JP2006005114A - Conveyance method and device, and exposure device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a conveyance method which can easily perform loading of a reticle in a case that the installation surface of the reticle exists at a position which is dug from the upper surface of a stage. <P>SOLUTION: A plurality of arms 48c<SB>1</SB>-48c<SB>3</SB>are made movable so that the respective arms advance mutually and retract by turnable performance by an arm opening and closing mechanism 48a. Furthermore, driving is enabled also in the vertical direction by a vertical movement/rotation drive mechanism 43A. As a result, the supporter of the arm is positioned on the lower surface side of the reticle R by turning performance and falling performance of a plurality of the arms, and the reticle can be supported by raise performance of the arm from this status. The reticle is laid on a stage RST positioned below the reticle by the falling performance of the arm which supports the reticle. The arm can be evacuated to the upper surface side of the reticle R by the turning performance and raise performance of the arm. As a result, loading of the reticle R can be performed from the upper part of the stage. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a transport method, a transport apparatus, and an exposure apparatus. More specifically, the present invention relates to a transport method and a transport apparatus that deliver a transport target to and from a stage, and an exposure apparatus that includes the transport apparatus.

  Conventionally, various exposure apparatuses have been used in lithography processes in the manufacture of semiconductor elements, liquid crystal display elements, and the like. In recent years, a light exposure apparatus such as a step-and-repeat type reduction projection exposure apparatus (so-called stepper) and a step-and-scan type scanning exposure apparatus (so-called scanning stepper) has been used relatively frequently. .

  For example, in a stepper, a mask or reticle (hereinafter collectively referred to as “reticle” as appropriate) is vacuum-sucked on a reticle stage that can be finely driven (including θz rotation (rotation about the Z axis)) in the XY plane. Is held by etc. Further, in the scanning stepper, the reticle coarse movement stage in which the reticle stage moves with a predetermined stroke in the scanning direction (for example, the Y-axis direction), and a minute drive (θz rotation (Z) in the XY plane on the reticle coarse movement stage. A reticle fine movement stage capable of including rotation around the axis), and the reticle is held on the reticle fine movement stage by vacuum suction or the like.

  In any case, in the conventional optical exposure apparatus, the reticle mounting surface is the upper surface of the stage capable of θz rotation. For this reason, in the reticle transfer sequence, the transfer robot arm holding the square reticle moves horizontally above the stage capable of θz rotation, and then the transfer robot arm moves downward to move the reticle onto the stage. A sequence was adopted in which the load was moved to a lower position, moved slightly downward, and then returned to the original position.

  Also, in the conventional optical exposure apparatus, a drive mechanism for rotating the θz of the reticle, for example, each of two push-pull bars connected to two orthogonal sides of the stage holding the reticle, or a total of four push-pull bars, or Two sets of voice coil motors and the like having the same function as the pull rod have been used.

  By the way, the semiconductor elements are highly integrated year by year, and the circuit pattern is miniaturized accordingly, and it is certain that the device rule (practical minimum line width) will be 0.1 μm or less in the future. In order to realize the exposure for forming such a fine pattern, there are a lot of problems that must be solved in the light exposure apparatus. Therefore, as a next-generation exposure apparatus, an electron beam exposure apparatus (hereinafter, referred to as an exposure apparatus). There is almost no mistake that "EB exposure apparatus") will be an effective option.

  However, in the case of the EB exposure apparatus, the inside of the chamber in which the exposure apparatus is stored needs to be evacuated, so that the reticle vacuum suction method as described above cannot be adopted, Adsorption method must be adopted. For exposure to form fine patterns of 0.1 μm or less, not only wafer side (projection lens image surface side) but also reticle side (projection lens object surface side) autofocus and auto leveling are essential. Therefore, it is necessary to dispose a focus / leveling sensor on the reticle side. Normally, an oblique incidence type multi-point focus position detection system is used as the focus / leveling sensor. However, when such a multi-point focus position detection system is arranged on the object plane side of the projection lens, a space similar to that on the wafer side is used. For this reason, it is necessary to cause the detection light beam to be incident at an inclination angle of about 5 to 12 ° with respect to the detection surface. Therefore, the reticle needs to be positioned near the lower surface instead of the upper surface of the reticle stage. As a means for realizing this, a configuration in which a counterbore is provided in the reticle stage and an electrostatic chuck is provided therein can be considered.

  However, if the counterbore structure as described above is employed, the reticle mounting surface as a mask is positioned lower than the upper surface of the stage, making it difficult to employ the reticle transport sequence described above as it is.

  Further, in the conventional optical exposure apparatus, since the drive mechanism for rotating the reticle θz as described above is indispensable, the structure of the reticle stage drive mechanism is complicated.

  The applicant and the inventor of the present application can load the mask onto the mask stage without any particular inconvenience even when the mask mounting surface is lower than the upper surface of the stage, and the θz rotation mechanism on the mask stage. An invention relating to a transport apparatus that eliminates the need for the above has been proposed (for example, see Patent Document 1).

  In the invention described in Patent Document 1, by rotating a plurality of support members (arms having a hand-like claw portion of a heel) within a predetermined angle range in the circumferential direction of the mask, a support state and a non-support state with respect to the mask are achieved. A configuration for switching was adopted. For this reason, it is necessary to form a notch or the like in which the nail portion can be inserted and removed on the mask side which is the object to be transported. In the case of a thin mask such as the mask itself or particularly a membrane mask used in an EB exposure apparatus However, it is necessary to form a notch in a ring-shaped support member (support ring) for mounting and supporting a mask.

JP-A-11-117460

  The present invention has been made under such circumstances, the first object of the present invention is to place the mounting surface at a position lower than the upper surface of the stage, even when there is no cutout or the like on the transport object side. An object of the present invention is to provide a conveyance method capable of placing a conveyance object on its placement surface without any trouble and capable of carrying out the conveyance object from the placement surface.

  Further, the second object of the present invention is to place the transport object on the placement surface at a position lower than the upper surface of the stage without any trouble even when there is no cutout or the like on the transport object side. Another object of the present invention is to provide a transport device that can be mounted on the transport surface and can transport a transport target object from the mounting surface.

  A third object of the present invention is to provide an exposure apparatus that can improve exposure accuracy.

The invention according to claim 1 is a transfer method for delivering the transfer object (R) to and from the stage (RST), and has a support part for supporting the transfer object in the vicinity of one end thereof. The plurality of support members (48c _{1 to} 48c ₃ ) that are rotatable about the other end side of the support portion as a rotation center are subjected to a _first operation including the rotation operation of the transport object. A first step of supporting one surface by support portions of the plurality of support members; a second step of carrying the transport object supported by the plurality of support members onto the stage; and the transport object And a third step of retracting the plurality of support members to the other surface side of the object to be transported by a second operation including the pivoting operation after being carried onto the stage.

  According to this, in the 1st process, it has a support part which supports a conveyance subject near the one end part, and a plurality of support members which were made to be rotatable centering on the other end side rather than the support part. However, by performing the first operation including the rotation operation, one surface of the conveyance target is supported by the support portions of the plurality of support members, and in the second step, the plurality of support members are supported in the first step. The supported conveyance object is carried onto the stage. And in a 3rd process, after carrying a conveyance subject onto a stage, a plurality of support members perform the 2nd operation including a rotation operation, and a plurality of support members are on the other surface side of a conveyance subject. Evacuated. That is, according to the present invention, it is possible to load on the stage from a direction substantially perpendicular to the stage mounting surface without forming a notch or the like in the conveyance target. Therefore, for example, even when the carrying surface of the conveyance object is in a position dug down from the upper surface of the stage, it is possible to easily load the conveyance object onto the stage. Further, by performing the reverse operation, it is possible to carry out (unload) the object to be transported from the placement surface without any trouble.

  In this case, as in the transfer method according to claim 2, at least one of the first operation in the first step and the second operation in the third step is the rotation of the plurality of support members. It is possible to include movement and movement movement in a predetermined axis direction parallel to the direction of gravity.

  In each of the transport methods according to claim 1 and 2, the transport method according to claim 3, which is performed after the processing of the first step is completed and before the processing of the second step is completed. A step of measuring an error of the transport object from a predetermined reference state; and a step of correcting the position of the transport object based on the measured error.

  In this case, as in the transport method according to claim 4, in the step of correcting the position of the transport object, the position of the transport object in the rotational direction is corrected while being held by the plurality of support members. Can be done.

  5. In each of the transport methods according to claim 3 and 4, in the step of correcting the position of the transport object as in the transport method according to claim 5, a surface orthogonal to the predetermined axis direction of the transport object. The position inside can be corrected by the movement of the stage.

Invention of Claim 6 is a conveying apparatus which delivers a conveyance target object (R) between stages (RST), Comprising: It has a support part which supports the said conveyance target object in the one end part vicinity. the other end side of the support portion is a plurality of support members and the center of rotation and (48c ₁ ~48c _3); as the supporting portion of the plurality of supporting members around the center of rotation toward and away from each other And a rotation mechanism (48a) for rotating the support member; and a drive mechanism (44) for driving the plurality of support members in a predetermined axial direction parallel to the direction of gravity.

  According to this, the plurality of support members are rotated by the rotation mechanism so that each of the plurality of support members approaches and separates from each other with the other end side of the support portion as the rotation center, and by the drive mechanism. It can be driven in a predetermined axial direction parallel to the direction of gravity. For this reason, a plurality of support members perform the rotation operation and are driven in a predetermined axial direction parallel to the gravitational direction, so that the support portion can be positioned on one surface (lower surface) side of the conveyance object. Is possible. In addition, the plurality of support members can be supported by the plurality of support members by driving the plurality of support members in a predetermined axis direction parallel to the direction of gravity in a direction approaching the object to be transported. On the other hand, by driving a plurality of support members that support the object to be conveyed in the predetermined axial direction, the object to be conveyed can be placed on the stage. By combining the moving operation and the driving in the predetermined axial direction, the plurality of support members can be retracted to the other surface side of the conveyance object.

  As described above, according to the present invention, even when a notch or the like is not formed in the conveyance object, the loading of the conveyance object onto the stage can be performed from a direction substantially perpendicular to the stage mounting surface. For example, even when the placement surface of the conveyance object is in a position dug down from the upper surface of the stage, it is possible to easily load the conveyance object onto the stage. Is possible. Moreover, in the transfer apparatus of the present invention, it is possible to carry out (unload) the transfer object from the stage without hindrance by performing an operation reverse to the above.

  In this case, a pad (54) may be provided on the support portion of the support member as in the transport device according to the seventh aspect.

  In each of the transfer devices according to claims 6 and 7, as in the transfer device according to claim 8, the drive mechanism further moves the rotation mechanism together with the plurality of support members in a rotation direction around the predetermined axis. It can be driven.

  In each of the transport apparatuses according to the sixth to eighth aspects, as in the transport apparatus according to the ninth aspect, the three support members are provided, and the transport objects are not in a straight line by the three support members. It can be supported at three points.

  In each of the transfer devices according to claims 6 to 9, as in the transfer device according to claim 10, the dust receiving device is provided so as to cover at least one drive portion of the rotation mechanism and the drive mechanism. The cover (48b) may be further provided.

  In each of the transfer devices according to the sixth to tenth aspects, like the transfer device according to the eleventh aspect, the transfer object may have a disk shape.

  The invention according to claim 12 is an exposure apparatus for transferring a pattern formed on a mask (R) onto an object (W), a mask stage (RST) for holding the mask; and holding the object. The object stage (WST); The conveyance target object which is at least one of the mask and the object is conveyed with respect to at least one specific stage of the mask stage and the object stage. An exposure apparatus.

  According to this, for example, when the specific stage is a mask stage, even if the mask mounting surface of the mask stage is at a position lower than the upper surface of the mask stage, the transfer according to any one of claims 6 to 11. Since the mask can be placed on the placement surface without any problem, the mask can be positioned near the lower surface of the mask stage. As a result, the oblique incidence type multipoint focus position detection system etc. It is possible to adopt a focus / leveling sensor. Therefore, the focus / leveling control of the mask is possible, and the mask pattern can be transferred onto the substrate with higher accuracy than the conventional exposure apparatus.

  For example, even when the specific stage is an object stage, it is possible to place an object on the object stage from above without any trouble by the transfer device according to claims 6 to 11.

  In this case, as in the exposure apparatus according to claim 13, a mark detection system (68A, 68B) that is provided in the vicinity of the transport apparatus and detects a mark formed on the transport object transported by the transport apparatus. ).

  14. The exposure apparatus according to claim 12 or 13, wherein, as in the exposure apparatus according to claim 14, the mounting surface of the conveyance object of the specific stage is in a recess (40) formed in the specific stage. It may be provided on the bottom surface of the.

  In this case, as in the exposure apparatus according to claim 15, grooves (41 a to 41 c) into which the plurality of support members can be inserted correspond to the support members on the bottom surface in the concave portion of the specific stage. It can be formed.

  According to the transport method of the present invention, even if there is no notch or the like on the transport object side, the transport object is placed on the placement surface at a position lower than the upper surface of the stage without any trouble. This has the effect of being able to place the object to be transported from the placement surface.

  Further, according to the transport apparatus of the present invention, even if there is no notch or the like on the transport object side, the transport object is placed on the placement surface at a position lower than the upper surface of the stage without any trouble. In addition, there is an effect that the object to be transported can be carried out from the placement surface.

  Further, according to the exposure apparatus of the present invention, there is an effect that the exposure accuracy can be improved.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS. FIG. 1 schematically shows a configuration of an exposure apparatus 10 according to an embodiment configured to include a transport apparatus according to the present invention. This exposure apparatus 10 employs an EBPS (Electron Beam Projection System) that employs an electron beam projection system (EBPS) that transfers a pattern of a reticle R as a mask (and an object to be transferred) onto a wafer W as an object by an electron beam. (EB exposure apparatus).

  The exposure apparatus 10 includes a reticle vacuum chamber 12 and a wafer vacuum chamber 14.

  Inside the reticle vacuum chamber 12, a cylindrical illumination system 18 with the Z-axis direction (vertical axis direction) supported by the support frame 16 as an axial direction, and an XY plane (horizontal plane) below the illumination system 18. A reticle stage RST arranged along the reticle stage, a reticle stage RST as a mask stage that moves in the XY two-dimensional direction while holding the reticle R on the reticle stage base 20, and the Z position of the reticle R and the tilt with respect to the XY plane are detected. A reticle AF / AL system (22, 24) and a reticle library (not shown) are stored. Further, the lower half portion of the elevator unit 26 as a transfer device is inserted into the reticle vacuum chamber 12 through a circular opening 12 a formed in the reticle vacuum chamber 12.

  Further, inside the wafer vacuum chamber 14, a plurality (four in this case) of anti-vibration tables 28 (here, the anti-vibration table on the back side of the paper is not shown) disposed on the floor surface of the chamber 14, Wafer stage base 30 held almost horizontally by vibration isolator 28, wafer stage WST as an object stage that holds wafer W on wafer stage base 30 and moves in the XY two-dimensional direction, and the Z position of wafer W A wafer AF / AL system (32, 34) for detecting an inclination with respect to the XY plane, a wafer loader 36, and the like are housed.

  Further, the exposure apparatus 10 includes a projection optical system PL as an optical system in which a reticle vacuum chamber 12 and a wafer vacuum chamber 14 are respectively housed in a part of the upper end and a part of the lower end.

The illumination system 18 includes an electron gun composed of LaB ₆ (lanthanum hexaboride), a blanking electrode, an illumination lens composed of an electron lens, a rectangular aperture, a molded lens composed of an electron lens, and a deflector (all not shown). Etc. The illumination system 18 is formed by forming an electron beam emitted by an electron gun into a bundle of approximately 1 mm square electron beams by blanking electrodes, illumination lenses, rectangular apertures, and shaping lenses. An area of about 1 mm square (referred to as a subfield) on the reticle R is irradiated with an electron beam for illumination. In addition, the deflector has a sufficient deflection capability corresponding to the width RW (see FIG. 3A) in the non-scanning direction of one divided pattern region of the reticle R, which will be described later. It is controlled by a main control device 100 (not shown in FIG. 1, see FIG. 5) that controls the whole. Here, one divided pattern region is not a pattern region to be transferred to one partition region on the wafer W, but one of pattern regions obtained by dividing a pattern to be transferred to one partition region on the wafer into a plurality of portions. In this embodiment, as shown in FIG. 3A, two divided pattern areas PA and PB having a length L in the scanning direction and a width RW in the non-scanning direction are formed on the reticle R. It shall be.

  The reticle stage RST is driven in the XY two-dimensional direction by a magnetically levitated two-dimensional linear actuator 19 (not shown in FIG. 1, see FIG. 5) while holding the reticle R by electrostatic attraction. In this embodiment, since the magnetic levitation type two-dimensional linear actuator 19 is provided with a Z drive coil in addition to an X drive coil and a Y drive coil, the reticle stage RST moves only in the XY plane. In addition, the micro drive is also possible in the Z-axis direction and the tilt direction with respect to the XY plane. Of course, the reticle stage RST can also be two-dimensionally driven by two sets of linear motors.

  As shown in FIGS. 2 and 3B, the reticle stage RST is formed with a counterbore 40 as a circular recess in plan view at the center thereof, and the bottom surface inside the counterbore 40 is formed. A concentric circular opening 42 is formed, leaving a part of the outer periphery. An electrostatic chuck (not shown) is provided on the bottom surface of the counterbore 40, and the reticle R is attracted by the electrostatic chuck. Further, as shown in FIG. 3B, the reticle stage RST is formed with notches 41a to 41c having a predetermined depth from the inner wall forming the counterbore 40 in a direction perpendicular to the inner wall. Yes. These notches 41a to 41c are formed at equiangular intervals (120 ° intervals), and an arm of an elevator unit 26 (described later) can enter these notches 41a to 41c.

  Returning to FIG. 1, the position of the reticle stage RST in the XY plane is detected by the reticle laser interferometer system 38 fixed to the reticle stage base 20 with a resolution of about 0.5 to 1 nm with reference to the projection optical system PL. ing. The measurement value of the reticle laser interferometer system 38 is supplied to the stage control system 21 (not shown in FIG. 1, refer to FIG. 5) and the main controller 100 via this. The configuration of the reticle laser interferometer system 38 will be described later.

  As the reticle AF / AL system for detecting the Z position of the reticle R and the tilt with respect to the XY plane, an imaging light beam for forming a plurality of slit images on the reticle R on the object plane side of the projection optical system PL is used. An irradiation system 22 that is supplied from an oblique direction with respect to the optical axis direction (Z-axis direction) of the projection optical system PL; and a light receiving system 24 that receives each reflected light beam on the reticle surface of the imaging light beam through a slit. An oblique incidence type multi-point focal position detection system is used. As this multipoint focal position detection system (22, 24), for example, one having the same configuration as that disclosed in Japanese Patent Laid-Open No. 6-283403 is used, and this multipoint focal position detection system (22, 24). Is supplied to the main control device 100 and the stage control system 21 via the main control device 100, and the stage control system 21 moves the reticle stage RST to a two-dimensional linear so that the reticle R and the projection optical system PL maintain a predetermined distance. Drive in the Z direction and the tilt direction via the actuator 19.

  The elevator unit 26 is installed directly above the delivery position (loading / unloading position) of the reticle R with respect to the reticle stage RST. As shown in detail in FIG. 2, the elevator unit 26 is provided in a state of closing a circular opening 12a formed in the reticle vacuum chamber 12, and is used for the reticle by a plurality of bolts 46 via a flange portion 59a. A cylindrical elevator unit main body 59 fixed to the vacuum chamber 12, a vertical movement / rotation drive unit 43 provided at the lower end of the elevator unit main body 59, and a vertical movement / rotation drive part 43 of the vertical movement / rotation drive unit 43. And a hand mechanism 48 provided at the tip of the shaft 43B. An annular groove is formed on the surface of the flange portion 59a facing the reticle vacuum chamber 12, and the reticle through the opening 12a is formed by a seal member 63 such as an O-ring provided in the groove. Inflow and outflow of gas between the inside and the outside of the vacuum chamber 12 for use are suppressed as much as possible.

  The vertical movement / rotation drive unit 43 includes a cylindrical guide member 43A provided at the lower end of the elevator unit main body 59, and a vertical movement / rotation shaft 43B inserted into the hollow portion of the guide member 43A. Yes. The vertical movement / rotation shaft 43B is moved along the inner wall of the guide member 43A by an arrow C in FIG. 2 by a vertical movement / rotation drive mechanism 51 (not shown in FIG. 2, see FIG. 5) built in the elevator unit main body 59. , C ′, the vertical direction (Z-axis direction), the direction of arrow D in FIG. 2 and the opposite direction, that is, the rotational direction around the Z-axis (θz direction).

The hand mechanism 48 has arms 48c ₁ , 48c ₂ , and 48c ₃ (in FIG. 2, one arm 48c ₃ is not shown) as a plurality (three in this case) of support members having a substantially W-shape. , 3 (a) and see), the arm 48c ₁ each ～48C ₃ rotationally drives the upper portion near the rotation center, arm opening and closing mechanism of a rotary mechanism for opening and closing the arms 48c ₁ ~48c ₃ 48a and a dust receiving cover 48b as a dust receiving cover provided near the lower end of the arm opening / closing mechanism 48a by a plurality of screws 52. In FIG. 2 and the like, the arm 48c ₁ and the arm 48c ₂ are illustrated as opposed to each other via the rotation center of the hand mechanism 48. However, this is illustrated for convenience of explanation and illustration. Actually, as shown in FIG. 3A, the three arms 48c _{1 to} 48c ₃ are arranged at equiangular intervals (ie, 120 ° intervals).

In addition, a hook-like support portion for supporting the reticle R is formed at the tip (lower end) of the arms 48c ₁ , 48c ₂ , 48c ₃ . Pads 54 made of rubber pins or the like are provided on the upper surfaces of the support portions of the arms 48c _{1 to} 48c ₃ as shown in FIG.

The dust receiving cover 48b is made of a box-like member having an upper opening, and the arms 48c _{1 to} 48c ₃ described above are connected to the dust receiving cover 48b through a plurality of (here, three) openings formed on the side walls thereof. It protrudes from the inside to the outside.

  FIG. 4 shows a plan view of the reticle stage base 20. In FIG. 4, a reticle stage RST indicated by a solid line is positioned at the center of the exposure position for transferring the pattern of the reticle R onto the wafer W, that is, at the center of the projection optical system PL indicated by the center AX of the cross mark. Reticle stage RST indicated by a virtual line (two-dot chain line) indicates a state in which the center of RST is substantially coincident, and is in a transfer position of reticle R. As is apparent from FIG. 4, in the present embodiment, reticle stage RST is configured to move between the delivery position of reticle R and the exposure position. In other words, since the transfer (load / unload) of the reticle R to the reticle stage RST and the exposure are performed at different positions, the description will be given later although the transmission type reticle R is used. As described above, the elevator unit 26 can deliver the reticle R to the reticle stage RST from above.

  Reflective surfaces 121a and 121b are formed on the side surface of the reticle stage RST on one side in the X-axis direction (+ X side) and the side surface on the one side in the Y-axis direction (+ Y side) by mirror finishing. The position of the reticle stage RST in the Y-axis direction, which is the scanning direction, is constantly measured by the reticle Y laser interferometer 38Y that projects the measurement beam RIY onto the reflecting surface 121b. Further, the position in the X-axis direction, which is the non-scanning direction, of the reticle stage RST at the time of exposure is measured by a reticle X laser interferometer 38X1 that projects a measurement beam RIX1 onto the reflecting surface 121a of the reticle stage RST at the exposure position. The position of the reticle stage RST in the X-axis direction during loading and unloading of the reticle R is measured by a reticle X laser interferometer 38X2 capable of projecting a measurement beam RIX2 onto the reflecting surface 121a of the reticle stage RST at the delivery position. It has come to be. The interferometer 38X1 and the interferometer 38X2 need to be switched in the middle of movement. This switching is performed by simultaneously reflecting the length measurement beams from the interferometers 38X1 and 38X2 while the reticle stage RST is moving in the Y-axis direction. This is performed after presetting the interferometer measurement value to match the measurement value of the interferometer that has not been used so far with the measurement value of the interferometer that has been used until then. In order to minimize the error due to the rotation of the reticle stage RST when switching the interferometer, a multi-axis interferometer capable of θz measurement in addition to the measurement of the Y-axis direction position is used as the reticle Y laser interferometer 38Y. ing. Further, the measurement beams from the interferometers 38X1, 38X2, and 38Y are irradiated at substantially the same height as the pattern surface of the reticle R (see FIG. 1).

  As described above, in this embodiment, the reticle laser interferometer system 38 is configured to include the reticle Y laser interferometer 38Y and the two reticle X laser interferometers 38X1 and 38X2. In FIG. 1, a reticle laser interferometer system 38 is typically shown.

  In the present embodiment, as shown in FIG. 4, the reticle stage base 20 is provided with a pair of reticle alignment microscopes 68A and 68B as a mark detection system in the vicinity of the transfer position of the reticle R. With the reticle alignment microscopes 68A and 68B, the reticle alignment marks formed on the pattern surface of the reticle R can be observed at the delivery position. Observation data of the reticle alignment microscopes 68A and 68B is supplied to the main controller 100 (see FIG. 5).

  Returning to FIG. 1, the projection optical system PL has a flange portion FLG provided at a slightly upper center of the lens barrel portion in the height direction, and is supported by the support frame 58 via the flange portion FLG. As the projection optical system PL, a reduction projection optical system composed of a plurality of electron lenses is used. Here, the reduction magnification (projection magnification) β of the projection optical system PL is ¼.

  The wafer stage WST is driven in the XY two-dimensional direction on the wafer stage base 30 by a magnetic levitation type two-dimensional linear actuator 29 (not shown in FIG. 1, see FIG. 5). Wafer W is fixed to the upper surface of wafer stage WST by electrostatic adsorption via wafer holder 60. The wafer holder 60 is driven by a drive system 61 (not shown in FIG. 1, refer to FIG. 5) with a slight drive in the Z-axis direction, a drive in the tilt direction with respect to the XY plane, and a drive in the rotational direction around the Z-axis (θz direction). It is possible. The position of wafer stage WST in the XY plane is detected by wafer laser interferometer system 64 via moving mirror 62 with a resolution of about 0.5 to 1 nm with reference to projection optical system PL. Measurement values of the wafer laser interferometer system 64 are supplied to the stage control system 21 and the main controller 100 via the stage control system 21 (see FIG. 5).

  On the upper surface of wafer stage WST, a reference mark plate FM on which a reference mark for baseline measurement of an alignment detection system described later and other reference marks is formed is provided. The surface of the reference mark plate FM is substantially the same height as the surface of the wafer W.

  As the wafer AF / AL system for detecting the Z position of the wafer W and the tilt with respect to the XY plane, an imaging light beam for forming a plurality of slit images on the wafer W on the image plane side of the projection optical system PL is used. An irradiation system 32 that is supplied from an oblique direction with respect to the optical axis direction (Z-axis direction) of the projection optical system PL; and a light receiving system 34 that receives each reflected light beam of the imaging light beam on the wafer surface through a slit. An oblique incidence type multi-point focal position detection system is used. As this multipoint focal position detection system (32, 34), for example, one having the same configuration as that disclosed in Japanese Patent Laid-Open No. Hei 6-283403 is used, and this multipoint focal position detection system (32, 34). The detected value is supplied to the main controller 100 and the stage control system 21 via the main controller 100, and in the stage control system 21, the wafer holder is held via the drive system 61 so that the wafer W and the projection optical system PL are kept at a predetermined distance. 60 is driven in the Z direction and the tilt direction (see FIG. 5).

  Further, in the exposure apparatus 10 of the present embodiment, off-axis type alignment detection for detecting the position of the alignment mark (wafer mark) attached to each shot area on the wafer W on the side surface of the projection optical system PL. A system, for example, an image processing type image forming alignment detection system ALG is provided, and the measurement result of the alignment detection system ALG is supplied to the main controller 100 (see FIG. 5). Then, main controller 100 calculates the array coordinates of the shot area on wafer W by statistical calculation disclosed in, for example, Japanese Patent Application Laid-Open No. 61-44429 based on the measured position of the wafer mark prior to exposure. EGA (Enhanced Global Alignment) is performed.

  FIG. 5 shows the main components described so far among the components of the control system of the exposure apparatus 10. The control system shown in FIG. 5 is configured around a main control device 100 including a microcomputer (or workstation).

  Next, the reticle R conveyance operation in the exposure apparatus 10 configured as described above will be described with reference to FIGS. 1 to 3B and FIGS. Here, FIG. 6 is an enlarged view of the circle E in FIG.

1. First, based on an instruction from main controller 100, loader robot arm 70 supporting reticle R moves in the horizontal direction as indicated by arrow H in FIG. 1, and conveys reticle R toward the delivery position. Thereafter, the loader robot arm 70 moves to a delivery position almost directly below the elevator unit 26 according to an instruction from the main controller 100 and stops. FIG. 2 shows a state where the loader robot arm 70 is stopped at the delivery position.

At this time, the three arms 48c _{1 to} 48c ₃ are positioned so as not to interfere with the reticle R, specifically, the upper movement limit position indicated by reference numeral P1 in FIG. 2 (more specifically, FIG. 6) above the transfer position. Waiting to In this state, the three arms 48c _{1 to} 48c ₃ are open.

2. Next, in response to an instruction from the main controller 100, the hand mechanism 48 is driven downward by a predetermined amount integrally with the vertical movement / rotation shaft 43B by the vertical movement / rotation drive mechanism 51 (see FIG. 5) in the elevator unit main body 59. As a result, the three arms 48c _{1 to} 48c ₃ are lowered to the position indicated by the symbol P2 in FIG. 2 (more specifically, FIG. 6) and stopped. At the time of the lowering, the tip portions (support portions) of the _three arms 48c _{1 to} 48c ₃ are located slightly outside the reticle R in the height direction. Even in this state, the three arms 48c _{1 to} 48c ₃ are maintained in the open state.

3. Then, according to instructions from main controller 100 by a predetermined angle arm 48c ₁ ~48c ₃ as the rotation around its upper end by the arm opening and closing mechanism 48a is driven to rotate, thereby, three arms 48c ₁ ~48c ₃ is closed. The position (including the posture) of the arm at this time is indicated by a symbol P3 in FIG. 2 (more specifically, FIG. 6). In this case, the tip portions (lower end portions) of the arms 48c _{1 to} 48c ₃ are located slightly below the reticle R.

4). Next, the hand mechanism 48 is driven upward by a predetermined amount integrally with the vertical movement / rotation shaft 43B by the vertical movement / rotation drive mechanism 51 in accordance with an instruction from the main controller 100. As a result, the three arms 48c ₁ , 48c ₂ , 48c ₃ are raised so that the pad 54 provided on the upper surface of the hand-shaped support portion of the heel contacts the bottom surface of the reticle R, and further three arms 48c ₁ , 48c ₂ , 48c ₃ are raised, the reticle R is lifted from below by the arms 48c ₁ , 48c ₂ , 48c ₃ and separated from the loader robot arm 70. In this way, the reticle R is transferred from the loader robot arm 70 to the three arms 48c _{1 to} 48c ₃ .

5. Thereafter, in response to an instruction from the main controller 100, the loader robot arm 70 moves in the direction opposite to the arrow H direction and returns to the original position. The positions (including the posture) of the arms 48c _{1 to} 48c ₃ at this time are indicated by a symbol P4 in FIG.

6). As described above, when the loader robot arm 70 is retracted to a position where it does not interfere with the reticle R, in accordance with an instruction from the main control device 100, the reticle R is loaded onto the reticle stage RST to move up and down and rotate. 51 hand mechanism 48 integrally with vertical movement and rotation shaft 43B is driven downward by, immediately before supported reticle R abuts against the counter bore 40 inside of the bottom surface of reticle stage RST in the three arms 48c ₁ ~48c ₃ It is positioned at the position. The positions (including the posture) of the arms 48c _{1 to} 48c ₃ at this time are indicated by a symbol P5 in FIG. In this case, the three arms 48c _{1 to} 48c ₃ are inserted into the notches 41A to 41C formed in the reticle stage RST.

7). Next, main controller 100 observes the alignment mark (alignment mark) formed on reticle R using a pair of reticle alignment microscopes 68A and 68B installed in the vicinity of opening 20a of reticle stage base 20. Based on the observation result, the positional deviation of the alignment mark from the reference point, that is, the error component of the reticle R in the XY direction and θz direction is calculated. Then, main controller 100 provides a command value for correcting the error component Δθz in the θz direction to the vertical movement / rotation drive mechanism 51 of the elevator unit 26 (in the elevator unit main body 59). Thus, the hand mechanism 48 by the up-and-down motion and rotation drive mechanism 51, i.e., the arm 48c ₁ ~48c ₃ is rotated in accordance with the command value, [theta] z direction error of the reticle R, onto the reticle stage RST on the reticle R It will be corrected just before loading. On the other hand, command values for correcting error components ΔX and ΔY in the XY direction of reticle R are sent from main controller 100 to stage control system 21, and reticle stage RST is slightly driven in the XY two-dimensional direction by stage control system 21. Then, the XY error of the reticle R is corrected immediately before the reticle R is loaded onto the reticle stage RST.

8). When the correction of the error in the XY direction and the θz direction of the reticle R, that is, the alignment of the reticle R is completed as described above, the vertical movement / rotation shaft is moved by the vertical movement / rotation drive mechanism 51 in accordance with an instruction from the main controller 100. The hand mechanism 48 is driven slightly downward together with 43B. As a result, the three arms 48c _{1 to} 48c ₃ are lowered to the position indicated by the symbol P6 in FIG. 8 and stopped. In the middle of this, the reticle R supported by the _three arms 48c ₁ , 48c ₂ , 48c ₃ comes into contact with the bottom surface inside the counterbore 40 of the reticle stage RST, and the three arms 48c _{1 to} 48c ₃ are lowered. As a result, the reticle R is transferred to the reticle stage RST.

9. Then, according to instructions from main controller 100, the arm opening and closing mechanism 48a is only the rotary drive a predetermined angle as a rotation around the upper end portion of the arm 48c ₁ ~48c _3, the reference symbols shown the arm 48c ₁ ~48c ₃ in FIG. 9 Set to the state of P7 (open state). Then, according to instructions from main controller 100, the hand mechanism 48 integrally with vertical movement and rotation shaft 43B by vertical movement and rotation drive mechanism 51 is driven upward, thereby three arms 48c ₁ ~48c ₃ of FIG. Retreat to position 10 P8. The position P8 in this case matches the position P1 (initial position) shown in FIG.

  Thus, the loading (loading) of the reticle R onto the reticle stage RST is completed.

  When carrying out (unloading) the reticle R from the reticle stage RST, the above 7. Except for the operation of 1. above, ~ 9. The operation is performed in the opposite order of the above procedure.

  Next, another operation of the exposure process in the exposure apparatus 10 performed following the loading of the reticle R will be briefly described.

  First, under the control of main controller 100, wafer loader 36 loads wafer W onto wafer stage WST, and baseline measurement using reference mark plate FM on wafer stage WST and alignment detection system ALG. Such preparatory work is performed according to a predetermined procedure.

  Thereafter, the main controller 100 executes wafer alignment measurement such as EGA using the alignment detection system ALG. In such an operation, when it is necessary to move the wafer W, the main controller 100 supplies a current value and current supplied to a predetermined armature coil constituting the two-dimensional linear actuator 29 via the stage control system 21. By controlling at least one of the directions, wafer stage WST holding wafer W is moved in a desired direction. After the wafer alignment measurement is completed, the scanning exposure type exposure operation is performed as follows.

  In this exposure operation, first, the wafer stage is set so that the XY position of the wafer W becomes the scanning start position for exposure of the first divided area in the first partitioned area (first shot area) on the wafer W. WST is moved. At the same time, the reticle stage RST is moved so that the XY position of the reticle R becomes the scanning start position of the first divided pattern area PA. Then, based on an instruction from main controller 100, stage control system 21 performs XY position information on reticle R measured by reticle laser interferometer system 38, and XY position information on wafer W measured by wafer laser interferometer system 64. Based on the above, the reticle R and the wafer W are synchronously moved along the Y-axis direction in opposite directions at a speed ratio corresponding to the projection magnification of the projection optical system PL via the two-dimensional linear actuators 19 and 29. The entire area of the first divided pattern area PA in the non-scanning direction is scanned in the non-scanning direction (X-axis direction) with a bundle of 1 mm square electron beams irradiated onto the reticle R from the illumination system 18 at a speed much higher than the scanning speed of To be deflected. This deflection is performed by a deflector in the illumination system 18 based on an instruction from the main controller 100. As a result, the entire first divided pattern area PA is transferred to the first divided area in the first shot area on the wafer W. During the scanning exposure for the first divided area, the stage control system 21 slightly drives the reticle stage RST in the Z direction and the tilt direction with respect to the XY plane based on the measurement values of the reticle AF / AL system (22, 24). Then, the focus / leveling control is performed, and the wafer holder 60 is slightly driven in the Z direction and the tilt direction with respect to the XY plane based on the measurement values of the wafer AF / AL system (32, 34) to perform the focus / leveling control.

  In this way, when the transfer of the first divided pattern area PA is completed, the reticle control RST and the wafer stage WST are synchronized by the stage control system 21 so that, for example, each of the U-shaped movement trajectories is continuously obtained. Moved. Then, the XY position of the wafer W becomes a scanning start position for exposure of the second divided area in the first shot area on the wafer W, and the XY position of the reticle R starts scanning of the second divided pattern area PB. When the position is reached, the pattern of the second divided pattern area PB is transferred to the second divided area adjacent to the first divided area in the first shot area on the wafer W in the same manner as described above. Thereby, the transfer of the reticle pattern to the first shot area on the wafer W is completed.

  Thus, when the transfer of the reticle pattern for one shot area is completed, the wafer stage WST is stepped by a predetermined amount, and the transfer of the reticle pattern for the next shot area is performed in the same manner as described above. Stepping and reticle pattern transfer are sequentially repeated, and a pattern having the required number of shots is transferred onto the wafer W.

As described in detail above, according to the present embodiment, the three arms 48c _{1 each} having a support portion for supporting the reticle R in the vicinity of one end thereof and rotatable around the vicinity of the other end. ˜48c ₃ perform the rotation operation and the vertical movement operation, so that one surface (lower surface) of the reticle R is supported by the support portions of the _three arms 48c _{1 to} 48c ₃ (first step), The supported reticle R is carried onto the reticle stage RST (second step). Then, after the carry-in, the three arms 48c _{1 to} 48c ₃ perform the rotation operation and the vertical movement operation so that the three arms are retracted to the other surface (upper surface) side of the reticle R (third step). ). That is, it is possible to load (and unload) the reticle R onto the reticle stage RST from a direction substantially perpendicular to the mounting surface of the reticle stage. Therefore, even when the mounting surface of the reticle R is at a position dug down from the upper surface of the reticle stage RST, loading onto the reticle stage RST (unloading from the reticle stage RST) is easily performed. Is possible. For this reason, a focus / leveling sensor such as an oblique incidence type multi-point focus position detection system can be employed on the reticle stage RST side, and the focus / leveling control of the reticle R can be performed. The reticle pattern can be transferred onto the wafer W with higher accuracy than the exposure apparatus having only the / AL system.

Further, according to this embodiment, the arm 48c ₁ ~48c ₃ is the lower surface from the upper surface side of the reticle R, and the movement from the lower side to the upper side is realized by opening and closing operation of the arm 48c ₁ ~48c ₃ Therefore, it is not necessary to process the reticle R such as a notch or attach a ring (support ring) in which the notch is formed.

Further, according to the present embodiment, since the pair of reticle alignment microscopes 68A and 68B are disposed below the delivery position of the reticle R, the reticle stage is supported after the _three arms 48c _{1 to} 48c ₃ support the reticle R. Until the loading of the reticle R into the RST is completed, the reticle alignment mark formed on the reticle R is observed and measured, the θz error of the reticle R is corrected by the elevator unit 26, and the XY movement of the reticle stage RST is performed. By correcting the XY error of the reticle, reticle alignment can be performed prior to loading of the reticle R into the reticle stage RST. Further, as a result, the conventional θz stage (θz rotation mechanism) is not required for the reticle stage RST, and the structure of the reticle stage RST can be simplified.

In the present embodiment, since the pads 54 are provided on the support portions of the _three arms 48c _{1 to} 48c ₃ , for example, the arms 48c _{1 to} 48c ₃ are made of metal such as iron, and the reticle R Is non-metal such as silicon carbide, the pad 54 can prevent the reticle R and the arms 48c _{1 to} 48c _{3 from} coming into direct contact with each other, so that the reticle R is scratched or dust is generated. It becomes possible to prevent it from doing as much as possible. In this case, if rubber is used as the pad, the friction coefficient is high, so that the reticle R can be stably supported by the arms 48c _{1 to} 48c ₃ .

Further, in the present embodiment, since it is provided with a dust receiving tray 48b on the lower side of the arm opening and closing mechanism 48a for opening and closing the arms 48c ₁ ~48c _3, dust is generated by the opening and closing of the arms 48c ₁ ~48c ₃ However, it is possible to prevent or effectively suppress the dust and the like from falling downward, that is, toward the reticle stage RST. The dust receiving tray may be provided around the vertical movement / rotation shaft 43B.

  Note that both the XY error and θz error of the reticle R may be performed by moving the reticle stage RST, and the vertical movement / rotation drive unit 43 of the elevator unit 26 is the vertical movement / rotation drive mechanism in the elevator unit main body 59. In the case of being configured so as to be able to be driven in the XY directions by 51, both the XY error and the θz error of the reticle R may be corrected by driving the elevator unit 26.

In the above embodiment, the case where the arms 48c _{1 to} 48c ₃ are rotated in the vicinity of the upper end thereof has been described. However, the arm 48c ′ as shown in FIG. 11A and the arm 48c ′ shown in FIG. It is also possible to employ such an arm 48c ″.

  That is, like these arms 48c ′ and 48c ″, a joint part 99 is provided at the middle part of the arm and can be rotated around the joint part 99. In this case, the joint part 99 can be configured. An arm opening / closing mechanism may be provided directly on the arm, or an arm opening / closing mechanism is provided in the elevator unit 59 together with the vertical movement / rotation drive mechanism 51, and the arm is opened via a wire connecting the arm opening / closing mechanism and a part of the arm. 11 (A) and 11 (B), the rotation center of the arm may be at any position as long as it is above the support portion of the arm. good.

  In the above-described embodiment, the case where the disk-shaped reticle R is used and the elevator unit 26 carries the disk-shaped reticle R onto the reticle stage RST is described. However, the present invention is not limited to this. The elevator unit 26 can also be suitably applied to a reticle having a rectangular shape or other shapes in plan view. Further, the present invention can be suitably applied not only to the reticle but also to the wafer side.

  In the above embodiment, the case where there are three arms as support members has been described. However, this is because three arms are supported from the viewpoint of stably supporting a disk-shaped object to be conveyed and simplifying the configuration. It is provided. However, the present invention is not limited to this, and two or four or more support members may be provided. When the number of support members is two, the contact portion of each support member with the object to be transported may have a shape that can stably support a certain range along the outer edge of the object to be transported.

  In the above embodiment, when the reticle R is carried into the reticle stage RST, the three arms 48c as the support members are driven in the vertical direction. However, if the stage is movable up and down, The support member and the stage may be relatively driven in the vertical direction.

In the above embodiment, the case where the present invention is applied to an electron beam exposure apparatus that adopts the EBPS method has been described. However, the scope of the present invention is not limited to this, and for example, an ultrahigh voltage as a light source is used. Deep ultraviolet (DUV) exposure device equipped with a mercury lamp or KrF excimer laser device (oscillation wavelength 248 nm), vacuum ultraviolet light source using ArF excimer laser device (oscillation wavelength 193 nm), F ₂ laser device (oscillation wavelength 157 nm) as a light source The present invention can also be suitably applied to an exposure apparatus such as a (VUV) exposure apparatus or an EUV exposure apparatus having a light source that emits extreme ultraviolet light (EUV light) in the soft X-ray region.

  Such an optical exposure apparatus is a scanning type exposure apparatus (for example, US Pat. No. 5,473,410) that exposes a mask pattern by moving the mask and the substrate synchronously, or the mask and the substrate in a stationary state. Any of a step-and-repeat type exposure apparatus that transfers the pattern to the substrate and sequentially moves the substrate stepwise may be used.

Further, the magnification of the projection optical system constituting such an exposure apparatus may be not only a reduction system but also an equal magnification or an enlargement system. As the projection optical system, a material that transmits far ultraviolet rays such as quartz or fluorite is used as a glass material when using far ultraviolet rays such as an excimer laser, and a catadioptric system or the like when using F ₂ laser light or EUV light. A reflective optical system may be used, and a reflective type reticle may be used. When such a reflective type reticle is used, the reticle may be loaded and unloaded near the exposure position.

  Further, when a linear motor (see US Pat. No. 5,623,853 or US Pat. No. 5,528,118) is used for a wafer stage or a reticle stage, an air floating type and a Lorentz force using an air bearing are used. Alternatively, either a magnetic levitation type using a reactance force may be used. The stage may be a tie that moves along a guide, or may be a guideless type without a guide.

  The reaction force generated by the movement of the wafer stage is mechanically applied to the floor (ground) using a frame member as described in JP-A-8-166475 (US Pat. No. 5,528,118). You can escape. The reaction force generated by the movement of the reticle stage may be mechanically released to the floor (ground) using a frame member as described in JP-A-8-330224.

  Furthermore, the present invention provides not only an exposure apparatus used for manufacturing a semiconductor element but also an exposure apparatus used for manufacturing a display including a liquid crystal display element, a plasma display, etc., which transfers a device pattern onto a glass plate, and thin film magnetism. For the exposure apparatus used for manufacturing the mask, the exposure apparatus for transferring the device pattern onto the ceramic wafer, the imaging device (CCD, etc.), the micromachine, and the DNA chip, and the exposure apparatus used for manufacturing the mask or reticle, etc. Can also be applied.

  In addition, the illumination system and projection optical system composed of a plurality of electron lenses and the like are incorporated and adjusted in the exposure apparatus main body, and a reticle stage and wafer stage consisting of a large number of mechanical parts are attached to the exposure apparatus main body to provide wiring and piping The exposure apparatus of the above-described embodiment can be manufactured by connecting and further performing overall adjustment (electrical adjustment, operation check, etc.). The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  The semiconductor device includes a step of designing a function and performance of the device, a step of manufacturing a reticle based on the design step, a step of manufacturing a wafer from a silicon material, and a reticle pattern by the exposure apparatus of the above-described embodiment. And a device assembly step (including a dicing process, a bonding process, and a packaging process), an inspection step, and the like.

  The transfer method and transfer apparatus of the present invention are suitable for delivering a transfer object to and from the stage. The exposure apparatus of the present invention is suitable for transferring a pattern formed on a mask onto an object.

It is a figure which shows schematically the structure of the exposure apparatus which concerns on one Embodiment. It is a figure which expands and shows the elevator unit vicinity of FIG. 3A is a cross-sectional view taken along the line AA in FIG. 2, and FIG. 3B is a plan view of the reticle stage RST. It is a top view of the reticle stage base of FIG. FIG. 2 is a block diagram showing a configuration of a control system of the exposure apparatus in FIG. 1. It is a figure which expands and shows the part in the circle E of FIG. FIG. 3 is a diagram (No. 1) for explaining reticle loading by the elevator unit of FIG. 2. FIG. 6 is a diagram (No. 2) for explaining reticle loading by the elevator unit of FIG. 2. FIG. 6 is a diagram (No. 3) for explaining reticle loading by the elevator unit of FIG. 2. FIG. 6 is a diagram (No. 4) for explaining reticle loading by the elevator unit of FIG. 2; It is a figure for demonstrating the modification of the some arm which comprises an elevator unit.

Explanation of symbols

40 ... concave portion, 41a to 41c ... groove, 44 ... vertical movement / rotation drive unit (drive mechanism), 48a ... arm opening / closing mechanism (rotation mechanism), 48b ... dust receiving cover (cover for dust receiving), 48c _1- 48c ₃ ... arm (support member), 54 ... pad, 68A, 68B ... reticle alignment microscope (mark detection system), R ... reticle (conveyed object, mask), RST ... reticle stage (stage, mask stage), W ... Wafer (object), WST ... wafer stage (object stage).

Claims (15)

A transfer method for transferring a transfer object to and from a stage,
A plurality of support members having a support portion for supporting the object to be conveyed in the vicinity of the one end portion and rotatable about the other end side of the support portion as a rotation center. A first step of supporting one surface of the transport object by a support portion of the plurality of support members by the operation of 1;
A second step of carrying the transport object supported by the plurality of support members onto the stage;
And a third step of retracting the plurality of support members to the other surface side of the conveyance object by a second operation including the rotation operation after the conveyance object is carried onto the stage. Method.   At least one of the first operation in the first step and the second operation in the third step is a rotation operation of the plurality of support members and a movement operation in a predetermined axial direction parallel to the direction of gravity. The transport method according to claim 1, comprising: A step of measuring an error of the transport object from a predetermined reference state, which is performed after the processing of the first step is completed and before the processing of the second step is completed;
The transport method according to claim 1, further comprising: correcting the position of the transport object based on the measured error.   4. The transport method according to claim 3, wherein in the step of correcting the position of the transport target object, the position of the transport target object in the rotation direction is corrected while being held by the plurality of support members. .   5. The step of correcting the position of the transport target object corrects the position of the transport target object in a plane perpendicular to the predetermined axis direction by moving the stage. Transport method. A transfer device for transferring a transfer object to and from a stage,
A plurality of support members having a support part for supporting the object to be conveyed in the vicinity of one end part thereof, the other end part of which is the rotation center of the support part;
A rotation mechanism that rotates the support member so that the support portions of the plurality of support members approach and separate from each other around the rotation center;
A drive mechanism that drives the plurality of support members in a predetermined axial direction parallel to the direction of gravity.   The transport device according to claim 6, wherein a pad is provided on the support portion of the support member.   The transport device according to claim 6 or 7, wherein the drive mechanism further drives the rotation mechanism together with the plurality of support members in a rotation direction around the predetermined axis.   The said support member is provided three and the said conveyance target object is supported by three different points which are not on a straight line with the said three support members, The conveyance as described in any one of Claims 6-8 characterized by the above-mentioned. apparatus.   The transport apparatus according to any one of claims 6 to 9, further comprising a dust receiving cover provided in a state of covering at least one drive portion of the rotation mechanism and the drive mechanism. .   The said conveying target object has a disk-shaped shape, The conveying apparatus as described in any one of Claims 6-10 characterized by the above-mentioned. An exposure apparatus for transferring a pattern formed on a mask onto an object,
A mask stage for holding the mask;
An object stage for holding the object;
The transfer apparatus according to any one of claims 6 to 11, wherein a transfer object that is at least one of the mask and the object is transferred to at least one specific stage of the mask stage and the object stage; An exposure apparatus comprising:   The exposure apparatus according to claim 12, further comprising a mark detection system that is provided in the vicinity of the transport apparatus and detects a mark formed on the transport object transported by the transport apparatus.   14. The exposure apparatus according to claim 12, wherein a mounting surface of the conveyance target of the specific stage is provided on a bottom surface in a recess formed in the specific stage. The exposure apparatus according to claim 14, wherein a groove into which the plurality of support members can be inserted is formed on a bottom surface in the concave portion of the specific stage so as to correspond to the support members.

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