IN2014CN02337A - - Google Patents

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Publication number
IN2014CN02337A
IN2014CN02337A IN2337CHN2014A IN2014CN02337A IN 2014CN02337 A IN2014CN02337 A IN 2014CN02337A IN 2337CHN2014 A IN2337CHN2014 A IN 2337CHN2014A IN 2014CN02337 A IN2014CN02337 A IN 2014CN02337A
Authority
IN
India
Prior art keywords
digits
conductive
digit
capacitor
interdigitated
Prior art date
Application number
Other languages
English (en)
Inventor
Zhaoyin D Wu
Parag Upadhyaya
Xuewen Jiang
Original Assignee
Xilinx Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xilinx Inc filed Critical Xilinx Inc
Publication of IN2014CN02337A publication Critical patent/IN2014CN02337A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H01L28/60—Electrodes
    • H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
    • H01L28/86—Electrodes with an enlarged surface, e.g. formed by texturisation having horizontal extensions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Integrated Circuits (AREA)
IN2337CHN2014 2011-09-09 2012-05-29 IN2014CN02337A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/229,207 US8941974B2 (en) 2011-09-09 2011-09-09 Interdigitated capacitor having digits of varying width
PCT/US2012/039898 WO2013036306A1 (en) 2011-09-09 2012-05-29 Interdigitated capacitor having digits of varying width

Publications (1)

Publication Number Publication Date
IN2014CN02337A true IN2014CN02337A (zh) 2015-06-19

Family

ID=46319183

Family Applications (1)

Application Number Title Priority Date Filing Date
IN2337CHN2014 IN2014CN02337A (zh) 2011-09-09 2012-05-29

Country Status (8)

Country Link
US (1) US8941974B2 (zh)
EP (1) EP2754189B1 (zh)
JP (1) JP6009567B2 (zh)
KR (1) KR101871544B1 (zh)
CN (1) CN103988328B (zh)
IN (1) IN2014CN02337A (zh)
TW (1) TWI533340B (zh)
WO (1) WO2013036306A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201602427UA (en) * 2013-08-29 2016-05-30 Apocell Inc Method and apparatus for isolation, capture and molecular analysis of target particles
US9270247B2 (en) 2013-11-27 2016-02-23 Xilinx, Inc. High quality factor inductive and capacitive circuit structure
US9524964B2 (en) 2014-08-14 2016-12-20 Xilinx, Inc. Capacitor structure in an integrated circuit
WO2016104598A1 (ja) * 2014-12-26 2016-06-30 京セラ株式会社 弾性波装置
US10409426B2 (en) * 2015-04-14 2019-09-10 Ford Global Technologies, Llc Motion based capacitive sensor system
US20160343796A1 (en) * 2015-05-22 2016-11-24 Mediatek Inc. Capacitor structure and method for forming the same
US9948313B1 (en) * 2016-12-19 2018-04-17 Silicon Laboratories Inc. Magnetically differential loop filter capacitor elements and methods related to same
US12119176B2 (en) * 2021-02-19 2024-10-15 Micron Technology, Inc. Supercapacitors and integrated assemblies containing supercapacitors

Family Cites Families (136)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1899176A (en) 1929-10-24 1933-02-28 Gen Electric High frquency condenser
GB1149569A (en) 1966-09-01 1969-04-23 Mini Of Technology Capacitors and methods for their manufacture
US3593319A (en) 1968-12-23 1971-07-13 Gen Electric Card-changeable capacitor read-only memory
GB1469944A (en) 1975-04-21 1977-04-06 Decca Ltd Planar capacitor
NL7609587A (nl) 1975-09-08 1977-03-10 Ncr Co Elektrisch afstembare mnos-capaciteit.
DE2548563A1 (de) 1975-10-30 1977-05-05 Licentia Gmbh Verfahren zum herstellen eines kondensators
US4249196A (en) 1978-08-21 1981-02-03 Burroughs Corporation Integrated circuit module with integral capacitor
JPS5851552Y2 (ja) 1978-10-18 1983-11-24 株式会社日立ホームテック ガス瞬間湯沸器
JPS57106804A (en) 1980-12-25 1982-07-02 Fuji Electric Co Ltd Measuring device for thickness of film
US4427457A (en) 1981-04-07 1984-01-24 Oregon Graduate Center Method of making depthwise-oriented integrated circuit capacitors
US4409608A (en) 1981-04-28 1983-10-11 The United States Of America As Represented By The Secretary Of The Navy Recessed interdigitated integrated capacitor
US4470096A (en) 1982-06-18 1984-09-04 Motorola Inc. Multilayer, fully-trimmable, film-type capacitor and method of adjustment
US4470099A (en) 1982-09-17 1984-09-04 Matsushita Electric Industrial Co., Ltd. Laminated capacitor
JPS5991718U (ja) 1982-12-11 1984-06-21 株式会社村田製作所 コンデンサアレイ
US4571543A (en) 1983-03-28 1986-02-18 Southwest Medical Products, Inc. Specific material detection and measuring device
DE3326957C2 (de) 1983-07-27 1986-07-31 Telefunken electronic GmbH, 7100 Heilbronn Integrierte Schaltung
JPH0682783B2 (ja) 1985-03-29 1994-10-19 三菱電機株式会社 容量およびその製造方法
JPS61259560A (ja) 1985-05-14 1986-11-17 Nec Corp 半導体集積回路
JPS61263251A (ja) 1985-05-17 1986-11-21 Nec Corp 半導体装置
US4827323A (en) 1986-01-07 1989-05-02 Texas Instruments Incorporated Stacked capacitor
US4831431A (en) 1986-03-31 1989-05-16 Honeywell Inc. Capacitance stabilization
JPS6370550A (ja) 1986-09-12 1988-03-30 Nec Corp 半導体集積回路装置
JPS6370550U (zh) 1986-10-27 1988-05-12
US4878151A (en) 1987-04-10 1989-10-31 National Semiconductor Corporation Anti-parallel capacitor
US4731696A (en) 1987-05-26 1988-03-15 National Semiconductor Corporation Three plate integrated circuit capacitor
JPH0196943A (ja) 1987-10-09 1989-04-14 Toshiba Corp 半導体集積回路装置
US4994688A (en) 1988-05-25 1991-02-19 Hitachi Ltd. Semiconductor device having a reference voltage generating circuit
JPH01298322A (ja) * 1988-05-27 1989-12-01 Fuji Photo Film Co Ltd 交叉くし形電極対
JPH01313917A (ja) 1988-06-13 1989-12-19 Taiyo Yuden Co Ltd 積層型電子部品
JPH038360Y2 (zh) 1988-10-26 1991-02-28
US4914546A (en) 1989-02-03 1990-04-03 Micrel Incorporated Stacked multi-polysilicon layer capacitor
JPH02231755A (ja) 1989-03-03 1990-09-13 Mitsubishi Electric Corp Ｍｉｍ容量を備えたモノリシック集積回路
JPH02268439A (ja) 1989-04-10 1990-11-02 Hitachi Ltd 半導体集積回路装置
JPH02307275A (ja) 1989-05-23 1990-12-20 Seiko Epson Corp 半導体装置
US5089878A (en) 1989-06-09 1992-02-18 Lee Jaesup N Low impedance packaging
JPH0244129A (ja) 1989-06-21 1990-02-14 Mitsubishi Petrochem Co Ltd 温水式床暖房構造の施工方法
EP0412514A1 (en) 1989-08-08 1991-02-13 Nec Corporation Capacitance device
JPH03181165A (ja) * 1989-12-11 1991-08-07 Sharp Corp インターデジタルキャパシタ
US5117114A (en) 1989-12-11 1992-05-26 The Regents Of The University Of California High resolution amorphous silicon radiation detectors
US5021920A (en) 1990-03-30 1991-06-04 Texas Instruments Incorporated Multilevel integrated circuit capacitor and method of fabrication
JPH0831392B2 (ja) 1990-04-26 1996-03-27 株式会社村田製作所 積層コンデンサ
JP2504606B2 (ja) 1990-05-18 1996-06-05 株式会社東芝 半導体記憶装置およびその製造方法
JP2590618B2 (ja) 1990-05-31 1997-03-12 松下電器産業株式会社 画像表示装置
US5005103A (en) 1990-06-05 1991-04-02 Samsung Electronics Co., Ltd. Method of manufacturing folded capacitors in semiconductor and folded capacitors fabricated thereby
JP2700959B2 (ja) 1991-02-25 1998-01-21 三菱電機株式会社 集積回路のキャパシタ
US5077225A (en) 1991-04-30 1991-12-31 Micron Technology, Inc. Process for fabricating a stacked capacitor within a monolithic integrated circuit using oxygen implantation
US5189594A (en) 1991-09-20 1993-02-23 Rohm Co., Ltd. Capacitor in a semiconductor integrated circuit and non-volatile memory using same
US5166858A (en) 1991-10-30 1992-11-24 Xilinx, Inc. Capacitor formed in three conductive layers
US5155658A (en) 1992-03-05 1992-10-13 Bell Communications Research, Inc. Crystallographically aligned ferroelectric films usable in memories and method of crystallographically aligning perovskite films
US5275974A (en) 1992-07-30 1994-01-04 Northern Telecom Limited Method of forming electrodes for trench capacitors
US5208725A (en) 1992-08-19 1993-05-04 Akcasu Osman E High capacitance structure in a semiconductor device
JPH07283076A (ja) 1994-04-15 1995-10-27 Nippon Telegr & Teleph Corp <Ntt> キャパシタ
AUPM596394A0 (en) 1994-05-31 1994-06-23 Dyksterhuis, Francis Henry Games and puzzles
US5583359A (en) 1995-03-03 1996-12-10 Northern Telecom Limited Capacitor structure for an integrated circuit
JPH09199973A (ja) * 1996-01-17 1997-07-31 Kazuhiko Yamanouchi 弾性表面波変換器
US5872697A (en) 1996-02-13 1999-02-16 International Business Machines Corporation Integrated circuit having integral decoupling capacitor
US5939766A (en) 1996-07-24 1999-08-17 Advanced Micro Devices, Inc. High quality capacitor for sub-micrometer integrated circuits
US5712813A (en) 1996-10-17 1998-01-27 Zhang; Guobiao Multi-level storage capacitor structure with improved memory density
US6064108A (en) 1997-09-02 2000-05-16 Hughes Electronics Corporation Integrated interdigitated capacitor
US6066537A (en) 1998-02-02 2000-05-23 Tritech Microelectronics, Ltd. Method for fabricating a shielded multilevel integrated circuit capacitor
JPH11274887A (ja) * 1998-03-26 1999-10-08 Masao Takeuchi 弾性表面波変換器
US6037621A (en) 1998-07-29 2000-03-14 Lucent Technologies Inc. On-chip capacitor structure
US6677637B2 (en) 1999-06-11 2004-01-13 International Business Machines Corporation Intralevel decoupling capacitor, method of manufacture and testing circuit of the same
JP4446525B2 (ja) 1999-10-27 2010-04-07 株式会社ルネサステクノロジ 半導体装置
US6417556B1 (en) 2000-02-02 2002-07-09 Advanced Micro Devices, Inc. High K dielectric de-coupling capacitor embedded in backend interconnect
US6383858B1 (en) 2000-02-16 2002-05-07 Agere Systems Guardian Corp. Interdigitated capacitor structure for use in an integrated circuit
US6303456B1 (en) 2000-02-25 2001-10-16 International Business Machines Corporation Method for making a finger capacitor with tuneable dielectric constant
US6538282B1 (en) * 2000-03-14 2003-03-25 Oki Electric Industry Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
JP2001267503A (ja) * 2000-03-16 2001-09-28 Toshiba Corp キャパシタ及び集積回路
US6747307B1 (en) 2000-04-04 2004-06-08 Koninklijke Philips Electronics N.V. Combined transistor-capacitor structure in deep sub-micron CMOS for power amplifiers
US6297524B1 (en) 2000-04-04 2001-10-02 Philips Electronics North America Corporation Multilayer capacitor structure having an array of concentric ring-shaped plates for deep sub-micron CMOS
US6822312B2 (en) 2000-04-07 2004-11-23 Koninklijke Philips Electronics N.V. Interdigitated multilayer capacitor structure for deep sub-micron CMOS
US6410954B1 (en) 2000-04-10 2002-06-25 Koninklijke Philips Electronics N.V. Multilayered capacitor structure with alternately connected concentric lines for deep sub-micron CMOS
US6570210B1 (en) 2000-06-19 2003-05-27 Koninklijke Philips Electronics N.V. Multilayer pillar array capacitor structure for deep sub-micron CMOS
US7259945B2 (en) 2000-08-09 2007-08-21 Server Technology, Inc. Active arc-suppression circuit, system, and method of use
US6635916B2 (en) 2000-08-31 2003-10-21 Texas Instruments Incorporated On-chip capacitor
US6974744B1 (en) 2000-09-05 2005-12-13 Marvell International Ltd. Fringing capacitor structure
US6625006B1 (en) 2000-09-05 2003-09-23 Marvell International, Ltd. Fringing capacitor structure
US6690570B2 (en) 2000-09-14 2004-02-10 California Institute Of Technology Highly efficient capacitor structures with enhanced matching properties
US6385033B1 (en) 2000-09-29 2002-05-07 Intel Corporation Fingered capacitor in an integrated circuit
US6653681B2 (en) 2000-12-30 2003-11-25 Texas Instruments Incorporated Additional capacitance for MIM capacitors with no additional processing
US6980414B1 (en) 2004-06-16 2005-12-27 Marvell International, Ltd. Capacitor structure in a semiconductor device
US6542351B1 (en) 2001-06-28 2003-04-01 National Semiconductor Corp. Capacitor structure
US6740922B2 (en) 2001-08-14 2004-05-25 Agere Systems Inc. Interdigitated capacitor and method of manufacturing thereof
DE10145462B4 (de) 2001-09-14 2006-01-26 Infineon Technologies Ag Schaltungsanordnung zur Verringerung einer Degradation eines Feldeffekt-Transistors
US6661079B1 (en) 2002-02-20 2003-12-09 National Semiconductor Corporation Semiconductor-based spiral capacitor
US6737698B1 (en) 2002-03-11 2004-05-18 Silicon Laboratories, Inc. Shielded capacitor structure
JP4014432B2 (ja) * 2002-03-28 2007-11-28 ユーディナデバイス株式会社 インタディジタルキャパシタ及びその容量調整方法
GB0207857D0 (en) 2002-04-05 2002-05-15 Zarlink Semiconductor Ltd Integrated circuit capacitors
DE10217567A1 (de) 2002-04-19 2003-11-13 Infineon Technologies Ag Halbleiterbauelement mit integrierter Kapazitätsstruktur und Verfahren zu dessen Herstellung
DE10217565A1 (de) 2002-04-19 2003-11-13 Infineon Technologies Ag Halbleiterbauelement mit integrierter gitterförmiger Kapazitätsstruktur
US7271465B2 (en) 2002-04-24 2007-09-18 Qualcomm Inc. Integrated circuit with low-loss primary conductor strapped by lossy secondary conductor
TW541646B (en) 2002-07-11 2003-07-11 Acer Labs Inc Polar integrated capacitor and method of making same
DE10249192A1 (de) 2002-10-22 2004-05-13 Infineon Technologies Ag Elektronisches Bauelement mit integriertem passiven elektronischen Bauelement und Verfahren zu dessen Herstellung
DE10303738B4 (de) 2003-01-30 2007-12-27 Infineon Technologies Ag Speicherkondensator und Speicherzellenanordnung
GB2398169B (en) 2003-02-06 2006-02-22 Zarlink Semiconductor Ltd An electrical component structure
US6963122B1 (en) 2003-02-21 2005-11-08 Barcelona Design, Inc. Capacitor structure and automated design flow for incorporating same
US6819542B2 (en) 2003-03-04 2004-11-16 Taiwan Semiconductor Manufacturing Co., Ltd. Interdigitated capacitor structure for an integrated circuit
US6765778B1 (en) 2003-04-04 2004-07-20 Freescale Semiconductor, Inc. Integrated vertical stack capacitor
US6880134B2 (en) 2003-04-09 2005-04-12 Freescale Semiconductor, Inc. Method for improving capacitor noise and mismatch constraints in a semiconductor device
US7013436B1 (en) 2003-05-25 2006-03-14 Barcelona Design, Inc. Analog circuit power distribution circuits and design methodologies for producing same
US6949781B2 (en) 2003-10-10 2005-09-27 Taiwan Semiconductor Manufacturing Co. Ltd. Metal-over-metal devices and the method for manufacturing same
US6972463B2 (en) 2003-10-20 2005-12-06 United Microelectronics Corp. Multi-finger transistor
US7259956B2 (en) 2003-12-19 2007-08-21 Broadcom Corporation Scalable integrated circuit high density capacitors
US7205854B2 (en) 2003-12-23 2007-04-17 Intel Corporation On-chip transistor degradation monitoring
US7282937B2 (en) 2003-12-31 2007-10-16 Intel Corporation On-chip frequency degradation compensation
US7050290B2 (en) 2004-01-30 2006-05-23 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated capacitor
US6933869B1 (en) 2004-03-17 2005-08-23 Altera Corporation Integrated circuits with temperature-change and threshold-voltage drift compensation
US6903918B1 (en) 2004-04-20 2005-06-07 Texas Instruments Incorporated Shielded planar capacitor
FR2870042B1 (fr) 2004-05-07 2006-09-29 St Microelectronics Sa Structure capacitive de circuit integre
US7154734B2 (en) 2004-09-20 2006-12-26 Lsi Logic Corporation Fully shielded capacitor cell structure
JP4343085B2 (ja) 2004-10-26 2009-10-14 Ｎｅｃエレクトロニクス株式会社 半導体装置
US7009832B1 (en) 2005-03-14 2006-03-07 Broadcom Corporation High density metal-to-metal maze capacitor with optimized capacitance matching
US7202548B2 (en) 2005-09-13 2007-04-10 Via Technologies, Inc. Embedded capacitor with interdigitated structure
US7368902B2 (en) 2005-10-28 2008-05-06 International Business Machines Corporation Impedance calibration for source series terminated serial link transmitter
TWI296852B (en) 2005-12-07 2008-05-11 Winbond Electronics Corp Interdigitized capacitor
US7161228B1 (en) 2005-12-28 2007-01-09 Analog Devices, Inc. Three-dimensional integrated capacitance structure
US7645675B2 (en) 2006-01-13 2010-01-12 International Business Machines Corporation Integrated parallel plate capacitors
US20070181973A1 (en) 2006-02-06 2007-08-09 Cheng-Chou Hung Capacitor structure
TWI271754B (en) 2006-02-16 2007-01-21 Jmicron Technology Corp Three-dimensional capacitor structure
KR100876881B1 (ko) 2006-02-24 2008-12-31 주식회사 하이닉스반도체 반도체 소자의 패드부
US7274085B1 (en) 2006-03-09 2007-09-25 United Microelectronics Corp. Capacitor structure
JP2009540541A (ja) 2006-06-02 2009-11-19 ケネット・インコーポレーテッド 改良された金属‐絶縁体‐金属キャパシタ
US8330251B2 (en) 2006-06-26 2012-12-11 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device structure for reducing mismatch effects
US7838919B2 (en) * 2007-03-29 2010-11-23 Panasonic Corporation Capacitor structure
JP5274857B2 (ja) * 2007-03-29 2013-08-28 パナソニック株式会社 キャパシタ構造
US7564264B1 (en) 2007-05-14 2009-07-21 Xilinx, Inc. Preventing transistor damage
US20090057826A1 (en) 2007-09-04 2009-03-05 Kim Sun-Oo Semiconductor Devices and Methods of Manufacture Thereof
US7944732B2 (en) 2008-11-21 2011-05-17 Xilinx, Inc. Integrated capacitor with alternating layered segments
US8362589B2 (en) 2008-11-21 2013-01-29 Xilinx, Inc. Integrated capacitor with cabled plates
US7994610B1 (en) 2008-11-21 2011-08-09 Xilinx, Inc. Integrated capacitor with tartan cross section
US8207592B2 (en) 2008-11-21 2012-06-26 Xilinx, Inc. Integrated capacitor with array of crosses
US7994609B2 (en) 2008-11-21 2011-08-09 Xilinx, Inc. Shielding for integrated capacitors
US7956438B2 (en) 2008-11-21 2011-06-07 Xilinx, Inc. Integrated capacitor with interlinked lateral fins
US8255858B2 (en) * 2008-11-26 2012-08-28 Broadcom Corporation Method for adjusting capacitance of capacitors without affecting die area
US8653844B2 (en) 2011-03-07 2014-02-18 Xilinx, Inc. Calibrating device performance within an integrated circuit

Also Published As

Publication number Publication date
KR101871544B1 (ko) 2018-08-02
TWI533340B (zh) 2016-05-11
JP2014531751A (ja) 2014-11-27
KR20140062493A (ko) 2014-05-23
US20130063861A1 (en) 2013-03-14
EP2754189B1 (en) 2020-12-16
TW201312613A (zh) 2013-03-16
CN103988328B (zh) 2016-12-21
US8941974B2 (en) 2015-01-27
EP2754189A1 (en) 2014-07-16
CN103988328A (zh) 2014-08-13
WO2013036306A1 (en) 2013-03-14
JP6009567B2 (ja) 2016-10-19

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