HK1253585A1 - 用於曝光和基板相關操作的裝置和方法 - Google Patents

用於曝光和基板相關操作的裝置和方法

Info

Publication number
HK1253585A1
HK1253585A1 HK18112791.6A HK18112791A HK1253585A1 HK 1253585 A1 HK1253585 A1 HK 1253585A1 HK 18112791 A HK18112791 A HK 18112791A HK 1253585 A1 HK1253585 A1 HK 1253585A1
Authority
HK
Hong Kong
Prior art keywords
exposure
substrate
operations related
operations
Prior art date
Application number
HK18112791.6A
Other languages
English (en)
Inventor
青木保夫
關忠
柳川卓也
Original Assignee
株式會社尼康
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式會社尼康 filed Critical 株式會社尼康
Publication of HK1253585A1 publication Critical patent/HK1253585A1/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups
HK18112791.6A 2009-11-27 2018-10-08 用於曝光和基板相關操作的裝置和方法 HK1253585A1 (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US27297909P 2009-11-27 2009-11-27
US27297809P 2009-11-27 2009-11-27
US12/954,760 US20110141448A1 (en) 2009-11-27 2010-11-26 Substrate carrier device, substrate carrying method, substrate supporting member, substrate holding device, exposure apparatus, exposure method and device manufacturing method

Publications (1)

Publication Number Publication Date
HK1253585A1 true HK1253585A1 (zh) 2019-06-21

Family

ID=43736207

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18112791.6A HK1253585A1 (zh) 2009-11-27 2018-10-08 用於曝光和基板相關操作的裝置和方法

Country Status (7)

Country Link
US (1) US20110141448A1 (zh)
JP (4) JP5761190B2 (zh)
KR (2) KR102139920B1 (zh)
CN (2) CN108008603A (zh)
HK (1) HK1253585A1 (zh)
TW (3) TWI537197B (zh)
WO (1) WO2011065589A2 (zh)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5843161B2 (ja) * 2011-05-13 2016-01-13 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
WO2012157231A1 (ja) * 2011-05-13 2012-11-22 株式会社ニコン 基板の交換装置
TWI647779B (zh) * 2011-08-30 2019-01-11 日商尼康股份有限公司 物體搬送裝置、物體處理裝置、曝光裝置、平板顯示器之製造方法、元件製造方法、物體之搬送方法、及物體交換方法
JP5943588B2 (ja) * 2011-11-29 2016-07-05 株式会社ディスコ 洗浄装置
KR101414830B1 (ko) * 2011-11-30 2014-07-03 다이닛뽕스크린 세이조오 가부시키가이샤 얼라이먼트 방법, 전사 방법 및 전사장치
WO2013150787A1 (ja) * 2012-04-04 2013-10-10 株式会社ニコン 物体搬送システム、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、物体保持装置、物体搬送装置、物体搬送方法、及び物体交換方法
JP6243898B2 (ja) 2012-04-19 2017-12-06 インテヴァック インコーポレイテッド 太陽電池製造のための２重マスク装置
JP6231078B2 (ja) 2012-04-26 2017-11-15 インテヴァック インコーポレイテッド 真空プロセスのためのシステム構成
US10062600B2 (en) 2012-04-26 2018-08-28 Intevac, Inc. System and method for bi-facial processing of substrates
DE202012102102U1 (de) * 2012-06-08 2012-07-03 De-Sta-Co Europe Gmbh Verbindungselement
US9694990B2 (en) * 2012-06-14 2017-07-04 Evatec Ag Transport and handing-over arrangement for disc-shaped substrates, vacuum treatment installation and method for manufacture treated substrates
KR101971453B1 (ko) * 2012-11-12 2019-04-24 주식회사 원익아이피에스 기판처리모듈 및 그를 가지는 기판처리시스템
CN102963578B (zh) * 2012-11-23 2015-07-01 深圳市华星光电技术有限公司 面板解包方法及解包装置
JP6079529B2 (ja) * 2013-09-18 2017-02-15 三星ダイヤモンド工業株式会社 支持機構および搬送装置
US9702815B2 (en) * 2013-11-11 2017-07-11 Boehringer Ingelheim Roxane, Inc. Sampling device and methods of using same
CN103708713A (zh) * 2013-12-26 2014-04-09 深圳市华星光电技术有限公司 夹持机构、液晶面板切割机以及液晶面板切割工艺
CN104051311B (zh) * 2014-07-08 2017-06-09 深圳市华星光电技术有限公司 基板传送装置及适用于湿制程的强酸或强碱刻蚀工艺
TWI662646B (zh) * 2014-08-05 2019-06-11 美商因特瓦克公司 植入用遮罩及其對準
JP2016132545A (ja) * 2015-01-21 2016-07-25 沖電気工業株式会社 媒体搬送装置及び媒体取引装置
US10354905B2 (en) * 2015-03-11 2019-07-16 Nv Bekaert Sa Carrier for temporary bonded wafers
US10752449B2 (en) * 2015-03-30 2020-08-25 Nikon Corporation Object carrier device, exposure apparatus, manufacturing method of flat-panel display, device manufacturing method, object carrying method, and exposure method
CN104992944B (zh) 2015-05-26 2018-09-11 京东方科技集团股份有限公司 一种柔性显示母板及柔性显示面板的制作方法
KR102186362B1 (ko) * 2015-06-02 2020-12-04 삼성디스플레이 주식회사 기판 정렬 장치 및 기판 정렬 방법
JP6580376B2 (ja) * 2015-06-04 2019-09-25 タキゲン製造株式会社 細胞・組織片輸送用無揺動ケース
JP6958354B2 (ja) * 2015-09-30 2021-11-02 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP6679157B2 (ja) * 2015-10-27 2020-04-15 株式会社ディスコ 加工装置の搬送機構
CN205674219U (zh) * 2016-05-13 2016-11-09 鄂尔多斯市源盛光电有限责任公司 机械手手臂、机械手及承载装置
CN105824200B (zh) * 2016-05-31 2017-08-29 京东方科技集团股份有限公司 一种基板支撑结构及曝光机
TWI623397B (zh) * 2016-06-30 2018-05-11 Kawasaki Heavy Ind Ltd Horizontal articulated robot
JP6791665B2 (ja) * 2016-06-30 2020-11-25 日本電産サンキョー株式会社 搬送システム
CN106044232B (zh) * 2016-07-26 2018-09-04 京东方科技集团股份有限公司 取片装置
US9637319B1 (en) * 2016-09-02 2017-05-02 Amazon Technologies, Inc. Tote handling systems and methods
WO2018084965A1 (en) * 2016-11-03 2018-05-11 Molecular Imprints, Inc. Substrate loading system
CN106783710B (zh) * 2016-12-31 2024-01-12 上海新阳半导体材料股份有限公司 晶圆转移装置
EP3361316A1 (de) * 2017-02-14 2018-08-15 VAT Holding AG Pneumatische stifthubvorrichtung und pneumatischer hubzylinder
CN106773553B (zh) * 2017-03-06 2018-11-30 重庆京东方光电科技有限公司 承载装置和曝光设备
CN107298283A (zh) * 2017-08-08 2017-10-27 惠科股份有限公司 显示面板检查设备和显示面板检测方法
TWI791036B (zh) * 2017-10-05 2023-02-01 日商索尼股份有限公司 光源裝置及投射型顯示裝置
CN108328070A (zh) * 2018-03-29 2018-07-27 苏州聚力电机有限公司 一种音圈马达下弹片的放置载具
US10535495B2 (en) * 2018-04-10 2020-01-14 Bae Systems Information And Electronic Systems Integration Inc. Sample manipulation for nondestructive sample imaging
WO2019231518A1 (en) 2018-05-31 2019-12-05 Applied Materials, Inc. Multi-substrate processing on digital lithography systems
JP7205966B2 (ja) * 2018-06-29 2023-01-17 川崎重工業株式会社 基板搬送装置及びその運転方法
CN109384062B (zh) * 2018-09-19 2020-02-18 武汉华星光电技术有限公司 一种曝光机及其传送基板的方法
CN109625970B (zh) * 2019-01-23 2020-10-30 深圳市华星光电技术有限公司 基板搬运机械手
JP7212558B2 (ja) 2019-03-15 2023-01-25 キヤノン株式会社 基板処理装置、決定方法及び物品の製造方法
JP7404348B2 (ja) * 2019-03-29 2023-12-25 Hoya株式会社 マスクブランク用基板、多層反射膜付き基板、反射型マスクブランク、反射型マスク、透過型マスクブランク、透過型マスク、及び半導体装置の製造方法
JP7207096B2 (ja) * 2019-03-29 2023-01-18 株式会社ニコン 基板搬送装置、露光装置、フラットパネルディスプレイ製造方法、デバイス製造方法、及び露光方法
JP7278854B2 (ja) * 2019-04-24 2023-05-22 株式会社ニューフレアテクノロジー ステージ機構及びテーブル高さ位置の調整方法
US11340179B2 (en) 2019-10-21 2022-05-24 Bae Systems Information And Electronic System Integration Inc. Nanofabricated structures for sub-beam resolution and spectral enhancement in tomographic imaging
TWI767391B (zh) * 2020-11-03 2022-06-11 群翊工業股份有限公司 自動化夾取堆合設備及其夾具
CN112944121B (zh) * 2021-01-23 2022-10-11 上海中中龙达智能科技有限公司 一种可防止歪斜挤压的监控用旋转式倾斜摄像装置
TW202340877A (zh) * 2022-03-31 2023-10-16 日商尼康股份有限公司 搬送裝置、曝光裝置、搬送方法、曝光方法及對準標記

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4775877A (en) * 1985-10-29 1988-10-04 Canon Kabushiki Kaisha Method and apparatus for processing a plate-like workpiece
JPH0628224B2 (ja) * 1985-10-29 1994-04-13 キヤノン株式会社 露光方法および装置
JPH06132398A (ja) * 1992-10-21 1994-05-13 Fujitsu Ltd ウエハリング固定装置
US5729331A (en) * 1993-06-30 1998-03-17 Nikon Corporation Exposure apparatus, optical projection apparatus and a method for adjusting the optical projection apparatus
TW318258B (zh) * 1995-12-12 1997-10-21 Tokyo Electron Co Ltd
JP2883597B2 (ja) * 1997-09-05 1999-04-19 株式会社日立製作所 真空処理装置及び半導体基板処理方法
JPH11219999A (ja) * 1998-01-30 1999-08-10 Nikon Corp 基板の受け渡し方法、及び該方法を使用する露光装置
JPH11284052A (ja) * 1998-01-30 1999-10-15 Nikon Corp 基板搬送方法、基板搬送装置、及び露光装置、並びにデバイス製造方法
KR20010032714A (ko) * 1997-12-03 2001-04-25 오노 시게오 기판 반송방법 및 기판 반송장치, 이것을 구비한 노광장치및 이 노광장치를 이용한 디바이스 제조방법
AU2186099A (en) * 1998-02-09 1999-08-23 Nikon Corporation Apparatus for supporting base plate, apparatus and method for transferring base plate, method of replacing base plate, and exposure apparatus and method of manufacturing the same
JP2000044056A (ja) * 1998-07-24 2000-02-15 Tabai Espec Corp パレット式物品浮上搬送用構造体
TWI226303B (en) * 2002-04-18 2005-01-11 Olympus Corp Substrate carrying device
JP2004001924A (ja) * 2002-05-30 2004-01-08 Nikon Corp 搬送装置及び露光装置
JP4360064B2 (ja) * 2002-06-10 2009-11-11 株式会社ニコン ステージ装置および露光装置
JP2004231331A (ja) * 2003-01-29 2004-08-19 Dainippon Printing Co Ltd 基板の搬送方法及び基板の搬送装置
JP2004273702A (ja) * 2003-03-07 2004-09-30 Nikon Corp 搬送装置及び搬送方法、露光装置
JP2005292645A (ja) * 2004-04-02 2005-10-20 Dainippon Printing Co Ltd 露光装置における基板の給排方法
JP4674467B2 (ja) * 2004-12-17 2011-04-20 株式会社ニコン 基板搬送方法、基板搬送装置、露光方法、露光装置及びマイクロデバイスの製造方法
JP4870425B2 (ja) * 2004-12-30 2012-02-08 エーエスエムエル ネザーランズ ビー．ブイ． 基板ハンドラ
TWI510869B (zh) * 2005-03-29 2015-12-01 尼康股份有限公司 曝光裝置、曝光裝置的製造方法以及元件的製造方法
JP4680657B2 (ja) * 2005-04-08 2011-05-11 株式会社アルバック 基板搬送システム
US7576835B2 (en) * 2005-07-06 2009-08-18 Asml Netherlands B.V. Substrate handler, lithographic apparatus and device manufacturing method
JP2008159784A (ja) * 2006-12-22 2008-07-10 Sumitomo Heavy Ind Ltd ステージ装置
KR101590645B1 (ko) * 2007-03-05 2016-02-18 가부시키가이샤 니콘 이동체 장치, 패턴 형성 장치 및 패턴 형성 방법, 디바이스 제조 방법, 이동체 장치의 제조 방법, 및 이동체 구동 방법
US7976261B2 (en) * 2008-05-20 2011-07-12 Fas Holdings Group, Llc Apparatus for moving and securing a substrate

Also Published As

Publication number Publication date
TW201643092A (zh) 2016-12-16
KR102002764B1 (ko) 2019-07-23
KR102139920B1 (ko) 2020-07-31
JP6885425B2 (ja) 2021-06-16
CN102696099A (zh) 2012-09-26
JP5761190B2 (ja) 2015-08-12
KR20190087662A (ko) 2019-07-24
KR20120098822A (ko) 2012-09-05
TWI537197B (zh) 2016-06-11
TW201927666A (zh) 2019-07-16
US20110141448A1 (en) 2011-06-16
CN108008603A (zh) 2018-05-08
JP2017108169A (ja) 2017-06-15
WO2011065589A3 (en) 2011-10-06
CN102696099B (zh) 2017-12-15
TW201206802A (en) 2012-02-16
JP2013512552A (ja) 2013-04-11
JP2019216243A (ja) 2019-12-19
JP6555546B2 (ja) 2019-08-07
TWI740113B (zh) 2021-09-21
JP2015165599A (ja) 2015-09-17
WO2011065589A2 (en) 2011-06-03

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