DE10065857A1 - Heat dissipation arrangement for plastic housings for electronic units has increased thermal conductivity area(s) produced during multiple component injection molding or by molding insert - Google Patents

Heat dissipation arrangement for plastic housings for electronic units has increased thermal conductivity area(s) produced during multiple component injection molding or by molding insert

Info

Publication number
DE10065857A1
DE10065857A1 DE10065857A DE10065857A DE10065857A1 DE 10065857 A1 DE10065857 A1 DE 10065857A1 DE 10065857 A DE10065857 A DE 10065857A DE 10065857 A DE10065857 A DE 10065857A DE 10065857 A1 DE10065857 A1 DE 10065857A1
Authority
DE
Germany
Prior art keywords
heat dissipation
thermal conductivity
increased thermal
injection molding
thermally conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE10065857A
Other languages
German (de)
Other versions
DE10065857B4 (en
Inventor
Christian Fricke
Ulrich Hartmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
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Siemens AG
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Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE10065857A priority Critical patent/DE10065857B4/en
Publication of DE10065857A1 publication Critical patent/DE10065857A1/en
Application granted granted Critical
Publication of DE10065857B4 publication Critical patent/DE10065857B4/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

The heat dissipation arrangement has a housing wall (1) with at least one area of increased thermal conductivity that is produced as a component of heat conducting plastic material during multiple component injection molding or by molding an insert of heat conducting plastic or metal. The heat conducting plastic component has metal powder mixed in with it.

Description

Die Erfindung betrifft die Wärmeableitung aus Kunststoffge­ häusen elektronischer Baugruppen, insbesondere aus Gehäusen, die unmittelbar als Schaltungsträger fungieren.The invention relates to heat dissipation from Kunststoffge housings of electronic assemblies, in particular of housings, which act directly as circuit carriers.

Die Wärmeableitung von elektronischen Schaltungen erfolgt üb­ licherweise durch Herausleiten der Wärme über den Substrat­ werkstoff auf die Gehäuseaußenseite oder durch Anbringen von separaten metallischen Kühlkörpern. Diese geben ihre Wärme an die Umgebung innerhalb des Gehäuses ab. Bei hohen Verlust­ leistungen der elektronischen Schaltungen müssen deshalb die Gehäuse eine entsprechende Luftzirkulation ermöglichen. Gege­ benenfalls werden zusätzlich Lüfter oder zumindest Luftaus­ lässe zur Erzielung einer Konvektion eingebaut.The heat dissipation of electronic circuits takes place Licher by dissipating the heat over the substrate material on the outside of the housing or by attaching separate metallic heat sinks. These indicate their warmth the environment inside the case. With high loss performance of the electronic circuits must therefore Allow housing to allow adequate air circulation. Gege if necessary, additional fans or at least air out built in to achieve convection.

Mit zunehmender Miniaturisierung elektronischer Baugruppen, die zu einer Steigerung der Verlustwärmedichte führt, stößt die Wärmeableitung auf mehr und mehr Schwierigkeiten.With increasing miniaturization of electronic assemblies, which leads to an increase in the heat loss density the heat dissipation on more and more difficulties.

So hat der Trend zur Miniaturisierung und zur technologisch einfachen Herstellung von Elektronik-Bauteilen in jüngster Zeit z. B. zu Systemen geführt, bei denen Leiterbahnen direkt in die innenseitige Oberfläche von Kunststoffgehäusen integriert und von dort mit Mikroprozessoren, Sensoren, Schaltern etc. verbunden sind. Auf eine separate Leiterplatte kann dann verzichtet werden. Die Wärmeableitung von leistungselektronischen Bauelementen erfolgt in herkömmlicher Weise durch Kühlkörper, die nach dem Spritzgießen des Gehäu­ ses und erfolgter Verschaltung durch Durchbrüche im Gehäuse auf die leistungselektronischen Bauelemente aufgesetzt wer­ den. Gegebenenfalls wird zur Verbesserung des Wärmeübergangs zwischen Bauelement und Kühlkörper noch eine Wärmeleitpaste eingebracht. Dieser Aufbau erfordert mehrere technologische Arbeitsgänge mit erheblichem Arbeitsaufwand.So the trend towards miniaturization and technological simple manufacture of electronic components in recent Time z. B. led to systems in which conductor tracks directly into the inside surface of plastic housings integrated and from there with microprocessors, sensors, Switches etc. are connected. On a separate circuit board can then be dispensed with. The heat dissipation from Power electronic components are conventional Way through heat sink after the injection molding of the casing This and successful connection through openings in the housing who placed on the power electronic components the. If necessary, to improve the heat transfer a thermal paste between the component and the heat sink  brought in. This structure requires several technological ones Operations with a considerable amount of work.

Der Erfindung liegt die Aufgabe zugrunde, eine Lösung für Kunststoffgehäuse elektronischer Baugruppen anzugeben, mit der die Wärmeableitung aus dem Gehäuseinneren optimiert und gleichzeitig der technologische Aufwand für die Herstellung der Gehäuse plus der wärmeableitenden Bauteile und Maßnahmen minimiert wird.The invention has for its object a solution for Specify plastic housing of electronic assemblies with which optimizes the heat dissipation from the inside of the housing and at the same time the technological effort for the production the housing plus the heat-dissipating components and measures is minimized.

Erfindungsgemäß wird die Aufgabe gelöst durch die Merkmale des Anspruchs 1. Zweckmäßige Ausgestaltungen sind Gegenstand der Unteransprüche.According to the invention, the object is achieved by the features of claim 1. Appropriate configurations are the subject of subclaims.

Danach erfolgt eine Wärmeableitung aus dem Gehäuseinneren nach außen oder eine Wärmespreizung innerhalb des Gehäuses dadurch, daß eine Gehäusewand mindestens einen Bereich erhöh­ ter thermischer Leitfähigkeit aufweist, indem dieser als eine Komponente aus einem wärmeleitenden Kunststoff beim Mehrkom­ ponentenspritzgießen oder durch Umgießen eines Inserts aus einem wärmeleitenden Kunststoff oder aus Metall hergestellt ist.This is followed by heat dissipation from the interior of the housing to the outside or heat spreading inside the case in that a housing wall increases at least one area ter thermal conductivity, by this as a Component made of a thermally conductive plastic at Mehrkom component injection molding or by casting around an insert a thermally conductive plastic or made of metal is.

Kunststoffe sind aufgrund der fehlenden freibeweglichen Elektronen schlechte Wärmeleiter. Ihre Wärmeleitfähigkeit liegt um ein mehrfaches niedriger als die von Metallen.Plastics are free to move due to the lack of them Electrons poor heat conductors. Your thermal conductivity is several times lower than that of metals.

Zur Steigerung der thermischen Leitfähigkeit können Kunst­ stoffe mit Metall- oder Keramikpulvern compoundiert werden. In den Fällen, wo bei Verwendung von Metallpulver die erhöhte elektrische Leitfähigkeit des Kunststoffes unerwünscht ist, ist der Einsatz von keramischen Füllstoffen wie Silikatoxid, Aluminiumoxid oder Berylliumoxid angezeigt. Gezielt einge­ brachte Anisotropien der Wärmeleitfähigkeit mit einer Vor­ zugsrichtung, z. B. durch faserförmige Füllstoffe, können ge­ zielt genutzt werden, um die Wärme gerichtet durch das Bau­ teil abzuleiten. To increase the thermal conductivity, art substances are compounded with metal or ceramic powders. In cases where the increased use of metal powder electrical conductivity of the plastic is undesirable, is the use of ceramic fillers such as silicate oxide, Alumina or beryllium oxide appear. Targeted brought anisotropies of thermal conductivity with a pre pull direction, z. B. by fibrous fillers, ge aims to be used to direct the heat through the construction derive part.  

Alternativ dazu ist es möglich, nur mit einer Spritzgusskom­ ponente zu arbeiten und vorgefertigte Inserts aus thermisch leitfähigem Kunststoff oder aus Keramik oder Metall, z. B. Magnesium oder Aluminium, in den Kunststoff einzubringen.Alternatively, it is possible to use only one injection molding machine component to work and pre-made inserts from thermal conductive plastic or ceramic or metal, e.g. B. Magnesium or aluminum to be introduced into the plastic.

Thermisch leitfähige Bereiche eines Kunststoffgehäuses können nicht nur zur Ableitung entstehender Wärme von Leistungsbau­ elementen dienen. Sie können auch dort zur Wärmeübertragung genutzt werden, wo gezielt Wärme durch ein Widerstandsheiz­ element erzeugt wird, um z. B. eine elektronische Baugruppe auf einer optimalen oder für deren Funktion nötigen Mindest­ temperatur zu halten oder um aus Gründen des Bedienkomforts ein "warmes" Bedienelement zur Verfügung zu haben. So können beispielsweise bei sehr niedrigen Außentemperaturen (weniger als -10°C) Bedienarmaturen in Automobilen wie Schalter oder ein Fingerprintsensor bei Fahrtbeginn so kalt sein, daß ein Finger durch Anhaften der Haut zum "Klebenbleiben" neigt. Durch Heizen eines in ein elektronisches Bauteil integrierten Bedienelements mittels Widerstandsheizung und der Wärmelei­ tung und -verteilung von dort über einen thermisch leitfähi­ gen Bereich im Gehäuse, z. B. dem Bereich unter einem Schal­ ter, gelingt es, derartiges Anhaften zu verhindern.Thermally conductive areas of a plastic housing can not only to dissipate heat from power engineering serve elements. You can also use it for heat transfer be used where targeted heat is generated by a resistance heater element is generated to z. B. an electronic assembly at an optimal minimum or necessary for their function maintain temperature or for reasons of ease of use to have a "warm" control element available. So can for example at very low outside temperatures (less than -10 ° C) control fittings in automobiles such as switches or a fingerprint sensor should be so cold at the start of the trip that a Finger tends to stick to the skin. By heating one integrated in an electronic component Control element by means of resistance heating and warmth from there and distribution via a thermally conductive gene area in the housing, for. B. the area under a scarf ter, it succeeds in preventing such attachment.

Die Erfindung hat den Vorteil, daß auf das separate Anbringen von Kühlkörpern nunmehr verzichtet werden kann. Die Wärme wird dicht am Entstehungsort aufgenommen. Außerdem werden neue gestalterische Lösungen ermöglicht.The invention has the advantage that the separate attachment heat sinks can now be dispensed with. The heat is recorded close to the place of origin. Also be enables new design solutions.

Die Erfindung soll nachstehend anhand eines Ausführungsbei­ piels näher erläutert werden. Die zugehörige Zeichnung zeigt ein Gehäuseteil eines elektronischen Bauteils mit einer Schaltung, die in die innere Oberfläche des Gehäuses integriert ist.The invention is illustrated below with the aid of an embodiment piels are explained in more detail. The accompanying drawing shows a housing part of an electronic component with a Circuit that in the inner surface of the case is integrated.

Derartige Bauteile sind unter dem Begriff 3D-MID bekannt ge­ worden. 3D-MID sind multifunktionale, produktspezifische Bauteile mit integrierten elektrischen und gegebenenfalls weite­ ren mechanischen oder optischen Funktionen.Such components are known under the term 3D-MID Service. 3D-MID are multifunctional, product-specific components  with integrated electrical and if necessary wide mechanical or optical functions.

Ein Gehäuseteil 1 aus Kunststoff trägt in seiner inneren Oberfläche Leiterbahnen 2, die mit einem Chip 3 beispiels­ weise zur Verarbeitung von Sensordaten verbunden sind. Das Gehäuseteil 1 wird im Mehrkomponentenspritzgießverfahren spritzgegossen, wobei ein Kühlkörper 4 aus wärmeleitendem Kunststoff mit angegossen wird. Auf den Kühlkörper 4 wird nach dem Spritzgießen der Chip 3 aufgesetzt. Der wärmelei­ tende Kühlkörper 4 ist ein Compound aus Kunststoff und Kera­ mikpulver.A housing part 1 made of plastic carries in its inner surface conductor tracks 2 , which are connected to a chip 3, for example for processing sensor data. The housing part 1 is injection molded in a multi-component injection molding process, a heat sink 4 made of heat-conducting plastic being cast on. The chip 3 is placed on the heat sink 4 after the injection molding. The thermally conductive heat sink 4 is a compound of plastic and ceramic powder.

Neben dem Kühlkörper 4 wird ein zweiter thermisch gut leiten­ der Bereich, nämlich ein Heizbereich 5 mit angegossen, über dem später ein Fingerprintsensor 6 angeordnet ist. In den Spritzguß integriert ist ein Widerstandsheizelement 7, mit dem der Heizbereich 5 bei niedriger Außentemperatur beheizt werden kann, so daß bei der Bedienung ein Finger nicht auf dem Fingerprintsensor 6 aufgrund der Kältewirkung anhaftet.In addition to the heat sink 4 , a second thermally well conductive area, namely a heating area 5 , over which a fingerprint sensor 6 is later arranged. Integrated in the injection molding is a resistance heating element 7 , with which the heating area 5 can be heated at a low outside temperature, so that during operation a finger does not adhere to the fingerprint sensor 6 due to the cold effect.

Claims (6)

1. Wärmeableitung aus Kunststoffgehäusen elektronischer Bau­ gruppen, insbesondere aus Gehäusen, die unmittelbar als Schaltungsträger fungieren, dadurch gekennzeichnet, daß, eine Gehäusewand (1) mindestens einen Bereich erhöhter ther­ mischer Leitfähigkeit aufweist, indem dieser als eine Kompo­ nente aus einem wärmeleitenden Kunststoff beim Mehrkomponen­ tenspritzgießen oder durch Umspritzen eines Inserts aus einem wärmeleitenden Kunststoff oder aus Metall hergestellt ist.1. heat dissipation from plastic housings electronic construction groups, in particular from housings that act directly as circuit carriers, characterized in that a housing wall ( 1 ) has at least one area of increased thermal conductivity by making it a component of a thermally conductive plastic in multi-component tensile injection molding or by overmolding an insert made of a thermally conductive plastic or metal. 2. Wärmeableitung nach Anspruch 1, dadurch gekennzeich­ net, daß der wärmeleitenden Kunststoffkomponente Metallpul­ ver beigemischt ist.2. Heat dissipation according to claim 1, characterized net that the thermally conductive plastic component Metallpul is admixed. 3. Wärmeableitung nach Anspruch 1, dadurch gekennzeich­ net, daß der wärmeleitenden Kunststoffkomponente Keramikpul­ ver beigemischt ist.3. Heat dissipation according to claim 1, characterized net that the thermally conductive plastic component ceramic pulp is admixed. 4. Wärmeableitung nach Anspruch 1, dadurch gekennzeich­ net, daß der wärmeleitenden Kunststoffkomponente Fasermate­ rial beigemischt ist.4. Heat dissipation according to claim 1, characterized net that the thermally conductive plastic component fiber mat rial is added. 5. Wärmeableitung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß der Bereich erhöhter thermi­ scher Leitfähigkeit in Verbindung mit einem Bedienelement (6) steht und durch ein Widerstandsheizelement (7) beheizt ist.5. Heat dissipation according to one of the preceding claims, characterized in that the region of increased thermal conductivity is in connection with an operating element ( 6 ) and is heated by a resistance heating element ( 7 ). 6. Wärmeableitung nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß der Bereich erhöhter thermischer Leit­ fähigkeit in Verbindung mit einer elektronischen Baugruppe steht und durch ein Widerstandsheizelement (7) beheizt ist.6. Heat dissipation according to one of claims 1 to 4, characterized in that the area of increased thermal conductivity is in connection with an electronic assembly and is heated by a resistance heating element ( 7 ).
DE10065857A 2000-12-22 2000-12-22 Heat transfer arrangement for a plastic housing of electronic assemblies Expired - Fee Related DE10065857B4 (en)

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Application Number Priority Date Filing Date Title
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DE10065857B4 DE10065857B4 (en) 2005-04-14

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10247828A1 (en) * 2002-10-14 2004-05-06 Siemens Ag Housing for electronic circuits and components, to lead off heat, is of two plastics shells, injection molded around part of a cooling body, leaving the remainder of the body for mounting components
DE10349775A1 (en) * 2003-10-24 2005-05-25 Sitronic Gmbh & Co. Kg Circuit carrier for electrical or electronic component has cooling body embedded in component carrying substrate, whereby component carrying substrate and cooling body form mechanical unit
DE102009005067A1 (en) * 2009-01-19 2010-07-22 Trw Automotive Gmbh Plate for cover for locking housing of vehicle control unit, has one or multiple areas made from one material with heat conductivity and one or multiple other areas made from another material
EP1546660B1 (en) * 2002-10-04 2012-11-28 Bourns, Inc. Non-contacting sensor multichip module with integral heat-sinks
DE102011113929A1 (en) * 2011-09-21 2013-03-21 Oechsler Aktiengesellschaft Electromechanical circuit structure for use as rack for e.g. LED in automotive environment, has deriving device deriving heat dissipated from electrical component that is contacted with injection molding casing
DE102014211443A1 (en) * 2014-06-16 2015-12-17 Robert Bosch Gmbh Control unit with thermally conductive housing wall
DE102014211438A1 (en) * 2014-06-16 2015-12-17 Robert Bosch Gmbh Control unit with thermally conductive housing wall
WO2015193026A1 (en) * 2014-06-16 2015-12-23 Robert Bosch Gmbh Control device with thermally conductive housing wall

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013219090B4 (en) * 2013-09-23 2021-02-25 Continental Automotive Gmbh Housing for a sensor system in a vehicle
DE102021117920A1 (en) 2021-07-12 2023-01-12 Valeo Schalter Und Sensoren Gmbh Detection device for monitoring at least one monitoring area, housing for a detection device, vehicle with at least one detection device and method for producing a detection device

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DE4340583A1 (en) * 1993-11-29 1995-06-01 Krautkraemer Gmbh Temperature-stabilised hybrid circuit
DE19549099A1 (en) * 1995-12-29 1997-11-27 Tele Quarz Gmbh Temperature stabilising element e.g. for communications engineering

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US3654521A (en) * 1971-01-13 1972-04-04 Gen Electric Electronic card module thermal clip
GB2038102A (en) * 1978-12-20 1980-07-16 Ferranti Ltd Circuit board temperature controller
DE3032744A1 (en) * 1979-08-30 1981-03-19 Showa Denko K.K., Tokyo ELECTRICALLY INSULATING UNDERLAY WITH HIGH HEAT CONDUCTIVITY
DE3916899A1 (en) * 1989-05-24 1990-11-29 Bosch Gmbh Robert Diverting mounting support for electronic components - has base of thermally-conducting plastics material accepting thick film circuit
DE4224682A1 (en) * 1992-07-25 1994-01-27 Riesselmann & Sohn Moulding tool for multi-component injection - has tool half with interchangeable insert having slightly larger cavity which when located in tool is fed by second runner
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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1546660B1 (en) * 2002-10-04 2012-11-28 Bourns, Inc. Non-contacting sensor multichip module with integral heat-sinks
DE10247828A1 (en) * 2002-10-14 2004-05-06 Siemens Ag Housing for electronic circuits and components, to lead off heat, is of two plastics shells, injection molded around part of a cooling body, leaving the remainder of the body for mounting components
DE10247828B4 (en) * 2002-10-14 2005-03-03 Siemens Ag Heat dissipating and radiating plastic housing with cooling / support ribs and molded heat sink and method for its production
DE10349775A1 (en) * 2003-10-24 2005-05-25 Sitronic Gmbh & Co. Kg Circuit carrier for electrical or electronic component has cooling body embedded in component carrying substrate, whereby component carrying substrate and cooling body form mechanical unit
DE10349775B4 (en) * 2003-10-24 2006-05-11 Sitronic Gmbh & Co. Kg Circuit carrier for light-emitting diodes
DE102009005067A1 (en) * 2009-01-19 2010-07-22 Trw Automotive Gmbh Plate for cover for locking housing of vehicle control unit, has one or multiple areas made from one material with heat conductivity and one or multiple other areas made from another material
DE102011113929A1 (en) * 2011-09-21 2013-03-21 Oechsler Aktiengesellschaft Electromechanical circuit structure for use as rack for e.g. LED in automotive environment, has deriving device deriving heat dissipated from electrical component that is contacted with injection molding casing
DE102011113929B4 (en) * 2011-09-21 2016-11-24 Oechsler Aktiengesellschaft Electromechanical circuit construction
DE102014211443A1 (en) * 2014-06-16 2015-12-17 Robert Bosch Gmbh Control unit with thermally conductive housing wall
DE102014211438A1 (en) * 2014-06-16 2015-12-17 Robert Bosch Gmbh Control unit with thermally conductive housing wall
WO2015193026A1 (en) * 2014-06-16 2015-12-23 Robert Bosch Gmbh Control device with thermally conductive housing wall

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