HK1202184A1 - 半導體器件及其製造方法 - Google Patents

半導體器件及其製造方法

Info

Publication number
HK1202184A1
HK1202184A1 HK15102570.7A HK15102570A HK1202184A1 HK 1202184 A1 HK1202184 A1 HK 1202184A1 HK 15102570 A HK15102570 A HK 15102570A HK 1202184 A1 HK1202184 A1 HK 1202184A1
Authority
HK
Hong Kong
Prior art keywords
manufacturing
semiconductor device
thereor
method thereor
semiconductor
Prior art date
Application number
HK15102570.7A
Other languages
English (en)
Inventor
Akira Ohashi
Akira Umezu
Hiromitsu Takeda
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Publication of HK1202184A1 publication Critical patent/HK1202184A1/zh

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/43Manufacturing methods
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4821Flat leads, e.g. lead frames with or without insulating supports
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    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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  • Engineering & Computer Science (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
HK15102570.7A 2013-07-19 2015-03-13 半導體器件及其製造方法 HK1202184A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013150391A JP6129671B2 (ja) 2013-07-19 2013-07-19 半導体装置の製造方法

Publications (1)

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HK1202184A1 true HK1202184A1 (zh) 2015-09-18

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