GB2038102B - Circuit board temperature controller - Google Patents

Circuit board temperature controller

Info

Publication number
GB2038102B
GB2038102B GB7849403A GB7849403A GB2038102B GB 2038102 B GB2038102 B GB 2038102B GB 7849403 A GB7849403 A GB 7849403A GB 7849403 A GB7849403 A GB 7849403A GB 2038102 B GB2038102 B GB 2038102B
Authority
GB
United Kingdom
Prior art keywords
circuit board
temperature controller
board temperature
controller
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7849403A
Other versions
GB2038102A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ferranti International PLC
Original Assignee
Ferranti PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferranti PLC filed Critical Ferranti PLC
Priority to GB7849403A priority Critical patent/GB2038102B/en
Priority to JP16487079A priority patent/JPS5595397A/en
Publication of GB2038102A publication Critical patent/GB2038102A/en
Application granted granted Critical
Publication of GB2038102B publication Critical patent/GB2038102B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/165—Stabilizing, e.g. temperature stabilization
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Control Of Temperature (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB7849403A 1978-12-20 1978-12-20 Circuit board temperature controller Expired GB2038102B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB7849403A GB2038102B (en) 1978-12-20 1978-12-20 Circuit board temperature controller
JP16487079A JPS5595397A (en) 1978-12-20 1979-12-20 Circuit disk temperature controller

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB7849403A GB2038102B (en) 1978-12-20 1978-12-20 Circuit board temperature controller

Publications (2)

Publication Number Publication Date
GB2038102A GB2038102A (en) 1980-07-16
GB2038102B true GB2038102B (en) 1982-12-15

Family

ID=10501853

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7849403A Expired GB2038102B (en) 1978-12-20 1978-12-20 Circuit board temperature controller

Country Status (2)

Country Link
JP (1) JPS5595397A (en)
GB (1) GB2038102B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57178496U (en) * 1981-05-02 1982-11-11
GB2163008A (en) * 1984-08-08 1986-02-12 Varian Associates Miniature, temperature controlled phase detector
GB2190795B (en) * 1986-05-09 1990-01-10 Hella Kg Hueck & Co Circuit arrangement
USRE34179E (en) * 1986-12-08 1993-02-16 John Fluke Mfg. Co., Inc. Temperature controlled hybrid assembly
US4841170A (en) * 1986-12-08 1989-06-20 John Fluke Mfg. Co., Inc. Temperature controlled hybrid assembly
DE19549099C2 (en) * 1995-12-29 1999-05-20 Tele Quarz Gmbh Temperature stabilized quartz crystal of an Ostzillator circuit
DE19613559C1 (en) * 1996-04-04 1997-11-20 Stn Atlas Elektronik Gmbh Electronic device, such as artillery ranging computer, for military tank
DE19722589A1 (en) * 1997-05-30 1998-12-03 Abb Patent Gmbh Overtemperature protection device
FI981032A (en) * 1998-05-08 1999-11-09 Nokia Networks Oy Heating method and circuit board
DE10065857B4 (en) * 2000-12-22 2005-04-14 Siemens Ag Heat transfer arrangement for a plastic housing of electronic assemblies
DE202005001163U1 (en) * 2005-01-24 2005-03-31 Juma Leiterplattentechologie M Circuit board for circuitry subject to temperature fluctuations, has heating wire arranged on or in circuit board and connected to power supply

Also Published As

Publication number Publication date
JPS5595397A (en) 1980-07-19
GB2038102A (en) 1980-07-16
JPS6313359B2 (en) 1988-03-25

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee