IL95739A - A polymerizable mixture by radiation and a process for producing a solder-resistant mask - Google Patents
A polymerizable mixture by radiation and a process for producing a solder-resistant maskInfo
- Publication number
- IL95739A IL95739A IL9573990A IL9573990A IL95739A IL 95739 A IL95739 A IL 95739A IL 9573990 A IL9573990 A IL 9573990A IL 9573990 A IL9573990 A IL 9573990A IL 95739 A IL95739 A IL 95739A
- Authority
- IL
- Israel
- Prior art keywords
- radiation
- weight
- mixture
- methacrylic acid
- polymerizable mixture
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 60
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims description 29
- 230000008569 process Effects 0.000 title claims description 24
- 150000001875 compounds Chemical class 0.000 claims abstract description 22
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000011230 binding agent Substances 0.000 claims abstract description 11
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 11
- 239000000049 pigment Substances 0.000 claims abstract description 10
- 239000003999 initiator Substances 0.000 claims abstract description 8
- 229910052500 inorganic mineral Inorganic materials 0.000 claims abstract description 8
- 239000011707 mineral Substances 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 5
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 claims abstract description 3
- 125000005397 methacrylic acid ester group Chemical group 0.000 claims description 8
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 6
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 claims description 6
- 239000000975 dye Substances 0.000 claims description 6
- 239000000178 monomer Substances 0.000 claims description 6
- 238000005406 washing Methods 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 229920001223 polyethylene glycol Polymers 0.000 claims description 5
- 230000005855 radiation Effects 0.000 claims description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000002202 Polyethylene glycol Substances 0.000 claims description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 4
- 239000003505 polymerization initiator Substances 0.000 claims description 4
- 238000006116 polymerization reaction Methods 0.000 claims description 4
- 229920001451 polypropylene glycol Polymers 0.000 claims description 4
- -1 vinyl heterocyclic compound Chemical class 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims description 3
- KTZVZZJJVJQZHV-UHFFFAOYSA-N 1-chloro-4-ethenylbenzene Chemical compound ClC1=CC=C(C=C)C=C1 KTZVZZJJVJQZHV-UHFFFAOYSA-N 0.000 claims description 2
- NVZWEEGUWXZOKI-UHFFFAOYSA-N 1-ethenyl-2-methylbenzene Chemical compound CC1=CC=CC=C1C=C NVZWEEGUWXZOKI-UHFFFAOYSA-N 0.000 claims description 2
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 claims description 2
- ISRGONDNXBCDBM-UHFFFAOYSA-N 2-chlorostyrene Chemical compound ClC1=CC=CC=C1C=C ISRGONDNXBCDBM-UHFFFAOYSA-N 0.000 claims description 2
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 claims description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 2
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- 125000005396 acrylic acid ester group Chemical group 0.000 claims description 2
- 125000005907 alkyl ester group Chemical group 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- PBGVMIDTGGTBFS-UHFFFAOYSA-N but-3-enylbenzene Chemical compound C=CCCC1=CC=CC=C1 PBGVMIDTGGTBFS-UHFFFAOYSA-N 0.000 claims description 2
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- 229920006037 cross link polymer Polymers 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims description 2
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 claims description 2
- SFBTTWXNCQVIEC-UHFFFAOYSA-N o-Vinylanisole Chemical compound COC1=CC=CC=C1C=C SFBTTWXNCQVIEC-UHFFFAOYSA-N 0.000 claims description 2
- 229920000909 polytetrahydrofuran Polymers 0.000 claims description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 6
- BOVQCIDBZXNFEJ-UHFFFAOYSA-N 1-chloro-3-ethenylbenzene Chemical compound ClC1=CC=CC(C=C)=C1 BOVQCIDBZXNFEJ-UHFFFAOYSA-N 0.000 claims 1
- 239000004698 Polyethylene Substances 0.000 claims 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 claims 1
- 239000004615 ingredient Substances 0.000 claims 1
- 229920002554 vinyl polymer Polymers 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 25
- 238000011161 development Methods 0.000 abstract description 10
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 abstract description 4
- 125000005395 methacrylic acid group Chemical group 0.000 abstract description 4
- 239000004848 polyfunctional curative Substances 0.000 abstract description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 description 21
- 239000000243 solution Substances 0.000 description 20
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 12
- 239000007787 solid Substances 0.000 description 11
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 11
- 230000018109 developmental process Effects 0.000 description 9
- 150000002118 epoxides Chemical class 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- JSGVZVOGOQILFM-UHFFFAOYSA-N 3-methoxy-1-butanol Chemical compound COC(C)CCO JSGVZVOGOQILFM-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000002585 base Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
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- 239000003513 alkali Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 150000001298 alcohols Chemical class 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
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- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
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- ONPGOSVDVDPBCY-CQSZACIVSA-N 6-amino-5-[(1r)-1-(2,6-dichloro-3-fluorophenyl)ethoxy]-n-[4-(4-methylpiperazine-1-carbonyl)phenyl]pyridazine-3-carboxamide Chemical compound O([C@H](C)C=1C(=C(F)C=CC=1Cl)Cl)C(C(=NN=1)N)=CC=1C(=O)NC(C=C1)=CC=C1C(=O)N1CCN(C)CC1 ONPGOSVDVDPBCY-CQSZACIVSA-N 0.000 description 1
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- 239000004416 thermosoftening plastic Substances 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
- C08F257/02—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00 on to polymers of styrene or alkyl-substituted styrenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/20—Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/136—Coating process making radiation sensitive element
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Polymerisation Methods In General (AREA)
- Epoxy Resins (AREA)
- Dental Preparations (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Reinforced Plastic Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3931467A DE3931467A1 (de) | 1989-09-21 | 1989-09-21 | Durch strahlung polymerisierbares gemisch und verfahren zur herstellung einer loetstopmaske |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL95739A0 IL95739A0 (en) | 1991-06-30 |
| IL95739A true IL95739A (en) | 1995-03-15 |
Family
ID=6389856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL9573990A IL95739A (en) | 1989-09-21 | 1990-09-19 | A polymerizable mixture by radiation and a process for producing a solder-resistant mask |
Country Status (15)
| Country | Link |
|---|---|
| US (2) | US5264324A (ko) |
| EP (1) | EP0418733B1 (ko) |
| JP (1) | JP2662083B2 (ko) |
| KR (1) | KR0161970B1 (ko) |
| AT (1) | ATE162316T1 (ko) |
| AU (1) | AU633363B2 (ko) |
| CA (1) | CA2025831C (ko) |
| DE (2) | DE3931467A1 (ko) |
| DK (1) | DK0418733T3 (ko) |
| ES (1) | ES2110956T3 (ko) |
| FI (1) | FI904605A0 (ko) |
| IE (1) | IE903402A1 (ko) |
| IL (1) | IL95739A (ko) |
| NO (1) | NO904115L (ko) |
| ZA (1) | ZA907479B (ko) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2706858B2 (ja) * | 1991-07-30 | 1998-01-28 | 富士写真フイルム株式会社 | 光重合性組成物 |
| DE4142735A1 (de) * | 1991-12-21 | 1993-06-24 | Hoechst Ag | Durch strahlung polymerisierbares gemisch und verfahren zur herstellung einer loetstoppmaske |
| US5389497A (en) * | 1992-06-03 | 1995-02-14 | Nippon Paint Co., Ltd. | Method for forming patterned solder mask |
| DE4234072A1 (de) * | 1992-10-09 | 1994-04-14 | Morton Int Inc | Durch Strahlung polymerisierbares Gemisch und Verfahren zur Herstellung einer Lötstoppmaske |
| DE4316087A1 (de) * | 1993-05-13 | 1994-11-17 | Morton Int Inc | Verfahren zum bildmäßigen Metallisieren von strukturierten Leiterplatten |
| DE4336901A1 (de) * | 1993-10-28 | 1995-05-04 | Du Pont Deutschland | Photopolymerisierbares Gemisch und Verfahren zur Herstellung von Lötstopmasken |
| US5545510A (en) * | 1995-03-28 | 1996-08-13 | Mac Dermid, Inc. | Photodefinable dielectric composition useful in the manufacture of printed circuits |
| US5925499A (en) * | 1995-08-01 | 1999-07-20 | Morton International, Inc. | Epoxy-containing waterborne photoimageable composition |
| US5844308A (en) * | 1997-08-20 | 1998-12-01 | Cts Corporation | Integrated circuit anti-bridging leads design |
| US5874197A (en) * | 1997-09-18 | 1999-02-23 | E. I. Du Pont De Nemours And Company | Thermal assisted photosensitive composition and method thereof |
| US6645696B1 (en) * | 2001-11-30 | 2003-11-11 | Euv Llc. | Photoimageable composition |
| DE10204114A1 (de) * | 2002-02-01 | 2003-08-14 | Basf Coatings Ag | Thermisch und mit aktinischer Strahlung härtbares Stoffgemisch, Verfahren zu seiner Herstellung und seine Verwendung |
| TW200304449A (en) * | 2002-02-15 | 2003-10-01 | Shipley Co Llc | Functionalized polymer, method of preparing the same, and photoimageable composition |
| JP4500657B2 (ja) * | 2004-11-30 | 2010-07-14 | 旭化成イーマテリアルズ株式会社 | パターン形成材料、並びにパターン形成装置及びパターン形成方法 |
| JP2006208730A (ja) * | 2005-01-27 | 2006-08-10 | Fuji Photo Film Co Ltd | パターン形成材料、並びにパターン形成装置及びパターン形成方法 |
| JP5661293B2 (ja) * | 2010-02-08 | 2015-01-28 | 太陽ホールディングス株式会社 | 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板 |
| JP5829035B2 (ja) * | 2011-03-31 | 2015-12-09 | 太陽インキ製造株式会社 | 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板 |
| CN103477282A (zh) * | 2011-04-13 | 2013-12-25 | 太阳油墨制造株式会社 | 光固化性树脂组合物、干膜、固化物及印刷电路板 |
| DE102011083791A1 (de) * | 2011-09-29 | 2013-04-04 | Robert Bosch Gmbh | Verfahren zur Herstellung einer Lötverbindung |
| TWI541594B (zh) * | 2011-09-30 | 2016-07-11 | Taiyo Ink Mfg Co Ltd | A photosensitive resin composition, a hardened film thereof, and a printed wiring board |
| JP2017165846A (ja) | 2016-03-15 | 2017-09-21 | アーゼッド・エレクトロニック・マテリアルズ（ルクセンブルグ）ソシエテ・ア・レスポンサビリテ・リミテ | 微細パターン形成用組成物およびそれを用いた微細パターン形成方法 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2064080C3 (de) * | 1970-12-28 | 1983-11-03 | Hoechst Ag, 6230 Frankfurt | Lichtempfindliches Gemisch |
| US3887450A (en) * | 1971-02-04 | 1975-06-03 | Dynachem Corp | Photopolymerizable compositions containing polymeric binding agents |
| US3776729A (en) * | 1971-02-22 | 1973-12-04 | Ibm | Photosensitive dielectric composition and process of using the same |
| DE2363806B2 (de) * | 1973-12-21 | 1979-05-17 | Hoechst Ag, 6000 Frankfurt | Lichtempfindliches Gemisch |
| ZA757984B (en) * | 1974-10-04 | 1976-12-29 | Dynachem Corp | Polymers for aqueous processed photoresists |
| DE2861486D1 (en) * | 1977-11-21 | 1982-02-18 | Ciba Geigy Ag | Process for the application of soldering masks to printed circuits with through holes for contacting |
| US4278752A (en) * | 1978-09-07 | 1981-07-14 | E. I. Du Pont De Nemours And Company | Flame retardant radiation sensitive element |
| CA1154287A (en) * | 1979-02-26 | 1983-09-27 | Joseph E. Gervay | Dry-developing photosensitive dry film resist |
| US4390615A (en) * | 1979-11-05 | 1983-06-28 | Courtney Robert W | Coating compositions |
| DE3114931A1 (de) * | 1981-04-13 | 1982-10-28 | Hoechst Ag, 6000 Frankfurt | Durch strahlung polymerisierbares gemisch und daraus hergestelltes photopolymerisierbares kopiermaterial |
| DE3120052A1 (de) * | 1981-05-20 | 1982-12-09 | Hoechst Ag, 6000 Frankfurt | Durch strahlung polymerisierbares gemisch und damit hergestelltes kopiermaterial |
| DE3134123A1 (de) * | 1981-08-28 | 1983-03-17 | Hoechst Ag, 6000 Frankfurt | Durch strahlung polymerisierbares gemisch und daraushergestelltes photopolymerisierbares kopiermaterial |
| DE3265242D1 (en) * | 1981-09-17 | 1985-09-12 | Ciba Geigy Ag | Light-sensitive coating agent and its use in protection purposes |
| CA1194637A (en) * | 1982-04-26 | 1985-10-01 | Charles R. Morgan | Uv and thermally curable, thermoplastic-containing compositions |
| DE3236560A1 (de) * | 1982-10-02 | 1984-04-05 | Hoechst Ag, 6230 Frankfurt | Lichtempfindliches schichtuebertragungsmaterial und verfahren zur herstellung einer photoresistschablone |
| US4479983A (en) * | 1983-01-07 | 1984-10-30 | International Business Machines Corporation | Method and composition for applying coatings on printed circuit boards |
| DE3412992A1 (de) * | 1984-04-06 | 1985-10-24 | Hoechst Ag, 6230 Frankfurt | Durch strahlung polymerisierbares gemisch und verfahren zum aufbringen von markierungen auf eine loetstopresistschicht |
| JPH0618856B2 (ja) * | 1986-02-14 | 1994-03-16 | 日本合成ゴム株式会社 | 液状感光性樹脂組成物およびそれを用いる画像形成法 |
| JPS63258975A (ja) * | 1986-12-26 | 1988-10-26 | Toshiba Corp | ソルダーレジストインキ組成物 |
| JP2604173B2 (ja) * | 1987-02-25 | 1997-04-30 | 東京応化工業株式会社 | 耐熱性感光性樹脂組成物 |
| JP2604174B2 (ja) * | 1987-03-25 | 1997-04-30 | 東京応化工業株式会社 | 耐熱性感光性樹脂組成物 |
| JPH0717737B2 (ja) * | 1987-11-30 | 1995-03-01 | 太陽インキ製造株式会社 | 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法 |
| KR940007784B1 (ko) * | 1987-12-07 | 1994-08-25 | 모르톤 티오콜 인코오포레이티드 | 광영상 조성물 및 이를 사용한 필름 형성 방법 |
| JPH0748108B2 (ja) * | 1988-02-02 | 1995-05-24 | イビデン株式会社 | 感光性樹脂組成物 |
| JPH01203424A (ja) * | 1988-02-09 | 1989-08-16 | Toagosei Chem Ind Co Ltd | 硬化性組成物 |
-
1989
- 1989-09-21 DE DE3931467A patent/DE3931467A1/de not_active Withdrawn
-
1990
- 1990-09-13 DK DK90117636T patent/DK0418733T3/da active
- 1990-09-13 DE DE59010796T patent/DE59010796D1/de not_active Expired - Fee Related
- 1990-09-13 EP EP90117636A patent/EP0418733B1/de not_active Expired - Lifetime
- 1990-09-13 ES ES90117636T patent/ES2110956T3/es not_active Expired - Lifetime
- 1990-09-13 AT AT90117636T patent/ATE162316T1/de not_active IP Right Cessation
- 1990-09-19 FI FI904605A patent/FI904605A0/fi not_active Application Discontinuation
- 1990-09-19 ZA ZA907479A patent/ZA907479B/xx unknown
- 1990-09-19 IL IL9573990A patent/IL95739A/en not_active IP Right Cessation
- 1990-09-19 KR KR1019900014795A patent/KR0161970B1/ko not_active IP Right Cessation
- 1990-09-20 JP JP25168090A patent/JP2662083B2/ja not_active Expired - Fee Related
- 1990-09-20 CA CA002025831A patent/CA2025831C/en not_active Expired - Fee Related
- 1990-09-20 IE IE340290A patent/IE903402A1/en not_active IP Right Cessation
- 1990-09-20 US US07/585,642 patent/US5264324A/en not_active Expired - Lifetime
- 1990-09-20 NO NO90904115A patent/NO904115L/no unknown
- 1990-09-20 AU AU63047/90A patent/AU633363B2/en not_active Ceased
-
1993
- 1993-10-27 US US08/144,115 patent/US5387486A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US5387486A (en) | 1995-02-07 |
| KR0161970B1 (ko) | 1999-01-15 |
| NO904115L (no) | 1991-03-22 |
| JP2662083B2 (ja) | 1997-10-08 |
| AU633363B2 (en) | 1993-01-28 |
| ATE162316T1 (de) | 1998-01-15 |
| ES2110956T3 (es) | 1998-03-01 |
| IE903402A1 (en) | 1991-04-10 |
| EP0418733A2 (de) | 1991-03-27 |
| IL95739A0 (en) | 1991-06-30 |
| AU6304790A (en) | 1991-03-28 |
| CA2025831A1 (en) | 1991-03-22 |
| JPH03164742A (ja) | 1991-07-16 |
| KR910006781A (ko) | 1991-04-30 |
| DK0418733T3 (da) | 1998-09-07 |
| CA2025831C (en) | 2001-11-20 |
| ZA907479B (en) | 1991-06-26 |
| FI904605A0 (fi) | 1990-09-19 |
| DE59010796D1 (de) | 1998-02-19 |
| NO904115D0 (no) | 1990-09-20 |
| DE3931467A1 (de) | 1991-04-04 |
| EP0418733B1 (de) | 1998-01-14 |
| EP0418733A3 (en) | 1992-03-04 |
| US5264324A (en) | 1993-11-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| KB | Patent renewed | ||
| HP | Change in proprietorship | ||
| KB | Patent renewed | ||
| MM9K | Patent not in force due to non-payment of renewal fees |