WO2008146426A1 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
WO2008146426A1
WO2008146426A1 PCT/JP2007/074710 JP2007074710W WO2008146426A1 WO 2008146426 A1 WO2008146426 A1 WO 2008146426A1 JP 2007074710 W JP2007074710 W JP 2007074710W WO 2008146426 A1 WO2008146426 A1 WO 2008146426A1
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WO
WIPO (PCT)
Prior art keywords
electrode pad
semiconductor device
semiconductor chip
conductive film
semiconductor
Prior art date
Application number
PCT/JP2007/074710
Other languages
English (en)
French (fr)
Inventor
Kenji Yamasaki
Yutaka Yamada
Ayako Morita
Yukiko Matsumoto
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to JP2008524289A priority Critical patent/JP4675419B2/ja
Priority to US12/160,387 priority patent/US20100219532A1/en
Publication of WO2008146426A1 publication Critical patent/WO2008146426A1/ja

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  • Engineering & Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

　半導体装置は、上面に第１の電極パッドが形成された第１の半導体チップと、第１の半導体チップの上方に設けられ、上面に第２の電極パッドが形成された第２の半導体チップと、第１の半導体チップおよび前記第２の半導体チップの外方に配置された導電膜と、ワイヤとを備えている。第１の電極パッドと第２の電極パッドとは、導電膜を介してワイヤにより電気的に接続されている。
PCT/JP2007/074710 2007-06-01 2007-12-21 半導体装置 WO2008146426A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008524289A JP4675419B2 (ja) 2007-06-01 2007-12-21 半導体装置
US12/160,387 US20100219532A1 (en) 2007-06-01 2007-12-21 Semiconductor device

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Application Number Priority Date Filing Date Title
JP2007146626 2007-06-01
JP2007-146626 2007-06-01

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WO2008146426A1 true WO2008146426A1 (ja) 2008-12-04

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PCT/JP2007/074710 WO2008146426A1 (ja) 2007-06-01 2007-12-21 半導体装置

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JP (1) JP4675419B2 (ja)
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WO (1) WO2008146426A1 (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6129671B2 (ja) * 2013-07-19 2017-05-17 ルネサスエレクトロニクス株式会社 半導体装置の製造方法

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JP2000124392A (ja) * 1998-10-16 2000-04-28 Sanyo Electric Co Ltd 半導体装置
JP2001177050A (ja) * 1999-12-20 2001-06-29 Nec Corp 半導体装置
JP2001196529A (ja) * 2000-01-17 2001-07-19 Mitsubishi Electric Corp 半導体装置及びその配線方法

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