IL148872A - Module containing controlled minienvironment for atmospheric wafer transport - Google Patents

Module containing controlled minienvironment for atmospheric wafer transport

Info

Publication number
IL148872A
IL148872A IL14887200A IL14887200A IL148872A IL 148872 A IL148872 A IL 148872A IL 14887200 A IL14887200 A IL 14887200A IL 14887200 A IL14887200 A IL 14887200A IL 148872 A IL148872 A IL 148872A
Authority
IL
Israel
Prior art keywords
minienvironment
module containing
wafer transport
containing controlled
atmospheric wafer
Prior art date
Application number
IL14887200A
Other languages
English (en)
Other versions
IL148872A0 (en
Inventor
Faro F Kaveh
David E Jacob
Dean Jay Larson
Martin R Maraschin
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23623640&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=IL148872(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of IL148872A0 publication Critical patent/IL148872A0/xx
Publication of IL148872A publication Critical patent/IL148872A/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Ventilation (AREA)
IL14887200A 1999-09-30 2000-09-28 Module containing controlled minienvironment for atmospheric wafer transport IL148872A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/410,190 US6364762B1 (en) 1999-09-30 1999-09-30 Wafer atmospheric transport module having a controlled mini-environment
PCT/US2000/027015 WO2001024233A1 (fr) 1999-09-30 2000-09-28 Module de transport atmospherique de plaquettes a mini-environnement regule

Publications (2)

Publication Number Publication Date
IL148872A0 IL148872A0 (en) 2002-09-12
IL148872A true IL148872A (en) 2005-08-31

Family

ID=23623640

Family Applications (1)

Application Number Title Priority Date Filing Date
IL14887200A IL148872A (en) 1999-09-30 2000-09-28 Module containing controlled minienvironment for atmospheric wafer transport

Country Status (9)

Country Link
US (1) US6364762B1 (fr)
EP (1) EP1218926B1 (fr)
JP (1) JP4632612B2 (fr)
KR (1) KR100660361B1 (fr)
CN (1) CN1189917C (fr)
DE (1) DE60013869T2 (fr)
IL (1) IL148872A (fr)
TW (1) TW462076B (fr)
WO (1) WO2001024233A1 (fr)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6660055B2 (en) * 2001-10-25 2003-12-09 Asm Technology Singapore Pte Ltd. Compartment for maintaining a clean production environment
TW509097U (en) * 2002-01-18 2002-11-01 Ritdisplay Corp Transporting device for evaporation
US20040069409A1 (en) * 2002-10-11 2004-04-15 Hippo Wu Front opening unified pod door opener with dust-proof device
KR100483428B1 (ko) * 2003-01-24 2005-04-14 삼성전자주식회사 기판 가공 장치
KR100505061B1 (ko) * 2003-02-12 2005-08-01 삼성전자주식회사 기판 이송 모듈
TWI228750B (en) * 2003-02-25 2005-03-01 Samsung Electronics Co Ltd Apparatus and method for processing wafers
CN1307692C (zh) * 2003-04-29 2007-03-28 力晶半导体股份有限公司 稳定材料层性质的方法
US6913654B2 (en) * 2003-06-02 2005-07-05 Mykrolis Corporation Method for the removal of airborne molecular contaminants using water gas mixtures
DE102004026883B4 (de) * 2004-05-27 2014-12-24 Inova Pharma Systems Gmbh Anordnung zum sterilen Abfüllen
WO2005121027A2 (fr) * 2004-06-04 2005-12-22 Durr Ecoclean, Inc. Module d'usinage integre servant au traitement de pieces a travailler et procede d'assemblage du module
JP2006019726A (ja) * 2004-06-29 2006-01-19 Samsung Electronics Co Ltd ウェーハ移送システム及びシステム内の圧力調整方法
KR100583730B1 (ko) * 2004-06-29 2006-05-26 삼성전자주식회사 기판 이송 시스템 및 상기 시스템의 프레임 내 압력을조절하는 방법
US20070134821A1 (en) * 2004-11-22 2007-06-14 Randhir Thakur Cluster tool for advanced front-end processing
US20060156979A1 (en) * 2004-11-22 2006-07-20 Applied Materials, Inc. Substrate processing apparatus using a batch processing chamber
KR20080034492A (ko) * 2005-08-03 2008-04-21 엔테그리스, 아이엔씨. 이송 용기
JP5030410B2 (ja) * 2005-09-28 2012-09-19 株式会社日立ハイテクノロジーズ 真空処理装置
KR101224454B1 (ko) * 2005-11-01 2013-01-22 엘지디스플레이 주식회사 액정 표시 장치용 리프터 장비
US8794896B2 (en) * 2005-12-14 2014-08-05 Tokyo Electron Limited Vacuum processing apparatus and zonal airflow generating unit
US20070144118A1 (en) * 2005-12-22 2007-06-28 Alvarez Daniel Jr Purging of a wafer conveyance container
JP5124096B2 (ja) * 2006-03-03 2013-01-23 川崎重工業株式会社 清潔空間用ロボットシステム
JP4606388B2 (ja) * 2006-06-12 2011-01-05 川崎重工業株式会社 基板移載装置の搬送系ユニット
US8757026B2 (en) 2008-04-15 2014-06-24 Dynamic Micro Systems, Semiconductor Equipment Gmbh Clean transfer robot
FR2933813B1 (fr) * 2008-07-11 2010-12-24 Alcatel Lucent Dispositif de purge et procede.
KR101541538B1 (ko) * 2008-12-19 2015-08-04 세메스 주식회사 웨이퍼 이송 유닛 및 이를 포함하는 프로브 스테이션
JP5796972B2 (ja) * 2010-06-14 2015-10-21 株式会社日立国際電気 基板処理装置
CN102162531A (zh) * 2010-12-27 2011-08-24 北京七星华创电子股份有限公司 风门装置
TWI514089B (zh) 2011-04-28 2015-12-21 Mapper Lithography Ip Bv 在微影系統中用於轉移基板的設備
CN102768977B (zh) * 2011-05-06 2015-09-02 北京北方微电子基地设备工艺研究中心有限责任公司 机械手、大气传输单元和晶片传输方法
CN103917466B (zh) 2011-09-14 2019-01-04 布鲁克斯自动化公司 装载工位
US9272315B2 (en) * 2013-10-11 2016-03-01 Taiwan Semiconductor Manufacturing Co., Ltd Mechanisms for controlling gas flow in enclosure
TWI678751B (zh) * 2013-12-13 2019-12-01 日商昕芙旎雅股份有限公司 設備前端模組(efem)
KR102343640B1 (ko) * 2014-12-15 2021-12-30 세메스 주식회사 기판 처리 장치
US9550219B2 (en) * 2014-12-29 2017-01-24 Daifuku Co., Ltd. Apparatus of inhalation type for stocking wafer at ceiling and inhaling type wafer stocking system having the same
SG11201800143RA (en) * 2015-08-04 2018-02-27 Hitachi Int Electric Inc Substrate processing device, semiconductor device manufacturing method, and recording medium
KR102618491B1 (ko) * 2016-10-31 2023-12-28 삼성전자주식회사 기판 이송 장치
CN110549316B (zh) * 2018-06-04 2021-06-22 沈阳新松机器人自动化股份有限公司 一种防水型洁净机器人
CN110549315B (zh) * 2018-06-04 2021-06-22 沈阳新松机器人自动化股份有限公司 一种迷宫式防水型洁净机器人

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6162740A (ja) * 1984-09-03 1986-03-31 Sanki Eng Co Ltd クリ−ントンネル送風清浄装置
KR920007809B1 (ko) * 1984-10-11 1992-09-17 가부시기가이샤 히다찌 세이사꾸쇼 클린 룸
US4723480A (en) * 1985-04-19 1988-02-09 Hitachi, Ltd. Manufacturing apparatus with air cleaning device
JPH0761618B2 (ja) * 1985-04-19 1995-07-05 株式会社日立製作所 製品製造装置
DE3704505A1 (de) 1987-02-13 1988-08-25 Leybold Ag Einlegegeraet fuer vakuumanlagen
KR0155158B1 (ko) 1989-07-25 1998-12-01 카자마 젠쥬 종형 처리 장치 및 처리방법
JP2986121B2 (ja) 1991-03-26 1999-12-06 東京エレクトロン株式会社 ロードロック装置及び真空処理装置
US5488964A (en) 1991-05-08 1996-02-06 Tokyo Electron Limited Washing apparatus, and washing method
JPH04334579A (ja) * 1991-05-08 1992-11-20 Tokyo Electron Ltd 洗浄装置
JP2696024B2 (ja) * 1991-11-07 1998-01-14 三菱電機株式会社 ウェット処理装置及びその制御方法
KR100221983B1 (ko) 1993-04-13 1999-09-15 히가시 데쓰로 처리장치
JP3470370B2 (ja) * 1994-01-24 2003-11-25 富士通株式会社 塵埃粒子発生位置特定装置および方法ならびにクリーンルーム
US5538385A (en) 1994-06-24 1996-07-23 Kensington Laboratories, Inc. Specimen carrier holder and method of operating it
US5833726A (en) * 1995-05-26 1998-11-10 Extraction System, Inc. Storing substrates between process steps within a processing facility
TW317644B (fr) 1996-01-26 1997-10-11 Tokyo Electron Co Ltd
JP3218425B2 (ja) * 1996-03-25 2001-10-15 東京エレクトロン株式会社 処理方法及び処理装置
JP3784117B2 (ja) 1996-11-13 2006-06-07 東京応化工業株式会社 基板の処理装置
JPH10312942A (ja) 1997-05-13 1998-11-24 Kokusai Electric Co Ltd 半導体製造装置
US6312525B1 (en) 1997-07-11 2001-11-06 Applied Materials, Inc. Modular architecture for semiconductor wafer fabrication equipment
JP4048387B2 (ja) 1997-09-10 2008-02-20 東京エレクトロン株式会社 ロードロック機構及び処理装置

Also Published As

Publication number Publication date
IL148872A0 (en) 2002-09-12
EP1218926B1 (fr) 2004-09-15
TW462076B (en) 2001-11-01
DE60013869T2 (de) 2005-09-22
JP2003510837A (ja) 2003-03-18
DE60013869D1 (de) 2004-10-21
EP1218926A1 (fr) 2002-07-03
JP4632612B2 (ja) 2011-02-16
KR20020047196A (ko) 2002-06-21
WO2001024233A1 (fr) 2001-04-05
CN1377510A (zh) 2002-10-30
US6364762B1 (en) 2002-04-02
CN1189917C (zh) 2005-02-16
KR100660361B1 (ko) 2006-12-21

Similar Documents

Publication Publication Date Title
IL148872A (en) Module containing controlled minienvironment for atmospheric wafer transport
AU5324600A (en) Semiconductor wafer carrier
EP1075418A4 (fr) Systeme de purge pour nacelle smif commande par depression
AU5682898A (en) Device for processing semiconductor wafers
AU6587394A (en) Semiconductor wafer transport container
HK1039475A1 (zh) 加襯墊的晶片容器
AU5295400A (en) Surface mount package for power semiconductor devices
EP1242198A4 (fr) Dispositif de traitement d'une plaquette a semi-conducteur simple
AU2002354691A1 (en) Wafer transport apparatus
AU6952500A (en) System for aligning rectangular wafers
AU5684799A (en) Substrate transport apparatus
AU2002332026A1 (en) System for cushioning wafer in wafer carrier
AU2001284456A1 (en) Substrate transporting device
AU6802200A (en) Atmospheric wafer transfer module with nest for wafer transport robot and methodof implementing same
SG103273A1 (en) Serial wafer handling mechanism
TW328294U (en) Container for semiconductor wafers with unique wafer cushioning means
AU6051700A (en) Semiconductor processing platform architecture having processing module isolation capabilities
SG67498A1 (en) Group iii-v compound semiconductor wafer
AU3529100A (en) Vacuum system for securing a semiconductor wafer
GB9907717D0 (en) System for growing material over semiconductor wafer
EP1067644A4 (fr) Module laser a semi-conducteur
AU7381200A (en) Semiconductor wafer level package
EP1087042A4 (fr) Plaquette de silicium
IL128087A0 (en) Buffer system for a wafer handling system
GB9909182D0 (en) Lead frames for semiconductor devices

Legal Events

Date Code Title Description
FF Patent granted
KB Patent renewed
KB Patent renewed
KB Patent renewed
MM9K Patent not in force due to non-payment of renewal fees