HRP20090045T3 - Method for applying an electronic assembly to a substrate and a device for applying said assembly - Google Patents
Method for applying an electronic assembly to a substrate and a device for applying said assemblyInfo
- Publication number
- HRP20090045T3 HRP20090045T3 HR20090045T HRP20090045T HRP20090045T3 HR P20090045 T3 HRP20090045 T3 HR P20090045T3 HR 20090045 T HR20090045 T HR 20090045T HR P20090045 T HRP20090045 T HR P20090045T HR P20090045 T3 HRP20090045 T3 HR P20090045T3
- Authority
- HR
- Croatia
- Prior art keywords
- substrate
- applying
- segment
- assembly
- electronic assembly
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 4
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/19—Manufacturing methods of high density interconnect preforms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP05100694A EP1686512A1 (fr) | 2005-02-01 | 2005-02-01 | Procédé de placement d'un ensemble électronique sur un substrat et dispositif de placement d'un tel ensemble |
| EP05109094 | 2005-09-30 | ||
| PCT/EP2006/050585 WO2006082199A2 (fr) | 2005-02-01 | 2006-02-01 | Procédé de placement d'un ensemble électronique sur un substrat et dispositif de placement d'un tel ensemble |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HRP20090045T3 true HRP20090045T3 (en) | 2009-02-28 |
Family
ID=36645615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HR20090045T HRP20090045T3 (en) | 2005-02-01 | 2009-01-23 | Method for applying an electronic assembly to a substrate and a device for applying said assembly |
Country Status (27)
| Country | Link |
|---|---|
| US (2) | US7785932B2 (ko) |
| EP (1) | EP1846874B1 (ko) |
| JP (1) | JP4838813B2 (ko) |
| KR (1) | KR101145535B1 (ko) |
| CN (1) | CN101111855B (ko) |
| AP (1) | AP2226A (ko) |
| AT (1) | ATE413666T1 (ko) |
| AU (1) | AU2006210245B2 (ko) |
| BR (1) | BRPI0606562A8 (ko) |
| CA (1) | CA2595796C (ko) |
| CY (1) | CY1108717T1 (ko) |
| DE (1) | DE602006003528D1 (ko) |
| DK (1) | DK1846874T3 (ko) |
| EG (1) | EG25336A (ko) |
| ES (1) | ES2318724T3 (ko) |
| HR (1) | HRP20090045T3 (ko) |
| MA (1) | MA29242B1 (ko) |
| ME (1) | ME01052B (ko) |
| MX (1) | MX2007009166A (ko) |
| PL (1) | PL1846874T3 (ko) |
| PT (1) | PT1846874E (ko) |
| RS (1) | RS50718B (ko) |
| RU (1) | RU2398280C2 (ko) |
| SI (1) | SI1846874T1 (ko) |
| TN (1) | TNSN07302A1 (ko) |
| WO (1) | WO2006082199A2 (ko) |
| ZA (1) | ZA200707271B (ko) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8181879B2 (en) | 2006-12-29 | 2012-05-22 | Solicore, Inc. | Mailing apparatus for powered cards |
| WO2008082616A1 (en) | 2006-12-29 | 2008-07-10 | Solicore, Inc. | Card configured to receive separate battery |
| JP5012896B2 (ja) * | 2007-06-26 | 2012-08-29 | 株式会社村田製作所 | 部品内蔵基板の製造方法 |
| FR2951866B1 (fr) * | 2009-10-27 | 2011-11-25 | Arjowiggins Security | Procede de fabrication d'un support integrant un dispositif electronique |
| DE102010011517A1 (de) * | 2010-03-15 | 2011-09-15 | Smartrac Ip B.V. | Laminataufbau für eine Chipkarte und Verfahren zu dessen Herstellung |
| US8963313B2 (en) | 2011-12-22 | 2015-02-24 | Raytheon Company | Heterogeneous chip integration with low loss interconnection through adaptive patterning |
| EP2736001A1 (fr) * | 2012-11-27 | 2014-05-28 | Gemalto SA | Module électronique à interface de communication tridimensionnelle |
| EP2767935A1 (fr) | 2013-02-18 | 2014-08-20 | NagraID S.A. | Couche plastique pour carte électronique |
| US10558905B2 (en) * | 2015-02-20 | 2020-02-11 | Nid Sa | Method for producing a device comprising at least one electronic element associated with a substrate and an antenna |
| DE102015220855A1 (de) * | 2015-10-26 | 2017-04-27 | Robert Bosch Gmbh | Sensorvorrichtung zur Erfassung mindestens einer Strömungseigenschaft eines fluiden Mediums |
| US10963770B2 (en) | 2016-03-01 | 2021-03-30 | Cardlab Aps | Circuit layer for an integrated circuit card |
| US10580745B1 (en) * | 2018-08-31 | 2020-03-03 | Globalfoundries Inc. | Wafer level packaging with integrated antenna structures |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2632100B1 (fr) * | 1988-05-25 | 1992-02-21 | Schlumberger Ind Sa | Procede de realisation d'une carte a memoire electronique et cartes a memoire electronique obtenue par la mise en oeuvre dudit procede |
| US5234530A (en) * | 1991-05-20 | 1993-08-10 | Eastman Kodak Company | Apparatus for controlling assembly force |
| US5406699A (en) * | 1992-09-18 | 1995-04-18 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing an electronics package |
| FR2701139B1 (fr) | 1993-02-01 | 1995-04-21 | Solaic Sa | Procédé pour l'implantation d'un micro-circuit sur un corps de carte intelligente et/ou à mémoire, et carte comportant un micro-circuit ainsi implanté. |
| ZA941671B (en) * | 1993-03-11 | 1994-10-12 | Csir | Attaching an electronic circuit to a substrate. |
| JP3409380B2 (ja) * | 1993-07-30 | 2003-05-26 | カシオ計算機株式会社 | プリント基板装置 |
| DE4344297A1 (de) * | 1993-12-23 | 1995-06-29 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Ausweiskarten |
| EP0786357A4 (en) * | 1994-09-22 | 2000-04-05 | Rohm Co Ltd | CONTACTLESS CHIP CARD AND METHOD FOR PRODUCING THE SAME |
| DE19602821C1 (de) * | 1996-01-26 | 1997-06-26 | Siemens Ag | Verfahren zur Herstellung einer Datenkarte |
| DE19609636C1 (de) * | 1996-03-12 | 1997-08-14 | Siemens Ag | Chipkarte und Verfahren zur Herstellung einer Chipkarte |
| FR2756955B1 (fr) | 1996-12-11 | 1999-01-08 | Schlumberger Ind Sa | Procede de realisation d'un circuit electronique pour une carte a memoire sans contact |
| FR2761497B1 (fr) | 1997-03-27 | 1999-06-18 | Gemplus Card Int | Procede de fabrication d'une carte a puce ou analogue |
| US6038133A (en) * | 1997-11-25 | 2000-03-14 | Matsushita Electric Industrial Co., Ltd. | Circuit component built-in module and method for producing the same |
| JP3440801B2 (ja) * | 1998-01-12 | 2003-08-25 | セイコーエプソン株式会社 | 電子部品の接合装置 |
| US6107920A (en) * | 1998-06-09 | 2000-08-22 | Motorola, Inc. | Radio frequency identification tag having an article integrated antenna |
| FR2780500B1 (fr) | 1998-06-25 | 2000-09-08 | Lorraine Laminage | Procede et dispositif de mesure d'un debit de matiere solide a l'etat divise, et application a un haut fourneau siderurgique |
| FR2780534B1 (fr) * | 1998-06-25 | 2002-08-16 | Solaic Sa | Procede de realisation d'objets portatifs a composants electroniques et objets portatifs tels qu'obtenus par ledit procede |
| CN1143374C (zh) * | 1998-07-01 | 2004-03-24 | 精工爱普生株式会社 | 半导体装置及其制造方法、电路基板和电子装置 |
| US6100804A (en) * | 1998-10-29 | 2000-08-08 | Intecmec Ip Corp. | Radio frequency identification system |
| US7038310B1 (en) * | 1999-06-09 | 2006-05-02 | Matsushita Electric Industrial Co., Ltd. | Power module with improved heat dissipation |
| US6259408B1 (en) * | 1999-11-19 | 2001-07-10 | Intermec Ip Corp. | RFID transponders with paste antennas and flip-chip attachment |
| JP3451373B2 (ja) * | 1999-11-24 | 2003-09-29 | オムロン株式会社 | 電磁波読み取り可能なデータキャリアの製造方法 |
| DE10016715C1 (de) * | 2000-04-04 | 2001-09-06 | Infineon Technologies Ag | Herstellungsverfahren für laminierte Chipkarten |
| FR2824939B1 (fr) * | 2001-05-16 | 2003-10-10 | A S K | Procede de fabrication d'une carte a puce sans contact a l'aide de papier transfert et carte a puce obtenue a partir de ce procede |
| DE10136359C2 (de) * | 2001-07-26 | 2003-06-12 | Muehlbauer Ag | Verfahren zum Verbinden von Mikrochipmodulen mit auf einem ersten Trägerband angeordneten Antennen zum Herstellen eines Transponders |
| FR2832354B1 (fr) * | 2001-11-20 | 2004-02-20 | Arjo Wiggins Sa | Procede de fabrication d'un article comportant une feuille et au moins un element rapporte sur cette feuille |
| US6838316B2 (en) * | 2002-03-06 | 2005-01-04 | Kabushiki Kaisha Toshiba | Semiconductor device manufacturing method using ultrasonic flip chip bonding technique |
| US7230994B2 (en) | 2002-04-04 | 2007-06-12 | Nec Corporation | Multi-level modulation apparatus, multi-level demodulation apparatus, multi-level modulation/demodulation communication system, program and modulation/demodulation method |
| US6867983B2 (en) * | 2002-08-07 | 2005-03-15 | Avery Dennison Corporation | Radio frequency identification device and method |
| CN1577819A (zh) * | 2003-07-09 | 2005-02-09 | 松下电器产业株式会社 | 带内置电子部件的电路板及其制造方法 |
| JP4479209B2 (ja) * | 2003-10-10 | 2010-06-09 | パナソニック株式会社 | 電子回路装置およびその製造方法並びに電子回路装置の製造装置 |
| US6974724B2 (en) * | 2004-04-28 | 2005-12-13 | Nokia Corporation | Shielded laminated structure with embedded chips |
| JP5052130B2 (ja) * | 2004-06-04 | 2012-10-17 | カミヤチョウ アイピー ホールディングス | 三次元積層構造を持つ半導体装置及びその製造方法 |
| US7385284B2 (en) * | 2004-11-22 | 2008-06-10 | Alien Technology Corporation | Transponder incorporated into an electronic device |
| US8067253B2 (en) * | 2005-12-21 | 2011-11-29 | Avery Dennison Corporation | Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film |
-
2006
- 2006-01-30 US US11/342,911 patent/US7785932B2/en not_active Expired - Fee Related
- 2006-02-01 RU RU2007128621/09A patent/RU2398280C2/ru not_active IP Right Cessation
- 2006-02-01 ZA ZA200707271A patent/ZA200707271B/xx unknown
- 2006-02-01 CA CA2595796A patent/CA2595796C/en not_active Expired - Fee Related
- 2006-02-01 DE DE602006003528T patent/DE602006003528D1/de active Active
- 2006-02-01 EP EP06707949A patent/EP1846874B1/fr active Active
- 2006-02-01 SI SI200630160T patent/SI1846874T1/sl unknown
- 2006-02-01 BR BRPI0606562A patent/BRPI0606562A8/pt not_active Application Discontinuation
- 2006-02-01 RS RSP-2009/0051A patent/RS50718B/sr unknown
- 2006-02-01 KR KR1020077017628A patent/KR101145535B1/ko active IP Right Grant
- 2006-02-01 JP JP2007552664A patent/JP4838813B2/ja not_active Expired - Fee Related
- 2006-02-01 CN CN2006800037584A patent/CN101111855B/zh not_active Expired - Fee Related
- 2006-02-01 PT PT06707949T patent/PT1846874E/pt unknown
- 2006-02-01 PL PL06707949T patent/PL1846874T3/pl unknown
- 2006-02-01 MX MX2007009166A patent/MX2007009166A/es active IP Right Grant
- 2006-02-01 ES ES06707949T patent/ES2318724T3/es active Active
- 2006-02-01 AT AT06707949T patent/ATE413666T1/de active
- 2006-02-01 ME MEP-2009-40A patent/ME01052B/me unknown
- 2006-02-01 AP AP2007004088A patent/AP2226A/xx active
- 2006-02-01 DK DK06707949T patent/DK1846874T3/da active
- 2006-02-01 AU AU2006210245A patent/AU2006210245B2/en not_active Ceased
- 2006-02-01 WO PCT/EP2006/050585 patent/WO2006082199A2/fr active Application Filing
-
2007
- 2007-07-26 EG EGNA2007000774 patent/EG25336A/xx active
- 2007-07-31 MA MA30119A patent/MA29242B1/fr unknown
- 2007-08-01 TN TNP2007000302A patent/TNSN07302A1/fr unknown
-
2009
- 2009-01-23 HR HR20090045T patent/HRP20090045T3/xx unknown
- 2009-01-27 CY CY20091100088T patent/CY1108717T1/el unknown
-
2010
- 2010-08-30 US US12/871,100 patent/US8218332B2/en not_active Expired - Fee Related
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