JPS5595397A - Circuit disk temperature controller - Google Patents
Circuit disk temperature controllerInfo
- Publication number
- JPS5595397A JPS5595397A JP16487079A JP16487079A JPS5595397A JP S5595397 A JPS5595397 A JP S5595397A JP 16487079 A JP16487079 A JP 16487079A JP 16487079 A JP16487079 A JP 16487079A JP S5595397 A JPS5595397 A JP S5595397A
- Authority
- JP
- Japan
- Prior art keywords
- temperature controller
- disk temperature
- circuit disk
- circuit
- controller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0212—Printed circuits or mounted components having integral heating means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/165—Stabilizing, e.g. temperature stabilization
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB7849403A GB2038102B (en) | 1978-12-20 | 1978-12-20 | Circuit board temperature controller |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5595397A true JPS5595397A (en) | 1980-07-19 |
JPS6313359B2 JPS6313359B2 (en) | 1988-03-25 |
Family
ID=10501853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16487079A Granted JPS5595397A (en) | 1978-12-20 | 1979-12-20 | Circuit disk temperature controller |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS5595397A (en) |
GB (1) | GB2038102B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57178496U (en) * | 1981-05-02 | 1982-11-11 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2163008A (en) * | 1984-08-08 | 1986-02-12 | Varian Associates | Miniature, temperature controlled phase detector |
GB2190795B (en) * | 1986-05-09 | 1990-01-10 | Hella Kg Hueck & Co | Circuit arrangement |
USRE34179E (en) * | 1986-12-08 | 1993-02-16 | John Fluke Mfg. Co., Inc. | Temperature controlled hybrid assembly |
US4841170A (en) * | 1986-12-08 | 1989-06-20 | John Fluke Mfg. Co., Inc. | Temperature controlled hybrid assembly |
DE19549099C2 (en) * | 1995-12-29 | 1999-05-20 | Tele Quarz Gmbh | Temperature stabilized quartz crystal of an Ostzillator circuit |
DE19613559C1 (en) * | 1996-04-04 | 1997-11-20 | Stn Atlas Elektronik Gmbh | Electronic device, such as artillery ranging computer, for military tank |
DE19722589A1 (en) * | 1997-05-30 | 1998-12-03 | Abb Patent Gmbh | Overtemperature protection device |
FI981032A (en) * | 1998-05-08 | 1999-11-09 | Nokia Networks Oy | Heating method and circuit board |
DE10065857B4 (en) * | 2000-12-22 | 2005-04-14 | Siemens Ag | Heat transfer arrangement for a plastic housing of electronic assemblies |
DE202005001163U1 (en) * | 2005-01-24 | 2005-03-31 | Juma Leiterplattentechologie M | Circuit board for circuitry subject to temperature fluctuations, has heating wire arranged on or in circuit board and connected to power supply |
-
1978
- 1978-12-20 GB GB7849403A patent/GB2038102B/en not_active Expired
-
1979
- 1979-12-20 JP JP16487079A patent/JPS5595397A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57178496U (en) * | 1981-05-02 | 1982-11-11 |
Also Published As
Publication number | Publication date |
---|---|
GB2038102B (en) | 1982-12-15 |
JPS6313359B2 (en) | 1988-03-25 |
GB2038102A (en) | 1980-07-16 |
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