AU2001284456A1 - Substrate transporting device - Google Patents

Substrate transporting device

Info

Publication number
AU2001284456A1
AU2001284456A1 AU2001284456A AU8445601A AU2001284456A1 AU 2001284456 A1 AU2001284456 A1 AU 2001284456A1 AU 2001284456 A AU2001284456 A AU 2001284456A AU 8445601 A AU8445601 A AU 8445601A AU 2001284456 A1 AU2001284456 A1 AU 2001284456A1
Authority
AU
Australia
Prior art keywords
transporting device
substrate transporting
substrate
transporting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001284456A
Inventor
Norio Maruyama
Yasuo Mori
Yoshihisa Taniguchi
Daisuke Yokoi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Optical Co Ltd filed Critical Olympus Optical Co Ltd
Publication of AU2001284456A1 publication Critical patent/AU2001284456A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
AU2001284456A 2000-09-06 2001-09-06 Substrate transporting device Abandoned AU2001284456A1 (en)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2000-270330 2000-09-06
JP2000270330 2000-09-06
JP2000280883 2000-09-14
JP2000-280883 2000-09-14
JP2000-285988 2000-09-20
JP2000285988 2000-09-20
JP2000285640 2000-09-20
JP2000-285640 2000-09-20
PCT/JP2001/007737 WO2002021589A1 (en) 2000-09-06 2001-09-06 Substrate transporting device

Publications (1)

Publication Number Publication Date
AU2001284456A1 true AU2001284456A1 (en) 2002-03-22

Family

ID=27481592

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001284456A Abandoned AU2001284456A1 (en) 2000-09-06 2001-09-06 Substrate transporting device

Country Status (7)

Country Link
US (1) US6675666B2 (en)
JP (1) JP3975164B2 (en)
KR (1) KR100444009B1 (en)
CN (1) CN1202568C (en)
AU (1) AU2001284456A1 (en)
TW (1) TW559855B (en)
WO (1) WO2002021589A1 (en)

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TWI231964B (en) * 2003-03-10 2005-05-01 Phicom Corp LCD panel auto gripping apparatus and method for use in a panel carrier for an automatic probe unit
JP2004294406A (en) * 2003-03-28 2004-10-21 Denso Corp Semiconductor dynamics quantity sensor and its carrying method, and collet sucking method
CN102152966B (en) * 2003-04-30 2013-03-27 奥林巴斯株式会社 Substrate-levitating device
US20040246335A1 (en) * 2003-06-04 2004-12-09 Zaki George Abdel Messih N-times multiplied enlarging system of a microscopic view observation of any object (including infinitesimal objects) on several stages The system comprises microscopes, digital video cameras, computers, and TV's in a circuit
US7077019B2 (en) * 2003-08-08 2006-07-18 Photon Dynamics, Inc. High precision gas bearing split-axis stage for transport and constraint of large flat flexible media during processing
JP2005286102A (en) * 2004-03-30 2005-10-13 Hitachi High-Technologies Corp Vacuum processing equipment and vacuum processing method
TWI252315B (en) * 2004-03-31 2006-04-01 De & T Co Ltd Inspection apparatus for flat display panel
JP2006269497A (en) 2005-03-22 2006-10-05 Olympus Corp Substrate-treating device and substrate storage method
WO2006118152A1 (en) * 2005-04-27 2006-11-09 Olympus Corporation Visual inspection apparatus, visual inspection method and periphery inspection unit attachable to visual inspection apparatus
JP4589853B2 (en) * 2005-09-22 2010-12-01 東京エレクトロン株式会社 Substrate transport system and substrate transport method
JP2007256173A (en) * 2006-03-24 2007-10-04 Olympus Corp Visual inspection device
JP5120018B2 (en) * 2007-05-15 2013-01-16 東京エレクトロン株式会社 Probe device
NL1036785A1 (en) * 2008-04-18 2009-10-20 Asml Netherlands Bv Rapid exchange device for lithography reticles.
JP5518550B2 (en) * 2010-04-12 2014-06-11 東京エレクトロン株式会社 Object processing equipment
JP5614326B2 (en) 2010-08-20 2014-10-29 東京エレクトロン株式会社 Substrate transport apparatus, substrate transport method, and recording medium on which program for executing the substrate transport method is recorded
US8936994B2 (en) * 2011-04-28 2015-01-20 Mapper Lithography Ip B.V. Method of processing a substrate in a lithography system
JP2013093389A (en) * 2011-10-24 2013-05-16 Hitachi High-Technologies Corp Optical inspection device and edge inspection device
JP6422695B2 (en) 2014-07-18 2018-11-14 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus and substrate processing method
KR102516801B1 (en) 2014-11-10 2023-03-31 브룩스 오토메이션 인코퍼레이티드 Tool auto-teach method and apparatus
WO2016076722A2 (en) 2014-11-14 2016-05-19 Mapper Lithography Ip B.V. Load lock system and method for transferring substrates in a lithography system
CN105161469A (en) * 2015-09-17 2015-12-16 沈阳拓荆科技有限公司 8-inch/12-inch substrate general platform structure
TWI614822B (en) * 2016-06-29 2018-02-11 All Ring Tech Co Ltd Substrate inspection method and device
CN106773170A (en) * 2016-12-29 2017-05-31 惠科股份有限公司 Colored filter macroscopic test machine equipment
KR102524625B1 (en) * 2017-09-12 2023-04-24 삼성전자주식회사 Apparatus for inspecting substrate and system for treating substrate including the same
CN108044355B (en) * 2017-12-22 2024-01-23 沈阳芯嘉科技有限公司 Laser grinding wheel scribing machine and composite material cutting method
CN110060952A (en) * 2019-04-30 2019-07-26 上海隐冠半导体技术有限公司 Plates connection device and method and the silicon wafer membrane thickness measuring system for using the device
JP7224254B2 (en) * 2019-07-17 2023-02-17 東京エレクトロン株式会社 SUBSTRATE PROCESSING APPARATUS, INFORMATION PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD
TWI709727B (en) * 2019-08-12 2020-11-11 京元電子股份有限公司 Ic chip appearance inspection module

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JPH0617295Y2 (en) * 1987-11-27 1994-05-02 大日本スクリーン製造株式会社 Substrate transfer device
US5310410A (en) * 1990-04-06 1994-05-10 Sputtered Films, Inc. Method for processing semi-conductor wafers in a multiple vacuum and non-vacuum chamber apparatus
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Also Published As

Publication number Publication date
KR100444009B1 (en) 2004-08-11
JPWO2002021589A1 (en) 2004-01-22
CN1388988A (en) 2003-01-01
US6675666B2 (en) 2004-01-13
WO2002021589A1 (en) 2002-03-14
CN1202568C (en) 2005-05-18
KR20020049021A (en) 2002-06-24
TW559855B (en) 2003-11-01
US20020134179A1 (en) 2002-09-26
JP3975164B2 (en) 2007-09-12

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