS devices
US7456548B2 (en) * 2006-05-09 2008-11-25 Canon Kabushiki Kaisha Piezoelectric element, piezoelectric actuator, and ink jet recording head
US7321457B2 (en) 2006-06-01 2008-01-22 Qualcomm Incorporated Process and structure for fabrication of MEMS device having isolated edge posts
US7405863B2 (en) * 2006-06-01 2008-07-29 Qualcomm Mems Technologies, Inc. Patterning of mechanical layer in MEMS to reduce stresses at supports
US7763546B2 (en) 2006-08-02 2010-07-27 Qualcomm Mems Technologies, Inc. Methods for reducing surface charges during the manufacture of microelectromechanical systems devices
US7566664B2 (en) * 2006-08-02 2009-07-28 Qualcomm Mems Technologies, Inc. Selective etching of MEMS using gaseous halides and reactive co-etchants
US7545552B2 (en) * 2006-10-19 2009-06-09 Qualcomm Mems Technologies, Inc. Sacrificial spacer process and resultant structure for MEMS support structure
US7706042B2 (en) * 2006-12-20 2010-04-27 Qualcomm Mems Technologies, Inc. MEMS device and interconnects for same
US7535621B2 (en) 2006-12-27 2009-05-19 Qualcomm Mems Technologies, Inc. Aluminum fluoride films for microelectromechanical system applications
US7733552B2 (en) * 2007-03-21 2010-06-08 Qualcomm Mems Technologies, Inc MEMS cavity-coating layers and methods
US7719752B2 (en) * 2007-05-11 2010-05-18 Qualcomm Mems Technologies, Inc. MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same
US7625825B2 (en) * 2007-06-14 2009-12-01 Qualcomm Mems Technologies, Inc. Method of patterning mechanical layer for MEMS structures
US8068268B2 (en) * 2007-07-03 2011-11-29 Qualcomm Mems Technologies, Inc. MEMS devices having improved uniformity and methods for making them
US7570415B2 (en) * 2007-08-07 2009-08-04 Qualcomm Mems Technologies, Inc. MEMS device and interconnects for same
US7863079B2 (en) 2008-02-05 2011-01-04 Qualcomm Mems Technologies, Inc. Methods of reducing CD loss in a microelectromechanical device
JP5393596B2 (ja) 2010-05-31 2014-01-22 キヤノン株式会社 インクジェット記録装置
US8659816B2 (en) 2011-04-25 2014-02-25 Qualcomm Mems Technologies, Inc. Mechanical layer and methods of making the same
US9469109B2 (en) * 2014-11-03 2016-10-18 Stmicroelectronics S.R.L. Microfluid delivery device and method for manufacturing the same
JP6566709B2 (ja) * 2015-05-07 2019-08-28 キヤノン株式会社 インクジェット記録ヘッド用基板
US10029908B1 (en) * 2016-12-30 2018-07-24 Texas Instruments Incorporated Dielectric cladding of microelectromechanical systems (MEMS) elements for improved reliability
JP7186540B2 (ja) * 2018-08-06 2022-12-09 キヤノン株式会社 液体吐出ヘッド用基板、液体吐出ヘッド、および、液体吐出装置

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US5479197A (en) 1991-07-11 1995-12-26 Canon Kabushiki Kaisha Head for recording apparatus
ATE235375T1 (de) * 1995-04-26 2003-04-15 Canon Kk Flüssigkeitsausstosskopf, flüssigkeitsausstossgerät und flüssigkeitsausstossverfahren
JP3524340B2 (ja) 1997-08-26 2004-05-10 キヤノン株式会社 液体吐出ヘッド

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