JP2008529262A - 発熱ワイヤを具備するプリント回路基板またはカード - Google Patents
発熱ワイヤを具備するプリント回路基板またはカード Download PDFInfo
- Publication number
- JP2008529262A JP2008529262A JP2007551636A JP2007551636A JP2008529262A JP 2008529262 A JP2008529262 A JP 2008529262A JP 2007551636 A JP2007551636 A JP 2007551636A JP 2007551636 A JP2007551636 A JP 2007551636A JP 2008529262 A JP2008529262 A JP 2008529262A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- card
- heating wire
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0212—Printed circuits or mounted components having integral heating means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/014—Heaters using resistive wires or cables not provided for in H05B3/54
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Surface Heating Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Resistance Heating (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
本発明は、電圧源に接続可能な少なくとも1本の電導性発熱ワイヤをプリント回路基板またはカードの面上または内部に配置するという発想に基づく。このようにして、カードまたはプリント回路基板を発熱により所定の温度に常時保つことができる。この温度のレベルは、特定のケースに合わせて調整され、電気回路の機能、特にその電気的及び電子的構成要素の機能を妨害することがないようにされる。発熱の結果として、結露水の発生とプリント回路基板またはカードの熱膨張の大きな変化が大部分回避されるので、回路の故障しやすさが有利に減少される。
Claims (6)
- 電圧源に接続可能な少なくとも1本の電導性発熱ワイヤ(2)がプリント回路基板またはカードの面上または内部に配置される、
ことを特徴とする電気回路を有するプリント回路基板(1)またはカード。 - 前記発熱ワイヤ(2)は、ワイヤ・プリンティングによって前記プリント回路基板(1)に配置されることを特徴とする、請求項1に記載のプリント回路基板(1)またはカード。
- 前記発熱ワイヤ(2)は、前記プリント回路基板(1)またはカードと絶縁コンパウンドの層(6)との間の配線レベルに配置されることを特徴とする、請求項2に記載のプリント回路基板(1)またはカード。
- 前記発熱ワイヤ(2)は、抵抗ワイヤにより形成されることを特徴とする、前請求項の少なくとも一つに記載のプリント回路基板(1)またはカード。
- 前記発熱ワイヤ(2)は、本質的に前記プリント回路基板またはカードの全表面にわたり蛇行するように延設されることを特徴とする、前請求項の少なくとも一つに記載のプリント回路基板(1)またはカード。
- 前記発熱ワイヤ(2)は、前記プリント回路基板(1)またはカードに配置された電圧源用の接続ポイント(4)を相互に接続することを特徴とする、前請求項の少なくとも一つに記載のプリント回路基板(1)またはカード。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE202005001163.0 | 2005-01-24 | ||
DE200520001163 DE202005001163U1 (de) | 2005-01-24 | 2005-01-24 | Leiterplatte oder Platine mit Heizdraht |
PCT/EP2006/000614 WO2006077165A1 (de) | 2005-01-24 | 2006-01-24 | Leiterplatte oder platine mit heizdraht |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008529262A true JP2008529262A (ja) | 2008-07-31 |
JP5111118B2 JP5111118B2 (ja) | 2012-12-26 |
Family
ID=34400320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007551636A Active JP5111118B2 (ja) | 2005-01-24 | 2006-01-24 | 発熱ワイヤを具備するプリント回路基板またはカード |
Country Status (6)
Country | Link |
---|---|
US (1) | US8481897B2 (ja) |
EP (1) | EP1842393B1 (ja) |
JP (1) | JP5111118B2 (ja) |
AT (1) | ATE551878T1 (ja) |
DE (1) | DE202005001163U1 (ja) |
WO (1) | WO2006077165A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006014027B3 (de) * | 2006-03-27 | 2007-11-15 | Bernstein, Al, Prof.art.h. | Elektrischer Heizzellenleiter |
JP2010245031A (ja) * | 2009-03-20 | 2010-10-28 | Semiconductor Energy Lab Co Ltd | 蓄電デバイス及びその作製方法 |
US9125301B2 (en) * | 2011-10-18 | 2015-09-01 | Integrated Microwave Corporation | Integral heater assembly and method for carrier or host board of electronic package assembly |
US9012811B2 (en) * | 2012-01-13 | 2015-04-21 | Viasystems Technologies Corp. L.L.C. | Printed circuit board with embedded heater |
DE102017209641A1 (de) | 2017-06-08 | 2018-12-13 | Conti Temic Microelectronic Gmbh | Leitungsträger für ein Steuergerät und Steuergerät |
US10306776B1 (en) | 2017-11-29 | 2019-05-28 | Lam Research Corporation | Substrate processing system printed-circuit control board assembly with one or more heater layers |
US10887979B2 (en) | 2018-01-10 | 2021-01-05 | Hamilton Sunstrand Corporation | Low cycle fatigue prevention |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6114674A (en) * | 1996-10-04 | 2000-09-05 | Mcdonnell Douglas Corporation | Multilayer circuit board with electrically resistive heating element |
JP2001508942A (ja) * | 1996-12-31 | 2001-07-03 | ノキア テレコミュニカシオンス オサケ ユキチュア | 部品を加熱する方法及び構成体 |
US20020162829A1 (en) * | 1999-10-12 | 2002-11-07 | Weber Joseph M. | Thermally controlled circuit using planar resistive elements |
JP2003234045A (ja) * | 2001-12-07 | 2003-08-22 | Nec Infrontia Corp | 感圧式タッチパネル及びそれを有する情報機器 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3440407A (en) * | 1966-12-29 | 1969-04-22 | Rca Corp | Temperature controlled circuit boards |
US6541736B1 (en) | 2001-12-10 | 2003-04-01 | Usun Technology Co., Ltd. | Circuit board/printed circuit board having pre-reserved conductive heating circuits |
GB2038102B (en) * | 1978-12-20 | 1982-12-15 | Ferranti Ltd | Circuit board temperature controller |
JPS5635383A (en) * | 1979-08-29 | 1981-04-08 | Kyoto Ceramic | Semiconductor integrated circuit support with heating mechanism |
US4450623A (en) | 1981-12-18 | 1984-05-29 | Kollmorgen Technologies Corporation | Process for the manufacture of circuit boards |
US4627162A (en) | 1983-11-04 | 1986-12-09 | Augat Incorporated | Method of producing a wired circuit board |
US4769525A (en) * | 1986-09-02 | 1988-09-06 | Hughes Aircraft Company | Circuit package attachment apparatus and method |
US4950868A (en) * | 1989-03-03 | 1990-08-21 | Marmon Holdings, Inc. | Heated gloves |
JPH02245678A (ja) * | 1989-03-20 | 1990-10-01 | Fujitsu Ltd | 集積回路装置 |
DE4221454A1 (de) | 1992-06-30 | 1994-03-10 | Fibertec Gmbh | Heizelement aus elektrisch leitfähigen Fasergeweben und Verfahren zu seiner Herstellung |
JPH06243954A (ja) * | 1993-02-19 | 1994-09-02 | Nec Kansai Ltd | 自己発熱型回路基板 |
DE4318327C2 (de) | 1993-06-02 | 1997-01-30 | Siemens Ag | Gassensor |
US5624750A (en) * | 1995-05-25 | 1997-04-29 | Hughes Electronics | Adhesive heater and method for securing an object to a surface |
DE19618917C1 (de) | 1996-05-12 | 1997-10-02 | Markus Woelfel | Verfahren und Vorrichtung zur Herstellung von drahtgeschriebenen Leiterplatten |
GB2330289A (en) * | 1997-10-13 | 1999-04-14 | Ericsson Omc Limited | Heated printed circuit board |
FI981032A (fi) * | 1998-05-08 | 1999-11-09 | Nokia Networks Oy | Lämmitysmenetelmä ja piirilevy |
JP2000091714A (ja) * | 1998-07-14 | 2000-03-31 | Kazuhito Sakano | プリント基板の温度調整構造 |
DE19851172A1 (de) | 1998-11-06 | 2000-05-11 | Alcatel Sa | Anordnung zur Erwärmung einer bestückten gedruckten Schaltung |
US6263158B1 (en) * | 1999-05-11 | 2001-07-17 | Watlow Polymer Technologies | Fibrous supported polymer encapsulated electrical component |
US6396706B1 (en) * | 1999-07-30 | 2002-05-28 | Credence Systems Corporation | Self-heating circuit board |
US6483078B2 (en) * | 2000-02-09 | 2002-11-19 | Oceanit Laboratories, Inc. | Moisture control system for electrical devices |
US6492620B1 (en) * | 2001-05-18 | 2002-12-10 | Trw Inc. | Equipotential fault tolerant integrated circuit heater |
JP2003151726A (ja) * | 2001-11-19 | 2003-05-23 | Nec Corp | 加温装置、加温装置実装構造および光導波路デバイス |
US6975305B2 (en) | 2001-12-07 | 2005-12-13 | Nec Infrontia Corporation | Pressure-sensitive touch panel |
US6841739B2 (en) * | 2002-07-31 | 2005-01-11 | Motorola, Inc. | Flexible circuit board having electrical resistance heater trace |
US20040075528A1 (en) * | 2002-10-22 | 2004-04-22 | Oak-Mitsui, Inc. | Printed circuit heaters with ultrathin low resistivity materials |
JP2006295019A (ja) * | 2005-04-14 | 2006-10-26 | Fujitsu Ltd | 電子部品を基板に取り付け及び取り外す加熱装置 |
-
2005
- 2005-01-24 DE DE200520001163 patent/DE202005001163U1/de not_active Expired - Lifetime
-
2006
- 2006-01-24 JP JP2007551636A patent/JP5111118B2/ja active Active
- 2006-01-24 EP EP06703653A patent/EP1842393B1/de active Active
- 2006-01-24 US US11/814,393 patent/US8481897B2/en active Active
- 2006-01-24 AT AT06703653T patent/ATE551878T1/de active
- 2006-01-24 WO PCT/EP2006/000614 patent/WO2006077165A1/de active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6114674A (en) * | 1996-10-04 | 2000-09-05 | Mcdonnell Douglas Corporation | Multilayer circuit board with electrically resistive heating element |
JP2001508942A (ja) * | 1996-12-31 | 2001-07-03 | ノキア テレコミュニカシオンス オサケ ユキチュア | 部品を加熱する方法及び構成体 |
US20020162829A1 (en) * | 1999-10-12 | 2002-11-07 | Weber Joseph M. | Thermally controlled circuit using planar resistive elements |
JP2003234045A (ja) * | 2001-12-07 | 2003-08-22 | Nec Infrontia Corp | 感圧式タッチパネル及びそれを有する情報機器 |
Also Published As
Publication number | Publication date |
---|---|
EP1842393B1 (de) | 2012-03-28 |
EP1842393A1 (de) | 2007-10-10 |
JP5111118B2 (ja) | 2012-12-26 |
US8481897B2 (en) | 2013-07-09 |
WO2006077165A1 (de) | 2006-07-27 |
US20080105670A1 (en) | 2008-05-08 |
ATE551878T1 (de) | 2012-04-15 |
DE202005001163U1 (de) | 2005-03-31 |
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