FR2870042B1 - Structure capacitive de circuit integre - Google Patents
Structure capacitive de circuit integreInfo
- Publication number
- FR2870042B1 FR2870042B1 FR0404992A FR0404992A FR2870042B1 FR 2870042 B1 FR2870042 B1 FR 2870042B1 FR 0404992 A FR0404992 A FR 0404992A FR 0404992 A FR0404992 A FR 0404992A FR 2870042 B1 FR2870042 B1 FR 2870042B1
- Authority
- FR
- France
- Prior art keywords
- integrated circuit
- capacitive structure
- circuit capacitive
- integrated
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
- H01G4/385—Single unit multiple capacitors, e.g. dual capacitor in one coil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
- H01L23/5223—Capacitor integral with wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/0805—Capacitors only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0404992A FR2870042B1 (fr) | 2004-05-07 | 2004-05-07 | Structure capacitive de circuit integre |
US11/123,831 US7170178B2 (en) | 2004-05-07 | 2005-05-06 | Capacitive integrated circuit structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0404992A FR2870042B1 (fr) | 2004-05-07 | 2004-05-07 | Structure capacitive de circuit integre |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2870042A1 FR2870042A1 (fr) | 2005-11-11 |
FR2870042B1 true FR2870042B1 (fr) | 2006-09-29 |
Family
ID=34945882
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0404992A Expired - Fee Related FR2870042B1 (fr) | 2004-05-07 | 2004-05-07 | Structure capacitive de circuit integre |
Country Status (2)
Country | Link |
---|---|
US (1) | US7170178B2 (fr) |
FR (1) | FR2870042B1 (fr) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4997786B2 (ja) * | 2006-02-17 | 2012-08-08 | 富士通セミコンダクター株式会社 | 半導体集積回路装置 |
FR2935533B1 (fr) * | 2008-08-27 | 2011-07-22 | St Microelectronics Sa | Condensateur tridimensionnel et procede de conception topologique d'un tel condensateur. |
US7944732B2 (en) * | 2008-11-21 | 2011-05-17 | Xilinx, Inc. | Integrated capacitor with alternating layered segments |
US7994610B1 (en) | 2008-11-21 | 2011-08-09 | Xilinx, Inc. | Integrated capacitor with tartan cross section |
US8362589B2 (en) * | 2008-11-21 | 2013-01-29 | Xilinx, Inc. | Integrated capacitor with cabled plates |
US7994609B2 (en) * | 2008-11-21 | 2011-08-09 | Xilinx, Inc. | Shielding for integrated capacitors |
US7956438B2 (en) * | 2008-11-21 | 2011-06-07 | Xilinx, Inc. | Integrated capacitor with interlinked lateral fins |
US8207592B2 (en) * | 2008-11-21 | 2012-06-26 | Xilinx, Inc. | Integrated capacitor with array of crosses |
US8378450B2 (en) | 2009-08-27 | 2013-02-19 | International Business Machines Corporation | Interdigitated vertical parallel capacitor |
US8653844B2 (en) | 2011-03-07 | 2014-02-18 | Xilinx, Inc. | Calibrating device performance within an integrated circuit |
US8941974B2 (en) | 2011-09-09 | 2015-01-27 | Xilinx, Inc. | Interdigitated capacitor having digits of varying width |
JP5776849B2 (ja) * | 2012-06-28 | 2015-09-09 | 株式会社村田製作所 | 高周波伝送線路および電子機器 |
US9450041B2 (en) * | 2012-11-28 | 2016-09-20 | Marvell World Trade Ltd. | Stackable high-density metal-oxide-metal capacitor with minimum top plate parasitic capacitance |
US9270247B2 (en) | 2013-11-27 | 2016-02-23 | Xilinx, Inc. | High quality factor inductive and capacitive circuit structure |
US9524964B2 (en) | 2014-08-14 | 2016-12-20 | Xilinx, Inc. | Capacitor structure in an integrated circuit |
US10177216B2 (en) | 2016-06-02 | 2019-01-08 | Mediatek Inc. | Metal-oxide-metal capacitor |
CN105957787B (zh) * | 2016-06-17 | 2024-03-29 | 深圳市槟城电子股份有限公司 | 一种气体放电管用组件、气体放电管及其集成件 |
US11870028B2 (en) * | 2017-02-14 | 2024-01-09 | Volkswagen Ag | Electric vehicle battery cell with internal series connection stacking |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5208725A (en) * | 1992-08-19 | 1993-05-04 | Akcasu Osman E | High capacitance structure in a semiconductor device |
US5583359A (en) * | 1995-03-03 | 1996-12-10 | Northern Telecom Limited | Capacitor structure for an integrated circuit |
US6297524B1 (en) * | 2000-04-04 | 2001-10-02 | Philips Electronics North America Corporation | Multilayer capacitor structure having an array of concentric ring-shaped plates for deep sub-micron CMOS |
KR100368930B1 (ko) * | 2001-03-29 | 2003-01-24 | 한국과학기술원 | 반도체 기판 위에 높이 떠 있는 3차원 금속 소자, 그 회로모델, 및 그 제조방법 |
EP1369922B1 (fr) * | 2002-06-07 | 2011-03-09 | STMicroelectronics Srl | Structure d'un anneau d'alimentation métallique multicouche avec grande résistance parasite |
-
2004
- 2004-05-07 FR FR0404992A patent/FR2870042B1/fr not_active Expired - Fee Related
-
2005
- 2005-05-06 US US11/123,831 patent/US7170178B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20050259379A1 (en) | 2005-11-24 |
US7170178B2 (en) | 2007-01-30 |
FR2870042A1 (fr) | 2005-11-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20140131 |