JPH10163300A - Stage device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the size of a substrate stage without deteriorating the substrate exchanging ability of the stage. SOLUTION: At the time of exchanging a treated substrate W with an untreated substrate W, a center-up 12 moves the treated substrate W to a delivering position (at the position of the virtual line in the figure) on the outside of a holder 9 from the center position of the holder 9 while, for example, the treated substrate W stops at a treating position and delivers the treated substrate W to a transfer arm 50 and, at the same time, receives the untreated substrate W from the arm 50 at the same position. After receiving the untreated substrate W, the center-up 12 moves the received untreated substrate W to the center of the holder 9. Since the substrate exchange can be performed regardless of the movement of a stage, the stage is not required to move for exchanging substrates except the movement within the extent required to perform its original treatment. Therefore, the size and the weight of the stage can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stage apparatus, and more particularly, to a projection exposure apparatus used for exposure when a semiconductor device or a liquid crystal display device is manufactured by a photolithography process, or a semiconductor device. The present invention relates to a stage device suitable as a stage for mounting a substrate to be exposed in a drawing apparatus for directly drawing a pattern on a substrate with a laser beam, an electron beam, or another charged particle beam for manufacturing a mask or the like for manufacturing a semiconductor element.

[0002]

2. Description of the Related Art Since a projection exposure apparatus and a drawing apparatus are used for mass production of microdevices and the like, high processing capability (throughput) is one of the most important requirements for the performance of the apparatus. In addition, since the apparatus itself is expensive, it is important that the productivity or throughput is high also from the viewpoint of investment efficiency.

For example, the time required for exchanging a substrate to be exposed such as a semiconductor wafer is also an important factor in determining the throughput of the apparatus. For this reason, various methods have conventionally been adopted to shorten the time required for replacing the substrate.

Here, a general method of replacing a wafer as a substrate to be exposed in a conventional semiconductor exposure apparatus will be briefly described with reference to FIG. The eleventh example is a slider arm dedicated to unloading (hereinafter, “unload arm”).
203 and a load-only slider arm (hereinafter referred to as
202), and the wafer exchange time is shortened by the parallel processing by both arms.

First, at the same time when wafer stage WST comes to a predetermined position (the position shown by a solid line in FIG. 11), wafer W ₂ already exposed by a wafer-up mechanism (not shown) is placed above wafer holder 201. Fixed amount is lifted. Thereafter, the unload arm 203 there is nothing on the load arm 202 which holds the new wafer W ₁ is on the holder, is inserted at the same time. That is, the unload arms 203 is inserted between the holder 102 and the wafer W _2, the load arm 202 which holds the new wafer W ₁ to the above the wafer W ₂ is inserted.

[0006] After this, the wafer-up mechanism passes the wafer W ₂ to unload arm 203, unload arm 203 which has received the wafer W ₂ is retracted. After the retreat of the unload arm 203, load arm 202 passes the wafer W ₁ to the wafer-up mechanism, then the load arm 20
Save 2 as well. Then the wafer up mechanism is lowered, the wafer W ₁ is mounted on the wafer holder 201. Thereby, the wafer exchange is completed.

[0007]

In the example of FIG. 11 described above, a method of exchanging wafers at a position considerably distant from the projection optical system PL is employed. This is for the following reasons.

That is, in the projection exposure apparatus, it is important to perform exposure by superposing a pattern already formed on the wafer W and a reticle pattern. In order to perform this superposition with high accuracy, FIG. As shown in FIG. 1, a microscope 204 for reading alignment marks (alignment marks) formed on a wafer is provided. This microscope 204 is arranged on the side of the projection optical system PL, and the projection optical system PL and the microscope 204
This is because the projection optical system PL, the microscope 204, and the like, which are usually arranged close to the wafer W in the optical axis AX direction, become obstacles when replacing the wafer W. Further, sensors (not shown) and the like for detecting the position of the wafer W in the direction of the optical axis AX are arranged around the lower part of the projection optical system PL, and these also become obstacles when replacing the wafer. Further, a mirror (moving mirror) of the laser interferometer for measuring the position of the wafer stage also becomes an obstacle when replacing the wafer.

In addition to this, in order to reduce the time required for wafer replacement,
A space where the wafers W ₁ and W ₂ are lined up and down as shown in FIG. 11 is required. From this viewpoint, the wafer must be replaced at a position avoiding the projection optical system PL and the microscope 204.

Therefore, the wafer stage needs to be moved more than necessary in a plane perpendicular to the optical axis for the purpose of only transferring the wafer (substrate), in addition to the work area which is really necessary. This increases the floor space (footprint) of the device more than necessary,
In particular, it not only increases the area of the clean room where construction and maintenance costs are high, but also for the following reasons:
There is also a disadvantage that the size of the wafer stage itself is increased.

That is, the position of the wafer stage is usually measured by a laser interferometer, but the measurement by the interferometer is not a measurement of an absolute position but a relative position of a movable mirror attached to the wafer stage with respect to a reference point (fixed mirror position). The distance is measured as the position of the wafer stage. Therefore, when the interferometer beam is no longer incident on the reflecting surface of the movable mirror, the measurement is interrupted, and once the measurement is interrupted in this manner, the subsequent position control of the wafer stage becomes impossible. It is necessary to prevent such inconveniences from occurring, and the beam must not deviate from the mirror (moving mirror) even when it is moved to a wafer transfer position that does not require exceptional accuracy. Usually, the position of the wafer stage is X,
Since the measurement is performed at the Y coordinate, the mirror (moving mirror) for reflecting the laser beam is fixed to two of the side surfaces of the wafer stage, so that the beam of the interferometer deviates from the mirror even when the wafer stage moves. In order to avoid interruption, the length of the mirror (moving mirror) for reflecting the laser beam in each direction is necessary for the moving distance of the wafer stage, and the wafer stage becomes large to hold it.

If the movable mirror is not fixed strictly (in a precise positional relationship) with respect to the wafer stage, the position of the wafer (wafer stage) cannot be measured accurately.
It is necessary to hold the moving mirror firmly on the stage,
For this reason, when the movable mirror becomes long, the holding mechanism also becomes large accordingly, and the entire stage tends to become large.

However, the positioning accuracy of the substrate stage is one of the important factors of the exposure overlay accuracy and the writing position accuracy for the exposure apparatus and the writing apparatus.
It is desirable that the substrate stage be as compact and lightweight as possible. In addition, heat generated by the motor driving the substrate stage disturbs air in the optical path of the interferometer for measuring the position of the substrate stage (so-called air fluctuation), adversely affects the measurement, and stabilizes the position of the alignment microscope of the exposure apparatus. It is desirable that the substrate stage be lightweight and compact, because it may cause a problem (stability of the baseline) or thermal distortion of the substrate stage itself, thereby deteriorating the accuracy.

Further, in recent years, the mask is illuminated in a slit shape, and the mask and the substrate to be exposed are mutually moved with respect to the projection optical system, because the exposure area can be increased without increasing the dimensions of the projection optical system. Opposite direction (or same direction)
Attention has been focused on a scanning projection exposure apparatus that performs exposure by performing relative scanning on a substrate. In this scanning projection exposure apparatus,
Since it is necessary to scan the mask and the substrate to be exposed in synchronization with high accuracy, the control accuracy of the stage is increasingly required. In addition, the throughput of this scanning projection exposure apparatus largely depends on the maximum acceleration and the maximum speed of the stage. Further, when the weight becomes large, the apparatus vibrates due to a reaction when the stage is driven, and the stage is vibrated. Control accuracy deteriorates. In order to achieve high acceleration, control accuracy, and suppress heat generation, it is necessary to reduce the size and weight.

The present invention has been made under such circumstances, and an object of the present invention is to reduce the size of the substrate stage without impairing the substrate exchange ability. It is to provide a stage device.

[0016]

According to the first aspect of the present invention, there is provided a stage (WST) movable in a predetermined plane;
Moving means mounted on the stage (WST) for moving the substrate (W) between a processing position and a transfer position of the substrate (W) independently of the movement of the stage (WST); 28, 32A, 32B, 34A-
34D); and a transfer means (12, 30) for transferring a substrate to and from an external substrate transport mechanism at the transfer position of the substrate (W).

According to this, when exchanging the substrate, the moving means may process the substrate (processed substrate) while the stage is stopped at the substrate processing position regardless of the movement of the stage. The substrate is moved from the position to the transfer position, and the transfer means transfers the substrate to the external substrate transfer mechanism at the transfer position of the substrate and receives the substrate (unprocessed substrate) from the external transfer mechanism. After receiving the substrate, the moving means moves the substrate from the delivery position to the processing position.

For this reason, the substrate can be exchanged irrespective of the movement of the stage. Therefore, the stage need only be moved within the range necessary for the original processing, and the exchange of the substrate unrelated to the original processing is performed. The movement only for the purpose is unnecessary, and the size and weight of the stage can be reduced accordingly. This makes it possible to reduce the cost by reducing the floor area (footprint) for installing the apparatus, to improve the controllability of the stage, to reduce the heat generated by the stage driving unit, and the like.

In this case, the moving means only needs to move the substrate between the processing position and the transfer position of the substrate. For example, as in the invention according to claim 2, the moving means includes: 4. A moving member (12) for holding a substrate (W) and linearly moving in the plane and driving means (32A, 32B, 34A to 34D) for the moving member. The moving means comprises a moving member (56) that holds the substrate (W) and rotates and moves about the predetermined rotation axis (54) in the plane, and a driving means for the moving member. (58). In particular, when the latter has a moving member that rotates, the moving distance of the substrate is determined by the length of the arm from the rotation axis, and the substrate can be moved in the same moving time regardless of the magnitude of the moving distance. Therefore, there is an advantage that the moving distance can be easily extended as compared with the former case in which the moving time depends on the moving distance.

In these cases, the moving means and the transfer means may be provided separately, but as in the invention according to claim 4, the transfer means holds the substrate and moves up and down. It may have a member (12 or 56), and this vertically moving member may also constitute the moving means. In such a case, the substrate received from, for example, the external transfer mechanism can be moved to the processing position as it is by the vertical movement member, and the substrate moved from the processing position to the transfer position can be transferred to the external transfer mechanism. Since the transfer can be performed, a mechanism or the like for transferring the substrate to the moving unit at the processing position is not required, and the replacement time can be shortened by reducing the number of components and the number of times of transferring the substrate.

Further, in these cases, if the moving means and the transfer means are provided for use both in transferring the substrate to an external substrate transport mechanism and in receiving the substrate from the substrate transport mechanism, It is sufficient that the moving means and the transfer means (72A, 72B) are provided only for receiving the substrate and only for transferring the substrate, respectively. In such a case, the operation of receiving the substrate from the external substrate transfer mechanism by the set of the transfer means and the transfer means dedicated to receiving the substrate, and the operation of the external substrate transfer mechanism by the set of the transfer means and the transfer means dedicated to the transfer of the substrate By performing the operation of transferring the substrate to the substrate in parallel, the substrate exchange time can be reduced, and the throughput can be improved.

Further, in the stage apparatus according to the second or third aspect, the moving member may be provided separately from the substrate holding member for holding the substrate. A substrate holding member (9) for sucking and holding the substrate (W) on the stage (WST) may be used. In this case, there is no need to incorporate the moving member in the substrate holding member, so that the structure of the holding member itself is not likely to be complicated, and the moving member is moved, for example, when a linear moving member is incorporated. There is no inconvenience such as the substrate not being able to be sucked at the road portion.

[0023]

BEST MODE FOR CARRYING OUT THE INVENTION

<< First Embodiment >> A first embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 shows a schematic configuration of a scanning exposure apparatus 100 of a first embodiment to which a stage apparatus according to the present invention is applied. This scanning exposure apparatus 100
Is a so-called step-and-scan exposure type projection exposure apparatus.

The scanning exposure apparatus 100 includes an illumination system including a light source 1 and illumination optical systems (2, 3, 5 to 7), a reticle stage RST as a mask stage for holding a reticle R as a mask, and a projection optical system. PL, wafer stage W as stage for holding wafer W as substrate
A stage device 10 having an ST, a control system for these components, and the like are provided.

The illumination system includes a light source 1, an illuminance uniforming optical system 2 including a collimator lens, a fly-eye lens and the like (all not shown), a relay lens 3, a variable ND filter 4, a reticle blind 5, a relay lens 6. And dichroic mirror 7 (including illuminance uniforming optical system 2, relay lens 3, reticle blind 5, relay lens 6)
And the dichroic mirror 7 constitutes an illumination optical system).

Here, each component of the illumination system will be described together with its operation. Illumination light I generated by the light source 1 will be described.
After passing through a shutter (not shown), the light L is converted by the illuminance uniforming optical system 2 into a light beam having a substantially uniform illuminance distribution. As the illumination light IL, for example, KrF excimer laser light or A
An excimer laser beam such as an rF excimer laser beam, a harmonic of a copper vapor laser or a YAG laser, or an ultraviolet bright line (g line, i line, or the like) from an ultrahigh pressure mercury lamp is used.

The light beam emitted horizontally from the illumination uniforming optical system 2 reaches the reticle blind 5 via the relay lens 3. The reticle blind 5 is a reticle R
The variable ND filter 4 is disposed so as to be in close contact with the reticle blind 5 side of the reticle blind 5 on the side of the relay lens 3.

As the reticle blind 5, a plurality of movable light shielding plates (for example, two L-shaped movable light shielding plates) are opened and closed by, for example, a motor to adjust the size of the opening (slit width and the like). . By adjusting the size of the opening, the slit-shaped illumination area IAR (see FIG. 2) for illuminating the reticle R can be set to an arbitrary shape and size.

The variable ND filter 4 sets the transmittance distribution to a desired state, for example, a double blind structure,
It is composed of a liquid crystal display panel, an electrochromic device, or an ND filter having a desired shape. In the present embodiment, the variable ND filter 4 is moved in and out (or its rotation angle) by the variable ND filter control unit 22.
And the like, whereby the illuminance distribution in the illumination area IAR on the reticle R is intentionally made non-uniform, and as a result, the exposure amount on the wafer W during scanning can be kept constant. It has become. Normally, the variable ND filter 4
Are 100% transparent, and the illuminance distribution in the illumination area IAR on the reticle R is uniform.

The light beam that has passed through the variable ND filter 4 and the reticle blind 5 passes through a relay lens 6 and reaches a dichroic mirror 7, where it is bent vertically downward to illuminate a reticle R on which a circuit pattern or the like is drawn. Illuminate the IAR part.

A reticle R is fixed on the reticle stage RST by, for example, vacuum suction. The reticle stage RST is used to position an optical axis IX of an illumination optical system (optical axis A of a projection optical system PL described later) for positioning the reticle R.
It is configured to be capable of minutely driving two-dimensionally (in the X-axis direction, in the Y-axis direction orthogonal to the X-axis direction, and in the rotation direction around the Z-axis orthogonal to the XY plane) in a plane perpendicular to the X-axis.

The reticle stage RST is a reticle driving section (not shown) composed of a linear motor or the like.
Thereby, it is possible to move at a specified scanning speed in a predetermined direction (scanning direction). This reticle stage RST
Means that the entire surface of the reticle R has at least the optical axis I of the illumination optical system.
It has a travel stroke that can cross X.

A reticle laser interferometer (hereinafter, referred to as “reticle interferometer”) 1 is provided at an end of reticle stage RST.
A movable mirror 15 for reflecting the laser beam from the reticle stage 6 is fixed, and the position of the reticle stage RST in the stage movement plane is set to 0.01 μm by a reticle interferometer 16.
It is always detected with a resolution of about m. Where, in practice,
On the reticle stage RST, a moving mirror having a reflecting surface perpendicular to the scanning direction and a moving mirror having a reflecting surface perpendicular to the non-scanning direction are provided. In correspondence with this, a reticle interferometer is also provided for measuring the position in the scanning direction. Although an interferometer and an interferometer for measuring the position in the non-scanning direction are provided, these are typically shown as a movable mirror 15 and a reticle interferometer 16 in FIG.

The position information of the reticle stage RST from the reticle interferometer 16 is sent to the stage control system 19, and the stage control system 19 sends a reticle stage via a reticle drive unit (not shown) based on the position information of the reticle stage RST. Drive RST.

Since the initial position of the reticle stage RST is determined so that the reticle R is accurately positioned at a predetermined reference position by a reticle alignment system (not shown), the position of the movable mirror 15 is changed to the reticle interferometer 16. This means that the position of the reticle R has been measured with sufficiently high accuracy.

The projection optical system PL is arranged below the reticle stage RST in FIG. 1, and its optical axis AX
The direction of (corresponding to the optical axis IX of the illumination optical system) is the Z-axis direction. Here, a refracting optical system having a predetermined reduction magnification (for example, 1/5 or 1/4) that is telecentric on both sides is used. . For this reason, the illumination light IL from the illumination optical system
When the illumination area IAR of the reticle R is illuminated by
With the illumination light IL passing through the reticle R, a reduced image of the circuit pattern of the reticle R is formed on the wafer W having a surface coated with a photoresist (photosensitive material) via the projection optical system PL.

The stage device 10 includes a projection optical system PL
1 is arranged below in FIG.
Substantially square wafer stage W moving in Y2-dimensional direction
ST, a wafer holder 9 mounted on the wafer stage WST, and a center-up 12 as a vertically moving member and a moving member incorporated inside the wafer holder 9.

The wafer W is vacuum-sucked on the wafer holder 9. The wafer holder 9 is driven by a driving unit (not shown).
The projection optical system PL can be tilted in any direction with respect to the best image forming plane, and can be finely moved in the optical axis AX direction (Z direction) of the projection optical system PL. Further, the wafer holder 9 can also rotate around the optical axis AX.

The wafer stage WST moves not only in the scanning direction (X direction) but also in a direction perpendicular to the scanning direction so that a plurality of shot areas on the wafer W can be positioned in an exposure area conjugate with the illumination area IAR. Direction (Y direction)
It performs a step-and-scan operation in which the operation of scanning (scanning) each shot area on the wafer W and the operation of moving to the exposure start position of the next shot are repeated. The wafer stage WST is a wafer stage driving unit such as a motor (not shown).
Is driven in the XY two-dimensional directions.

A movable mirror 17 for reflecting a laser beam from a wafer laser interferometer (hereinafter, referred to as "wafer interferometer") 18 as a position measuring means is fixed to an end of wafer stage WST, and an XY plane of wafer stage WST. The position within is determined by the wafer interferometer 18, for example, 0.01 μm.
It is always detected with a resolution of about m. Here, actually, as shown in FIG. 4, on the wafer stage WST, an X moving mirror 17X having a reflecting surface orthogonal to the scanning direction is provided.
Moving mirror 17Y having a reflecting surface perpendicular to the non-scanning direction
Corresponding to this, the wafer interferometer also has an X interferometer 18X for measuring the position in the X-axis direction and a Y interferometer for measuring the position in the Y-axis direction.
An interferometer 18Y is provided, and these are typically shown as a moving mirror 17 and a wafer interferometer 18 in FIG. The position information (or speed information) of wafer stage WST is sent to stage control system 19, and
9 controls the wafer stage WST based on this position information (or speed information).

Here, a circular holder is used as the wafer holder 9, and concentric suction grooves 24a and 24b for vacuum suction of the wafer W are provided on the upper surface of the wafer holder 9, and these suction grooves 24a and 24b are provided. The inside of 24b is evacuated by a vacuum suction force of a vacuum pump (vacuum pump) (not shown) so that the wafer W is sucked. In order to effectively use the depth of focus of the projection optical system PL, the wafer W needs to be held with good flatness, and there is a possibility that dust or the like may be interposed. It is devised to hold it. In addition, in addition to the concentric circular shape, the type in which the point-like shape is distributed, a linear shape, and the like are devised.
It goes without saying that any type of suction groove may be provided.

As shown in the plan view of FIG. 4, the wafer holder 9 is formed with a radial guide groove 26 extending from the center thereof in a direction forming about 45 degrees with respect to the X axis and the Y axis. A guide hole 28 extending parallel to the guide groove 26 is formed at the center of the inner bottom surface of the guide groove 26. As shown in the cross-sectional view of FIG. 5, the guide hole 28 penetrates the wafer holder 9 and reaches the upper portion of the wafer stage WST below the guide hole 28. Therefore, the guide hole 28 is further extended than the outer peripheral edge of the wafer holder 9. It extends to the outer portion and is also formed at the wafer stage WST portion.

As shown in the sectional view of FIG. 5, the center-up 12 has a suction portion 12a and a shaft portion 12b provided on the uppermost surface, and is driven by a center-up driving mechanism (not shown) in the unit 30. It can be moved up and down. A suction hole (not shown) is formed in the center of the suction portion 12a. The suction hole penetrates the center of the shaft portion 12b in the axial direction and is connected to a vacuum pump (not shown) near the bottom of the unit 30 near the bottom of the unit 30. It is connected to the. As a result, the wafer W is sucked by the vacuum suction force of a vacuum pump (not shown) into the suction unit
The upper surface 2a can be adsorbed.

Further, a pair of coil portions 32A, 32B protrude from both side surfaces of the unit 30 in FIG. 5, and are made of permanent magnets so as to sandwich the coil portions 32A, 32B from above and below, respectively. Linear guide 34
A, 34B and 34C, 34D extend in a direction perpendicular to the paper surface of FIG. 5 (that is, a direction parallel to the guide groove 26 and the guide hole 28 in FIG. 4). Coil portion 32A and linear guides 34A and 34B, coil portion 32B and linear guide 34
C, 34D, moving coil type linear motors 36A, 36B as driving means for reciprocating the center-up 12 between the center position (processing position) of the wafer holder 9 and the wafer transfer position integrally with the unit 30.
Are respectively constituted. These linear motors 36
A and 36B are connected to the main controller 3 via the stage control system 19.
Controlled by 0.

The wafer stage WST is moved so that the unit 30 can be moved between the center position of the wafer holder 9 and the wafer transfer position by the linear motors 36A and 36B.
In FIG. 5, a space 40 is formed as shown in FIG.
A pair of permanent magnets 42A, 42 extending parallel to A-34D
B is buried. These permanent magnets 42A, 42B
, A permanent magnet 42A,
A permanent magnet (not shown) having the same polarity on the surface facing 42B is attached. The unit 30 is levitated and supported above the inner bottom surface of the space 40 by a predetermined gap due to the repulsive force of these permanent magnets. Therefore, instead of the permanent magnets, a gas static pressure bearing or the like may be provided on the bottom surface of the unit 30, and the unit 30 may be floated and supported.

A projection 44 is provided on the bottom surface of the unit 30 in order to prevent the unit 30 from being displaced in the direction perpendicular to the movement of the unit 30 during movement. Is formed with a sliding guide groove 46 with which the projection 44 can be engaged and extends in parallel with the guide hole 28. When the gas static pressure bearings or the like are provided on both side surfaces of the unit 30, the projections 44, the sliding guide grooves 46, and the like are not required.

In the projection exposure apparatus 100 of the present embodiment, as shown in FIG.
Direction) reticle R is illuminated with illumination area IAR rectangular (slit shape) having a longitudinal direction perpendicular to the reticle R is scanned at a speed V _R in the -X direction during exposure (scanning). Illumination area IAR (center is optical axis AX
Is substantially projected onto the wafer W via the projection optical system PL to form a slit-shaped exposure area IA. Since the wafer W is to the reticle R in inverted imaging relationship, the wafer W is the direction of the velocity V _R is scanned at a speed V _W in synchronization with the reticle R in the opposite direction (+ X direction), the shot on the wafer W The entire surface of the area SA can be exposed. The scanning speed ratio V _W / V _R accurately corresponds to the reduction magnification of the projection optical system PL, and the pattern area PA of the reticle R
Is accurately reduced and transferred onto the shot area SA on the wafer W. The width of the illumination area IAR in the longitudinal direction is wider than the pattern area PA on the reticle R, and
T is set to be smaller than the maximum width of T, and scanning (scanning) illuminates the entire pattern area PA.

Returning to FIG. 1, on the side of the projection optical system PL,
An off-line for detecting the position of an alignment mark (wafer mark) attached to each shot area on the wafer W
Axis type alignment microscope 8 (this will be described later) is provided.
The main control device 2 that controls the operation of the entire device
0, the main controller 20 calculates the array coordinates of the shot area on the wafer W from the measured position of the wafer mark using, for example, the least squares method disclosed in Japanese Patent Application Laid-Open No. 61-44429. It is calculated by a statistical calculation method.

The alignment microscope 8 is fixed to one side surface of the projection optical system PL. In this embodiment, a high-magnification image processing system is used. The alignment microscope 8 includes a light source that emits broadband illumination light such as a halogen lamp, an objective lens, an index plate, an image sensor such as a CCD, a signal processing circuit, and an arithmetic circuit (all not shown). . Illumination light emitted from a light source constituting the alignment microscope 8 is irradiated onto the wafer W after passing through an objective lens inside the alignment microscope 8, and reflected light from a wafer mark area (not shown) on the surface of the wafer W is aligned. After returning to the inside of the microscope 8, the image of the wafer mark and the image of the index on the index plate are formed on an imaging surface such as a CCD through the objective lens and the index plate sequentially. The photoelectric conversion signals of these images are processed by the signal processing circuit, and the arithmetic circuit calculates the relative position between the wafer mark and the index. The calculation result is supplied to main controller 20. Although various methods of aligning the wafer W have been proposed, other methods can be similarly used.

In the apparatus shown in FIG. 1, an image forming light beam for forming a pinhole or a slit image is supplied from an oblique direction to the optical axis AX toward the best image forming plane of the projection optical system PL. An oblique incidence type wafer position detection system (focus detection system), which includes an irradiation optical system 13 for receiving light and a light receiving optical system 14 for receiving, via a slit, a light beam reflected by the surface of the wafer W of the image forming light beam, is projected. It is fixed to a support (not shown) that supports the optical system PL. The configuration and the like of this wafer position detection system are disclosed in, for example, Japanese Patent Application Laid-Open No. 60-168112. The position deviation in the vertical direction (Z direction) of the wafer surface with respect to the imaging plane is detected, and the wafer W It is used to drive the wafer holder 9 in the Z direction so as to keep a predetermined distance from the optical system PL. The wafer position information from the wafer position detection system is sent to the stage control system 19 via the main controller 20. The stage control system 19 drives the wafer holder 9 in the Z direction based on the wafer position information. Here, the space (working distance) between the upper surface of the wafer holder and the projection optical system PL and the alignment microscope 8 is actually narrowest than that shown in FIG. 1, but in FIG. 1, the light beam from the wafer position detection system is shown. The drawing is somewhat wider in order to avoid complicated drawings such as overlapping of the alignment microscope 8 with the alignment microscope 8.

In the present embodiment, the angle of a parallel flat glass (not shown) provided beforehand in the light receiving optical system 14 is adjusted so that the image plane becomes the zero point reference, and the wafer position is detected. System calibration shall be performed. Further, for example, Japanese Patent Laid-Open No. 58-11370
The wafer position detection system is configured to use a horizontal position detection system as disclosed in Japanese Unexamined Patent Publication No. 6 (1996) or to detect a focus position at a plurality of arbitrary positions in an image field of the projection optical system PL ( For example, by forming a plurality of slit images in the image field), the inclination of the predetermined area on the wafer W with respect to the image plane may be detected.

Next, the first book constructed as described above is used.
A wafer exchange sequence in the projection exposure apparatus 100 according to the embodiment will be described with reference to FIGS. In the following description, the processed wafer that has been subjected to the exposure processing is referred to as a wafer W ₂ , and the wafer before exposure is referred to as a new wafer W ₁ or a wafer W ₁ .

After the exposure is completed, the main controller 20 releases the wafer W from the wafer holder 9 via the stage control system 19, and the center-up 12 which is waiting at the center position of the wafer holder 9 during exposure is not shown. The suction drive of the vacuum pump (not shown) is started when the upper surface of the suction unit 12a comes into contact with the back surface of the wafer W at that time, and the wafer W is sucked on the upper surface of the suction unit 20a. In this case, the wafer W is sucked with sufficient strength so that the wafer W does not shift on the center-up 12 when the center-up 12 moves as described later.

Then, the center-up 12 is further driven upward by a predetermined amount, and the wafer W is lifted by the center-up 12 to a position indicated by the imaginary line in FIG. 3, at which position the center-up 12 stops rising. afterwards,
The moving coil type linear motors 36A and 36B as the above-described driving means are driven by the stage control system 19 in response to a command from the main control device 20, and the center-up 12 holding the wafer W is thereby moved to the center-up position shown in FIGS. Is moved to the position shown by the solid line (wafer replacement position).
In this case, since it is necessary to finally place the wafer W at a predetermined position on the wafer holder 9 accurately, the center-up 12 must be accurately stopped at a predetermined wafer exchange position. For example, the stop position is monitored by a limit switch, a position sensor, or the like (not shown).

As described above, when the center-up 12 moves to the wafer exchange position, the transfer arm 50 constituting the substrate transfer mechanism is waiting at the wafer exchange position (the position indicated by the solid line in FIG. 3). , Center up 12
There in the course of being driven a predetermined amount downward by the center-up driving mechanism, exposed wafer W ₂ is placed on the conveying arm 50. Then, the wafer W by the center up 12
A _second suction of the wafer W ₂ by the transfer arm 50 at the same time is released aspiration starts, further at the time when the center-up 12 was lowered, passing from the center up 12 of the wafer W ₂ to the transfer arm 50 is completed. FIG. 3 shows a state immediately before the completion of the delivery.

After the center up 12 is further lowered from the state of FIG. 3 and the wafer W ₂ is transferred to the transfer arm 50,
Transfer arm 50 is retracted by moving in Figure 4 the direction of arrow A, after passing the exposed wafer W ₂ to the transport unit (not shown) constituting the substrate transfer mechanism in this retracted position, the new wafer W ₁ from the transport unit receive. In this case, the new wafer W ₁ is transferred to the transfer arm 50 in a state in which schematically on pre-alignment unit (not shown) X, Y, is θ direction positioning has been made.

[0058] Then, the transfer arm holding the new wafer W ₁ is moved to above the center-up 12 waiting in the exchange position along the direction of arrow A ', stops at that position. The stop position of the transfer arm 50 is also monitored by a limit switch (not shown), a position sensor, and the like.

[0059] Then, center-up 12 waiting in the exchange position is driven upward by the center-up drive mechanism (not shown), a vacuum (not shown) when the top is in contact with the case wafer W ₁ backside adsorption section 20a suction of the pump is started, the wafer W ₁ is adsorbed onto the adsorbing portion 20a. Is released the vacuum suction of the wafer W ₁ by the transfer arm 50 simultaneously therewith (or immediately before), at the time the addition is center-up 12 is driven upward, it receives the wafer W ₁ from the transfer arm 50 by the center-up 12 Upon completion, the center-up 12 further rises to a predetermined position and stops. At the same time the transport arm in this state starts to retreat and move in the direction of the arrow A, the linear motor 36A by the stage control system 19, 36B are driven, thereby the center-up 12 in FIG. 1 and FIG holding the new wafer W ₁ The wafer 2 moves horizontally to the center position of the wafer holder 9 indicated by a virtual line in FIG. The stop position of the center-up 12 is also monitored by a limit switch, a position sensor, and the like (not shown).

When the center-up 12 is driven downward by the center-up driving mechanism, the new wafer W ₁ is placed on the wafer holder 9, and the suction of the wafer W ₁ by the center-up 12 is released, and at the same time, the wafer holder 9 is released. suction of the wafer W ₁ is started, thereby a series of the wafer exchange sequence is terminated by.

As is apparent from the above description, in the first embodiment, the center-up 12, the guide groove 26, the guide hole 28, the coil portions 32A and 32B, and the linear guides 34A to 34B are used as a moving member and a vertically moving member. The moving means is constituted by the linear motors 36A and 36B constituted by 34D, and the transfer means is constituted by the center-up 12 and the center-up drive mechanism in the unit 30.

As described above, according to the projection exposure apparatus 100 of the present embodiment, when exchanging a wafer, the center up 12 conveys the exposed wafer W ₂ to the wafer exchanging position and transfers the exposed wafer W ₂ to the transfer arm 50. pass W _2, receives new wafer W ₁ from the transfer arm 50 on standby at the replacement position, so as to place the wafer holder 9 conveys the new wafer W ₁ to the center position of the wafer holder 9 (processing position) The wafer stage WST
Can exchange wafers while stopped at the exposure end position. That is, the wafer stage WST does not need to be moved only for the purpose of wafer exchange, and
The moving range of wafer stage WST can be set small, and consequently moving mirror 1 on wafer stage WST
7Y can be shortened, which allows the movable mirror 1
Wafer stage WST holding 7Y can be reduced in size to one side of which is slightly larger than the wafer diameter. Therefore, the control accuracy of the wafer stage WST can be improved by reducing the size and weight of the wafer stage WST, and the heat generation and the driving reaction force of the wafer stage driving mechanism can be reduced. In addition to facilitating the WST synchronization control, it is possible to reduce the adverse effect on the exposure accuracy caused by the vibration of the exposure apparatus main body when the wafer stage WST is moved. As a result, the reticle pattern during exposure and the shot area on the wafer are formed. There is an effect that it is possible to improve the accuracy of superimposition with the set pattern.

Here, the moving distance of the center-up 12 is sufficient to transfer a wafer avoiding the projection optical system PL and the like from within a moving range for an original purpose such as an exposure process other than the wafer transfer of the wafer stage WST. It is desirable to set so that the wafer stage WST can move to the position. However, if the moving distance is too long, the wafer stage WST must be enlarged, and the effect of the present invention is reduced by half. It is desirable to appropriately set the balance between the moving distance and the distance that the center-up 12 moves.

In the projection exposure apparatus 100 of this embodiment, as is apparent from FIGS. 3 and 4, the wafer is exchanged at an exchange position set outside the wafer holder 9 on the wafer stage WST, and the transfer arm is set. Since there is no need to move the wafer 50 onto the wafer holder 9, the working distance between the wafer holder 9 and the projection optical system PL or the alignment microscope 8 is narrow. For example, even if the working distance is slightly larger than the thickness of the wafer, there is no particular problem. The wafer can be replaced without the need.

<< Second Embodiment >> Next, a second embodiment of the present invention will be described with reference to FIGS. Here, the same reference numerals are used for the same or equivalent components as those in the first embodiment, and the description thereof will be omitted.

FIG. 4 is a schematic plan view of a stage device 60 according to the second embodiment. This stage device 60 is rotated about a shaft 54 in the directions of arrows D and D 'separately from the center up 52 which is an original wafer up mechanism, and moves from a first position shown by a solid line in FIG. A rotary arm 5 as a moving member that rotates at a high speed from a second position to a second position indicated by a virtual line or from the second position to the first position.
6 is provided.

The rotary arm 56 can also move up and down as indicated by arrows B and B 'in the sectional view of FIG. 7 (that is, the rotary arm 56 also serves as a vertical moving member). The rotary arm 56 is mounted on the wafer stage WS.
It is driven in the directions of arrows D and D 'and arrows B and B' by an up-down and rotation mechanism 58 as a driving means housed inside T. Further, a suction part connected to a vacuum pump (not shown) is provided on the upper surface of the tip of the rotary arm 56 so that the wafer W can be suction-held as shown in FIG. ing.

In this case, as the center up 52,
A type that only moves up and down as in a normal projection exposure apparatus is used. That is, this center up 5
Reference numeral 2 denotes a rotary arm 56 that cannot be accessed when the wafer W is directly placed on the wafer holder 9 when the wafer is replaced, so that the rotary arm 56 is once lifted up so that the rotary arm 56 can be inserted under the wafer W. is there. As the wafer holder 9, a normal wafer holder having no guide groove or the like is used. The configuration of the other parts is the same as that of the projection exposure apparatus 100 according to the first embodiment described above.

Next, the stage device 6 of the second embodiment will be described.
The operation at the time of wafer replacement at 0 will be described.

During the exposure, the rotating arm 56 is shown in FIG.
Waiting at the second position indicated by _-1 , the exposure is completed,
When performing the wafer exchange, the wafer W ₂ exposed by the center-up 52 is lifted a predetermined amount, vertical and
Rotating arm 56 by a rotating mechanism 58 is rotated in the direction of arrow D, moves to the first position indicated by the wafer W ₂ below the imaginary line 56 _-2. In this state, the rotary arm 56 is driven to rise by a predetermined amount in the direction of arrow B (center-up 52
The and also good) by a predetermined amount downward, the wafer W ₂ backside contacts the rotating arm 56 upper surface, when the suction of the suction portion of the rotary arm 56 in this state is started, the wafer W ₂ is rotating arm 56 the upper surface The wafer W ₂ is transferred from the center-up 52 to the rotating arm 56 by the suction by the suction unit and the lowering of the center-up 52. 6 and 7, the rotating arm 56 in a state of receiving the wafer W ₂ from the center up 52 is shown by a solid line.

The rotary arm 56 that has received the wafer W ₂ in this manner is driven in the direction of the arrow D ′ by the up / down / rotation mechanism 58, and holds the wafer W ₂ by suction and holds the position indicated by the imaginary line _56-3. When the transfer arm (not shown) constituting the substrate transfer mechanism (not shown) comes below the wafer in this state, the rotary arm 56 is driven down by a predetermined amount in the direction of arrow B ′, and the wafer W ₂ is moved to the transfer arm. Passed.

Thereafter, the transfer arm transfers and retreats the wafer W _2, and transfers the exposed wafer W to the transfer section constituting the substrate transfer mechanism at this retreat position, and then transfers the new wafer W ₁ from the transfer section. receive. In this case, the new wafer W ₁ is passed to a transfer arm in a state in which schematically on pre-alignment unit (not shown) X, Y, is θ direction positioning has been made.

Then, the transfer arm holding the new wafer W ₁ moves above the rotating arm 56 waiting at the exchange position, and stops at that position.

Next, the rotary arm 56 waiting at the exchange position is driven upward by the vertical / rotational drive mechanism 58,
At that time the suction of a vacuum pump (not shown) is started when the adsorbing portion of the rotating arm 56 the upper surface of the wafer W ₁ backside is in contact,
Wafer W ₁ is sucked by the suction unit. At the same time (or immediately before), the vacuum suction of the wafer W ₁ by the transfer arm is released, and when the rotating arm 56 is further driven up, the wafer W _{1 from} the transfer arm by the rotating arm 56 is moved.
_When the reception of ₁ is completed, the rotating arm 56 further rises to a predetermined position and stops. In this state, when the transfer arm retracts, the rotation arm 56 holding the wafer W ₁ is rotated in the direction of arrow D, the wafer W at a position indicated by the solid line in FIG. 7
Stop while holding ₁ . Also in this case, as described later, when the wafer W ₁ is placed on the wafer holder 9, a rotary encoder or the like is used so that the wafer W ₁ is accurately placed at a predetermined position on the wafer holder 9. It is desirable to strictly manage (control) the stop position of the rotary arm 56.

[0075] Then, the center-up 52 descends the rotational arm 56 and at the same time is driven upward by the center-up driving mechanism, when the wafer W ₁ is passed to the center-up 52, the suction by the center-up 52 of the wafer W ₁ There adsorption of the wafer W ₁ is released by the rotary arm together with the start. Further, the rotating arm 56 is moved to the position shown in FIG.
After descending to the position of the imaginary line 56 _-2, retracted and rotated in the arrow D 'direction, it stands at the position of the imaginary line 56 _-1. After this evacuation of the rotating arm 56, or the center-up 52 immediately before being driven downward, new wafer W ₁ is placed on the wafer holder 9, at the same time suction starts the holder 9 when the suction of the center-up 52 is released Thus, a series of wafer exchange sequences is completed.

According to the second embodiment described above, the same operation and effect as those of the first embodiment can be obtained. In addition, as apparent from a comparison between FIG. 4 and FIG.
In the embodiment, the moving distance of the wafer W can be further extended without expanding the moving range of the wafer stage WST, whereby the moving distance of the transfer arm can be further shortened. Since the wafer is moved, the moving time can be reduced. In this case, compared to the first embodiment,
Although there is a disadvantage that the number of transfer times increases, it is possible to secure a throughput equal to or higher than that of the first embodiment by shortening the moving distance of the transfer arm and increasing the moving speed of the wafer. .

In the second embodiment, the case where the center-up 52 rises when a wafer is transferred from the wafer holder 9 to the rotating arm 56 has been described. When transferring the wafer, the height of the wafer holder 9 and the height of the wafer W may be relatively changed, and the wafer holder 9 may be lowered relative to the center up 52, or the wafer holder 9 and the center up 52 May be configured to be able to move up and down. In the latter case, the wafer holder 9
It is desirable that the center-up 52 and the center-up 52 both descend once, and then the center-up 52 moves up and down, because interference with the projection optical system PL can be effectively prevented.

In each of the first and second embodiments, only one moving member constituting the moving means for moving the wafer is provided, but a moving mechanism for transferring the wafer to an external transfer arm is provided. In the case where separate moving mechanisms for receiving wafers from the transfer arm are provided and the respective operations are partially performed in parallel, it is considered that the wafer replacement time can be further reduced. The following third embodiment has been made from such a viewpoint.

<< Third Embodiment >> Next, a third embodiment of the present invention will be described with reference to FIG. Here, the same reference numerals are used for the same or equivalent components as those in the first embodiment, and the description thereof will be omitted.

FIG. 8 is a schematic plan view of a stage device 70 according to the third embodiment. The stage device 70 is used to move the wafer holder 9 regardless of the movement of the wafer stage WST described in the first embodiment.
Two sets of moving means and transfer means having a center-up, a center-up driving mechanism, a guide groove, a guide hole, a linear motor, and the like for linearly moving a wafer between the above processing position and the wafer exchange position are provided. It has features. The configuration of the other parts is basically the same as that of the above-described first embodiment.

Here, the one moving means and transfer means is referred to as a first substrate moving mechanism 72A, and the other transfer means and transfer means is referred to as a second substrate moving mechanism 72B. It intended to represent and distinguish center-up 12 constituting the first substrate moving mechanism 72A as required center-up _121, the center-up 12 of the second substrate moving mechanism 72B as the center-up 12 _2.

Next, the operation at the time of wafer exchange by the stage device 70 according to the third embodiment will be briefly described.

The wafer W ₂ placed on the wafer holder 9
When the exposure is finished, the wafer W ₂ of the exposure already (treated) is immediately moved by the center-up 12 ₂ constituting the substrate moving mechanism 72B to the position shown in FIG. 8, waiting in the vicinity of that position It is delivered to an unload arm (not shown).

[0084] On the other hand, center-up 12 ₁ constituting the substrate moving mechanism 72A stands by the wafer receiving position shown in solid lines in FIG. 8, the new wafer W in the vicinity of the position
_From the load arm (not shown) holding ₁ and waiting,
After the movement of the center up 12 ₂ to the outside of the wafer holder 9, the new wafer W ₁ is received when the wafer W ₂ is sufficiently separated from the center of the wafer holder 9, and immediately thereafter, the center up 12 ₁ is moved to the center of the wafer holder 9.
₁ is transferred to the wafer holder 9.

[0085] Then, after the center-up ₁₂₁ constituting the substrate moving mechanism 72A is passed the wafer W ₁ to the wafer holder 9, it drops below the upper surface of the wafer holder 9 8
To the standby position (wafer receiving position) indicated by the solid line. Similarly, toward the center-up 12 ₂ constituting the substrate moving mechanism 72B is provided on the next delivery to move down below the upper surface of the wafer holder 9 in the direction of the center of the wafer holder 9. These Center Up 1
2 _1, 12 ₂ move is possible during exposure operation unless generate vibration.

[0086] Thus, according to the present third embodiment, the simultaneous parallel processing and a part of the load operation to the treated part of the unloading operation wafer W ₂ and the new wafer W ₁ of the wafer holder 9 above Therefore, the wafer replacement time can be reduced as compared with the first and second embodiments.

In this case, if the holding heights of the respective center-ups 12 ₂ and 12 ₁ when the wafers W ₂ and W ₁ are moved are made different, the wafer W ₂ before the wafer W ₂ is sufficiently separated from the center of the wafer holder 9 can be obtained. The substrate moving mechanism 7 at the time
Center-up ₁₂₁ constituting the 2A can receive the wafer W ₁ from the load arm can be shortened further exchange time.

Further, the center up after wafer replacement 12
Since _{the 2,} 12 ₁ of the movement is for performed during exposure as described above, working time is also the wafer exchange in this respect is shortened.

In the third embodiment, as shown in FIG. 8, a substrate moving mechanism 72A and a substrate moving mechanism 72B are provided. As described above, in the center-up operations 12 ₁ and 12 ₂ , the wafer cannot be suctioned at the center position of the wafer. For this reason, in implementation, it is necessary to take care to hold the wafer accurately in consideration of the suction force and the suction area.

According to the third embodiment described above,
As in the first and second embodiments described above, various effects can be obtained by reducing the size and weight of the wafer stage, and the wafer exchange time can be reduced as described above, thereby improving the throughput. There is also the advantage that it can be done.

[0091] The substrate moving mechanism 72A, as an arrangement method of 72B, the end portion of the wafer holder 9 the center side of the likewise center-up 12 ₁ moving range and 4 the substrate moving mechanism 72A of the load only requiring accurate positioning Wafer holder 9
In the arrangement to coincide with the center position, so as to hold the central portion of the wafer in the center-up _121, the wafer holder 9 the center side of the center-up 12 ₂ movement range of the substrate moving mechanism 72B of unloading only not required precision end disposed off-center and may be held a position off the center of the wafer W by the center-up 12 _2. Alternatively, the shape of the center-up constituting the substrate moving mechanisms 72A and 72B is devised so that one center-up has a nested structure that can be inserted into the other center-up, and the center-up is held by both center-ups. It is also possible to adopt a different configuration.

In the first to third embodiments described above, the moving member for moving the wafer from the processing position to the transfer position, such as a center-up or a rotating arm, also functions as a vertically movable member capable of moving up and down, and the transfer means In the case where a part is configured, that is, some components of the moving means for moving the wafer between the processing position and the transfer position of the wafer are moved between the wafer transfer position and an external substrate transfer mechanism. A case has been described in which the transfer unit that transfers the wafer also serves as a part of the component. However, the present invention is not limited to this, and the transfer unit and the transfer unit are configured by completely separate components. Is also good.

The following fourth embodiment has been made from such a viewpoint.

<< Fourth Embodiment >> Next, a fourth embodiment of the present invention will be described with reference to FIG. FIG. 9 is a schematic plan view of a stage device 80 according to the fourth embodiment. Here, the same reference numerals are used for the same or equivalent components as those of the above-described first and second embodiments, and description thereof is omitted.

In the stage device 80, the wafer holder 9 itself, which holds the wafer by suction, functions as a moving member constituting a moving means for moving the wafer between the processing position and the transfer position of the wafer. The center-up 52 functions as a transfer means for transferring a wafer to and from an external substrate transfer mechanism at a wafer transfer position.

That is, in the stage device 80, the wafer holder 9 is rotated about the rotation shaft 82 by a motor (not shown) or the like, and moves between the processing position indicated by the solid line and the wafer exchange position indicated by the imaginary line. The center up 52 moves up and down at the wafer exchange position, and transfers and receives the wafer to and from a transfer arm (not shown) constituting an external substrate transfer mechanism.

In this case, similarly to the above-described first and second embodiments, various effects can be obtained by reducing the size and weight of the wafer stage, and the weight of the moving member can be obtained because the wafer holder 9 itself constitutes the moving member. However, since there is no moving member inside the wafer holder 9, there is no danger that the wafer cannot be suctioned at a place where a moving guide of the moving member is located, and the flatness of the wafer holder is not reduced. There are advantages.

As a modification of the fourth embodiment, it is conceivable that the wafer holder 9 shown in FIG. 10 moves in parallel along a pair of slide guide mechanisms 92A and 92B.

In the above embodiment, the case where the present invention is applied to a step-and-scan type scanning exposure apparatus has been described. However, the scope of the present invention is not limited to this. The present invention can be similarly applied to an AND-repeat type reduction projection type exposure apparatus and the like. In such a case, the control accuracy (positioning accuracy) of the wafer stage is reduced by reducing the size and weight of the wafer stage as in the above embodiment. As a result, it is possible to improve the overlay accuracy of the reticle pattern at the time of exposure and the pattern formed in the shot area on the wafer by reducing the heat generation of the wafer stage driving mechanism, the driving reaction force, and the like. .

In the stage apparatus according to the present invention, a projection optical system, an alignment microscope, a focus detection system, and the like are arranged above the substrate. It is particularly effective when applied to an exposure apparatus, but is not limited to this. For manufacturing a semiconductor element, a mask for manufacturing a semiconductor element, etc., a pattern is directly formed on a substrate with a laser beam, an electron beam, or another charged particle beam. The present invention can be suitably applied to a drawing apparatus for drawing. Even when applied to these devices, the advantages of downsizing the stage, reducing the moving range of the stage, specifically, improving the controllability of the stage and reducing costs by reducing the footprint for installing the device, etc., are also obtained. can get.

In addition to the above embodiments, various methods for moving the wafer are conceivable. For example, a method of attaching a roller (usually retracted downward) to the wafer holder to send the wafer, a method of floating and pushing with an air blow instead of suction, a method of tilting and sliding the wafer holder, and the like can be considered. As with the above embodiments, the effect of reducing the stage size and weight can be obtained. However, in consideration of movement accuracy, dust generation / adsorption, and the like, it can be said that the above embodiments are more realistic choices.

[0102]

As described above, claims 1 to 6
According to the invention described in (1), the size and weight of the substrate stage can be reduced without impairing the substrate exchange capability, and as a result, the control performance of the stage, the performance of the device, and the device area can be reduced. There is an unprecedented excellent effect that the conversion can be achieved.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a schematic configuration of a projection exposure apparatus according to a first embodiment.

FIG. 2 is a view showing the principle of scanning exposure of the apparatus of FIG.

FIG. 3 is a schematic front view of the stage device according to the first embodiment.

FIG. 4 is a schematic plan view of the stage device of FIG.

FIG. 5 is a schematic sectional view taken along the line BB when the center is up at a position indicated by a virtual line 12 ′ in FIG. 4;

FIG. 6 is a schematic plan view of a stage device according to a second embodiment.

FIG. 7 is a schematic sectional view taken along line EE of FIG. 6;

FIG. 8 is a schematic plan view of a stage device according to a third embodiment.

FIG. 9 is a schematic plan view of a stage device according to a fourth embodiment.

FIG. 10 is a schematic plan view of a stage device according to a modification of the fourth embodiment.

FIG. 11 is an explanatory diagram showing a conventional example.

[Explanation of symbols]

Reference Signs List 9 Wafer holder (moving member, substrate holding member) 10 Stage device 12 Center up (moving member, vertical moving member, part of moving means, part of transfer means) 26 Guide groove (part of moving means) 28 Guide hole ( 30 unit (part of transfer means) 36A, 36B Linear motor (part of transfer means, drive means) 52 Center up (transfer means) 56 Rotating arm (part of transfer means, move member) 58 Up / down / rotation mechanism (part of moving means, driving means) 60 Stage device 70 Stage device 72A, 72B Substrate moving mechanism (moving means, transfer means) 80 Stage device WST Wafer stage (stage)

Claims (6)

[Claims] A stage movable in a predetermined plane;
Moving means mounted on the stage, for moving the substrate between a processing position and a transfer position of the substrate irrespective of the movement of the stage; and an external substrate transfer mechanism at the transfer position of the substrate. A stage device having a transfer unit for transferring a substrate. 2. The stage apparatus according to claim 1, wherein the moving unit includes a moving member that holds the substrate and moves linearly in the plane, and a driving unit for driving the moving member. 3. The moving device according to claim 1, wherein the moving unit includes a moving member that holds the substrate and rotates around the predetermined rotation axis in the plane and a driving unit for the moving member. A stage device according to item 1. 4. The apparatus according to claim 1, wherein said transfer means has a vertically moving member which vertically moves while holding said substrate, and said vertically moving member also constitutes said moving means. Stage equipment. 5. The stage apparatus according to claim 1, wherein the moving unit and the transfer unit are provided only for receiving the substrate and for transferring the substrate. 6. The stage apparatus according to claim 2, wherein the moving member is a substrate holding member that sucks and holds the substrate on the stage.