HK1202184A1 - 半導體器件及其製造方法 - Google Patents
半導體器件及其製造方法Info
- Publication number
- HK1202184A1 HK1202184A1 HK15102570.7A HK15102570A HK1202184A1 HK 1202184 A1 HK1202184 A1 HK 1202184A1 HK 15102570 A HK15102570 A HK 15102570A HK 1202184 A1 HK1202184 A1 HK 1202184A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- manufacturing
- semiconductor device
- thereor
- method thereor
- semiconductor
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2013150391A JP6129671B2 (ja) | 2013-07-19 | 2013-07-19 | 半導体装置の製造方法 |
Publications (1)
Publication Number | Publication Date |
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HK1202184A1 true HK1202184A1 (zh) | 2015-09-18 |
Family
ID=52319617
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK15102570.7A HK1202184A1 (zh) | 2013-07-19 | 2015-03-13 | 半導體器件及其製造方法 |
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US (2) | US9275940B2 (zh) |
JP (1) | JP6129671B2 (zh) |
CN (1) | CN104299947B (zh) |
HK (1) | HK1202184A1 (zh) |
Families Citing this family (2)
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ITUB20155696A1 (it) * | 2015-11-18 | 2017-05-18 | St Microelectronics Srl | Dispositivo a semiconduttore, corrispondenti procedimenti di produzione ed uso e corrispondente apparecchiatura |
KR20230141770A (ko) * | 2021-02-05 | 2023-10-10 | 소니 세미컨덕터 솔루션즈 가부시키가이샤 | 반도체 장치, 촬상 장치 |
Family Cites Families (17)
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JP3048496B2 (ja) * | 1993-04-16 | 2000-06-05 | 株式会社東芝 | 半導体装置 |
JPH07122703A (ja) * | 1993-10-22 | 1995-05-12 | Kawasaki Steel Corp | 樹脂封止型半導体装置及びその製造方法 |
JP3421747B2 (ja) * | 1995-02-15 | 2003-06-30 | セイコーエプソン株式会社 | 圧電発振器及び電圧制御発振器 |
JPH09260418A (ja) * | 1996-03-27 | 1997-10-03 | Oki Micro Design Miyazaki:Kk | ワイヤーボンディングを考慮したtcp用半導体装置 |
US5955777A (en) * | 1997-07-02 | 1999-09-21 | Micron Technology, Inc. | Lead frame assemblies with voltage reference plane and IC packages including same |
JP2000100854A (ja) * | 1998-09-17 | 2000-04-07 | Toshiba Corp | 半導体装置 |
JP2000294684A (ja) * | 1999-04-09 | 2000-10-20 | Hitachi Ltd | 半導体装置およびその製造方法 |
JP4820683B2 (ja) * | 2006-04-28 | 2011-11-24 | 川崎マイクロエレクトロニクス株式会社 | 半導体装置と半導体装置の絶縁破壊防止方法 |
JP4942020B2 (ja) * | 2006-05-12 | 2012-05-30 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP4362784B2 (ja) * | 2006-07-06 | 2009-11-11 | エルピーダメモリ株式会社 | 半導体装置 |
WO2008146426A1 (ja) * | 2007-06-01 | 2008-12-04 | Panasonic Corporation | 半導体装置 |
JP5113509B2 (ja) * | 2007-12-25 | 2013-01-09 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP5191915B2 (ja) * | 2009-01-30 | 2013-05-08 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
US8547709B2 (en) * | 2010-02-12 | 2013-10-01 | Cyntec Co. Ltd. | Electronic system with a composite substrate |
JP5750937B2 (ja) * | 2011-02-25 | 2015-07-22 | 富士通株式会社 | 半導体装置及びその製造方法 |
WO2012117960A1 (ja) * | 2011-03-02 | 2012-09-07 | シャープ株式会社 | 半導体素子および表示パネル |
JP5848517B2 (ja) * | 2011-04-26 | 2016-01-27 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
-
2013
- 2013-07-19 JP JP2013150391A patent/JP6129671B2/ja active Active
-
2014
- 2014-07-10 US US14/328,527 patent/US9275940B2/en not_active Expired - Fee Related
- 2014-07-18 CN CN201410345262.1A patent/CN104299947B/zh active Active
-
2015
- 2015-03-13 HK HK15102570.7A patent/HK1202184A1/zh not_active IP Right Cessation
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2016
- 2016-01-21 US US15/003,518 patent/US20160148895A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN104299947A (zh) | 2015-01-21 |
US20160148895A1 (en) | 2016-05-26 |
US9275940B2 (en) | 2016-03-01 |
US20150021749A1 (en) | 2015-01-22 |
JP2015023159A (ja) | 2015-02-02 |
JP6129671B2 (ja) | 2017-05-17 |
CN104299947B (zh) | 2018-04-06 |
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