GB2038102A - Circuit board temperature controller - Google Patents
Circuit board temperature controller Download PDFInfo
- Publication number
- GB2038102A GB2038102A GB7849403A GB7849403A GB2038102A GB 2038102 A GB2038102 A GB 2038102A GB 7849403 A GB7849403 A GB 7849403A GB 7849403 A GB7849403 A GB 7849403A GB 2038102 A GB2038102 A GB 2038102A
- Authority
- GB
- United Kingdom
- Prior art keywords
- circuit board
- temperature
- temperature controller
- leads
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0212—Printed circuits or mounted components having integral heating means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/165—Stabilizing, e.g. temperature stabilization
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Control Of Temperature (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A circuit board temperature controller comprises a plate 15 of metal or other thermal storage mass arranged to be clamped to, and electrically insulated from, the conductor side of a printed circuit board 10. The plate has a heating or cooling element 19 on the face away from the board and has an array of apertures 17 located to accept component leads protruding from the board, and any solder meniscus surrounding the lead, such that heat is transferred between sheet and components by way of the leads to control the temperature of the components. <IMAGE>
Description
SPECIFICATION
Circuit board temperature controller
This invention relates to a temperature controller and in particular to a controller for maintaining components, mounted on a circuit board, at a desired temperature.
Where a number of components mounted on a circuit board, commonly a printed circuit board, have to be maintained at a predetermined operating temperature, or within a range of temperatures, it is known to use temperature controlled ovens in which the complete circuit board is enclosed. A typical oven may consist of an enclosure with thermally conductive, preferably metal, walls in which heaters and temperature sensors are located. The circuit board is mounted in the enclosure and electrically insulated from the walls. Thermal insulation is frequently necessary surrounding the enclosure to reduce power requirement related to heat loss and to preclude any damage to adjacent components.Such an oven is wasteful of space on a circuit board where great packing density is required both of components on the board and of boards in a rack and particularly where comparatively few components need temperature control.
It is an object of the present invention to provide a circuit board temperature controller of simpler and more compact form.
According to one aspect of the present invention a circuit board temperature controller comprises a thermal transferance mass in the form of a sheet of thermally conductive material electrically insulating on at least one face, heating or cooling means carried by the sheet to change the temperature thereof and a plurality of apertures in said face of the plate at locations corresponding to protrusion of component leads through the circuit board said controller being adapted to be clamped with said one face adjacent the circuit board such that said protrusions of component leads locate in the apertures in close thermal contact with the sheet whereby the components are maintained substantially at the temperature of the sheet by way of heat flow through the component leads.
The sheet may be coextensive with the area of circuit board occupied by components whose temperatures are to be controlled. The sheet may be a plate of metal such as aluminium carrying on said one face a layer of a thermally conductive electrical insulating - material. One such material is alumina-loaded rubber.
The layer, if of flexible material such as said rubber, may extend over the ends of the apertures to be deformed thereinto by the leads. When the sheet is a metal plate the heating means may be an electrical heating element carried by the face of the plate oppo
site to that carrying the thermally conductive
electrically insulating material. The element
may be bonded to the surface and may be
wound as a bifilar spiral avoid inductance
effects.
The aperture may be blind or extend
through the plate. Edges of the apertures may
be countersunk to accommodate solder men
isci around lead protrusions.
If it is desired to avoid raising the tempera
ture of any components on the board the
apertures in the sheet, corresponding to the
protruding leads of those components, may
be made of large diameter so as to give poor thermal contact between the sheet and the
leads.
The controller may include an enclosure of
poor thermal conductivity material arranged to
enclose both the thermal transferance mass, and a circuit board with which it is used.
According to another aspect of the present
invention a temperature controlled circuit
board includes a controller as defined in any
of the preceding paragraphs, a temperature
sensor in contact with the thermal transfer
ance mass and a closed loop control circuit
responsive to the temperature sensor to main
tain the thermal transferance mass at a pre
determined temperature. The temperature sen
sor may be mounted on the circuit board so
as to make thermal contact with the sheet
clamped thereto. Where the means to change
the temperature is an electric heater it may be
supplied from the circuit board.
According to yet another aspect of the pre
sent invention a method of controlling the
temperature of components mounted on a
circuit board and having leads extending
through, and protruding from, the board com prises providing a thermal transferance mass
having an electrically insulating thermally con
ductive surface in contact with the non-com
ponent side of the board and a plurality of
apertures in said surface arranged to accom modate and make thermal contact with the
protruding parts of the leads and maintaining
the mass at a suitable temperature. The above
method may include covering the circuit
board to prevent heat loss.The method may also include sensing the temperature of the
mass by means of a temperature sensor car
ried by the circuit board and in response
thereto controlling the supply of heat to or
from the mass.
Embodiments of the invention will now be
described by way of example with reference to
the accompanying drawings, in which:~
Figure 1 is a sectional elevation of a printed
circuit board and a board temperature control ler mounted to control the temperature of
components on the board,
Figure 2 is a detailed sectional view show
ing a detail of the controller in juxtaposition
with a protruding part of a component of the circuit board,
Figure 3 is a plan view of one side of the contreller, and
Figure 4 is a sectional elevation of a printed circuit board and board temperature controller joined as a sub-assembly and mounted on a main circuit board.
Referring to Figs. 1 and 2, a printed circuit board 10 carries a plurality of components, one of which is shown at 11, each component having leads 12 extending through the board and soldered to a conductive track 13 printed on the opposite side of the board. Each lead protrudes from the plane of the board and the solder of the joint forms as a meniscus 13' between the lead 12' and track 13.
The board temperature controller, indicated at 14, comprises a thermal storage mass in the form of a rigid sheet, or plate, 15 of aluminium. A layer of electrically insulating thermally conductive alumina-loaded rubber is carried by one face of the plate.
The plate has a plurality of apertures 17 extending through it at locations corresponding to the holes on the printed circuit board such that when the plate is attached to the conductor side of the p.c.b., for example by screws 18, with the rubber layer sandwiched between them the ends 12' of the leads depress the rubber into the holes. Each hole is countersunk as shown at 17' in Fig. 2 such that the rubber conforms both to the profile of the aperture and of the meniscus 13' and provides a good thermal path over a surface area large in comparison with the protruding end of the lead. For this reason it is preferred that the rubber layer is continuous over the ends of the apertures and sufficiently flexible to be displaced by the ends of the leads into the apertures.
Referring to Figs. 1 and 3, the plate 15 also carries a heating means in the form of an electric resistive heating element 19 of insulated Nichrome bonded by epoxy adhesive to the opposite surface to the rubber layer in good thermal contact with the surface of the plate. As shown the element is bifilar wound so as to eliminate any inductive effects of current flow through the heater particularly on components of the circuit.
In operation and with the plate 15 clamped to the circuit board 10 current passed through the element 19 heats the plate 15 to a substantially uniform temperature. The rubber layer conducts the heat to the conductive tracks of the board and the protruding leads 12' and solder joints such that the components 11 receive heat both by radiation/convection/conduction from the board and by way of conduction through their leads.
As an example of a practical system the parts shown in Fig. 2 are dimensioned for a component lead of 0.5 mm., diameter;by aperture 17 is 0.15 mm., diameter and enlarged by the countersink taper to 0.25 mm.
The aperture need not extend through the plate but may be blind. Where a plurality of plates are to be made it is more convenient to drill apertures through a number of plates at one time.
If it is desired to avoid raising the temperature of any particular component or introducing a thermal lag the apertures 17 corresponding to the leads of that component may be enlarged so tha#t the lead and joint makes poor contact with the plate. To aid this the rubber layer may be provided with through apertures at these locations.
To prevent heat loss from the circuit board 10 and/or the heat controller plate 15 or possible heat effects on adjacent components the controller and relevant component section of the board may be covered by enclosures 20 comprising a cap of material such as polycarbonate having a poor thermal conductivity. The space between the components and enclosure wall may be filled with mineral or glass wool or of a moulding of rigid polyurethane foam. The enclosure containing the plate 15 may be similarly filled or the plate may carry a strip of adhesive insulating foam.
Fig. 4 shows a second embodiment of the present invention in which the heat controller plate 15 is clamped to a printed circuit board 10', as described in relation to Figs. 1 to 3, to form a sub-assembly 21 which is carried by a main circuit board 10. The whole subassembly may be enclosed by an enclosure 20'.
The temperature controller may receive heating element current from the circuit board to which it is attached and the circuit may include a closed loop system by which the temperature of the plate 15 is maintained at a constant value. Such control circuits are con ventional and will not be described here but include a temperature sensing element 22 (Fig. 4) such as a thermistor carried by the circuit board 10' and extending into contact with the plate 15. The plate 15 is insulated from the board 10 by silicone rubber foam.
The board 10' being separated from the board 10 minimises capacitive coupling between the components of the respective boards as well as restricting projections (due to the temperature controller) to one side only of the main board 10.
It will be appreciated that several design variations are possible. For instance the controller may be used and the aperture neck profile altered to suit any form of circuit board in which component leads extend through the board to a joint with a conductor as long as the joint makes a thermal contact with the plate which provides adequate heat flow to the component.
The sheet forming the thermal storage mass, described in the above embodiments as a plate 15 of aluminium, may be a plate of any thermally suitable metal, such as copper, or may be formed by a block of non-electri cally-conductive material such as the aforementioned alumina-loaded rubber dimensioned to provide the requisite thermal capacity for the circuit to be temperature controlled.
The heating means may be other than an electric heating element, for example a pipe through which heated fluid is circulated. Such a heating system would be able to serve also as a cooling system and may be formed using a a heat pipe.
Claims (21)
1. A circuit board temperature controller comprising a thermal transferance mass in the form of a sheet of thermally conductive material electrically insulating on at least one face, temperature changing means carried by the sheet to change the temperature thereof and a plurality of apertures in said face of the plate at locations corresponding to protrusion of component leads through the circuit board said controller being adapted to be clamped with said one face adjacent the circuit board such that said protrusions of component leads locate in the apertures in close thermal contact with the sheet whereby the components are maintained substantially at the temperature of the sheet by way of heat flow through the component leads.
2. A circuit board temperature controller as claimed in claim 1 in which the sheet is coextensive with the area of circuit board occupied by components whose temperatures are to be controlled.
3. A circuit board temperature controller as claimed in claim 1 or claim 2 in which the sheet is a plate of metal carrying on said one face a layer of thermally conductive electrically insulating material.
4. A circuit board temperature controller as claimed in claim 3 in which the metal is aluminium.
5. A circuit board temperature controller as claimed in claim 3 or claim 4 in which the thermally conductive electrically insulating material is alumina-loaded rubber.
6. A circuit board temperature controller as claimed on any one of claims 3 to 5 in which the rubber layer extends over the ends of the apertures to be deformed thereinto by the leads.
7. A circuit board temperature controller as claimed in any one of claims 3 to 6 in which the temperature controlling changing means comprises an electrical heating element carried by the face of the metal plate opposite to that carrying the thermally conductive élec- trically insulating material.
8. A circuit board temperature controller as claimed in claim 7 in which the heating element comprises an insulated wire formed into a bifilar spiral.
9. A circuit board temperature controller as claimed in claim 7 or claim 8 in which the heating element is bonded to the plate by an epoxy adhesive.
10. A circuit board temperature controller as claimed in any one of the preceding claims in which the edges of at least some of the apertures are countersunk to accommodate solder menisci around component lead protrusions.
11. A circuit board temperature controller as claimed in any one of the preceding claims in which apertures corresponding to protruding leads of some components, whose temperature it is not desired to control, are of a diameter greater than that of solder menisci surrounding those leads.
1 2. A circuit board temperature controller as claimed in any one of the preceding claims including an enclosure formed of a cap of low thermal conductivity material arranged to enclose both the thermal transferance mass and a a circuit board with which it is used.
13. A circuit board temperature controller as claimed in claim 12 in which the cap comprises a polycarbonate material filled with polyurethane foam.
14. A circuit board temperature controller substantially as herein described with reference to, and as shown by, the accompanying drawings.
15. A temperature controlled circuit board including a controller as claimed in any one of the preceding claims, a temperature sensor in contact with the thermal transferance mass and a closed loop control circuit responsive to the temperature sensor to maintain the sheet at a predetermined temperature.
16. A temperature controlled circuit board as claimed in claim 15 in which the sensor is mounted on the circuit board so as to make thermal contact with the thermal transferance mass.
17. A temperature controlled circuit board as claimed in claim 15 or claim 16 when dependent from any one of claims 7 to 14 in which the temperature controller is connected to receive power to the heating element from the circuit board.
18. A temperature controlled circuit board substantially as herein described with reference to, and as shown by, Fig. 1 or Fig. 4 of the accompanying drawings.
19. A method of controlling the temperature of components mounted on a circuit board having leads extending through and protruding from the board comprising providing a thermal transferance mass having an electrically insulating surface in contact with the non-component-carrying side of the board and a plurality of apertures in said surface arranged to accommodate and make thermal contact with the protruding parts of the leads and maintaining the mass at a suitable temperature.
20. A method as claimed in claim 19 including sensing the temperature of the mass by means of a temperature sensor carried by the circuit board and in response thereto controlling the flow of heat to or from the mass.
21. A method of controlling the temperature of components mounted on a circuit board substantially as herein described with reference to, and as shown in, the accompanying drawings.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB7849403A GB2038102B (en) | 1978-12-20 | 1978-12-20 | Circuit board temperature controller |
| JP16487079A JPS5595397A (en) | 1978-12-20 | 1979-12-20 | Circuit disk temperature controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB7849403A GB2038102B (en) | 1978-12-20 | 1978-12-20 | Circuit board temperature controller |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2038102A true GB2038102A (en) | 1980-07-16 |
| GB2038102B GB2038102B (en) | 1982-12-15 |
Family
ID=10501853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB7849403A Expired GB2038102B (en) | 1978-12-20 | 1978-12-20 | Circuit board temperature controller |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS5595397A (en) |
| GB (1) | GB2038102B (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2163008A (en) * | 1984-08-08 | 1986-02-12 | Varian Associates | Miniature, temperature controlled phase detector |
| GB2190795A (en) * | 1986-05-09 | 1987-11-25 | Hella Kg Hueck & Co | Circuit arrangement comprising planar resistors |
| FR2607999A1 (en) * | 1986-12-08 | 1988-06-10 | Fluke Mfg Co John | ELECTRONIC CIRCUIT ASSEMBLY CONTROLLING TEMPERATURE |
| USRE34179E (en) * | 1986-12-08 | 1993-02-16 | John Fluke Mfg. Co., Inc. | Temperature controlled hybrid assembly |
| DE19613559C1 (en) * | 1996-04-04 | 1997-11-20 | Stn Atlas Elektronik Gmbh | Electronic device, such as artillery ranging computer, for military tank |
| DE19549099A1 (en) * | 1995-12-29 | 1997-11-27 | Tele Quarz Gmbh | Temperature stabilising element e.g. for communications engineering |
| EP0881870A1 (en) * | 1997-05-30 | 1998-12-02 | ABBPATENT GmbH | Thermal protection device |
| WO1999059387A1 (en) * | 1998-05-08 | 1999-11-18 | Nokia Networks Oy | A heating method for a printed circuit board and a printed circuit board comprising a heating element |
| DE10065857A1 (en) * | 2000-12-22 | 2002-07-18 | Siemens Ag | Heat dissipation arrangement for plastic housings for electronic units has increased thermal conductivity area(s) produced during multiple component injection molding or by molding insert |
| US8481897B2 (en) * | 2005-01-24 | 2013-07-09 | Jumatech, Gmbh | Printed circuit board or card comprising a heating wire |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57178496U (en) * | 1981-05-02 | 1982-11-11 |
-
1978
- 1978-12-20 GB GB7849403A patent/GB2038102B/en not_active Expired
-
1979
- 1979-12-20 JP JP16487079A patent/JPS5595397A/en active Granted
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2163008A (en) * | 1984-08-08 | 1986-02-12 | Varian Associates | Miniature, temperature controlled phase detector |
| GB2190795B (en) * | 1986-05-09 | 1990-01-10 | Hella Kg Hueck & Co | Circuit arrangement |
| GB2190795A (en) * | 1986-05-09 | 1987-11-25 | Hella Kg Hueck & Co | Circuit arrangement comprising planar resistors |
| FR2682552A1 (en) * | 1986-12-08 | 1993-04-16 | Fluke Mfg Co John | TEMPERATURE CONTROL ELECTRONIC CIRCUIT ASSEMBLY. |
| DE3741579A1 (en) * | 1986-12-08 | 1988-06-16 | Fluke Mfg Co John | TEMPERATURE CONTROLLED HYBRID SWITCHING |
| GB2198593A (en) * | 1986-12-08 | 1988-06-15 | Fluke Mfg Co John | Temperature controlled hybrid circuit |
| GB2198593B (en) * | 1986-12-08 | 1991-07-03 | Fluke Mfg Co John | Temperature controlled hybrid assembly |
| USRE34179E (en) * | 1986-12-08 | 1993-02-16 | John Fluke Mfg. Co., Inc. | Temperature controlled hybrid assembly |
| FR2607999A1 (en) * | 1986-12-08 | 1988-06-10 | Fluke Mfg Co John | ELECTRONIC CIRCUIT ASSEMBLY CONTROLLING TEMPERATURE |
| DE19549099A1 (en) * | 1995-12-29 | 1997-11-27 | Tele Quarz Gmbh | Temperature stabilising element e.g. for communications engineering |
| DE19549099C2 (en) * | 1995-12-29 | 1999-05-20 | Tele Quarz Gmbh | Temperature stabilized quartz crystal of an Ostzillator circuit |
| DE19613559C1 (en) * | 1996-04-04 | 1997-11-20 | Stn Atlas Elektronik Gmbh | Electronic device, such as artillery ranging computer, for military tank |
| EP0881870A1 (en) * | 1997-05-30 | 1998-12-02 | ABBPATENT GmbH | Thermal protection device |
| WO1999059387A1 (en) * | 1998-05-08 | 1999-11-18 | Nokia Networks Oy | A heating method for a printed circuit board and a printed circuit board comprising a heating element |
| US6184494B1 (en) | 1998-05-08 | 2001-02-06 | Nokia Networks Oy | Printed circuit board having a heating element and heating method thereof |
| DE10065857A1 (en) * | 2000-12-22 | 2002-07-18 | Siemens Ag | Heat dissipation arrangement for plastic housings for electronic units has increased thermal conductivity area(s) produced during multiple component injection molding or by molding insert |
| DE10065857B4 (en) * | 2000-12-22 | 2005-04-14 | Siemens Ag | Heat transfer arrangement for a plastic housing of electronic assemblies |
| US8481897B2 (en) * | 2005-01-24 | 2013-07-09 | Jumatech, Gmbh | Printed circuit board or card comprising a heating wire |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5595397A (en) | 1980-07-19 |
| JPS6313359B2 (en) | 1988-03-25 |
| GB2038102B (en) | 1982-12-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101517496B (en) | Apparatus and method for thermal stabilization of pcb-mounted electronic components within an enclosed housing | |
| US4374316A (en) | Semiconductor integrated circuit supporter having a heating element | |
| GB2038102A (en) | Circuit board temperature controller | |
| US4139763A (en) | Blanket heater with temperature control means | |
| GB1573235A (en) | Heated sensor for use on aircraft and a method of making such a sensor | |
| CN108207097A (en) | A kind of heat-proof device and electronic product | |
| JPH03505543A (en) | biochemical reaction equipment | |
| US4684783A (en) | Environmental control apparatus for electrical circuit elements | |
| CN108803728A (en) | A kind of spacecraft self-regulation temp controlling heater | |
| JPS58199730A (en) | Protected electronic control device from glass product forming device atomosphere | |
| US7057139B2 (en) | Electric heating assembly | |
| US4157466A (en) | Crystal oven for maintaining crystals at a predetermined temperature | |
| IT1280150B1 (en) | COMBINATION OF COMPONENTS FOR ELECTRIC HOT PLATES, IGNITION DEVICES, TEMPERATURE SENSORS OR SIMILAR | |
| JPS63281375A (en) | Electric heating cable and assembly of the same | |
| US2955185A (en) | Constant temperature apparatus | |
| KR930702869A (en) | Electrical element assembly | |
| US3461954A (en) | Active heat transfer device | |
| RU2161384C1 (en) | Apparatus for temperature stabilization of electronic equipment | |
| EP4017213A1 (en) | Pcb for aerosol generation device | |
| US6476361B2 (en) | Heater unit for tray | |
| RU2081506C1 (en) | Quartz generator and process of its manufacture | |
| RU2051474C1 (en) | Plate-type electric heater | |
| US2170664A (en) | Temperature compensation device | |
| CN208424812U (en) | A kind of subregion controllable safety electric hot plate | |
| FR2418600A1 (en) | Circulating fluid constant temp. maintaining system - has electric resistance heating unit having cavity and clamped in pump or valve |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |