AU1648801A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- AU1648801A AU1648801A AU16488/01A AU1648801A AU1648801A AU 1648801 A AU1648801 A AU 1648801A AU 16488/01 A AU16488/01 A AU 16488/01A AU 1648801 A AU1648801 A AU 1648801A AU 1648801 A AU1648801 A AU 1648801A
- Authority
- AU
- Australia
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/409—Read-write [R-W] circuits
- G11C11/4097—Bit-line organisation, e.g. bit-line layout, folded bit lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/09—Manufacture or treatment with simultaneous manufacture of the peripheral circuit region and memory cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/50—Peripheral circuit region structures
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34424199 | 1999-12-03 | ||
JP11/344241 | 1999-12-03 | ||
PCT/JP2000/008424 WO2001041211A1 (en) | 1999-12-03 | 2000-11-29 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
AU1648801A true AU1648801A (en) | 2001-06-12 |
Family
ID=18367730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU16488/01A Abandoned AU1648801A (en) | 1999-12-03 | 2000-11-29 | Semiconductor device |
Country Status (6)
Country | Link |
---|---|
US (4) | US6400596B2 (en) |
KR (1) | KR100688237B1 (en) |
CN (1) | CN1260810C (en) |
AU (1) | AU1648801A (en) |
TW (1) | TW503396B (en) |
WO (1) | WO2001041211A1 (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW503396B (en) * | 1999-12-03 | 2002-09-21 | Hitachi Ltd | Semiconductor device |
JP2001273788A (en) * | 2000-03-29 | 2001-10-05 | Hitachi Ltd | Semiconductor memory |
JP4392680B2 (en) * | 2002-09-05 | 2010-01-06 | エルピーダメモリ株式会社 | Semiconductor memory device |
US7146596B2 (en) * | 2003-08-29 | 2006-12-05 | International Business Machines Corporation | Integrated circuit chip having a ringed wiring layer interposed between a contact layer and a wiring grid |
KR100706233B1 (en) | 2004-10-08 | 2007-04-11 | 삼성전자주식회사 | Semiconductor memory device and method of fabricating the same |
US7547936B2 (en) * | 2004-10-08 | 2009-06-16 | Samsung Electronics Co., Ltd. | Semiconductor memory devices including offset active regions |
KR100621554B1 (en) * | 2005-08-01 | 2006-09-11 | 삼성전자주식회사 | Semiconductor memory device |
JP4509887B2 (en) * | 2005-08-05 | 2010-07-21 | パナソニック株式会社 | Semiconductor memory device |
JP4907967B2 (en) * | 2005-12-01 | 2012-04-04 | ルネサスエレクトロニクス株式会社 | Semiconductor memory device |
KR100827694B1 (en) * | 2006-11-09 | 2008-05-07 | 삼성전자주식회사 | Layout structure for sub word line drivers for use in semiconductor memory device |
US8243484B2 (en) * | 2007-03-30 | 2012-08-14 | Rambus Inc. | Adjustable width strobe interface |
US7800965B2 (en) | 2008-03-10 | 2010-09-21 | Micron Technology, Inc. | Digit line equilibration using access devices at the edge of sub-arrays |
JP2012043486A (en) * | 2010-08-13 | 2012-03-01 | Elpida Memory Inc | Semiconductor device |
KR20120018016A (en) * | 2010-08-20 | 2012-02-29 | 삼성전자주식회사 | Bit line sense amplifier layout array, layout method, and apparatus having the same |
KR101906946B1 (en) * | 2011-12-02 | 2018-10-12 | 삼성전자주식회사 | High density semiconductor memory device |
TWI630607B (en) * | 2016-09-09 | 2018-07-21 | 東芝記憶體股份有限公司 | Memory device |
JP2019054102A (en) * | 2017-09-14 | 2019-04-04 | 東芝メモリ株式会社 | Memory device and method of manufacturing the same |
CN114255802B (en) * | 2020-09-22 | 2023-09-15 | 长鑫存储技术有限公司 | integrated circuit |
TWI746303B (en) * | 2020-12-07 | 2021-11-11 | 華邦電子股份有限公司 | Layout of wordline and method of forming the same |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6413290A (en) * | 1987-07-07 | 1989-01-18 | Oki Electric Ind Co Ltd | Semiconductor memory |
JP2691280B2 (en) * | 1988-05-12 | 1997-12-17 | 三菱電機株式会社 | Semiconductor memory device |
JPH0541081A (en) | 1991-08-02 | 1993-02-19 | Fujitsu Ltd | Dynamic ram |
JP3302796B2 (en) * | 1992-09-22 | 2002-07-15 | 株式会社東芝 | Semiconductor storage device |
US5838038A (en) * | 1992-09-22 | 1998-11-17 | Kabushiki Kaisha Toshiba | Dynamic random access memory device with the combined open/folded bit-line pair arrangement |
JPH08172169A (en) * | 1994-12-16 | 1996-07-02 | Toshiba Microelectron Corp | Semiconductor storage device |
JP3247573B2 (en) * | 1995-04-12 | 2002-01-15 | 株式会社東芝 | Dynamic semiconductor memory device |
JP3305919B2 (en) * | 1995-05-17 | 2002-07-24 | 株式会社東芝 | Exposure mask and exposure method |
JP2803712B2 (en) | 1995-11-10 | 1998-09-24 | 日本電気株式会社 | Semiconductor storage device |
US6043562A (en) * | 1996-01-26 | 2000-03-28 | Micron Technology, Inc. | Digit line architecture for dynamic memory |
JP3633354B2 (en) * | 1999-03-29 | 2005-03-30 | 株式会社日立製作所 | Semiconductor device |
TW503396B (en) * | 1999-12-03 | 2002-09-21 | Hitachi Ltd | Semiconductor device |
-
2000
- 2000-10-23 TW TW089122250A patent/TW503396B/en not_active IP Right Cessation
- 2000-11-29 AU AU16488/01A patent/AU1648801A/en not_active Abandoned
- 2000-11-29 US US09/725,107 patent/US6400596B2/en not_active Expired - Lifetime
- 2000-11-29 WO PCT/JP2000/008424 patent/WO2001041211A1/en active Application Filing
- 2000-11-29 CN CNB008160392A patent/CN1260810C/en not_active Expired - Fee Related
- 2000-11-29 KR KR1020027005277A patent/KR100688237B1/en active IP Right Grant
-
2002
- 2002-05-07 US US10/139,330 patent/US6538912B2/en not_active Expired - Lifetime
-
2003
- 2003-01-30 US US10/354,122 patent/US6671198B2/en not_active Expired - Lifetime
- 2003-10-02 US US10/676,110 patent/US6845028B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6538912B2 (en) | 2003-03-25 |
US20010002702A1 (en) | 2001-06-07 |
KR100688237B1 (en) | 2007-02-28 |
CN1391702A (en) | 2003-01-15 |
WO2001041211A1 (en) | 2001-06-07 |
US6845028B2 (en) | 2005-01-18 |
US20030142528A1 (en) | 2003-07-31 |
CN1260810C (en) | 2006-06-21 |
US20040080971A1 (en) | 2004-04-29 |
US6671198B2 (en) | 2003-12-30 |
US20020126520A1 (en) | 2002-09-12 |
TW503396B (en) | 2002-09-21 |
US6400596B2 (en) | 2002-06-04 |
KR20020084062A (en) | 2002-11-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |