JP2000343476A - 搬送用部材 - Google Patents

搬送用部材

Info

Publication number
JP2000343476A
JP2000343476A JP16262399A JP16262399A JP2000343476A JP 2000343476 A JP2000343476 A JP 2000343476A JP 16262399 A JP16262399 A JP 16262399A JP 16262399 A JP16262399 A JP 16262399A JP 2000343476 A JP2000343476 A JP 2000343476A
Authority
JP
Japan
Prior art keywords
prepreg
layer
carbon fiber
cfrp
volume
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16262399A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000343476A5 (enExample
Inventor
Kenichi Aoyanagi
健一 青柳
Takashi Kobayashi
孝至 小林
Daisuke Uchida
大介 内田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mitsubishi Oil Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mitsubishi Oil Corp filed Critical Nippon Mitsubishi Oil Corp
Priority to JP16262399A priority Critical patent/JP2000343476A/ja
Priority to KR1020000031629A priority patent/KR100760168B1/ko
Publication of JP2000343476A publication Critical patent/JP2000343476A/ja
Priority to US09/955,178 priority patent/US6893712B2/en
Publication of JP2000343476A5 publication Critical patent/JP2000343476A5/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/12Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer characterised by the relative arrangement of fibres or filaments of different layers, e.g. the fibres or filaments being parallel or perpendicular to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24149Honeycomb-like
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/249921Web or sheet containing structurally defined element or component
    • Y10T428/249924Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/249921Web or sheet containing structurally defined element or component
    • Y10T428/249924Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994Fiber embedded in or on the surface of a polymeric matrix
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/249921Web or sheet containing structurally defined element or component
    • Y10T428/249953Composite having voids in a component [e.g., porous, cellular, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/249921Web or sheet containing structurally defined element or component
    • Y10T428/249953Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249962Void-containing component has a continuous matrix of fibers only [e.g., porous paper, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/249921Web or sheet containing structurally defined element or component
    • Y10T428/249953Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249978Voids specified as micro
    • Y10T428/24998Composite has more than two layers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]

Landscapes

  • Laminated Bodies (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP16262399A 1999-06-09 1999-06-09 搬送用部材 Pending JP2000343476A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP16262399A JP2000343476A (ja) 1999-06-09 1999-06-09 搬送用部材
KR1020000031629A KR100760168B1 (ko) 1999-06-09 2000-06-09 반송용 부재
US09/955,178 US6893712B2 (en) 1999-06-09 2001-09-19 Transport member

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP16262399A JP2000343476A (ja) 1999-06-09 1999-06-09 搬送用部材
US09/955,178 US6893712B2 (en) 1999-06-09 2001-09-19 Transport member

Publications (2)

Publication Number Publication Date
JP2000343476A true JP2000343476A (ja) 2000-12-12
JP2000343476A5 JP2000343476A5 (enExample) 2004-12-02

Family

ID=29585894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16262399A Pending JP2000343476A (ja) 1999-06-09 1999-06-09 搬送用部材

Country Status (2)

Country Link
US (1) US6893712B2 (enExample)
JP (1) JP2000343476A (enExample)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003049157A1 (en) * 2001-12-03 2003-06-12 E. I. Du Pont De Nemours And Company Transfer member with electric conductivity and its manufacturing method
KR100511546B1 (ko) * 2001-07-05 2005-08-31 (주)애드컴텍 복합재료 로보트 암
WO2005102618A1 (ja) * 2004-04-20 2005-11-03 Nippon Oil Corporation ロボットハンド部材、その製造方法及びロボットハンド
WO2005117100A1 (ja) * 2004-05-26 2005-12-08 Nippon Oil Corporation 基板カセット用サポートバー及び基板カセット
JP2006173363A (ja) * 2004-12-16 2006-06-29 Dainippon Printing Co Ltd 搬送体
KR100674881B1 (ko) * 2005-07-22 2007-01-29 주식회사 디엠에스 기판 이송용 핸드
JP2007042962A (ja) * 2005-08-05 2007-02-15 Tocalo Co Ltd 基板処理装置用回転部材
CN100402246C (zh) * 2001-03-29 2008-07-16 日石三菱株式会社 机器人手部件及其制造方法
EP1610360A4 (en) * 2003-03-31 2010-07-14 Nippon Oil Corp DUMMY WAFER
JP2010524241A (ja) * 2007-04-05 2010-07-15 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 基板を搬送するためのエンドエフェクタおよびロボット
WO2011065435A1 (ja) * 2009-11-30 2011-06-03 Jx日鉱日石エネルギー株式会社 ロボットハンド及びその製造方法
KR20170053107A (ko) * 2016-09-12 2017-05-15 세메스 주식회사 핸드 제조 방법 및 기판 처리 방법

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007281251A (ja) * 2006-04-07 2007-10-25 E I Du Pont De Nemours & Co サポートバーおよび基板カセット
JP4278677B2 (ja) * 2006-11-30 2009-06-17 株式会社ジャムコ サンドイッチパネル
DE102008023071A1 (de) * 2008-05-09 2009-11-12 Multivac Sepp Haggenmüller Gmbh & Co. Kg Roboterstrukturelement, insbesondere für einer Verpackungsmaschine zugeordnete Roboter
JP2009285823A (ja) * 2008-05-28 2009-12-10 Meian Kokusai Gigyo Kofun Yugenkoshi ロボットアーム、並びに、その保持手段の構成材及び該構成材の製造方法
US8827339B2 (en) * 2010-03-04 2014-09-09 Jx Nippon Oil & Energy Corporation Robot hand
EP2674265A4 (en) * 2011-02-07 2014-08-06 Jx Nippon Oil & Energy Corp SHAPED TUBE BODY
EP2610165B1 (en) * 2011-12-28 2017-02-08 AIRBUS HELICOPTERS DEUTSCHLAND GmbH Composite gusset filler and method of manufacture of said composite gusset filler
KR102177156B1 (ko) * 2014-03-10 2020-11-10 삼성전자주식회사 로봇 및 그를 구비한 기판 처리 장치
JP6397205B2 (ja) * 2014-04-01 2018-09-26 Jxtgエネルギー株式会社 プリプレグ、炭素繊維強化複合材料、ロボットハンド部材及びその原料樹脂組成物
US20150290815A1 (en) * 2014-04-11 2015-10-15 Varian Semiconductor Equipment Associates, Inc. Planar end effector and method of making a planar end effector
JP6344982B2 (ja) * 2014-06-04 2018-06-20 三菱重工業株式会社 複合材構造
KR102471763B1 (ko) * 2015-03-10 2022-11-25 화이바 레인포스드 써모플라스틱스 비.브이. 섬유-강화 복합체
KR102883702B1 (ko) * 2021-04-28 2025-11-10 삼성전자주식회사 이송 유닛을 갖는 반도체 제조 장치 및 반도체 소자 형성 방법

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EP0167533B1 (en) * 1984-01-09 1990-02-07 The Boeing Company Composite material structure with integral fire protection
US4680216A (en) * 1984-09-04 1987-07-14 United Technologies Corporation Method for stabilizing thick honeycomb core composite articles
US5085928A (en) * 1989-04-06 1992-02-04 E. I. Dupont De Nemours And Company Fiber reinforced composites comprising uni-directional fiber layers and aramid spunlaced fabric layers
US5106668A (en) * 1989-06-07 1992-04-21 Hexcel Corporation Multi-layer honeycomb structure
JP2980325B2 (ja) * 1989-07-31 1999-11-22 株式会社東芝 ハニカム構造体
JPH04215599A (ja) * 1990-12-10 1992-08-06 Mitsubishi Electric Corp 超軽量サンドイッチパネル
US5204033A (en) * 1991-10-21 1993-04-20 Brunswick Corporation Method of fabricating a preform in a resin transfer molding process
JPH06190847A (ja) * 1992-12-25 1994-07-12 Nippon Oil Co Ltd 炭素繊維強化プラスチック成形体の製造方法
JP3393955B2 (ja) 1995-04-18 2003-04-07 株式会社ダイヘン 薄板状ワーク搬送用ハンド
US5653331A (en) * 1996-03-05 1997-08-05 Voith Sulzer Papiermaschinen Gmbh Paper roll guide
JP3529009B2 (ja) * 1996-10-14 2004-05-24 新日本石油株式会社 炭素繊維強化複合材
JPH11354608A (ja) * 1998-06-10 1999-12-24 Mitsubishi Chemical Corp 搬送装置用ハンド
JP2001044259A (ja) 1999-07-30 2001-02-16 Fujikura Rubber Ltd 半導体搬送腕
US6815037B2 (en) * 2001-09-19 2004-11-09 Nippon Mitsubishi Oil Corporation Carrier member made of a UV resistant fiber-reinforced composite material and process for producing thereof

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7833455B2 (en) 2001-03-29 2010-11-16 Nippon Oil Corporation Robot hand member and method of producing the same
CN100402246C (zh) * 2001-03-29 2008-07-16 日石三菱株式会社 机器人手部件及其制造方法
KR100511546B1 (ko) * 2001-07-05 2005-08-31 (주)애드컴텍 복합재료 로보트 암
CN1332419C (zh) * 2001-12-03 2007-08-15 纳幕尔杜邦公司 具有电导的转移部件及其制造方法
WO2003049157A1 (en) * 2001-12-03 2003-06-12 E. I. Du Pont De Nemours And Company Transfer member with electric conductivity and its manufacturing method
EP1610360A4 (en) * 2003-03-31 2010-07-14 Nippon Oil Corp DUMMY WAFER
JPWO2005102618A1 (ja) * 2004-04-20 2008-03-13 新日本石油株式会社 産業ロボット用ハンド及びその製造方法
WO2005102618A1 (ja) * 2004-04-20 2005-11-03 Nippon Oil Corporation ロボットハンド部材、その製造方法及びロボットハンド
JP4980712B2 (ja) * 2004-04-20 2012-07-18 Jx日鉱日石エネルギー株式会社 ロボットハンド部材、その製造方法及びロボットハンド
WO2005117100A1 (ja) * 2004-05-26 2005-12-08 Nippon Oil Corporation 基板カセット用サポートバー及び基板カセット
JP2006173363A (ja) * 2004-12-16 2006-06-29 Dainippon Printing Co Ltd 搬送体
KR100674881B1 (ko) * 2005-07-22 2007-01-29 주식회사 디엠에스 기판 이송용 핸드
JP2007042962A (ja) * 2005-08-05 2007-02-15 Tocalo Co Ltd 基板処理装置用回転部材
JP2010524241A (ja) * 2007-04-05 2010-07-15 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 基板を搬送するためのエンドエフェクタおよびロボット
WO2011065435A1 (ja) * 2009-11-30 2011-06-03 Jx日鉱日石エネルギー株式会社 ロボットハンド及びその製造方法
KR20170053107A (ko) * 2016-09-12 2017-05-15 세메스 주식회사 핸드 제조 방법 및 기판 처리 방법
KR102030729B1 (ko) 2016-09-12 2019-11-08 세메스 주식회사 핸드 제조 방법 및 기판 처리 방법

Also Published As

Publication number Publication date
US6893712B2 (en) 2005-05-17
US20030170440A1 (en) 2003-09-11

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